background statement for semi draft document 4770 info new

Background Statement for SEMI Draft Document 4770 info NEW STANDARD: PRELIMINARY MECHANICAL SPECIFICATION FOR Horizontal Multi Application Carrier (H-MAC) USED TO TRANSPORT AND SHIP 450mm WAFERS

Note: This background statement is not part of the balloted item. Text is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document. Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or a patent application has been submitted. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background

There is a need by multiple end users in the Semiconductor industry for a carrier which can address various applications that already exist in the industry for 300mm wafer manufacturing and wafer shipping and will carry forward to 450mm. To fulfill this need in 450mm wafer manufacturing, wafer storage, and wafer shipping the carrier shall enable factory integration compatibility with the 450 FOUP thus minimizing impact to Tools, Load Port & EFEM, AMHS and manufacturing environment/facilities. This document is being developed as part of the design of a system for moving and handling 450 mm wafers, which will ultimately include wafer shippers, load ports and automation transport system. This one document covers subjects that, for 450 mm shippers, were contained in multiple documents for 300 mm FOSB shippers SEMI M31 E15 E62,E1.9, E47.1 and E57. It is being developed in parallel with SEMI Doc 4599 Mechanical Interface for 450 mm Load Port The following features included in this document as requirements:

Reference planes Kinematic coupling pins shapes and locations Kinematic coupling mating grooves Bottom Surface Features - Info and lockout pads, presence and placement features Shipper hold down feature Conveyor rail locations and dimensions Automation handling flange Provision for Carrier ID Shipper door and door mechanism Wafer support features Height of first wafer slot Distance between adjacent wafer slots (wafer pitch) End effector exclusion volumes Shipper center of gravity

The following features have open issues: Areas reserved for ports The COG requirement of the shipper

o Peter Davison has concerns about this entire section. I can see where AMHS and COG are critical for an In Fab Carrier, but it would seem impractical to add weight for the sake of COG to the shipping container. Can AMHS tolerate a larger tolerance (mainly forward for the door) so a counterweight is not required?

The lifting of the shipper from the secondary packaging when the wafers are in a vertical position.

Front and rear conveyor pin holes Kinematic coupling pin location definition relative to FP is still under discussion in Foup Task Force Additional 4570B updates will be reviewed for applicability and transferred as approved by the NA SBTF

to this document.

This document is being developed based on the content of SEMI M74 Specification for 450 mm Diameter Mechanical Handling Polished Wafers. In that document, the wafer is specified as having a diameter of 450 +/- 0.20 mm, and a thickness of 925 +/-25 µm.

Issues Related to Intellectual Property

The task force has been informed that there may be intellectual property within this document that is carried over from 300 mm standards. The task force is currently reviewing all known IP that may be related to this blue ballot including known IP from 300 mm standards and will publish an update in future ballots. SEMI staff is currently retrieving 300 PIC IP submissions from archives and will include this info as part of future ballots.

Responding to This Ballot

The task force has created a response template, and requests that voters use the template when responding to this ballot. If you need a copy of the template, please contact Ian McLeod at [email protected] .

Responses to this ballot will be sent to the North America 450mm Shipping Box task force, and will be discussed during meetings of that task force. If you are not a member of the task force but would like to participate, please contact any of the following persons:

Tom Quinn: [email protected]

Eric Olson: [email protected]

Ian McLeod: [email protected]

This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 1 Doc. 4770 SEMI

Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone:408.943.6900 Fax: 408.943.7943

INF

OR

MA

TIO

NA

L B

AL

LO

T

DRAFTDocument Number: 4770 info

Date: 2009/08/06

SEMI Draft Document 4770 info NEW STANDARD: PRELIMINARY MECHANICAL SPECIFICATION FOR Horizontal Multi Application Carrier (H-MAC) USED TO TRANSPORT AND SHIP 450mm WAFERS

1 Purpose

1.1 The purpose of this document is to establish basic physical dimensions for the shippers intended to be used to transport and ship 450 mm wafers, as specified by SEMI M74.

1.2 This document is intended to define the reference planes for the dimensions of the shippers and the load port features that will interact with the shippers.

1.3 This document is intended to define a set of requirements to ensure interoperability of load ports and shippers without limiting innovative solutions.

2 Scope

2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. However, this standard has been written so that H-MAC can be manufactured in conformance with it, and can be utilized for maintaining wafers quality during Si manufacturing, transportation, storage and processed wafer shipping. while allowing automated use of carrier.

