background statement for semi draft document...

Background Statement for SEMI Draft Document 4570BNEW STANDARD: MECHANICAL SPECIFICATION FOR FAB WAFER CARRIER USED TO TRANSPORT AND STORE 450 MM WAFERS (450 FOUP) AND KINEMATIC COUPLING Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.

Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or a patent application has been submitted. In the latter case, only publicly available information on the contents of the patent application is to be provided.

BackgroundThis document is being developed as part of the design of a system for moving and handling 450 mm wafers, which will ultimately include wafer carriers, load ports and transport system. This one document covers subjects that, for 300 mm carriers, were contained in three documents for 300 carriers: SEMI E1.9, E47.1 and E57. It is being developed in parallel with SEMI Doc 4599 Mechanical Interface for 450 mm Load Port

The following features are included in this document as requirements:

Reference planes Kinematic coupling pins shapes and locations Kinematic coupling mating grooves Bottom Surface Features - Info and lockout pads, presence and placement features Carrier retention feature Conveyor rail locations and dimensions Fork-lift rail locations and features Areas reserved for purge ports Automation handling flange Provision for Carrier ID Carrier door and door mechanism Wafer support features Height of first wafer slot Distance between adjacent wafer slots (wafer pitch) End effector exclusion volumes Carrier center of gravity

This document is being developed based on the content of SEMI M74 Specification for 450 mm Diameter Mechanical Handling Polished Wafers. In that document, the wafer is specified as having a diameter of 450 +/- 0.20 mm, and a thickness of 925 +/-25 µm.

This formal letter (yellow) ballot will be discussed and adjudicated at the SEMI Standards NA Fall 2009 Meetings taking place at Santa Clara, CA, November 2-5, 2009.

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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l

SEMI Draft Document 4570BNEW STANDARD: MECHANICAL SPECIFICATION FOR IN-FABCARRIER USED TO TRANSPORT AND STORE 450 MM WAFERS (450 FOUP) AND KINEMATIC COUPLING1 Purpose1.1 The purpose of this document is to establish basic physical dimensions for the carriers intended to be used to transport and store 450 mm wafers, as specified by SEMI M74, within semiconductor device manufacturing facilities.1.2 This document is intended to define the reference planes for the dimensions of the carriers and the load port features that will interact with the carriers.1.3 This document is intended to define a set of requirements to ensure interoperability of load ports and carriers without limiting innovative solutions.

2 Scope 2.1 This document specifies the external features and dimensions of the 450 mm carrier.2.2 This document specifies the interior exclusion volumes for supporting and restraining wafers in the 450 mm carrier.2.3 This document specifies the critical dimensions and locations of the kinematic coupling pins that will support and position the 450 mm carriers.2.4 This document defines three orthogonal reference planes as references for carrier dimensions.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

3 Limitations3.1 The detailed methods and mechanisms inside a 450 FOUP door as to how a carrier door may be engaged to and disengaged from the carrier shell are not specified by this document.

4 Referenced Documents and Standards4.1 SEMI Standards

SEMI E144 ― Specification for RF Air Interface Between RFID Tags in Carriers and RFID Reader in Semiconductor Production and Material Handling Equipment

SEMI M74 ― Specification for 450 mm Diameter Mechanical Handling Polished Wafers

1: SEMI is developing a Mechanical Interface Specification for 450 mm Load Ports intended to be used in conjunction with this document.

4.2 ISO Standards1

ISO 4287 ― Geometrical Product Specifications (GPS) - Surface texture: Profile method - Terms, definitions and surface texture parameters

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology5.1 Abbreviations and Acronyms5.1.1 BP — bilateral plane5.1.2 CL — center line5.1.3 EE — end effector1 International Organization for Standardization (ISO), ISO Central Secretariat, 1, ch.de la Voie-Creuse, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http://www.iso.ch

This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 0 Doc. 4570B SEMI

Semiconductor Equipment and Materials International3081 Zanker RoadSan Jose, CA 95134-2127Phone:408.943.6900 Fax: 408.943.7943

DRAFTDocument Number: 4570B

Date: 2009/09/04

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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l5.1.4 FOUP — front-opening unified pod5.1.5 FP — facial plane5.1.6 HP — horizontal plane5.1.7 KC ― kinematic coupling5.1.8 KCP — kinematic coupling pin5.1.9 OHT ― overhead hoist transport5.1.10 RFID ― radio frequency identification5.1.11 TIR — total indicator runout5.2 Definitions5.2.1 450 FOUP — used generally as a “term” only within this document to identify the front-opening carrier used in fabs for 450 mm wafers.2: Unless otherwise specified, the word ‘carrier’ used herein shall mean 450 FOUP.5.2.2 bilateral plane (BP) — a vertical plane, defining x=0 of a system with three orthogonal planes (HP, BP, FP), coincident with the nominal location of the rear primary KC pin, and midway between the nominal locations of the front primary KC Pins.5.2.3 center line (CL) — a horizontal line centered vertically on the carrier door used as the reference for z dimensions of door features.5.2.4 facial plane (FP) — a vertical plane, defining y=0 of a system with three orthogonal planes (HP, BP, FP), y33=194 ±0 mm in front of the nominal location of the rear primary KC pin. 5.2.5 front (of carrier) — the part of the carrier closest to the door.5.2.6 horizontal plane (HP) — a horizontal plane, defining z=0 of a system with three orthogonal planes (HP, BP, FP), coincident with the nominal location of the uppermost points (tips) of the three kinematic coupling pins.5.2.7 nominal location — the value a dimension would have if its tolerance were reduced to zero. 5.2.8 nominal wafer seating plane — a horizontal plane that bisects the wafer pickup volume. [SEMI E1.9]5.2.9 origin — the intersection of the BP and FP.5.2.10 plane ― a theoretical surface which has infinite width and length, zero thickness and zero curvature.5.2.11 rear (of carrier) — the part of the carrier farthest from its door.5.2.12 wafer deflection — change in wafer shape (TIR) due to gravity while the wafer is resting on the carrier wafer supports with the carrier door open.5.2.13 wafer seating plane — the bottom surface of an ideally rigid flat disk that meets the diameter specification for 450 mm wafers, with negligible droop due to gravity, as it rests on the wafer supports.

6 Reference Planes (HP, FP, BP) Specification6.1 The HP, FP, and BP as described in the definition section are ideal planes, which are intended to be used to depict the position of certain features relatively to these planes. These planes are at position zero (x, y, z) with no tolerance associated, since these ideal planes do not represent a physical feature.3: The top surfaces of the Kinematic Coupling Pins are not the surfaces on which the carrier rests. Appendix 1 shows how test fixtures can be made to rest on the KCPs to duplicate the position of a carrier. 6.2 FP and BP are defined as vertical planes and ideally are parallel to the gradient of the gravity field. All three planes are mutually perpendicular. Only positive numbers are used to define coordinates within this system of three planes. No negative numbers are used in order to be as close as possible to standard mechanical drawing practices. Necessary clarification on the position of a feature usually will be achieved via figures. 4: For best understanding, the definitions of the reference planes should be read in the order HP, BP, FP.6.3 Reference Baselines — One centerline is defined:

CL — Centerline for the carrier door. It passes through the centers of the openings for the door pins. All the z-dimensions of door features are symmetric to the CL.





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Figure 1Overall Views of 450 FOUP

7 Carrier Envelope 7.1 The overall dimensions of the 450 FOUP, (x1), (y1), and (z1), are given as reference dimensions because they are derived from other dimensions. See Table 2. (x1) ≤ x2 * 2 (y1) ≤ y2 + y4max

(z1) ≤ z8max + z11

8 Features for Automated Handling8.1 Automation Flange — On top of the 450 FOUP is an automation flange for manipulating the carrier. See Figure 2 (top view) and Figures 3, 4 & 5 (sections).

8.1.1 The automation flange shall be centered in front of the FP. Its orientation and location are constrained by x4 and y12. See Figure 6.

8.1.2 The center of the flange is located x63 and y54 relative to its side and front respectively. The flange shall have a centering feature at its center. The centering feature shall have a depth of z2, diameter of d3 at the top surface, and (d2) at the bottom. The side of the centering feature shall have an angle of θ4.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l8.1.3 The flange shall extend back from its front side by y3, and shall extend from its right side (as viewed from the front of the carrier) to the opposite side by x3. The neck below the flange shall extend x34 to each side of the BP, and shall extend y37 in front of the FP and y56 behind the FP.

8.1.4 The flange has a pattern of notches on all sides. Notches on the front and back have a depth of y31 and those on the sides shall have a depth of x56. The notches shall have an angle of θ5. The four corners shall have chamfers with size of x32 and y28. Notches are located at x30, x31, x33, and x63 on the front and back, and at y29 and y54 on the sides. The flange shall have a thickness of z13, and the carrier shall have no obstructions around the flange for a height of z9, except for the door frame as shown by y30 in Figure 4.

Figure 2Automation Flange – Top View

Figure 3Automation Flange Section at BP





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Figure 4Carrier Section at BP

Figure 5Carrier Section at FP





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l8.2 Center of Gravity Volume ― The carrier’s center of gravity in x and y direction with the door closed shall be in front of the FP and within a cylinder of radius r20 from a point on the BP at y36. The center of gravity shall be within this volume whether the carrier is empty, partly filled with wafers, or fully occupied. See Figure 6.8.2.1 Appendix 3 describes a method for measuring the location of the center of gravity.

Figure 6Automation Flange Location

8.3 Fork-lift Feature — The 450 FOUP shall have features on the sides for handling by fork-lift, shown in Figure 7. The fork-lift feature includes a notched indentation for a pin to retain the carrier on the fork-lift.

8.3.1 On each side of the carrier, there shall be an opening to the rear extending vertically from z35 to z19, and forward to y45. The horizontal surface at z19 shall extend from y45 to y46. There shall be no obstruction at the top of the opening to the rear of y46. The surface at z19 shall extend from x17 to the surface at x66. There shall be notches at the FP with a height of z20, a depth of x35 and an angle of θ6.

8.3.2 There shall be a vertical surface extending a distance z20 above z19 at x66 from the BP, from y45 at the front and without any obstruction to the back of the carrier.

