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Thomas Kolossa / Balver ZinnHead of Techn. DepartmentCertified IPC-A-610 Trainer (CIT)[email protected]
Balver Zinn_CobarJosef Jost GmbH & Co.KG
Blintroper Weg 11
58802 Balve / Germany
www.balverzinn.com / www.cobar.com
SN100C (SnCu0,7Ni0,05Ge0,005)
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Agenda
93% of wave and selective soldering users do not need the extremly good properties of SN100C (SnCu0,7NiGe) but can enjoy the cost benefits of silver free alloys andreally protect our environment.
Lead Free Alloy Choice
- Company- SN100C- Wave soldering with SN100C- Approvals
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History1973 Establishment as a private company Josef Jost tin and metal wholesale:
Casting of tin and for the galvanic industry, table-ware tin and soldering technics in Balve.
1976 Building of a production hall and an office building in Balve “Auf demWerenfelde"
1977-84 Upgrading and expansion of the halls in Balve.1983 Rename into Balver Zinn KG Josef Jost.1986-7 Building of the production halls and the office building for the zinc foundry in
Garbeck "Blintroperweg"1990-1 Building of the Ba-Ti-Loy solder wire production in Garbeck.1991 First QM certifying according to DIN 90021992-3 Building of the Balver Zinn II zinc wire production in Garbeck.1994-6 Building of the Balver Zinn III storage hall in Garbeck.
2000 First EMS certifying according to DIN 140012002 Cooperation with Nihon Superior, Japan2003 Cooperation with Nihon Superior, Japan; solder wire production in Malaysia.
1999 Rename into the Balver Zinn Josef Jost GmbH & Co KG
2007 Merger Balver Zinn / Cobar
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Balver Zinn_CobarJost Zinc FounderCapacity: 2700to./Month(Single Mould Casting)
3350to./Month(Wire, Continius Casting)Alloy: Zn, ZnAl; ZnTi, ZnMn, etc.Market: Automotive , Surface Treatment, Targets, etc.
Balver Zinn Josef Jost (Recycling)Capacity: 950to./Month (Single-Continius Casting)Alloy: Sn; SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer;etc.
BaTiLoyCapacity: 450to./Month(Wire; Anodes)Alloy: Sn; SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer etc.
CobarCapacity: 10.000l / Day (Flux)
900kg / Day (Paste)Alloy: SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer; etc.
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Balver Zinn_Cobar!!
- ParkheathUNITED KINGDOM
- Balver Zinn- Sub distributors
GERMANY
- Dial Electrolux- Intertechs
RUSSIA
SLOVAKIA- PBT Rosnov
CZECH REPUBLIC
-PEM TechnologiesSOUTH AFRICA
- Soldering Technologies
SPAIN
- Dilectro- Arnaud
FRANCE
- SiprelITALY
POLAND- CH Erbsloeh Polska
- Candor SwedenSWEDEN
- Cobar BeneluxBENELUX
- SelasTURKEY
- ATT Hungary
HUNGARYROMANIA
- Candor DenmarkDENMARK
- CH Erbsloh BalticBALTIC
- Candor FinlandFINLAND
-MetallexSWITZERLAND
- ATT AustriaAUSTRIA
SLOVENIA
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SN100C / Statements
It behaves as a eutectic
It is compliant
Low copper erosion
Low dross
Not aggressive toward stainless steel
Cost not inflated by silver content
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SN100C / Statements
World’s 2nd Most Widely Used Lead-free Wave Solder
Rapidly catching up on SAC305
Most Widely Used Lead-free Wave Solder in Europe
Most Widely Used Lead-free HASL Alloy
Increasing use as reflow solder
Popular flux-cored solder wire
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Alloy
SN100C ™Legierung: SnCu0,7NiGeSchmelzpunkt: 227 ºCDichte: 7,4 g/cm³
+ Günstiger Preis
+ Krätzebildung
+ Glänzende Lötstelle
+ Duktilität
+ Zuverlässigkeit
- Schmelzpunkt 227 °C
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Alloy
SAC 305Legierung: SnAg3,0Cu 0,5Schmelzbereich: 217 – 219 ºCDichte: 7,5 g/cm³
+ Schmelzbereich 217 – 219°C
+ Bekannt (IPC)
+ Langjährige Erfahrung
- Hoher Preis
- Hohe Kupferablösung
- Edelstahlkorrosion
- Krätzebildung
- Duktilität
- Oberfläche / Lunker
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Alloy
LowSACLegierung: SnCu0,7Ag0,3Schmelzpunkt: 217 – 228 ºCDichte: 7,37 g/cm³
+ Günstiger Preis
- Schmelzbereich 217 - 228 °C
- Krätzebildung
- Fließverhalten
- Kupferablösung
- Edelstahlkorrosion
- Oberfläche
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Alloy
SnCu0,7Legierung: SnCu0,7Schmelzpunkt: 227 ºCDichte: 7,4 g/cm³
+ Günstiger Preis
- Schmelzpunkt 227 °C
- Krätzebildung
- Oberfläche / Lunker
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Solidification Behaviour
SN100CSn-0.7Cu
Cooling Rate ~ 5°C/sec
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Solidification Behaviour
Fast Cooling
SAC305
Slow Cooling
The surface is a reflection of what is going on inside the alloy.A grainy cracked surface is telling you that the alloy is not behaving like a eutectic.