2.2 This standard assumes that the H-MAC is primarily used for processed wafer shipping and silicon manufacturing. The H-MAC is not intended to be used in IC (Device) manufacturing processes. It is recommended that wafers be transferred from the H-MAC to a FOUP, using automated methods.

2.3 This document specifies the external features and dimensions of the 450 mm shipper.

2.4 This document specifies the interior exclusion volumes for supporting and restraining wafers in the 450 mm shipper.

2.5 This document specifies the critical dimensions and locations of the kinematic pins that will support and position the 450 mm shippers.

2.6 This document defines three orthogonal reference planes as references for shipper dimensions.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 The detailed methods and mechanisms inside a 450 H-MAC door as to how a carrier door may be engaged to and disengaged from the carrier shell are not specified by this document.

3.2 Since it has not yet been demonstrated that a direct scale-up of the 300 mm shipper and load port methods (i.e., FIMS, how a load port opens/closes a H-MAC, KC pin to carrier groove interface, KC pin/groove system to load port open/close interface, wafer pitch/wafer handling, etc.) this document may include alternative methods to address the need for prototyping and data gathering.

4 Referenced Documents and Standards

NOTE 1: Unless otherwise indicated, all documents cited shall be the latest published versions.

4.1 SEMI Standards

SEMI M74 ― Specification for 450 mm Diameter Mechanical Handling Polished Wafers

SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment

SEMI Draft Doc. #4570— Mechanical Specification for FOUP Used to Transport and Store 450 mm Wafers

SEMI Draft Doc. #XXX— Provisional Standard for 450mm Wafer Shipping System




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

NOTE 2:SEMI is developing a Mechanical Interface Specification for 450 mm Load Ports intended to be used in conjunction with this document.

4.2 ISO Standards1

ISO 4287 ― Geometrical Product Specifications (GPS) - Surface texture: Profile method - Terms, definitions and surface texture parameters ISO/IEC 16022 — International Symbology Specification - Data Matrix

4.3 ISTA Packaging Performance Testing Standards

ISTA-2A ― Individual packaged products 68kg or less ISTA-3E ― Unitized loads of the same product

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 BP — bilateral plane

5.1.2 CL — center line

5.1.3 EE — end effector

5.1.4 FCL ― flange center line

5.1.5 H-MAC — Horizontal Multi Application Carrier

5.1.6 FP — facial plane

5.1.7 HP — horizontal plane

5.1.8 KC ― kinematic coupling

5.1.9 KCP — kinematic coupling pin

5.1.10 OHT ― overhead hoist transport

5.1.11 RFID ― radio frequency identification

5.1.12 TIR — total indicator run out

5.2 Definitions

5.2.1 450 H-MAC — used generally as a “term” only within this document to identify the Horizontal-Multi Application Carrier used for wafer manufacturing, wafer storage, and wafer shipping.

NOTE 3: Unless otherwise specified, the word ‘shipper’ or ‘carrier’ used herein shall mean 450 H-MAC.

5.2.2 bilateral plane (BP) — a vertical plane, defining x=0 of a system with three orthogonal planes, coincident with the center of a circle defined by the centerline of the three kinematic coupling pins and the centerline of the rear pin.

5.2.3 center line (CL) — a horizontal line centered vertically on the carrier door used as the reference for z dimensions of door features.

5.2.4 edge contact end effector — an end effector designed to contact the wafer on the edge.

5.2.5 facial plane (FP) — a vertical plane, defining y=0 of a system with three orthogonal planes, coincident with the center of a circle defined by the centerline of the three kinematic coupling pins.

5.2.6 flange center line (FCL) ― a horizontal line through the center of the automation flange, parallel to the facial plane, used as the reference for y dimensions of the automation flange.

5.2.7 front (of shipper) — the part of the carrier closest to the door.

1 International Organization for Standardization (ISO), ISO Central Secretariat, 1, ch.de la Voie-Creuse, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http://www.iso.ch




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

5.2.8 horizontal plane (HP) — a horizontal plane, defining z=0 of a system with three orthogonal planes, coincident with the uppermost points (tips) of the three kinematic coupling pins.

5.2.9 internal end effector— an end effector designed to support wafers inside of where they are contacted by the shipper’s wafer supports.

5.2.10 origin — the intersection of the BP, FP, HP.

5.2.11 plane ― a theoretical surface which has infinite width and length, zero thickness and zero curvature.

5.2.12 rear (of shipper) — the part of the shipper farthest from its door.