8.4 Front Clamp Features — The 450 FOUP shall have provision for being clamped at the front of the carrier on vertical surfaces located behind the door frame.

8.4.1 There shall be two front clamping features on the top of the carrier. Each is a rectangular hole with a depth of z5, and is bounded by x15 & x16, and by y43 & y44. See Figure 7.

8.4.2 There shall be two front clamping features on the bottom of the carrier. Each is a rectangular hole with a depth of z36 and is bounded by x57 & x58, and by y47 & y48. See Figure 27.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l5: It is recommended that the front clamp features not be used for pulling the FOUP from the undocked position into the FIMS interface. All of the dimensions of the 450 FOUP (such as the wafer location, etc.) are defined with reference to the kinematic coupling pins, and will be in the proper location only when the 450 FOUP is held in place on the kinematic coupling pins only by gravity.

Figure 7Front Clamp & Fork-lift Features

8.5 Manual Handling — A fully-loaded 450 mm FOUP will be too heavy for manual handling during normal production or maintenance activities. It is anticipated that manual handling will only occur when recovering from an abnormal situation. Consequently, there is no provision for manual handles.8.6 Conveyor Rails — See section 15.

9 Requirements for Kinematic Coupling Pins 9.1 Kinematic Coupling Pin Shape — The physical alignment interface on the bottom of the wafer carrier consists of features (specified in § 10) that mate with six pins underneath. As shown in Figure 8 and defined in Table 1, each pin is radially symmetric about its vertical center axis line and can be seen as the intersection of a cylinder of radius r1 and a sphere of radius r4 (which establishes the tip of the pin and might contact a flat plate). The radius r4 is centered on the axis of symmetry at a height z3 below the HP. An additional radius r3 establishes the contact with the angled mating groove surface on the carrier. The center of the radius r3 is defined by the intersection of a vertical plane through the axis of symmetry of the pin with the horizontal circle of radius r2 at the height z4 below the HP. A blend radius of r5 is applied at the intersection of r1 and r3, and at the intersection of r3 and r4. The minimum height of the pin is given by z4. Ra1 is the surface finish roughness, as defined by ISO 4287, of all features





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lgiven by r1, r3, r4, and r5. Dimensions r2, z3, and z4 have zero tolerance because they only define offsets and not physical features.9.2 Kinematic Coupling Pin Locations — The KC pins are arranged in three sets with two pins in each set, as shown in Figure 11. The outer pins of each set are designated the primary pins for use on a load port or vehicle nest, and the inner pins are designated the secondary pins for use on a robotic arm used to pick up a carrier from the primary pins. The rear pins (farthest from the door) are located on the BP, at a distance from the FP of y18 for the secondary pin and y15 for the primary pin. The front primary pins are located at a distance of y16 from the FP, symmetric across the BP with distance x18 from the BP. The front secondary pins are located at a distance of y17 from the FP, symmetric across the BP with distance x19 from the BP. For reference only, the front kinematic coupling pins are located symmetrically with respect to the BP at an angle of (θ2), and circumferentially equidistant on a circle about the origin with radius (r22) for the primary kinematic coupling pins and radius (r26) for the secondary kinematic coupling pins. For reference only, the rear primary kinematic pin is located on the BP and on a circle with radius (r27), and the secondary rear pin is located on the BP and on a circle with radius (r16). See Figure 11.

Figure 8Kinematic Coupling Pin

10 Requirements for Kinematic Coupling Groove In order to achieve the proper lead-in value of r15 and control contact pressures, certain characteristics of the kinematic groove surface on the bottom of the 450 FOUP are described in this section and shown in Figures 9 & 10. 10.1 Kinematic Coupling Groove Locations — Grooves shall be provided to capture both primary and secondary pins locations. The centerlines of the grooves are located along radii passing through the kinematic pin locations from the origin. The rear groove has its centerline along the BP, while the two front grooves have their centerlines at the angle (θ2) with respect to the FP.10.2 Kinematic Coupling Groove Shape and Finish — When viewed along the axis of symmetry of the groove (parallel to the HP), the angle of each wall shall be θ1 to the vertical. The height of the groove at the opening shall be z11 beneath the HP. The shape and surface finish of the groove shall ensure that the carrier will seat fully onto the KC Pins when there is an offset (lead-in error) of r15, allowing an empty, partially filled or full carrier to seat completely on the KC Pins so long as it is placed on the load port within r15 from nominal. See Figure 10.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l10.3 Kinematic Coupling Groove Length — In order to ensure capture of either the primary or secondary KC pin during a physical handoff with an offset (lead-in error) of r15, along the length of the groove, a minimum groove length is specified. The innermost end of the front KC grooves shall be no farther than r8 from the origin, and the outermost end of the grooves shall be no closer than r24 from the origin. The innermost end of the rear KC groove shall be no farther than r33 from the origin, and the outermost end of the groove shall be no less than r9 from the origin. The KC grooves shall not interfere with the edge of the conveyor rail or other exclusion features. See Figures 10 & 11.

Figure 9Kinematic Coupling Groove

Figure 10Kinematic Coupling Offset





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Figure 11Bottom View – Kinematic Coupling Pin Locations





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l11 Requirements for Bottom Surface Features

Figure 12Bottom Features

11.1 Presence Sensor Feature

11.1.1 The presence sensing features on the bottom of the 450 FOUP are designed to provide three flat, opaque areas for sensing. The load port or other systems using KCPs can use the features to determine that a carrier is present, even if misplaced (see the discussion in the Related Information R5). The features consist of three flat, opaque areas centered along the FP of the carrier within the conveyor rails and extending y21 to the front and rear of the FP. The center area extends x22 to each side of the BP, and the outer areas extend from x20 to x9. The vertical location of the presence sense areas is z29 below the HP. See Figures 13 & 14.

11.2 Placement Sensor Features

11.2.1 Placement sensing features are intended to provide defined locations to confirm proper placement of the kinematic coupling grooves onto the kinematic coupling pins. These consist of a set of four elongated and three circular flat areas. The elongated flat areas are located symmetrically to the front KC pins, with the outer center at approximately the same distance from the origin (at x21 and y22), The distance from the outer to inner centers is approximately the same as the distance between the primary and secondary KC pins. Two of the circular flat areas are located on either side of the rear secondary KC pin, and the third is in front of the rear KC pins, for use with fork-lifts. The flat areas shall be at a height of z23. Because the KC pins are not symmetrical, this configuration allows fail-safe sensing of the carrier placement. See Figures 13 & 14.

11.3 Info Pads & Mechanical Lockout Features

11.3.1 The info pads and mechanical lockout features of the 450 FOUP are located symmetrically about the BP, with one row of three info pads and one mechanical lockout feature on each side. From the carrier side, there is no





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn ldifference between the info pads and mechanical lockout features. On the load port side, the optional mechanical lockout pins will be separate from the sensing info pads. As with the placement sensing pads, the info pad features have a radius of r21 mm (flat or hole per customer option). The flat surface shall be at z50 below the HP, (with a more relaxed tolerance than z23). Hole “depth” shall be at z24. For the mechanical lockout feature, the flat must be capable of supporting a fully loaded FOUP.

11.3.2 The info pads and mechanical lockout features are located y24 mm from the FP, and symmetrically about the BP at distances of x24 mm, x25 mm, x26 mm, and x27 mm from the BP. The two features nearest the BP are reserved for mechanical lockout; the other six are reserved for info sensors only (no mechanical lockout pins). The lockout pads are numbered (1 & 2) and the Info Pads are lettered (A thru F) to highlight that the info pads and lockout pins are not intended to be interchangeable.

11.3.3 The info pads and lockout features are end user selectable. See Related Information R1-3 for an example of how they may be specified.

Figure 13Bottom View of Presence, Placement, Info-Pads and RFID tag placement





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Figure 14Sensor Pad & Hole Cross-Section

12 Requirement for RFID Tag Placement Volume12.1 The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID tag, if present, must be placed within the volume defined by x29, y26, y27, z37 and z38 as shown in Figures 13 and 15. 6: SEMI E144 provides specifications for the required elements of RFID tags.

Figure 15 RFID Tag Placement Volume

13 Requirements for Carrier Hold-Down Features13.1 The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly closer to the FP than the front kinematic coupling pins. Each feature consists of cylindrical volume centered at x28 and y38 with top and bottom surfaces at HP and z6 with radius r7. Each volume has an opening to the bottom of the carrier bounded by y34, y35 and r7. From the bottom of the opening, a vertical surface of height z7 joins (with a





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lsmall but unspecified blend radius) a sloping plane of angle θ3 above the horizontal (and parallel to the intersection of FP and HP). This sloping plane meets the surface at z6. See Figures 16 & 17.13.2 This configuration provides the load port with several options for holding the carrier in place not limited to the following: A hook shape that presses against the slope and the shelf, or A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the

sloping plane with or without contacting the incline. See Figure 18.13.2.1 Either (each) hold-down feature shall be able to withstand a force in any direction of f001 without permanent damage or deformation.13.2.2 Door opening and closing shall operate correctly with a force of f002 applied to either (each) hold-down feature. The carrier must withstand this force without impact on its intended function.

7: The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing forces that occur during the door insertion and removal operation. Carrier suppliers should consider the maximum force generated in their carrier design when designing the carrier’s hold down feature.

