bonding and brazing sequence (based on accelerating ......pressure application td24 pressure...
TRANSCRIPT
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X-band Accelerating structure Review 1 24-25 NOVEMBER 2014
Bonding and brazing sequence (based on accelerating structures TD26 CC and TD24)
Serge Lebet and Anastasiya Solodko
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X-band Accelerating structure Review 2 24-25 NOVEMBER 2014
Drawings TD26 CC TD24 KEK
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X-band Accelerating structure Review 3 24-25 NOVEMBER 2014
Environment
• Assembly of the structures are done in air-conditioned room with air-filtering which corresponds to a «salle blanche».
• The room is equipped with leak detector of H2 and of N2
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X-band Accelerating structure Review 4 24-25 NOVEMBER 2014
Thermal cycles
Brazing of the couplers
Machining of interfaces for RF flanges
1st brazing of cooling circuits
Brazing of RF flanges
Preparation of discs for bonding
Alignment measurements of disc stacks before bonding
Difussion bonding
Alignment measurements after bonding
Brazing of tuning studs, vacuum tubes and vacuum flanges
Brazing of cooling circuits
Leak tightness test
RF measurements and tuning
Vacuum baking
Structure Components Numbers of
heating cycles
TD24 Couplers 4
Discs 3
TD26 CC
CC waveguides 5
Input/output cells 5
Discs 3
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X-band Accelerating structure Review 5 24-25 NOVEMBER 2014
Requirements
Temperature ~ 1040 °C; Time ~ 1,5 h; Vacuum 10-6 mbar; H2 partial pressure 20 mbar; Applied pressure 0.1 MPa; 3 thermocouples; Witness discs for pollution analysis
Bonding oven (outside)
Bonding oven (inside) all molybdenum
Temperature profile
Bonding requirements
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X-band Accelerating structure Review 6 24-25 NOVEMBER 2014
Assembly process • Assembly in V-shape column • Straightness and tilt measurements before bonding • Weight application • Bonding • Straightness and tilt measurement after bonding
Pro
cess
Eq
uip
me
nt
• V-shape column • Measurement column • Tooling for the weight application • Graphite/ceramic pads
Straightness measurements before and after bonding
Equipment
Bonding procedure
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X-band Accelerating structure Review 7 24-25 NOVEMBER 2014
Brazing requirements:
High temperature (depends on the brazing alloy); Time a few minutes; Vacuum 10-6 mbar; H2 partial pressure 20 mbar.
Au/Cu 25%/75% 1040 °C
Au/Cu 35%/65% 1020 °C
Au/Cu 50%/50% 980 °C
Brazing material (configuration):
Paste; Wire; Shim; Plating.
Brazing material (composition):
Au/Cu; Ag/Cu/Pd.
MO
ST U
SED
Brazing requirements
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X-band Accelerating structure Review 8 24-25 NOVEMBER 2014
First step: outgassing of the bonding/brazing tooling at 1100 °C
• Ceramic pad • Graphyte pad • Tooling bonding • Etc…
Outgassing of the tooling
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X-band Accelerating structure Review 9 24-25 NOVEMBER 2014
Brazing of coupleurs (body & cover)
3. Brazing of compact coupler waveguides TD26 CC
2. Brazing of couplers TD24 1. 1st brazing of cooling circuits
Au/Cu 25%/75% 1040 °C
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X-band Accelerating structure Review 10 24-25 NOVEMBER 2014
Machining of couplers
Machining of compact coupler waveguides TD26 CC
Machining of coupleurs TD24
Machining of interfaces for the RF flange
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X-band Accelerating structure Review 11 24-25 NOVEMBER 2014
Bonding input / output cells TD26 CC
Bonding of output/input cells TD26 CC
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X-band Accelerating structure Review 12 24-25 NOVEMBER 2014
Brazing of couplers & RF flanges Brazing of output/input cells,
CC waveguides and RF flanges TD26 CC
(assembly before brazing)
Brazing of couplers, vacuum and RF flanges TD24
(assembly before brazing)
Au/Cu 25%/75% 1040 °C
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X-band Accelerating structure Review 13 24-25 NOVEMBER 2014
Alignment tools
Column Mitutoyo 600mm (1.1 + 0.6L µm)
Camera Vision
Equipment for: - straightness measurement of disc stacks; - measurement of external diameter of discs; - angular positioning of discs using a reference line.
Comparator (±0.5 µm) with gage blocks
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X-band Accelerating structure Review 14 24-25 NOVEMBER 2014
Straightness measurement before bonding
Straightness measurement before bonding TD24
Straightness measurement before bonding TD26 CC
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X-band Accelerating structure Review 15 24-25 NOVEMBER 2014
Pressure application
TC1
TC3
TC2 30 kg
28 kg
Pressure application 0.1 MPa P= F/S
Pressure application TD24 Pressure application TD26 CC
3 Thermocouples
Witness discs
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X-band Accelerating structure Review 16 24-25 NOVEMBER 2014
Straightness measurements after bonding
16
Measurement 1
Measurement 2
Measurement 3
Measurement 4
Measurement 6
Measurement 5 22
2 m
m
Engr
aved
are
a Starting height 5 mm, length 222 mm, step 8.3 mm (1 point per disc)
5 mm
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X-band Accelerating structure Review 17 24-25 NOVEMBER 2014
Straightness measurements
Straightness measurements for the disc stacks of accelerating structures have been done before and after bonding:
• Before bonding, measurements have been done for two generatrices because
of the position of the structure in the v-shape column, the position of the tooling and the position of engraved numbers.
• After bonding, measurements have been done for six generatrices.
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X-band Accelerating structure Review 18 24-25 NOVEMBER 2014
Brazing of tuning studs
Fixed by ceramic studs
Brazing of tuning studs TD26 CC Brazing of tuning studs TD24
Au/Cu 35%/65% 1020 °C
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X-band Accelerating structure Review 19 24-25 NOVEMBER 2014
Brazing of cooling circuits
Brazing of cooling circuits TD26 CC Brazing of cooling circuits TD24
Au/Cu 50%/50% 980 °C
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X-band Accelerating structure Review 20 24-25 NOVEMBER 2014
Leak tightness test TD26 CC TD24
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X-band Accelerating structure Review 21 24-25 NOVEMBER 2014
RF measurements and tuning TD26 CC TD24
…see B. Woolley presentation on 25.11.2014 Session “Established procedures and Quality assurance”
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X-band Accelerating structure Review 22 24-25 NOVEMBER 2014
Vacuum baking
CERN oven now is equipped with an gas analyser
Requirements
Temperature 650 °C; Time 10 days; Total time ~ 15 days; Vacuum 10-9 mbar.
…see M. Taborelli presentation on 25.11.2014 Session “Established procedures and Quality assurance”
Packaging and shipping
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X-band Accelerating structure Review 23 24-25 NOVEMBER 2014
TD26 CLEX superstructure
One TD26 CLEX structure is currently under test in CLEX. The second SAS is supposed to be installed in January 2015.
A superstructure (two AS brazed together);
4 waveguides with WFM; Compact couplers; Vacuum manifolds; SiC absorbers.