5.2.13 wafer deflection — change in wafer shape (TIR) due to gravity while the wafer is resting in a horizontal position on the shipper wafer supports with the shipper door open.

5.2.14 wafer seating plane — the bottom surface of an ideally rigid flat wafer that meets the diameter specification for 450 mm wafers, with negligible droop due to gravity, as it rests on the wafer supports.

5.2.15 Microenvironment — a localized environment created by an enclosure to isolate the product from contamination and people

5.2.16 Shipping box — a protective portable container for a shipper and/or wafer(s) that is used to ship wafers from the wafer suppliers to their customers

5.2.17 2D code placement area — an area on the door and another area on top of the shell, where a 2D code can be placed.

5.2.18 2D code — a code identifying elements such as maker, model, version and serial number of a H-MAC, by using a data matrix ECC200 symbol according to ISO/IEC 16022.

6 Reference Planes (HP, FP, BP) Specification

6.1 The HP, FP, and BP as described in the definition section are theoretical planes, which are intended to be used to depict the position of certain features relatively to these planes. These planes are at position zero (x, y, z, defined as the origin) with no tolerance associated, since these ideal planes do not represent a physical feature. Only positive numbers are used to define coordinates within this system of three planes. No negative numbers are used in order to be as close as possible to standard mechanical drawing practices. Necessary clarification on the position of a feature usually will be achieved via figures.

6.2 FP and BP are defined as vertical planes parallel to gravity when resting on the Kinematic Coupling interface (horizontal wafer orientation.). These planes are perpendicular. . NOTE 4: The top surfaces of the Kinematic Coupling Pins are not the surfaces on which the carrier rests. Appendix 3 shows how test fixtures can be made to rest on the KCPs to duplicate the position of a carrier.

6.3 Reference Baselines — Two centerlines are defined:

CL — Centerline for the carrier door. It passes through the centers of the openings for the door pins. All the z-dimensions of door features are symmetric to the CL.

FCL — Flange Centerline. Since the automation flange is offset forward of the FP by y36, it is convenient to refer the y-dimensions of flange features to the center of the flange.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 1

Overall Views of 450 H-MAC

7 Shipper Envelope

7.1 The overall dimensions of the 450 H-MAC, (x1), (y1), and (z1), are given as reference dimensions because they are derived from other dimensions.

(x1) ≤ x2 + x2 plus tolerances

(y1) ≤ y2 + y4 plus tolerances

(z1) ≤ x8 + z12plus tolerances

8 Features for Automated Handling

8.1 Automation Flange — On top of the 450 H-MAC is an automation flange for manipulating the carrier. See Figure 2 (top view) and Figures 3, 4 & 5 (sections).

8.1.1 The Automation Flange shall extend front and back from its center (from the FCL) by y3, and shall extend to each side by x3. The neck below the flange shall extend x34 to each side of the BP, and by y56 and y37 in front of the FP.

8.1.2 The Automation Flange has a pattern of notches on all sides. Notches on the front and back have a depth of y31 and those on the sides shall have a depth of x56. The notches shall have an angle of θ4. The four corners shall have chamfers with size of x32 and y28. The flange shall have a centering feature at the intersection of the BP and FCL. The centering feature shall have a depth of z2 and diameter of d3 at the top surface. The side of the centering feature shall have an angle of θ5.

8.1.3 The Automation Flange shall have a thickness of z13, and the shipper shall have no obstructions around the flange for a height of z9, except for the door frame as shown by y30 in Figure 4.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

8.1.4 The Automation Flange shall be located forward of the FP by (y36), the orientation and location are constrained by the values and tolerances of x4 and y40. See Figure 5.

Figure 2

Automation Flange – Top View

Figure 3

Automation Flange Section at BP

Right Front Left Front




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 4

Shipper Section at BP

See Figure 3

See Figure 26See Figure 15

Left Right

See Figure 25

See Figure 30




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 5

Shipper Section at FP

8.2 Center of Gravity Volume ― No specific coordinates are defined within this standard for the exact location of the center of gravity of the 450 H-MAC. However, the 450 H-MAC shall be designed in a way to ensure the center of gravity in x and y direction with the door closed is within a volume defined by that part of a cylinder of a radius r20 defined about a point on the BP at y36, which is in front of the FP. The center of gravity shall be within this volume whether the shipper is empty, partly filled with wafers, or fully occupied. The center of gravity shall not be behind the FP. It may be necessary for a counterweight to be placed at the rear of the 450 H-MAC to locate the center of gravity to meet this requirement. See Figure 6.