Figure 16Hold-Down Feature Locations





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Figure 17 Hold-Down Section at x28=50 mm

Figure 18 Hold-Down Devices

14 Requirements for Carrier Door14.1 The carrier door is on the front of the 450 FOUP. The door and its frame must be designed to mate with a load port that conforms to the SEMI standard for 450 mm load ports. (x43), (x44), (x45), (d4) and (d7) are provided for reference; the carrier shall be designed to interface with the dimensions and tolerances provided in the SEMI





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lstandard for 450 mm load ports. The FOUP door and its frame must have surfaces that mate with seal areas, the FOUP door sensing area, and reserved areas for vacuum application. See Figures 19, 21 & 23.14.2 The areas for vacuum application are the four circles bounded by r28 and located at x49 & z31. The vacuum pad areas, door seal areas, frame seal areas and door sense areas shall be at a distance of y4 from the FP when the door is closed and latched. No feature on the FOUP may project further from the FP than these areas. 14.3 Dimension y39 assures that there is clearance between the door and latch keys when the FOUP is pressed against the FIMS port and both latch keys on the port are inserted to their full length. See Figure 22. 14.3.1 When the latch keys are turned more than 45° toward the position that unlocks the FOUP door from the FOUP, the latch key holes on the door shall be such that the door is not removable from the latch keys.14.4 To allow for unobstructed latch key rotation, the thickness of the outer panel of the carrier door in the area defined by r23 shall be y10. Clearance for latch keys shall be provided by y39 at (x44). Clearance for door pins shall be provided by y40 at (x45). The latch keys and door pins shall be located on the centerline (CL). See Figure 22. 14.5 FOUP door features are symmetrical about the CL. Features other than the openings for Frame Pins and Door Pins are symmetrical about the BP.14.6 The opening for the door pin on the left side is circular with diameter (d4), and the opening on the right side is a slot. See Figure 23. The purpose of these openings is to assist with FOUP door recovery when the system experiences utility loss.14.7 The opening for the frame pins are circular on the left side with diameter d5, and are slots on the right side. See Figure 23.

Figure 19450 FOUP Door Features

14.8 The frame seal area is bounded by x11 & x64 on the sides, by z27 & z34 on the top, and by z28 & z43 on the bottom. There are blend radii r30and r36 at the inner and outer corners respectively.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l14.9 The door seal area is bounded by x47 on the sides, and by z33 on the top and bottom. The width of the seal area is given by x48 and z32. There are blend radii of r31 & r32 at the outer and inner edges respectively. See Figure 21 and Related Information R1-2.10.

Figure 20Carrier Door Frame





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Figure 21Carrier Door

Figure 22 Section at Door Centerline - Looking Down on the Right Side





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Figure 23 Frame Pin and Door Pin Area - Right Side

14.10 Front Clamp Features — See section 8.4. Figure 7 shows the top front clamp features and Figure 27 shows the bottom front clamp features. 8: It is recommended that the front clamp features not be used for pulling the FOUP from the undocked position into the FIMS interface. Also, all of the dimensions of the 450 FOUP (such as the wafer location, etc.) are defined with reference to the kinematic coupling pins, and will be in the proper location only when the 450 FOUP is held in place on the kinematic coupling pins only by gravity.14.11 Door Closing Force —The force required to push the carrier door into the carrier shell to its fully seated position is f234. The application of f234 to the door shall push the door fully closed, so that the outer surface of the door is equal to y4 from the FP. With the door in this position, the latches shall operate without exceeding the torque limit f230 for the latch keys.9: Carrier suppliers should design their products to keep this force required to close as small as possible to ensure no damage will occur to wafers upon opening and closing the door.14.12 Latch Torque — The maximum torque required to turn each of the latch mechanisms (with which the latch keys of a load port will engage) on the carrier door is f230.14.13 Door Latching and Unlatching ― The door of the FOUP must be designed so that the door is completely latched or completely unlatched when the door latch keys are turned to the angular positions described in the relevant SEMI Mechanical Interface Specification for 450 mm load ports. 14.14 Latch Pull Force — Load ports may pull in on the latches to hold the FOUP door in place with a force f235 that is defined in the SEMI standard for 450 mm load ports. 14.15 See Related Information R1-1.14 for more discussion.

15 Requirements for Conveyor RailsThis section specifies certain aspects of the 450 FOUP envelope that define the square conveyor rails, their exclusion areas, and relationships to other features.15.1 Conveyor Rail Surface Dimensions — The conveying surface extends below the HP, as shown in Figures 25 and 26. The bottom view is given in Figure 24. The conveyor rail surfaces are meant to provide smooth, continuous surfaces symmetric to the origin. The inner boundary of the conveying surfaces is defined by x6 and y6. The outer guiding edges of the conveying surfaces are defined by x5 and y5 on the left and rear sides. The front side is y13 from the rear side, and the right side is x59 from the left side. A blend radius r11 connects the inner boundaries, and the four outer corners are bounded by radius r10. The conveying surface forms a plane at a distance z12 below the HP. 15.2 Conveyor Rail Cylindrical Fork-lift Pin Holes – Cylindrical holes are provided in the side conveyor rails, defining cylindrical volumes on the FP. The holes (cylinders) are of diameter d1. The left side hole is located x60





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn linside of the left conveyor guiding surface, and the right side hole is x37 from the left side hole. Both holes are centered on the FP. The depth of the holes is z46. See Figure 25.15.3 Conveyor Guiding Surface —. The external edges of the conveyor rails will provide a physical conveyor guiding surface consisting of a vertical edge with height of z10 above the conveying surface. No part of the FOUP may occupy the space outside of or below the conveyor guiding surface below its top at z10. Note that r35 applies to the guiding surface while r10 applies to parts of the carrier that are above z10.

15.3.1 The (vertical) conveyor guiding surfaces shall be opaque for the purpose of presence sensing.

Figure 24Conveyor Rail Locations





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Figure 25 Conveyor Rail: Section at FP

Figure 26 Conveyor Rail: Section at BP





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l16 Requirements for Port Exclusion Areas16.1 The port area is here described only as an exclusion area. No details are assumed for the shape or other details for the port interface.16.2 As shown in Figure 27 port exclusion areas of radius r14 are defined at the four points defined symmetrically at distance x7 left and right of the BP and distance y57 to the front and y7 to the rear of the FP.

Figure 27Port Locations & Front Clamps

17 Requirements for Wafer Support Features 17.1 Location of wafer supports — 450 mm wafers shall not be handled or supported within an exclusion area that extends 3 mm in from the edges of the wafers. Dimensions have been selected to keep backside contact more than 3 mm away from the edge of a wafer, when it is within either the wafer pick-up volume or wafer set down volume. See Related Information 3 for more information about the exclusion area. See Figures 28, 29 & 30.17.2 The wafer support areas are bounded by r17 towards the front and rear, by x13 on the inside and x8 on the outside. If the wafer supports are moved out from x13 the wafer deflection will increase. See Related Information 2 for discussion of wafer sag. At the rear of the carrier, an additional support area, bounded by x14, and between r17 and y11, may be provided at the carrier supplier’s option for wafer support. 17.3 Appendix 2 describes a method for measuring the wafer seating planes.17.4 The wafer support contact with the wafer back side shall minimize generation of particles, and prevent the wafer edges from making contact as follows. The contact with the wafer shall be at discrete points.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l The contact points shall prevent the back side (bottom) of the wafer from contacting any other part of the

support structure. The height of the wafer support structure shall be limited by the wafer pitch z17 and the wafer clearance z16.

This shall include the wafer support structure and contact points. The contact points shall be shaped so that in case the wafer slides on the wafer support, it will not be caught on

the contact point.

10: If wafer being inserted into the carrier strikes a rear support it is likely to break.

17.5 The carrier shall have features to constrain the wafer along all axes so the wafer will be within the wafer pick-up volume after the door is opened. See Figures 31 & 32.

Figure 28FOUP Section (Between Wafer Supports)





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Figure 29Wafer Support Area

Figure 30Wafer Slots





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Figure 31Wafer Pick-Up Volume (Between Wafer Supports)

Figure 32 Wafer Pick-Up Side View





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Figure 33Wafer Set-Down Volume (Between Wafer Supports)

Figure 34 Wafer Set-Down Side View





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Figure 35Wafer Extraction Volume (Between Wafer Supports)

Figure 36 Wafer Extraction Side View

17.6 Requirements for Wafer Insertion and Extraction





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l17.6.1 Vertical Dimensions — Figures 4 & 5 show the vertical dimensions of the carrier. Note that z14 (the height of the bottom nominal wafer seating plane above the HP) and z17 (the distance between adjacent nominal wafer seating planes) are given as absolute distances with no tolerance. This means that the deviation of each wafer support from its nominal height shall be no more than z21. The space reserved for end effectors below the first wafer shall be z15. The space above the top wafer support shall be z18. The method for meeting these requirements is left up to the carrier supplier. See also Figure 30.17.6.2 Wafer Set-Down Volume ― The open space for the wafer set-down volume consists of a cylindrical section with radius r12 and a vertical axis y14 in front of the origin. The bottom of this cylindrical section is z49 above the nominal wafer seating plane and its height is z22. See Figures 33 & 34.17.6.3 The implications of the tolerance on r12 for wafer positioning are as follows. The wafers shall be placed in the carrier within a circle of radius corresponding to the smaller bound on r12 to avoid touching the edge of the wafer to the side of the carrier. Once the wafer has been placed, the carrier shall not allow a wafer to move outside of a circle of radius corresponding to the larger bound on r12. Except that when the carrier door is closed and re-opened, the wafer seating plane shall be within the wafer pick-up volume (see ¶ 17.2.6). 17.6.4 Wafer Extraction Volume ― The open space for the wafer extraction volume shall include a cylindrical section with radius r18 which has a vertical axis y14 in front of the origin. The vertical cross section at the FP is extended out to the door opening. The bottom of this cylindrical section is z22 above the nominal wafer seating plane and its height is z49. See Figures 35 & 36.17.6.5 The implications of wafer extraction for the definition of dimension r18 are as follows. The carrier shall provide an extra 1 mm (0.04 in.) of horizontal clearance once the wafer is picked up from wherever it ends up (within the bounds of r12) after transport in the carrier. 17.6.6 If a wafer is placed in the wafer set-down volume and the carrier door is closed and subsequently opened (i.e. a normal transportation between load ports), the wafer seating plane shall be contained in the wafer pick-up volume. 11: If the wafer is not pushed toward the rear of the carrier, then the wafer may only be somewhere within the wafer extraction volume.17.6.7 Wafer Pick-Up Volume ― The wafer pick-up volume shall be defined by a cylindrical section with radius r13 and a vertical axis at the origin. Its top and bottom are the upper and lower tolerance of z21 around the nominal wafer seating plane. See Figures 31 & 32.