…. that is not behaving like “63/37”
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Nickel (Ni)
Hohe Tolerierbarkeit von Ni-Gehalten bis 0,1%
Nickel wird in SnAgCu und SnCu Loten als Kornfeinungselement eingesetzt (erhöht die Zuverlässigkeit, homogenes Gefüge)
Löst sich von NiAu und NiPdAu Oberflächen ab
Verlangsamt bei SnCu Loten die Cu Ablösung
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SN100C / Ni
The Ni addition in SN100C concentrates in the Cu6Sn5 intermetallic
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Property
Property SnPb SAC305 SN100CEutectic yes no yesCompliant yes no yesCopper Erosion low high lowDross medium high lowStainless Steel Erosion no yes noSilver no yes no
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SN100C / Ni
The addition of Ni to the Sn-0.7Cu alloy significantly improves fluidity
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Stable Intermetallic Layer
Initial thickness of intermetallic is greater in Sn-0.7Cu containing Ni and structure is more open
During ageing the intermetallic layer in the Ni-stabilised Sn-0.7Cu coating does not increase in thickness and the microstructure consolidates.
This stability of the intermetallic layer ensures a longer service life
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Silber (Ag)Fließverhalten bei Zugabe von Silber
Erstarrungslunker Gefüge
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Germanium (Ge)
Germanium ist ein Antioxydant
Verbesserung des Fließverhaltens
Nachlassende Wirkung bei Ge < 20 ppm
Keine Probleme bei Gehalten bis 80 – 100 ppm
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SN100C / Ge
[Results]1. The Ni addition to the Sn-Cu lead-free increases fluidity of the solder
and eliminates bridging.2. The addition of Ge to the Sn-Cu-Ni alloy to make “SN100C” improves
the drainage properties of the solder to further reduce any tendency to bridging.
Whether or not bridging occurs depends on what happens as the joint exits the wave (the “peel back” area)
To study the effect of bridge elimination, the icicle test was carried out and the drainage characteristic of solder wave were confirmed.
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SN100C / Ge
1. Desk-top mini-wave solder pot
・Solder capacity: 7kg・Bath dimensions: 130mm x 150mm・Nozzle dimensions: 30mm x 30mm・Fall distance from the jet outlet to the surface of the bath: 35-40mm
2. Melting temperature: 255℃
3. Precondition the bath by operating for 30minutes in airat constant pump speed.Remove the dross generated this preconditioning.Start the test with the preconditioned solder bath.
4. Collect the dross every hour for 4hours and weigh.Calculate the quantity of dross per hour for each alloy.
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SN100C / Ge
The effect of Ge
The dross generation of SN100C is half as much as that of SAC305.
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SN100C / Ge
ⅠBridge elimination
The beneficial effect of Ge on drainage combined with the beneficial
Ⅱ Faster wetting
The Ni addition accelerates initial wetting and the Ge addition
Ⅲ Reduced dross generation
The thin film that Ge forms on the surface of solder bath reduces the
effect of Ni on fluidity ensures minimum bridges.
accelerates wetting after zero-crossing.
formation of the tin oxide that is the basis of dross.