Figure 6

Automation Flange Location

8.3 Forklift Feature — The 450 H-MAC shall have features on the sides for handling by forklift, shown in Figure 7. The forklift feature includes a notched indentation for a pin to retain the carrier on the forklift.

8.3.1 On each side of the carrier, there shall be an opening to the rear extending vertically from z51 to z39, and forward to y45. The surface at z39 shall extend from y45 to y46. There shall be no obstruction at the top of the opening to the rear of y46. The surface at z39 shall extend from x54 to the outside of the shipper. There shall be notches at the FP with a height of z40, a depth of x55 and an angle of θ6.

8.4 Front Clamp Features — The 450 H-MAC shall have provision for being clamped at the front of the shipper.

8.4.1 There shall be two front clamping features on the top of the shipper. Each is a rectangular depression with a depth of z5, and is bounded by x52 & x53, and by y43 & y44. See Figure 7.

Left Right




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

8.4.2 There shall be two front clamping features on the bottom of the shipper. They shall be rectangular depression with a depth of z36 and be bounded by x57 & x58, and by y47 & y48. See Figure 27.

NOTE 5: It is recommended that the front clamp features not be used for pulling the H-MAC from the undocked position into the FIMS interface. Also, all of the dimensions of the 450 H-MAC (such as the wafer location, etc.) are defined with reference to the kinematic coupling pins, and will be in the proper location only when the 450 H-MAC is held in place on the kinematic coupling pins by gravity.

Figure 7

Front Clamp & Forklift Features

8.5 Manual Handling — A fully-loaded 450 mm H-MAC will have a mass of about 24 kg, which means it will be too heavy for manual handling during normal production or maintenance activities. It is anticipated that manual handling will only occur when recovering from an abnormal situation. Consequently, there is no provision for manual handles.

8.6 If temporary manual handles are provided:

Features on the 450 H-MAC for attaching temporary handles shall not increase the overall size of the shipper when the handles are not installed.

When the temporary handles are installed, automated handling of the shipper shall be blocked.

8.7 Conveyor Rails — See section 15.

9 Requirements for Kinematic Coupling Pins

9.1 Kinematic Coupling Pin Shape — The physical alignment interface on the bottom of the carrier consists of features (specified in § 10) that mate with six pins underneath. As shown in Figure 8 and defined in Table 1, each pin is radially symmetric about its vertical center axis line and can be seen as the intersection of a cylinder of radius




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

r1 and a sphere of radius r4 (which establishes the tip of the pin and might contact a flat plate). The radius r4 is centered on the axis of symmetry at a height z3 below the HP. An additional radius r3 establishes the contact with the angled mating groove surface on the carrier. The center of the radius r3 is defined by the intersection of a vertical plane through the axis of symmetry of the pin with the horizontal circle of radius r2 at the height z4 below the HP. A blend radius of r5 is applied at the intersection of r1 and r3, and at the intersection of r3 and r4. Ra1 is the surface finish roughness, as defined by ISO 4287, of all features given by r1, r3, r4, and r5. Dimensions r2, z3, and z4 have zero tolerance because they only define offsets and not physical features.

9.2 Kinematic Coupling Pin Locations — The KC pins are arranged in three sets with two pins in each set, as shown in Figure 11. The outer pins of each set are designated the primary pins for use on a load port or vehicle nest, and the inner pins are designated the secondary pins for use on a robotic arm used to pick up the carrier. The rear pins (farthest from the door) are located on the BP, at a distance from the FP of y18 for the secondary pin and y15 for the primary pin. The front primary pins are located at a distance of y16 from the FP, symmetric across the BP with distance x18 from the BP. The front secondary pins are located at a distance of y17 from the FP, symmetric across the BP with distance x19 from the BP. For reference only, the front kinematic coupling pins are located symmetrically with respect to the BP at an angle of θ2, and circumferentially equidistant on a circle about the origin with radius r22 for the primary kinematic coupling pins and radius r26 for the secondary kinematic coupling pins. For reference only, the rear primary kinematic pin is located on the BP and on a circle with radius r27, and the secondary rear pin is located on the BP and on a circle with radius r16. See Figure 11.

Figure 8

Kinematic Coupling Pin

10 Requirements for Kinematic Coupling Groove

In order to achieve the proper lead-in value of r15 and control contact pressures, certain characteristics of the kinematic groove surface on the bottom of the 450 H-MAC are described in this section and shown in Figure 9.