18 Requirements for End Effector and Wafer Mapping Exclusion Volumes18.1 End Effectors ― End effectors reaching into the carrier shall stay between the wafer support areas defined by x13, except as specified in paragraph 18.1.2. See Figure 37.18.1.1 The maximum reach into the carrier is limited by r6, y11, and y19. 18.1.2 If an end effector width extends beyond x13, it shall not extend beyond y8 when the width is between x13 and x12.18.2 Wafer Mapping ― A volume shall be reserved for wafer mapping. 18.2.1 It shall extend from z26 above the HP up to z25 above the top nominal wafer seating plane. See Figure 4.18.2.2 It shall extend from y55 to y9 and shall have a width of x12. See Figure 28.





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Figure 37End Effector Exclusion





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Table 1 Carrier and KC Dimensions 12:All linear dimensions are in mm, all angular dimensions are in degrees.

Symbol Used Figure Value Specified Datum Measured From Feature Measured To

θ1 9 45 ±6 degrees Vertical (BP & FP) Angle from vertical of the planar surfaces of kinematic coupling grooves

(θ2) 11 (34.0 degrees) BP Axis of symmetry of front pin-mating groove s

θ3 17 30.0 ±2 degrees HP Incline of hold-down featureθ4 3, 5 45 ±0.5 degrees Vertical (BP & FP) Edge of automation flange centering

featureθ5 2 45 ±0.5 degrees Perpendicular to Side surface

of automation flangeSide surfaces of automation flange notches

θ6 7 45 ±0.5 degrees FP Side of fork-lift retainer feature

d1 24 8.0 ±0.5 x37, x60 & FP Diameter of fork-lift pin hole(d2) 3 (17) Automation flange centering

feature at x63, y54Diameter at bottom of depression

d3 2, 3, 5 51 ±0.5 Automation flange centering feature at x63, y54

Diameter at top of depression

(d4) 21 (10.6) x45, CL Diameter of door pin openingd5 20 6.5 ±0.5 x46, CL Diameter of frame pin openingd6 23 6.5 ±0.5 (x40 & x41), CL Diameter of slot for frame pin(d7) 23 (10.6) (x43 & x42), CL Diameter of slot for door pin

f001 ¶ 13.2.1 ≥ 175 N Applied at any point, in any direction

Force that the any one hold down feature that the carrier must withstand.

f002 ¶ 13.2.2 ≥ 141 N Force applied to hold down feature

Force that carrier must withstand during door opening and closing without a negative impact on the intended function of the carrier

f230 ¶ 14.12 ≤ 1.7 Nm Latch Key Torque required to operate latches (each latch key)

f234 ¶ 14.11 ≤ 192 N Door Force to close carrier door

r1 8 10.0 ±0.025 Centerline of KCP Cylindrical (side) surface of KCPr2 8 14 ±0 Centerline of KCP Circle to define center of curvature of

KCP contact surfacer3 8 30.0 ±0.05 Circle defined by r2 & z4 Contact surface of KCPr4 8 15.0 ±0.05 Centerline of KCP & z3 Top surface of KCP (sphere)r5 8 2.0 ±0.1 Blend radius Surface between KCP contact surface

and adjacent surfacesr6 28, 37 ≥ 245 Origin Rear boundary of EE exclusion arear7 16 ≥ 30 x26, y29 Space in hold-down featurer8 11 ≤ 136 Origin Innermost end of Kinematic Coupling

Groove for Front KCPsr9 11 ≥ 218 Origin Outermost end of Kinematic Coupling

Groove for rear KCPr10 6, 24, 28 ≤ 314 Origin Outer limit of carrier and conveyor

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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lSymbol Used Figure Value Specified Datum Measured From Feature Measured To

r11 24 ≥ 10 Blend Radius Blend radius of conveyor rail edgesr12 33, 34 227 +1/-0 x=0, y14 Radius of wafer set-down volumer13 31, 32 ≤ 226 Origin Radius of wafer pick-up volumer14 27 25 x7, y7 and x7, y57 Radius of exclusion area for portsr15 10 ≥ 15 N/A Lead in: correctable 450 FOUP

misalignment in any horizontal direction

(r16) 11 (145) Origin Location of rear secondary KCPr17 29 ≤ 220 x=0, y20 Wafer support area for wafer offset by

y20r18 35, 36 ≥ r12 + 1 Origin Radius of wafer extraction volumer20 6 ≤ 17 BP, y36 Outer surface of cylinder contains the

center of gravity of the carrierr21 13 ≥ 10 Center of Info, placement and

Lock-Out padsExtent of pad area

(r22) 11 (206.5) Origin Location of front primary KCPsr23 21, 23 ≥ 14 latch key Clearancer24 11 > 231 Origin Outermost end of Kinematic Coupling

Groove for Front KCPs(r25) 11 (225) Origin Radius of 450 mm diameter wafer(r26) 11 (160) Origin Location of front secondary KCPs(r27) 11 (194) Origin Location of rear primary KCPr28 21 ≥ 30 x38, z31 Area reserved for vacuum padsr29 21 ≥ 20 x44, CL & x45, CL Boundary of door sense arear30 20 ≤ 23 Blend radius Corners of frame seal area r31 21 ≥ 21 Blend radius Outer edge of door seal area r32 21 ≥ 19 Blend radius Inner edge of door seal arear33 11 ≤ 121 Origin Innermost end of Kinematic Coupling

Groove for Rear KCPsr35 24 313 ±1 Origin Front and rear corners of conveyor

guiding surfacer36 20 ≤ 33 Blend radius Corners of frame seal area

Ra1 ¶ 9.1 ≤ 0.30 µm n/a Kinematic Coupling Pin surface finish roughness per ISO 4287

(x1) 1, 5, 11, 20, 28

(≤555) n/a Overall width of carrier

x2 6, 7, 20, 28 ≤ 277.5 BP Outer edge of carrierx3 2 300 ±0.5 Right side of automation flange Left side of automation flangex4 5, 6 150 ±1 BP Right edge of automation flange on

carrierx5 5, 24, 25 234 ±1 BP Outer edge of left side conveyor rail

surfacex6 24, 25 ≤ 220 BP Inner edge of side conveyor rail

surfacex7 27 185 BP Center of port exclusion areax8 29 ≤ 185 BP Outside boundary of wafer support

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x9 13 ≤ 220 BP Outer edge of presence sense areax10 13 193 ±1 BP Outer center of placement sense pad

x11 20, 28 ≤ 259 BP Inner edge of frame seal areax12 28, 37 ≥ 243.5 BP Inner edge of EE exclusion area x13 29, 37 ≥ 135 BP Inner extent of wafer support surface x14 29, 37 ≤ 25 BP Extent of rear wafer support structurex15 7 ≥ 250 BP Outer side of top front clamping

featurex16 7 ≤ 210 BP Inner side of top front clamping

featurex17 7 ≤ 260 BP Inner side of fork-lift feature x18 11 171.20 ±0.05 BP Location of front primary KCPx19 11 132.65 ±0.05 BP Location of front secondary KCPx20 13 ≤ 160 BP Inner edge of side presence sense areax21 13 141 ±1 BP Outer center of placement sense padx22 13 ≥30 BP Edge of central presence sense padx23 13 55 ±1 BP Center of rear placement sense padx24 13 55 ±1 BP Center of lock-out pad (1 left / 2 right)x25 13 85 ±1 BP Center of info pad (C left / D right)x26 13 115 ±1 BP Center of info pad ( B left / E right)x27 13 145 ±1 BP Center of info pad (A left / F right)x28 16 50 ±0.5 BP Center of hold-down featurex29 13 25 ±1 BP Side of RFID placement volumex30 2 50 ±0.5 Right side of automation flange Automation flange notchx31 2 210 ±0.5 Right side of automation flange Automation flange notchx32 2 12 ±1 Edge of flange Automation flange chamferx33 2 250 ±0.5 Right side of automation flange Automation flange notchx34 5 ≤ 132 BP Side of automation flange neckx35 7 14 ±0.5 Outer edge of carrier Depth of notch for fork-liftx37 24 450 ±1 Left fork-lift pin hole Right fork-lift pin holex38 21, 23 ≥ 10 Centered at x44, CL Width of latch key clearancex40 23 ≥ 1.0 Centered at x41 Length of slot for frame pin

x41 23 272 ±0.5 BP Center of slot for right frame pin, r24x42 23 ≥ 3.0 Centered at x43 Length of slot for door pin(x43) 23 (220) BP Center of slot for right door pin, r22(x44) 21, 23 (142) BP Latch key opening(x45) 21 (220) BP Left door pin openingx46 20 272 ±0.5 BP Left frame pin openingx47 21 256 ±1 BP Outer edge of door seal areax48 21 ≥ 2 Outer edge of door seal area Inner edge of door seal areax49 21 200 BP Area reserved for vacuum padsx50 5, 28 ≥ 229 BP Inner wall of carrierx56 2 14 ±0.5 Edge of automation flange depth of notchesx57 27 ≥ 257 BP Outer side of bottom front clamp





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x58 27 ≤ 217 BP Inner side of bottom front clampx59 24 469 +0,-2 Left side of conveyor guiding

surfaceOpposite side of conveyor guiding surface

x60 24 9 ±0.2 Left side of conveyor guiding surface

Left fork-lift hole

x61 13 154 ±1 BP Inner center of placement sense padx62 13 102 ±1 BP Inner center of placement sense padx63 2 150 ±0.5 Right side of automation flange Front automation flange notch and

center of d3x64 20 ≥ 275.5 BP Outer side of frame seal areax66 7 276 ±1 BP Outer surface of fork-lift feature

(y1) 1, 11, 28, 31

(≤ 481.75) n/a Overall depth of carrier

y2 4, 6, 24, 28 ≤ 235 FP Rear of carriery3 2 300 ±0.5 Front side of automation flange Rear side of automation flange y4 4, 6, 26, 28,