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Is there a difference for soldering process with different lead free alloys?
Are there special requirements for SN100C™?
Are there requirements in comparison to SAC – alloys?
How to manage the process with SN100C™?
Process indications for lead free wave soldering
Answer: It’s easier as expected!!
Wave Soldering with SN100C
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AlloyMelting temp.
° C
Typical solder bath temp. for wave
soldering
°C
Difference between solder bath and melting temp.
Specific Gravity
g/cm3
Sn63Pb37 183 250 67 8.4
SN100C™ (SnCu0.7NiGe) 227 265 38 7.4
LowSAC (SnCu0.7Ag0.3) 217-228 265 38 7.37
SAC305 (SnAg3.0Cu0.5) 217-218 265 47 7.5
Sn63Pb37 SN100C™ LowSAC SAC305
Different Alloys
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Typical settings and process requirements depends on machine type, PCB, flux, solder and components.
Sn63Pb37 SN100C™ LowSAC SAC305
Transportation speed [m/sec] 70 - 150 50 - 130 50 - 130 50 - 130
Preheating temperature
[°C]80-100 90 - 130 90 - 130 90 - 130
Contact time [sec.] 2 - 3 3 - 5 3 - 5 3 - 5
Typical Nozzle setting Chip + Laminary Turbulet Turbulet Turbulet
Please don’t consider this information as recommendations! This are only typical settings which can be found in most productions.
Requirements
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Conclusion:Due to melting temperature and the process temperature for leadfree in comparison to SnPbthe process window is much smaller
The higher preheating temperature is required to reduce the thermal shock on components
There are not many differences between the different leadfree alloys in requirement and process conditions!
A higher contact time is required for lead free alloys. This can be achieved by lower transportation speed or nozzle type!
Requirements
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Fluxes with higher activation temperature are required.For “No Clean” applications will be needed a very low solid contentThe requirements for fluxes are very height. Especially in machines with two waves. Here it’s important to ensure enough activation for the second waveWater based fluxes as BALVER ZINN 2420 has been developed especially for lead free applicationsCobar 390-RX-HT for example is a very suitable solution for alcohol based fluxes!
General Information / Flux
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Preheating temperature depends on the used flux
Preheating temperature depends on the used PCB (multilayer; single layer)
Preheating temperature depends on the used components
There is no difference in preheating for SAC305, SN100C™ or other lead free alloys
Preheating
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The preheating temperature will measured on the top of PCB!
Heater
PCB
No distinction in preheating for the different lead free alloys!
Heat
Prehaeting
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Heat
We recommend to cover the heater of old machines!Advantages: Homogenous heating
Save energySave money
Less component impact
Cover: The evolution
Heater
Preheating
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Recommendation for new equipment:Heaters from bottom and from top!!
Absolutely free for every processFree for every setup
Free for every problem
Heater on top: The revolution
Preheating
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Recommendation for alcohol based flux: measured on top of PCB
Flux Cobar 390-RX-HT
Lead free: 90 –120°C
Profile!?
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Recommendation for water based flux: measured on top of PCB
2420 NC
Lead free: 110 –130°C
Profile!?
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Typical profile for SN100C™ alcohol based flux
Typical profile for SAC 305 alcohol based flux
Profile!?
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Typical profile for SN100C™ water based flux
Typical profile for SAC 305 water based flux
Profile!?
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Preheating temperature does not depends onthe used lead free alloy
There is no difference in preheating for SAC305, SN100C™ or other lead free alloys
Preheating temperature depends on the used components
Preheating temperature depends on the used flux
Conclusion:
Preheating
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Solder Bath
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Typical solder bath temperature for SN100C™: 265°C
Typical solder bath temperature for other lead free alloys: 265°C
For SN100C™ it can be found the same settings as for SAC- alloys
No difference for wave height, pressure or wave type
A chip wave is not often required
General Information
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Chip WaveIn some cases the use of the chip wave is needed, it
depends on PCB, SMD-components on the bottom etc.