10.1 Kinematic Coupling Groove Locations — Grooves shall be provided to capture both primary and secondary pins locations. The centerlines of the grooves are located along radii passing through the kinematic pin locations from the origin. The rear groove has its centerline along the BP, while the two front grooves have their centerlines at the angle θ2 with respect to the FP.

10.2 Kinematic Coupling Groove Shape and Finish — When viewed along the axis of symmetry of the groove (parallel to the HP), the dihedral angle of each wall shall be θ1 to the vertical. The height of the groove at the opening shall be z12 beneath the HP. This should result in an effective half-width of r34 at the mouth of the groove.

10.3 Kinematic Coupling Groove Length — In order to ensure capture of either the primary or secondary K-pin during a physical handoff with an offset (lead-in error) of r15, a minimum groove length is specified. The innermost end of the front KC grooves shall be no farther than r8 from the origin, and the outermost end of the grooves shall




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

be no closer than r24 from the origin. The innermost end of the rear KC groove shall be no farther than r33 from the origin, and the outermost end of the groove shall be no less than r9 from the origin. The KC grooves shall not interfere with the edge of the conveyor rail or other exclusion features. See Figures 10 & 11.

Figure 9

Kinematic Coupling Groove

Figure 10

Kinematic Coupling Offset




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 11

Bottom View – Kinematic Coupling Pin Locations

11 Requirements for Bottom Surface Features




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 12

Bottom Features

11.1 Presence Sensor Feature

11.1.1 The presence sensing features on the bottom of the 450 H-MAC are designed to provide three flat, opaque areas for sensing. The load port or other systems using KCPs can use the features to determine that a carrier is present, even if misplaced (see the discussion in the Related Information). The features consist of three flat, opaque areas centered along the BP of the carrier within the conveyor rails and extending y21 to the front and rear of the FP. The center area extends x22 to each side of the BP, and the outer areas extend from x20 to x9.

11.2 Placement Sensor Features

11.2.1 Placement sensing features are intended to provide defined locations to confirm proper placement of the kinematic coupling grooves onto the kinematic coupling pins. These consist of a set of four elongated and three circular flat areas located. The elongated flat areas are located symmetrically to the front KC pins, with the outer center at approximately the same distance from the origin (at x21 and y22), The distance from the outer to inner centers is approximately the same as the distance between the primary and secondary KC pins. Two of the circular flat areas” Are located on either side of the rear secondary KC pin, and the third is in front of the rear KC pins, for use with forklifts. The flat areas shall be at a height of z23. Because the KC pins are not symmetrical, this configuration allows fail-safe sensing of the carrier placement. See Figure 13.

11.3 Info Pads & Mechanical Lockout Features

11.3.1 The info pads and mechanical lockout features of the 450 H-MAC are located symmetrically about the BP, with one row of three info pads and one mechanical lockout feature on each side. From the shipper side, there is no difference between the info pads and mechanical lockout features. On the load port side, the optional mechanical lockout pins would be separate from the sensing info pads. As with the placement sensing pads, the info pad features have a radius of r21 mm (flat or hole per customer option). The flat surface shall be at z50 below the HP, (with a more relaxed tolerance than z23). Hole “depth” shall be at z24. For the mechanical lockout feature, the flat must be capable of supporting a fully loaded H-MAC




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

11.3.2 The info pads and mechanical lockout features are located y24 mm from the FP, and symmetrically about the BP at distances of x24 mm, x25 mm, x26 mm, and x27 mm from the BP. The two features nearest the FP are reserved for mechanical lockout; the other six are reserved for info sensors only (no mechanical lockout pins). The lockout pads are numbered (1 & 2) and the Info Pads are lettered (A thru F) to highlight that they are not intended to be interchangeable.

Figure 13

Presence, Placement, Info-Pads and RFID tag placement




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 14

Sensor Pad & Hole Cross-Section

12 RFID Tag Placement Volume - Optional

12.1.1 The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID tag, if present, must be placed within the volume defined by x29, y26, y27, z37 and z38 as shown in Figures 13 and 15.

Figure 15

RFID Tag Placement Volume

13 Requirements for Shipper Hold-Down Features

13.1 The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly closer to the FP than the front kinematic coupling pins. Each feature consists of cylindrical volume centered at x28 and y38 with top and bottom surfaces dimensioned from the HP and z6 with radius r7. Each volume has an opening to the bottom of the carrier bounded by y34, y35 and r7. From the bottom of the opening, a vertical surface of height z8 joins (with a small but unspecified blend radius) a sloping plane of angle θ3 above the horizontal (and parallel to the intersection of FP and HP). This sloping plane meets the surface at z6. See Figures 16 & 17.