35246.25 ±0.5 FP Front surface of carrier at door and

frame seal areas, and reserved areas for vacuum application and door sensing

y5 24, 26 234 ±1 FP Outer edge of front & rear conveyor rail surface

y6 24, 26 ≤ 220 FP Inner edge of front & rear conveyor rail surface

y7 27 174 FP Center of rear port exclusion areasy8 28, 29, 37 ≤ 180 FP Inner extent of EE exclusion area

between x12 and x13y9 4, 28, 37 ≥ 211.25 FP Inner surface of doory10 22 3.00 ±0.25 Front surface of door (y4) Space for unobstructed rotation of

latch keysy11 29, 37 ≥ 200 FP Extent of rear wafer support structurey12 4, 6 162 ±1 FP Front edge of automation flangey13 24 469 +0,-2 Front conveyor guiding surface Rear conveyor guiding surfacey14 33 >0, ≤3.0 FP Center of r12y15 11 194 ±0.05 FP Location of rear primary KCPy16 11 115.5 ±0.05 FP Location of Front Primary KCPy17 11 89.47 ±0.05 FP Location of front secondary KCPy18 11 145 ±0.05 FP Location of rear secondary KCPy19 4, 28, 29,

31, 33, 34, 35, 36, 37

≥ 228 FP Inner extent of EE exclusion area near rear wafer support structure

y20 29 5 ±0 FP Center of wafer for defining rear wafer support location, r17

y21 13 ≥ 30 FP Edges of side presence sense areay22 13 151 ±1 FP Outer center of placement sense pady23 13 74 ±1 FP Outer center of placement sense pady24 13 120 ±1 FP Row of info and lock out padsy25 13 194 ±1 FP Center of rear placement sense padsy26 4, 13, 15 ≥ 225 FP Front of RFID placement volume





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y27 4, 13, 15 ≤ 230 FP Rear of RFID placement volumey28 2 12 ±1 Edge of automation flange Automation flange chamfery29 2 90 ±0.5 Front side of automation flange Automation flange notchy30 4, 6 ≥ 195.75 FP Back of door flangey31 2 14 ±0.5 Side of automation flange Depth of notchesy32 5.2.4 194 ±0 FP Nominal location of rear primary KCPy34 16, 17 90 ±0.5 FP Front edge of hold-down openingy35 16, 17 60 ±0.5 FP Rear edge of hold-down openingy36 6 12 ±1 FP Center of cylinder containing the

center of gravityy37 3 ≤ 144 FP Front side of automation flange necky38 16, 17 75 ±0.5 FP Center of hold-down featurey39 22 ≥ 12 Front surface of door Clearance for latch keysy40 22 ≥ 12 Front surface of door Clearance for door pin and frame piny43 7 3.5 ±0.5 Front surface of FOUP frame Front side of front clamping featurey44 7 ≤ 222.75 FP Rear side of front clamping featurey45 7 ≥ 180 FP Front side of fork-lift featurey46 7 ≥ 120 FP Rear limit of surface for fork-lifty47 27 3.5 ±0.5 Front surface of FOUP Frame Front side of bottom front clampy48 27 ≤ 230 FP Rear side of bottom front clampy50 13 95 ±1 FP Placement sense pad y52 13 125 ±1 FP Inner center of placement sense pady53 13 48 ±1 FP Inner center of placement sense pady54 2 150 ±0.5 Front of automation flange Automation flange notchy55 4 ≤ 196.25 FP Rear of wafer mapping exclusion

volumey56 3 ≤ 120 FP Rear side of automation flange necky57 27 179 FP Center of front port exclusions areas

(z1) 1, 4, 5 (≤ 404) n/a Over all height of carrierz2 5 ≥ 17 Top of automation flange Bottom of centering depressionz3 8 15 ±0 HP Point on KCP centerline to define KCP

top surface, r1z4 8 24.543 ±0 HP Center of radius, r3 z5 7 ≥ 12 Top of door frame Bottom of upper front clamp featurez6 17 11 ±0.5 HP Lower horizontal surface inside hold-

down featurez7 17 6 ±0.2 Lower horizontal surface inside

hold-down featureLower edge of hold-own incline

z8 1, 4, 5 382 ±1 HP Top of carrierz9 3, 4, 5 ≥ 21 Bottom surface of automation

flangeClearance for use of automation flange

z10 25, 26 ≥ 8 Conveyor running surface, z12 Top edge of conveyor guiding surfacez11 4, 5, 9, 10,

14, 17, 25, 26

≤ 21 HP FOUP bottom surface areas not otherwise specified

z12 25, 26 20 ±1.0 HP Conveyor surface





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z13 3, 5 7.5 ±0.5 Top surface of automation flange

Bottom surface of automation flange

z14 4 36 ±0 HP Bottom nominal wafer seating planez15 4 ≥ 12 Height of first wafer slot top Clearance below top of first wafer slotz16 30 ≥ 8 Top surface of each nominal

wafer seating planeBottom surface of next higher wafer support

z17 30, 32 12 ±0 Each nominal wafer seating plane

Adjacent nominal wafer seating planes (wafer pitch)

z18 4 ≥ 8 Top surface of top wafer slot Any point above top nominal wafer seating plane

z19 7 163 ±1 HP Top of fork-lift featurez20 7 ≥ 10 Top of fork-lift feature Bottom of fork-lift retainer featurez21 30, 32 0 ±0.5 Each nominal wafer seating

planeEach actual wafer seating plane

z22 34, 36 6.8 z49 above each nominal wafer seating plane

Top of wafer extraction and wafer set-down volumes

z23 14 20 ±0.5 HP Surface of placement sense padsz24 14 ≤ 15 HP Top of space within lockout & info

pads when not activez25 4 ≥ 17 Top of wafer 25 nominal

supportTop of wafer mapping exclusion volume

z26 4 ≥ 17 HP Bottom of wafer mapping exclusion volume

z27 20 ≥ 192 CL Top of frame seal areaz28 20 ≥ 188 CL Bottom of frame seal areaz29 14 20, +1, -5 HP Presence sense areaz30 20, 21 178 HP CL – Horizontal Center Line of the

doorz31 21 129 CL Center of area reserved for vacuum

padsz32 21 ≥ 2 Outer edge of door seal area Inner edge of door seal areaz33 21 178 ±1 CL Outer edge of door seal areaz34 20 ≤ 181 CL Inner edges of frame seal area z35 7 ≤ 74 HP Bottom of fork-lift featurez36 7 ≥ 4 Bottom of door frame Top of lower front clamp featurez37 15 ≥ 5 HP Bottom of RFID placement volumez38 15 ≤ 10 HP Top of RFID placement volumez42 20 (12) HP Bottom of door flange

z43 4, 7, 20 376 ±1 HP Top of door flange(z44) 4, 20 (≤ 362) n/a Height of door opening(z45) 20 (388) n/a Height of door flangez46 25 ≥ 9 Conveyor running surface Depth of opening for fork-lift pinz48 17 ≥ 11 Lower horizontal surface inside

hold-down featureUpper horizontal surface inside hold-down feature

z49 34, 36 0.7 Each nominal wafer seating plane

Bottom of wafer extraction volume. (To center the extraction volume between slots)

z50 14 20 ±1 HP Height of info and lockout pads when active





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lUnless otherwise noted, all dimensions are in mm. Reference dimensions are in parentheses and are not requirements.Measured values for dimensions without specified tolerance should be rounded up or down to the last significant figure of the dimension in accordance with good engineering practice.Measured values for dimensions with specified tolerances should be rounded up or down to the last significant figure of the tolerance in accordance with good engineering practice.

Table 10 Derivation of Reference DimensionsSymbol Used Value Formula(x1) (≤ 555) x2 + x2 (≤ 277.5 + ≤ 277.5)(y1) (≤ 481.75) y2 + y4 (≤ 235 + 246.25 +0.5)(z1) (≤ 404) z8 + z11 (382 +1 + 21)(z42) (≤12) z12 – z10 (20 +1 - ≥9)(z44) (362) Z34 + z34 (181 + 181)(z45) (388) z42 + z43 (12 + 328)





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lAPPENDIX 1FIXTURES for MEASURING the HORIZONTAL PLANENOTICE: The material in this appendix is an official part of SEMI (doc#) and was approved by International Physical Interfaces & Carriers Committee vote procedures on (date of approval).

IntroductionThere are at least two ways to implement a jig/fixture, for establishing the HP, depending on the expected purpose and accuracy.

A1-1 Top Surface of KCPsA1-1.1 A simple fixture can establish the HP by setting a flat plate on top of the three KC pins. The lower surface would represent the HP with an accuracy limited by the tolerances of r15 and r3. Such a method will be suitable to determine the distance from the HP to the floor (e.g. for positioning equipment). See Figure A1-1.

Figure A1-1 Flat plate precision limited by tolerance stack-up

A1-2 Emulating KC GroovesA1-2.1 A more precise fixture would emulate the KC grooves, where the upper surface may be designed to be at a position to reflect the height of the first wafer. Any method using KC grooves would cause similar tolerance stack-ups as a real 450 FOUP, since it is resting on the same contact points of the KC pins. A1-2.2 The tolerances of the radius on the upper points of the KC pins would not affect such a fixture. This type of fixture is needed for precise measurements and alignments.A1-2.3 In the example in shown in Figure A1-2, the HP adjustment/alignment would be completely independent from the tolerance of the radius on top of the KC pins.



HP

r4=nominal　RR335

r4=nominal

r3=Maximum r3=Minimum

X m m

fr o m

th e H P

KC Plate

ust sure theLevel



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Figure A1-1Precision is independent of KCP top surface



HP

r4=Maximum r4=Minimum

r3=Minimum r3=Maximum

Xm m

fro m

the

HP ust sure theLevel

KC Plate



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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lAPPENDIX 2MEASUREMENT of WAFER SEATING PLANESNOTICE: The material in this appendix is an official part of SEMI (doc#) and was approved by International Physical Interfaces & Carriers Committee vote procedures on (date of approval).

A2-1 Suggested Method for Measuring Wafer Seating PlanesA2-1.1 Although wafer seating plane measurement is not limited to any specific method, it is recommended that, for inspection purposes, the wafer seating plane can be measured at three points at the front of the FOUP. One point is at the intersection of the front of the wafer and the BP and two points are at the intersection of the wafer and symmetric planes located 30 degrees from BP.

A2-1.2 Wafer height at each of the 25 slots is to be measured from HP, and single crystal wafers are to be used.

A2-1.3 Three front measurement points cannot characterize the entire wafer seating plane perfectly; therefore, this measurement method is recommended for the purpose of ongoing inspection during the manufacturing of a FOUP. For qualification purposes, the carrier supplier may choose to provide more detailed wafer seating plane measurement data to the end user.