Set the pressure at a maximum level, but ensure that the PCB will be not over flown
Contact time should be no much longer than approx. 1 second
Ensure enough flux activation for the second solder wave
Chip waves decrease in some cases the hole filling
Wave Setting
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1. Turbulent wave (two or more lines of holes)Keep the nozzle always hot by setting of standbyThe solder should stay in the holes of nozzleHeight between nozzle and PCB should be approx. 6–8
mmContact length approx. 35 – 45 mmNot overflow the PCBContact time should be 3 – 5 secondsWave height at approx. 1/3 of PCB thicknessMinimize the wave running times as less as possible
Wave Settings
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1. Other Wave types (laminar etc.)Keep the nozzle always hot by setting of standbyThe solder should flow only if a PCB touches their surface.
Set careful the wave and back plate height Height between nozzle and PCB should be approx. 6–8 mmContact length approx. 35 – 45 mmNot overflow the PCBContact time should be 3 – 5 secondsWave height at approx. 1/3 of PCB thicknessMinimize the wave running times as less as possible
Wave Settings
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Conclusion 3:
A wave soldering process is possible with different types of nozzles
the most important thing is a very well balance in setup
Contact time should be approx. 3 – 5 seconds
Contact length should be approx. 35 – 45 mm
Wave Settings
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Conclusion 4:
SAC 305: height copper erosionSN100C™: less copper erosion, lower than SnPb!
What about electrical conductivity of board??What about thermal conductivity of board??What about alloy in pot composition during working??What about solder bath management??
Answer: Here, it can be found a difference between SAC and SN100C™!!
Copper Erosion
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Sn-3.0Ag-0.5Cu 250°C, 3.3 seconds
50μm
Solder fillet
Copper laminate
Copper Erosion During Wave Soldering
Copper Erosion
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Sn 3.0Ag 0.5Cu Sn 3.5Ag 0.7Cu SN100C™
NO COMMENT ON THIS!
Copper Erosion
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Cu-trend SN100C™ Cu-trend SAC305
Results of over 38.000 solder bath analyses!
Copper Erosion
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Can we find a difference between SAC305 and SN100C™ in maintenance??Why??
Because of solder bath management as showed!
Answer: Here, it can be found a difference between SAC and SN100C™!!
Maintenance
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Dross formation (by Ge) in comparison to SAC305
Reduction of Dross by a small amount of Germanium (Ge)!!
Dross
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Stainless steel erosion
Maintenance
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Conclusion 5:
30-40 % less dross formation in comparison to SAC 305
Less stainless steel erosion
Costs saving due to less maintenance
Increasing of productivity due to less maintenance
Here, it can be found a difference between SAC and SN100C™ too!!
Maintenance
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For SAC 305 and SN100C™ there are no differences in Flux application!
For SN100C™ it is not required a special or different preheating profile!
For SN100C™ it is not required a different solder bath temperature as for SAC – alloys!
Typical wave nozzles can be used without modifications!
Summary
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The copper erosion is more less than with SAC 305!
The solder bath management is with this alloy much easier as with SAC 305!
SN100C™ helps to increase the productivity and reduce the maintenance
And last but not least: It is similar in characteristics and much cheaper!
Summary
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SN100C / BoingJCAA/JG-PP Lead-free Project
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SN100C / Boing
Vibration Testing
SN100C
Sn-Pb
Sn-3.9Ag-0.6Cu
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SN100C / Boing
SN100C
SN100C is the only lead-free wave solder to be carried through to the next stage of this project, the NASA/DoD Lead-free Solder Project.
SN100C is also being included as a reflow solder.
CONCLUSIONSAC305 is a strong but brittle alloy than is not always the most reliable option.
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Baugruppe B-CPU, Unterseite:
© Siemens AG, Corporate Technology
Siemens
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Reflowprofilanpassung:
© Siemens AG, Corporate Technology
Siemens
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Bosch
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Imaps
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Try…
Google Search
I’m feeling lucky
..for some independent information on SN100C.
SN100C vs SAC305
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Thanks for your attentionVielen Dank für Ihre Aufmerksamkeit
Dziekuje za uwage
Grazie per l’attenzione
Gracias por su amabilidad
Tack för din uppmärksamhet
Gohairyo arigatou gozaimasu
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