13.2 This configuration provides the load port with several options for holding the shipper in place not limited to the following: See Figure 18.

A hook shape that presses against the slope and the shelf, or A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the

sloping plane with or without contacting the incline.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

13.2.1 Either (each) hold-down feature shall be able to withstand a force in any direction of f001 without permanent damage or deformation.

13.2.2 Door opening and closing shall operate correctly with a force of f002 applied to either (each) hold-down feature.

NOTE 6: The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing forces that occur during the door insertion and removal operation. Carrier suppliers should consider the maximum force generated in their shipper design when designing the carrier’s hold down feature.

Figure 16

Hold-Down Feature Locations

Figure 17

Hold-Down Section at x28=50 mm




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 18

Hold-Down Devices

14 Requirements for Carrier Door

14.1 The H-MAC is not intended to be opened with the wafers in a vertical orientation.

14.2 The shipper door is on the front of the 450 H-MAC. The door and its frame must be designed to mate with a load port that conforms to the Mechanical Interface Specification for 450 mm Load Port. The H-MAC door and its frame must have surfaces that mate with seal areas, the H-MAC door sensing area, and reserved spaces for vacuum application. See Figure 19.

14.3 The spaces for vacuum application include the four of the circles bounded by r28 and located at x49 & z31. The vacuum pad areas, door seal areas, frame seal areas and door sense areas shall be at a distance of y4 from the facial plane when the door is closed and latched. No surface on the H-MAC door may project further from the facial plane than these areas and the reserved spaces.

14.4 The door of the H-MAC must also be designed so that when the H-MAC is pressed against the FIMS port, both latch keys on the port are inserted to their full length there is clearance of y39. Furthermore, when the latch keys are turned more than 45° toward the position that unlocks the H-MAC door from the H-MAC, the latch key holes on the door must be such that the door is not removable from the latch keys.

14.5 To allow for unobstructed latch key rotation, the thickness of the outer panel of the carrier door in the area defined by r23 shall be y10. Clearance of y39 shall be provided for latch keys at x46. Clearance of y40 shall be provided for door pins at x45. The latchkeys and door pins shall be located on the centerline (CL). See Figure 22.

14.6 H-MAC door features are symmetrical about the CL. Features other than the openings for Frame Pins and Door Pins are symmetrical about the BP.

14.7 The openings for the door pins are circular on the left side with diameter d4, and are slots on the right side. See Figure 23.

14.8 The openings for the frame pins are circular on the left side with diameter d5, and are slots on the right side.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 19

450 H-MAC Door Features

14.9 The frame seal area is bounded by x11 & x64on the sides, by z27& z34on the top, and by z28 & z44on the bottom. There is a blend radius r30 & r36 at the corners.

14.10 The door seal area is bounded by x47& x48 on the sides, and by z32 & z33 on the top and bottom. There are blend radii of r31 & r32 at the outer and inner edges respectively.

Figure 20

Shipper Door Frame




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 21

Carrier Door

Figure 22

Section at Door Centerline - Looking Down on the Left Side

See Figure 23




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 23

Frame Pin and Door Pin Area - Right Side

14.11 Front Clamp Features — See section 8.4. Figure 7 shows the top front clamp features and Figure 27 shows the bottom front clamp features. NOTE 7: It is recommended that the front clamp features not be used for pulling the H-MAC from the undocked position into the FIMS interface. Also, all of the dimensions of the 450 H-MAC (such as the wafer location, etc.) are defined with reference to the kinematic coupling pins, and will be in the proper location only when the 450 H-MAC is held in place on the kinematic coupling pins by gravity.

14.12 Door Closing Force — The force required to push the carrier door into the carrier shell to its fully seated position is f234. The application of f234 to the door shall push the door fully closed, so that the outermost point of the outer surface of the door is less than or equal to y4 from the BP. With the door in this position, the latches shall operate without exceeding the torque limit f230.

14.13 Thickness of Door (y9) — y58 See Figure 7 Section 8 NOTE 8: Shipper suppliers should design their products to keep this force required to close as small as possible to ensure no damage will occur to wafers upon opening and closing the door.

14.14 Latch Torque — The maximum torque required to turn each of the latch mechanisms individually on the carrier door (to which the latch keys of a load port will engage with) is f230.

14.15 See Related Information R1-7 for more discussion.

15 Requirements for Conveyor Rails

This section specifies certain aspects of the 450 H-MAC that define the conveyor rails, their exclusion areas, and relationships to other features.