Figure A2-1Wafer Plane Measurement





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lAPPENDIX 3METHOD FOR MEASURING CARRIER CENTER OF GRAVITYNOTICE: The material in this appendix is an official part of SEMI (doc#) and was approved by International Physical Interfaces & Carriers Committee vote procedures on (date of approval).

A3-1 Suggested Method Using Load CellsA3-1.1 The carrier’s COG (center of gravity) can be measured by using three load cells. A3-1.2 Each of the load cells should provide a support point similar to the Kinematic Coupling Pins defined in this standard.A3-1.3 The location of the pins should conform to the Relevant SEMI Standard for 450 mm load ports in order to provide a reference for the FP and BP.A3-1.4 VariablesA3-1.4.1 F1, F2 & F3 – the downward force on each pin due to the weight of the carrier.A3-1.4.2 Lx – the distance parallel to the FP between the front KCPs.A3-1.4.3 Lx/2 –the distance from each front KCP to the BPA3-1.4.4 Ly – the distance parallel to the BP between the front KCPs and the rear KCPA3-1.4.5 Lx0 – the distance from the BP to the COG.A3-1.4.6 Ly0 – the distance from the rear KCP to the COG.A3-1.5 Derivation of Lx0 Calculation:

F1 × Lx0 + F3 × (Lx / 2 + Lx0) = F2 × (Lx / 2 - Lx0)F1 × Lx0 + F3 × Lx / 2 + F3 × Lx0 = F2 × Lx / 2 – F2 × Lx0(F1 + F2 + F3) × Lx0 = (F2 - f3) × Lx / 2Lx0 = Lx / 2 × (F2 - F3) / (F1 + F2 + F3)

A3-1.6 Derivation of Ly0 Calculation:F1 × Ly0 = F2 × (Ly - Ly0) + F3 × (Ly - Ly0)F1 × Ly0 = F2 × Ly – F2 × Ly0 + F3 × Ly – F2 × Ly0(F1 + F2 + F3) × Ly0 = (F2 – F3) × LyLy0 = Ly × (F2 – F3) / (F1 + F2 + F3)

1: For the Primary KCPs Lx = 342.4 mm (x18 × 2) and Ly = 309.5 mm (y15 + y16). For the secondary KCPs Lx = 265.3 mm (x19 × 2) and Ly = 234.5 mm (y17 + y18).





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Figure A3-1Center of Gravity Measurement





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lRELATED INFORMATION 1 APPLICATION NOTESNOTICE: This related information is not an official part of SEMI (doc#) and was derived from the work of the International Physical Interfaces & Carriers Committee. This related information was approved for publication on (date of approval) by the International Physical Interfaces & Carriers Committee.

R1-1 Referenced Documents and StandardsR1-1.1 SEMI Auxiliary DocumentsSEMI AUX012-0705 — 300 mm FOUP/Load Port Interoperability Report

R1-2 Notes:R1-2.1 The automation handling features do not need to be molded into the plastic shell of the FOUP, but can be attached as a framework around the shell.R1-2.2 Skewness, warp, rock, and stiffness are implicitly defined in the geometric tolerances.R1-2.3 Dimension y4 is given as a maximum based on the maximum distance to the port door specified in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports. Dimension y4 applies to the frame seal area, door seal area, vacuum seal areas, and door sense areas. No part of the door or frame may extend beyond these critical areas. Each of these areas should be suitable for a seal surface. The door seal, vacuum seal and door sense areas should form a plane. R1-2.4 The position tolerance of the door of the FOUP is likely to be much larger than the position tolerance of the door pins. To make both manual and automated door opening easier, it is recommended that the holes for the door pins on the door of the FOUP have openings with a lead-in capability.1: If the bottom of the FOUP does not extend below the bottom conveyor rail, the conveyor rail may become contaminated and may distribute particles.R1-2.5 Although both of the retaining features on the bottom of the FOUP must be able to withstand a force in any direction of f001, continuously applied stress may result in plastic deformation.R1-2.6 In order to minimize particle generation when the FOUP door is opened or closed, it is recommended that the tolerance between the FOUP door and its frame be larger than the tolerance between the FOUP door pin holes and FIMS door pins.R1-2.7 One type of carrier presence sensor uses a beam of light with an optical detector that is triggered when the beam of light is attenuated as it passes through the FOUP shell.R1-2.8 The use of the door pins for FOUP door lead-in to the load port door is not recommended. The door pins should be only used to limit the maximum displacement of the FOUP door while on the load port door. Neither the FOUP nor FOUP door positions should change as a result of engaging or disengaging the door pins. When the Load port experiences utility loss (such as EMO, vacuum loss, electrical failure, etc.), the door pins may be used to maintain the FOUP door’s position, and to ensure that the FOUP door does not fall off. The clearance between the Door Pins and the Door Pin Holes should be less than the clearance between the outer edge of the FOUP Door and the inner edge of the FOUP Door Frame. Balancing these tolerances is a FOUP design issue related to the Seal Area specified in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports. The diameter of the Door Pin Holes should be designed to accommodate the Door Pin tolerances defined by x239, z238 & d231 in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports, and the Door Pin Hole location tolerance in a FOUP.R1-2.9 It is recommended that the FOUP have a capability to roughly position the FOUP door in the FOUP frame during the door close sequence (during either return of the FOUP door or during latching of the FOUP door). This positioning capability should keep the clearance between the FOUP frame and the FOUP door larger than sum of the FOUP (self) tolerance and the door pin tolerance in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports along with the FOUP door’s circumference. Possible methods for accomplishing this may include positioning by latch motion and positioning by a slope between the FOUP frame and the FOUP door.R1-2.10 There is a gap between the load port door and door frame, which allows clean air from the EFEM minienvironment to displace the volume of the carrier door when it is opened. The size of the carrier door should be coordinated with the accuracy of its placement on the load port door, so this gap is kept clear on all sides when the





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lcarrier door is opened. The half-width of the load port door is x233 = 257±0.25 mm, and the half-height is z233 = 179±0.5, so the size of the carrier door plus its positioning error should be kept below these values. If the half-width plus placement error exceeds 257 mm a side gap may be partially covered. If the half width plus placement error exceeds 259 mm, a side gap may be completely covered. If the half-height plus placement error exceeds 179 mm the top and/or bottom air gap may be partially covered. If the half-height plus placement error exceeds 181 mm, the top and/or bottom air gap may be completely covered. Partial covering is shown in the yellow area of Figure R1-1, the red areas signifies complete covering. See Figure R1-1.R1-2.11 It is recommended that the FOUP have a lead-in mechanism on its latch key holes. This lead-in mechanism should compensate for the FOUP’s latch key hole location error. See Figure R1-2.R1-2.12 It is recommended that the latch key hole mechanisms have some flexibility in their position for compliance with the latch key positions. The purpose of this is to adjust for any discrepancy in rotation axis between the latch key and the latch key hole mechanism. As shown in Figure R1-3, if only one side of the latch key pushes on the inside of the latch key hole, the latch key can not rotate more than half way.R1-2.13 It is recommended that the torque required to rotate the FOUP latch key holes be kept small enough that it will not produce movement of the FOUP door in the x and z directions during latch key rotation. R1-2.14 It may be possible for latches to fail to engage the carrier door frame properly. See SEMI AUX 012.R1-2.15 It is recommended that the latch key holes be maintained in the position that unlocks the FOUP door from the FOUP (ψ = 0 ± 1° as defined in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports) while the FOUP is open and in the position that locks the FOUP door to the FOUP (ψ = 90 ± 1°) while the FOUP is closed. One method to accomplish this is to have the FOUP latch key hole mechanisms snap into both end points of their rotation (ψ = 0 ± 1° and ψ = 90 ± 1°) using a detent mechanism. The torque required to overcome such a detent mechanism should not exceed f230 (as defined in Table 1of this document).R1-2.16 It is recommended that the space approximately 2 mm above z18 (above the top wafer support) be kept clear of vertical surfaces so that if a wafer is inserted above the extraction volume, it will be forced down rather than collide.

``



X:255.0Z:177.0

X:256.0Z:178.0

X:257.0Z:179.0

2.00mm

1.00mm

0.00mmDoor

size

Door positiontolerance

Gap Clear

Partially Covered

Gap Covered

X:258.0Z:180.0

X:259.0Z:181.0

3.00 mm



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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lFigure R1-1

Coordinating Carrier Door Size and Placement Accuracy

Figure R1-2Displacement Enabled by Flexibility Around Latch Key Hole Block

Latch key can rotate full 90°

Latch key rotation stops before 90°

Figure R1-3Need for Latch Key Hole Flexibility





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lR1-3 Carrier Options ChecklistTable R1-1 can be used for communicating the compliance of FOUPs to this standard and the options chosen:Table R1-1

Section Optional Feature Choice

11.3 info pad A height up (pad missing)or

down (pad present)11.3 info pad B height up (pad missing)

or down (pad present)

11.3 info pad C height up (pad missing)or

down (pad present)11.3 info pad D height up (pad missing)


11.3 info pad E height up (pad missing)or

down (pad present)11.3 info pad F height up (pad missing)


11.3 Lockout Pad 1 up (pad missing)or

down (pad present)11.3 Lockout Pad 2 up (pad missing)






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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lRELATED INFORMATION 2 CONSIDERATIONS for DETERMINING DIMENSIONS NOTICE: This related information is not an official part of SEMI (doc#) and was derived from the work of the International Physical Interfaces & Carriers Committee. This related information was approved for publication on (date of approval) by the International Physical Interfaces & Carriers Committee.