15.1 Conveyor Rail Surface Dimensions — The conveying surface extends below the HP, as shown in Figures 25 and 26. The bottom view is given in Figure 24. The conveyor rail surfaces are meant to provide smooth, continuous surfaces symmetric to the origin. The inner edges of the conveying surfaces are bounded by x6 and y6, and the outer guiding edges of the conveying surfaces are defined by x5 and y5. A blend radius r11 connects the corners of the edges, and the four outer corners are bounded by radius r35. The conveying surface forms a plane at a distance z11 below the HP.

15.2 Conveyor Rail Cylindrical Forklift Pin Holes – Holes are provided on all four conveyor rails, defining cylindrical volumes on the FP. The holes (cylinders) are of diameter d1, centered on the FP at distances x37and on the BP at y32. The depth of the holes is z46.

15.3 Conveyor Guiding Surface —. The external edges of the conveyor rails will provide a physical conveyor guiding surface consisting of a vertical edge with height of z10 above the conveying surface. No part of the H-MAC




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

may occupy the volume outside of the conveyor guiding surface. Note that r35 applies to the guiding surface while r10 applies to parts of the carrier that are above z10.

15.3.1 The conveyor guiding surfaces shall be opaque for the purpose of presence sensing.

Figure 24

Conveyor Rail Locations




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 25

Conveyor Rails

Figure 26

Conveyor Rails




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 27

Front Clamps

16 Requirements for Wafer Support Features

16.1.1 Location of wafer contacts — 450 mm wafers shall be handled or contacted within an exclusion area that extends 2 mm in from the edges of the wafers. Dimensions have been selected to eliminate backside contact more than 2 mm away from the edge of a wafer, when it is within either the wafer pick-up volume or wafer set down volume. See Figures 28, 29 & 30.

16.1.2 The wafer support areas are bounded by r35 & r36 towards the front and rear, by x13 on the inside and x50 on the outside. If the wafer supports are moved out from x13 the wafer deflection will increase. See Related Information 1 for discussion of wafer sag. At the rear of the shipper, an optional additional area, bounded by x14, and between and y11 & y19, may be used for wafer support.

16.1.3 The shipper shall have features to constrain the wafer along all axes so the wafer will be within the wafer pick-up volume after the door is opened. See Figures 31 & 32.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 28

H-MAC Section (Between Wafer Supports)




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 29

Wafer Support Area

Figure 30

Wafer Slots




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 31

Wafer Pick-Up Volume

Figure 32

Wafer Pick-Up Side View




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 33

Wafer Set-Down Volume

Figure 34

Wafer Set-Down Side View




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 35

Wafer Extraction Volume

Figure 36

Wafer Extraction Side View

16.2 Requirements for Wafer Slot Pitch

16.2.1 Vertical Dimensions — Figures 4 & 5show the vertical dimensions of the shipper. Note that z14 (the height of the bottom nominal wafer seating plane above the horizontal datum plane) and z17 (the distance between adjacent nominal wafer seating planes) are given as absolute distances with no tolerance. This means that the sum of actual height variations in the shipper from the kinematic coupling to the supporting features holding each wafer shall be contained within the tolerance of z21 with no further stack-up at each higher wafer. z15 specifies the space reserved for end effectors below the first wafer. The method for meeting these requirements is left up to the shipper supplier.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

As wafer supports are moved farther apart from the BP, the wafer deflection under gravity will increase. The wafer pitch budget assumes that wafer deflection will be no more than 0.50 mm above end effector, so if wafer supports are designed to allow more than 0.50 mm of deflection, the thickness of the wafer support, (z17 – z16) or its tolerance (z21) needs to be reduced accordingly. See also Figure 30.

16.2.2 Wafer Set-Down Volume ― The open space for the wafer set-down volume consists of a cylindrical section with radius r12 and a vertical axis y14 in front of the origin. The bottom of this cylindrical section is z49 above the nominal wafer seating plane and its height is z22. See Figures 33 & 34.

16.2.3 The implications of the tolerance on r12 for wafer positioning are as follows. The wafers shall be placed in the carrier within a circle of radius corresponding to the smaller bound on r12 to avoid touching the edge of the wafer to the side of the carrier. Once the wafer has been placed, the carrier shall not allow a wafer to move outside of a circle of radius corresponding to the larger bound on r12. There are two exceptions to this limit on wafer movement. When the wafer is pushed toward the rear of the carrier, the location of the wafer is defined by the wafer pick-up volume See figures 31 & 32

16.2.4 Wafer Extraction Volume ― The open space for the wafer extraction volume shall include a cylindrical section with radius r18 which has a vertical axis y14 in front of the origin. The vertical cross section at the FP is extended out to the door opening. The bottom of this cylindrical section is z22 above the nominal wafer seating plane and its height is z49. See Figures 35 & 36.