R2-1 Referenced Standards and DocumentsR2-1.1 Semi StandardsSEMI M74 — Specification for 450 mm Diameter Mechanical Handling Polished Wafers

R2-2 Discussion R2-2.1 The PIC committee considered the specifications in SEMI M74, the draft for the SEMI standard for 450 mm load ports, and this document to determine how much space between wafers and wafer supports is needed for safe handling of wafers. In addition, the following issues were considered: R2-2.1.1 wafer deflection under gravity — the deflection caused by gravity of a wafer resting on the carrier supports directly above the end effector pick-up points and at a 30 degree angle from the line of end effector stroke. Once the wafer has been lifted by the end effector, the deflection will be determined by the design of the end effector and is not considered to add to the budget for the end effector with wafer. The reason for measuring at 30 degrees is that the height of the end effector pads allows for some droop between the pads without the wafer touching the end effector structure. Based on the measurements made by ISMI and simulations done by task force participants, the committee has used the value of 0.50 mm. R2-2.1.2 process induced warp — 300 mm wafers have had process induced warp as great as 1 mm. When this is extrapolated to 450 mm wafer size, the warp would be 1.6mm. With 300 mm wafers, the warp has produced wafers with a convex top surface and a concave top surface. When an end effector is inserted between two wafers the clearance is reduced by 3.2 mm. Once a wafer has been picked up, the effect on clearance will be 1.6 mm since the end effector has moved up away from the wafer below. R2-2.1.3 carrier placement error — the maximum misalignment of the carrier that is expected, based on prototype testing, is 0.2 mm. This error results in the carrier not fully seating on the KC pins, so it is always a positive error. R2-2.2 After testing and discussion the committee has settled on a wafer pitch of 12 mm.

R2-3 Height of wafer extraction and set-down volumes R2-3.1 The height of extraction and set-down volumes dimensions is equal to the clearance between wafer supports minus to tolerance of the wafer planes and the carrier placement error. Since the carrier placement error serves to raise the wafer supports above their nominal position, it causes the volumes to be offset.. So the volumes start 0.7 mm above nominal wafer seating plane and extend to within 0.5 mm of the next wafer support.

R2-4 Kinematic Coupling SystemR2-4.1 The central approach in scaling the kinematic coupling concept to the 450 FOUP was to try to make the current 300 mm style of pin the plan if possible. While mass of fully loaded 300 mm carriers was about 7.6 kg, the mass of 450 mm carriers is estimated to be 24 kg. The increased weight load of the 450 FOUP means that the existing 300 mm pin would have provided a contact pressure that could have exceeded safe deformation limits for the likely carrier materials. R2-4.2 The key structure of the 450 FOUP bottom consists of a pedestal extending below the lowest FOUP door surface. A number of advantages can be obtained from this approach: More vertical space can be used to increase the “lead-in” or capture area during handoff (more discussion of this

in the detailed discussion of the groove below). Provides separate heights for the conveying surfaces and the door features, so that both features can be better

optimized for their intended purposes. Conveyor rail can be moved inward from the edge, so that the conveying surface does not define the lateral

envelope of the carrier (as both the conveyor rails and the fork-lift structures did in the 300 mm FOUP).





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn l The pedestal base (interior of the conveyor rails) can be made slightly lower (farther from HP) than the

conveying surfaces, providing areas separate from transport structures that can be defined (in later ballots) for sensing features (presence, placement, lockout, info pad, etc.).

Adding these features below the plane of the kinematic coupling pins allows these advantages to be made without requiring additional height between the top of the kinematic coupling pins and the plane of the first (bottom-most) wafer. This is important because it is that dimension which defines the height of the wafer planes above the floor.

R2-4.3 The kinematic coupling pins themselves are similar in shape to those at 300 mm, but are scaled up to control the deformation created by the contact pressure between them and the carrier groove materials. Several different geometries were considered, geometry “B” was selected and is shown below, along with the geometry used for 300 mm systems. R2-4.4 The kinematic coupling pin locations were selected to provide access to the secondary pins from the side as well as the back. The front pin locations were moved forward and out from the center in order to keep the weight of a fully loaded FOUP evenly distributed on the pins.R2-4.5 In all cases the materials analyzed were stainless steel for the KCPs and plastic for the grooves.

Table R2-1 Contact Stress at Kinematic Coupling Pins

Design 300 mm (Shape A) 450 mm (Shape B)

Description Current 300 mm KCP 20 mm pin with offset radius 4 mm transition

Pin Diameter (mm) 12 20

Radius Minor (mm) 7.127 11.585

Radius Major (mm) 15 30

Math. Equiv. 5 8

Applied angle 45 degrees 45 degrees

Carrier Mass (kg) 7.6 24

Force (Newtons) 74.53 235.54

Force per pin 24.84 78.52

Stress Ratio 0.92 0.92

Relative contact stress 53,071,124 53,783,837

Result Used for 300 mm 1.34% higher stress

Figure R2-2 Shapes from Table R2-2

R2-4.6 The goal is that even for the most heavily loaded 450 FOUP, the relative contact stress should not exceed that for 300 mm. To that end, the contact radius is increased from 15 mm to 30 mm and the pin diameter is increased from 12 mm to 20 mm. The resulting wear on the grooves mating to the 450 mm kinematic coupling pins should thus be no worse than that of their 300 mm counterparts. R2-4.7 One common issue for 300 mm FOUPs was the occasional problem with the kinematic coupling caused by improper lead-in or “stickiness” that prevented the pin from seating properly. The lead-in issue caused issues with AMHS handoffs, and caused a need for additional axes of motion to rotate the FOUP around a vertical axis to ensure proper capture by the pins for an arbitrarily placed tool and load port. The stickiness issue causes improper seating and can cause bad wafer handling.R2-4.8 To help address both of these issues, the approach in the 450 mm standard has been to define key aspects of the groove surface of the carrier which mates with the kinematic coupling pins. Doing so allows an increased height





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lfor improved range of lead-in, and specifying the groove angle at 45 ±6 degrees (θ1) allows for a good balance (trade-off) between capture range and increased FOUP height. This results in a taller KCP height for the load port or shelf. Conversely, the distance can be thought of as specifying an upper plane of an exclusion volume from which load port or shelf features (unrelated to sensing) shall not enter. Increased “capture” or “lead-in” of up to 15 mm (r15) in all directions when the FOUP is oriented properly in

angle Rotations of the FOUP around its z axis of a few degrees can still allow enough capture range so that 450 mm

AMHS vehicles and systems may be able to have better speed and reliability for the factories.R2-4.9 To describe the capture, consider figure R2-2:

Figure R2-1 Kinematic Coupling Pin and Groove Detail

R2-4.10 Figure R2-2 shows how the specification ensures that even a 15 mm offset can be captured. Note that because of the shape of the pin and the fact that the contact point is at the 45-degree plane, not at the tip of the point, so that the opening of the groove is larger than 15 mm to guarantee a 15 mm offset can be corrected.R2-4.11 An angular misalignment of the FOUP during handoff is also possible. Ensuring a 15 mm lead-in for the case which is properly aligned angularly will allow a greater tolerance for angular misalignment than in the 300 mm case. R2-4.12 Another issue at 300 mm was the fact that the wafer center was not the center of mass of the carrier. Thus AMHS or other systems that handled the FOUP had to deal with gravitational torques that changed in magnitude depending on the number of wafers in the carrier. This limited transfer speeds and added complexity to handling.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lR2-4.13 At 450 mm, the approach has been to align the center of mass of the carrier with the center of the automation flange, and allow this to be forward of the FP and the center of the wafers. Doing so has the advantage not only of simpler FOUP handling (the critical handling feature will all be weight-balanced for any number of wafers in the FOUP), but also eliminates the need for a counterweight. To compensate for the change in center of gravity, the front kinematic coupling pins were moved forward to keep the loads on the pins approximately equal.R2-4.14 The location of the kinematic coupling pins was designed to allow a fork-lift to pass under the carrier from the front and from the side to transfer the carrier from primary to secondary pins.R2-4.15 In keeping with the philosophy of explicitly designating guiding and sensing surfaces in the 450mm standards, the outside edges of the conveyor rails is called to be vertical surface at x5 and y5 with material (for guiding surface) extending at least 9mm up. No blend radius has yet been defined for the junction of the conveying surface and the vertical guiding surface, but that corner is meant to be relatively sharp (blend radius is suggested to be less than 0.5mm). To provide a volume for the conveyor edge rails and any corresponding sensing mechanics, the volume external to x5 and y5 from the BP and FP is defined as clear of FOUP features up to the height of at least 8mm. This is true not only for “pedestal” features but also for the bottom surface of any door flange of the shell.R2-4.16 The conveyor rails have been defined as having a square footprint centered at the origin. This will allow conveyance of the FOUP in any of the four orientations on the same conveyor unit, enabling possible new handling and loading approaches in the factory. Having the rails the same length and centered close to the carrier center of mass will avoid handling issues such as twisting or undulating, and should improve vibration performance during transport and handling.

R2-5 Forces on the Carrier DoorR2-5.1 The values in the following table are based on estimates provided by several parties. The highest values submitted were placed in the table.Table R2-1 Carrier Door Forces

Door Seal Gasket ForcesDoor Seal Height (mm) 372Door Seal Width (mm) 542Door Seal Perimeter (mm) 1828Door Seal Force/Length (N/mm) 0.05Door Seal Total Force (N) 91.4

Wafer Retention ForcesShock Load Wafer Retention Capability Without Cross Slotting and Assurance That Wafers Will Be In Pick-Up Volume After Transport From Point A to Point B (G)

1

Wafer Retention Force 25 Wafers (N) 100.0

Door Closing Force (N) 192

R2-5.2 The Wafer Retention force and Door Seal Gasket force must be applied in order to close the carrier door. So the door closing force is 91.4 N plus 100 N or ~192 N. R2-5.3 AMHS suppliers have stated that the carrier will experience shock forces up to 4 G in the x, y, and z axes when the carrier is set down on the KCPs.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lRELATED INFORMATION 3 ISMI GUIDANCE for 450 mm CARRIERSNOTICE: This related information is not an official part of SEMI (doc#) and was derived from the work of the International Physical Interfaces & Carriers Committee. This related information was approved for publication on (date of approval) by the International Physical Interfaces & Carriers Committee.

R3-1 TerminologyR3-1.1 Abbreviations and AcronymsR3-1.1.1 ISMI — International SEMATECH Manufacturing Initiative

R3-2 ISMI GuidelinesR3-2.1 ISMI has published guidelines for wafer contact.

R3-3 Edge exclusion areaR3-3.1 ISMI has informed the IPIC committee that wafers should not be contacted within 3 mm of the wafer edge, except as necessary to constrain wafers within carriers. Wafers should be contacted in the area from the center of the wafer out to the exclusion area for support while they are in the carrier and for handling during transfer and processing. In cases where edge contact is necessary for processing wafers, the edge contact should be minimized as much as possible, R3-3.2 When wafers are contacted within the exclusion area for the purpose of constraining the wafer within carriers, the contact should be within 508 microns of the edge. Contact within 508 microns may be at the edge, above the edge, or below the edge. Constraint does not include support. Wafer support should be inside the exclusion area. The 508 micron dimension is derived from the blue ballot for the 450 mm wafer, and may be subject to revision.

Front side Surface

Carrier Wafer ConstraintsPermitted to Contact Wafer Edge In this areaOnly

3 mm Edge Exclusion Area

Vertical Tangential Point or Surface

Horizontal Tangential Point or Surface

CL CLBackside Surface

Permitted Wafer Supportand Handling Contact Area

450mm Wafer Vertical Cross-Section

508 µm

Note: Dimension According to Mechanical Wafer Rev 8 SEMI Blue Ballot

508 µmFront side Surface

Carrier Wafer ConstraintsPermitted to Contact Wafer Edge In this areaOnly

3 mm Edge Exclusion Area

Vertical Tangential Point or Surface

Horizontal Tangential Point or Surface

CLCL CLCLBackside Surface

Permitted Wafer Supportand Handling Contact Area

450mm Wafer Vertical Cross-Section

508 µm

Note: Dimension According to Mechanical Wafer Rev 8 SEMI Blue Ballot

508 µm

Figure R3-1 ISMI Edge Exclusion Detail

Note: Conceptual diagram – see appropriate SEMI 450 mm Wafer Standard for actual geometry





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lR3-4 Wafer DeformationR3-4.1 ISMI has informed the IPIC committee that wafer processing is expected to cause deformation of the wafers beyond the amount allowed for new unprocessed wafers. This deformation may be as much as 500 microns. The geometry of this deformation is not known at this time. It may be a convex or concave shape or it may be a bow shape.

R3-5 Manual Handling of 450 FOUPR3-5.1 ISMI has informed the IPIC committee that manual handling of 450 FOUPs will be infrequent so that handles as were included in 300 mm FOUPs are not needed and not desirable for reasons of conserving space.

450 FOUPs should have provision for attaching temporary removable handles. Features on the 450 FOUP for attaching temporary handles should not increase the overall size of the

carrier When the temporary handles are installed, automated handling of the carrier should be blocked. Use of temporary handles should not increase required clearances.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lRELATED INFORMATION 4 CARRIER HOLD-DOWN FEATURENOTICE: This related information is not an official part of SEMI (doc#) and was derived from the work of the International Physical Interfaces & Carriers Committee. This related information was approved for publication on (date of approval) by the International Physical Interfaces & Carriers Committee.

R4-1 The hold-down features on the bottom of the 450 FOUP are meant to interact with their counterparts on the load port and AMHS systems to provide multiple uses for hold-down and support, namely: On load ports, Force for frame-to-shell seal On load ports, Force to counter door-closing force during that action On load ports and shelves, force to impede unauthorized removal On AMHS transfer devices (robots, AGV, OHS, etc.), forces to avoid loss of FOUP during rapid

acceleration/deceleration/EMOR4-1.1 Load Port Hold-Down Interactions. The load port is the primary user of the hold-down feature. In this Related Information, the Standards team felt it was important for prospective users of the standard to understand what the hold-down function WAS and WAS NOT. The hold-down is NOT intended to be a work-around for an otherwise non-functional kinematic coupling; that is, in the presence of only gravity, the carrier is always expected to slide down to the proper seated position without the need for other external forces. For example, following a small “upset” force (human push, cart bumping the load port, etc.) the 450 FOUP should return to its proper seating on the pins without the need for external forces beyond gravity. This statement is also expected to be true for the case where the carrier is docked with its door OPEN and the (optional?) seal between the load port frame and carrier shell is maintained; any “maintenance” downward force exerted by the load-port hold-down device onto the carrier hold-down feature is expected to be small (actual values are not yet defined, but expected to no more than 20N to 40N, or well under 10% of the loaded carrier weight). This force is meant to be kept relatively small so that neither the carrier shell nor the wafer support plane is altered by the hold-down.R4-1.2 During door opening (and especially door closing) there may be substantial forces being applied to the FOUP shell. At 300mm, these were 9N for FOUPs and up to 110N for FOSBs. At 450mm the values are still not set, and may depend on the type of seal needed to hold purge environment inside the carrier, but these are temporary forces and are not needed to be applied constantly. In fact, given some minimum “lead-in” for the 450 FOUP door into its shell, some slight horizontal motion may occur during the door closing process. Multiple designs could accomplish this, such as the various physical analogs of the force profile of one light spring (for the constant force) in parallel with a heavy spring with a non-elastic slack (so that a large force can be applied but only after some small motion). The direction of the resultant force would be downward and toward the door, to act against the tendency of the door-closing operation to push the front Kinematic Coupling Grooves up off their seated position on the pins.R4-1.3 The final Load-Port hold-down functionality is to prevent unauthorized removal of the carrier during use. While automated systems should be able to avoid this through the (to-be-developed) next generation handoff protocol, there is still an opportunity for carriers to be removed in a “semi-automated” fashion (using a mechanically assisted lifting cart, for example). If these semi-automatic lifters had a force-actuated switch, it could trigger an alarm when attempting to operate against a hold-down. This functionality would imply that the switch force would have to be set at a force significantly above the maximum weight of a loaded 450 FOUP (say 130%?). Conversely, this sets a minimum “tear away” force on the hold-down feature on the carrier, which should be the maximum “alarm” force times a safety factor. One possible value would be 200% of the maximum carrier weight. This value is consistent with the “emergency stop” function described in the next paragraph

R4-2 AMHS Hold-Down Interactions. AMHS systems (such as RGV, AGV, stocker crane end effectors, or other robotic lifters) may need to hold the 450 FOUP by the secondary kinematic coupling pins. The Hold-down features are also designed to be used by the AMHS system to help prevent unwanted tipping or sliding of the carrier, perhaps during a robotic EMO event. The forces from these events may be in different directions, depending upon the direction of robotic motion at the time of the EMO. In the worst case of the fastest robot, this deceleration could be on the order of several “g” so that the holder would need to maintain multiple carrier weights (if it is to be the only feature used for retention during such an event).





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lR4-2.1 Hold-Down Feature Shape to Support Different Hold-Down Elements. The shape and size of the 450 FOUP hold-down feature is designed to allow differing access methods for differing applications, in keeping with the 450mm standards philosophy of using fewer features to do multiple functions to simply the standards and implementation. The front (door-side) feature, with its 30-degree slope and shelf, will support a “hook” style retainer facing toward the carrier door, in a way that supports downward and forward forces to be applied by the hooks. The “mirroring” of this feature to the rear would allow access by “V”-shaped keys which rotate about their vertical access, or for “T” shape keys, similar in shape to the E62 keys (but with different forces and motions, of course). The point of this related information of the standard is not to pick a design, but to allow multiple innovations to address the problem but understand the basic multiple requirements.





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Informational (Blue) Ballot1000AInformational (Blue) Ballotjn lRELATED INFORMATION 5 CARRIER PRESENCE AND PLACEMENT AREASNOTICE: This related information is not an official part of SEMI (doc#) and was derived from the work of the International Physical Interfaces & Carriers Committee. This related information was approved for publication on (date of approval) by the International Physical Interfaces & Carriers Committee.

R5-1 One of the key “Lessons Learned” from the 300mm standards was that considerable problems were created by leaving sensing areas undefined in location and purpose, as load port and AMHS makers used locations and methods that did not always have a corresponding feature on the carrier side.R5-1.1 This 450mm standard, defines specific locations and characteristics for sensing and information. One example of these is the presence and placement sensing areas on the carrier bottom.R5-1.2 The purpose of Presence sensing is to alert the manipulating device (load port, robot, AMHS device) that a carrier (or something) is present, but may or may not be correctly placed and loaded yet for processing or handoff.R5-1.3 In the case of a load port, the presence sensing is primarily to ensure that automated deliveries do not occur to an occupied location, even if the carrier occupying that location is misplaced. It must therefore still be functional even if the carrier were, say, sitting atop the pins but not seated in the grooves. Even though carriers will not be “hand-delivered” at 450mm, they may be “semi-automatically” delivered (using human-steered lifting assistance). Thus the load port still needs to be able to detect when a 450 FOUP is misplaced. The approach taken in the 450mm standard is to define a flat, opaque (at least to red and infrared, the most common LED sensor wavelengths) spot about the center of the wafer. R5-1.4 Typical tests used are to move the carrier:R5-1.4.1 Leftward or rightward a fixed distance from seated, and still be detectable. The area centered on the FP and BP allows a full 19 cm in either direction to be detected. An alternate proposal that limits the band to 5 cm either side of the BP would allow motion of 5 cm either left or right to be detected (more if sensors were angled).R5-1.4.2 Forward a fixed distance. The band proposed in this ballot would extend 30mm from the FP, so that a sensor at the FOUP center could see a 3 cm forward movement and still be detectable (note under the current likely load port proposal the carrier would then be touching the load port door already).R5-1.4.3 Backward a fixed distance. Again, the band would ensure detection up to a motion of 3 cm away from the door. Misplacement farther than that would require a larger dark spot / bottom plate, or an opaque substrate in or near the bottom slot of the carrier.R5-1.4.4 Rotations about the carrier center (of a few degrees, or a right angle, or reversed). The band at the carrier center (and the corresponding sensor likewise on the load port) will allow the carrier to be detected with arbitrary angular orientation (although it should be noticed that on a load port only a few degrees of misalignment would be possible before the carrier would interfere with the load port door or the carrier on the adjacent load port.

R5-2 Placement sensing false positive R5-2.1 A carrier placement false positive may occur due to offset placement of a carrier on the load port if the KC pins slip into open cavities in the carrier bottom.

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Date: 2009/09/04

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Date: 2009/09/04