16.2.5 The implications of wafer extraction for the definition of dimension r18 are as follows. The carrier shall provide an extra 1 mm of horizontal clearance once the wafer is picked up from wherever it ends up (within the bounds of r12) after transport in the shipper.

16.2.6 If a wafer is placed in the wafer set-down volume and is then pushed toward the rear of the shipper, then the entire bottom of the wafer shall be contained in the wafer pick-up volume.

NOTE 9: If the wafer is not pushed toward the rear of the shipper, then the wafer may only be somewhere within the wafer extraction volume.

16.2.7 Wafer Pick-Up Volume ― The wafer pick-up volume shall be defined by a cylindrical section with radius r13 and a vertical axis at the origin. Its top and bottom are the upper and lower tolerance of z21 around the nominal wafer seating plane. Between the time when the wafer is set down and when it is picked up, including transportation, the wafer shall not be rotated from its wafer set-down position by more than θ7 (6.3 mm along perimeter), nor shall it be displaced from its original slot. See Figures 31 & 32.

16.2.8 Wafer Insertion and Extraction — The extraction volume is the maximum space available for a wafer to be moved into or out of the shipper.

16.2.9 Wafer Retaining Structure — The slot is usually designed that wafers are suspended in the slot without contacting the surface of the slot for preventing the damage during transportation when H-MAC door is closed. It should be noted that wafer position when door is open may be different than when the door is closed due to the wafer retaining structure.

16.2.10 Wafer Retaining — When the H-MAC is closed, the wafers must be retained in the H-MAC to prevent movement during subsequent handling, including shipping. It should be noted that wafers are required to be shipped in a vertical orientation and generally require shipping performance from secondary packaging. It is recommended that this secondary package be designed to allow for automated removal of the H-MAC from the secondary packaging.

17 Requirements for Internal End Effector Exclusion Volume

17.1 Internal end effectors reaching into the shipper shall stay between the wafer support areas defined by x13 See Figure 37.

17.2 The maximum reach into the carrier is limited by r6, y11, and y19.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure 37

End Effector Exclusion Area

End Effector Boundary Area




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Table 1 Carrier and KC Dimensions

Note: All linear dimensions are in mm, all angular dimensions are in degrees.

Symbol Used Figure Value Specified Datum Measured From Feature Measured To

θ1 9 45 ±6 degrees Vertical (BP & FP) Dihedral angle to planar surface of kinematic coupling groove

(θ2) 11 (34.0 degrees) BP Axis of symmetry of front pin-mating groove

θ3 17 30.0 ± 2degrees HP Incline of hold-down feature

θ5 5 45 ±0.5 degrees Vertical (BP & FP) Edge of automation flange centering feature

θ4 2 45 ±0.5 degrees Perpendicular to Side surface of automation flange

Side surfaces of automation flange notches

θ6 7 45 ±0.5degrees FP Side of forklift retainer feature

θ7 not shown ≤1.6 degrees n/a Maximum rotation of any wafer between wafer set-down and wafer pick-up, including door closing, transportation and door opening.

d1 24 8.0 ±0.5 x37, FP and y32, BP Diameter of conveyor rail pin hole

(d2) 3 (17) Automation flange centering feature (BP & FCL)

Diameter at bottom of depression

d3 2, 3 51. 0 ±0.5 Automation flange centering feature (BP & FCL)

Diameter at top of depression

d4 21 10.6 x45, CL Diameter of door pin opening

d5 20 6.5 ±0.2 x46, CL Diameter of frame pin opening

d6 23 6.5 ±0.2 (x40 & x41), CL Diameter of slot for Frame Pin

d7 23 10.0 (x43 & x42), CL Diameter of slot for Door Pin

f001 13.2. 1 ≥ 175 N Applied at any point, in any direction

Force that the any one hold down feature that the shipper must withstand.

f002 13.2. 2 ≥ 141 N Force applied to hold down feature

Force that shipper must withstand during door opening and closing

f230 14. 14 ≤ 1.7 Nm Latch Key Torque required to operate latches (each latch key)

f234 14. 12 ≤ 227 N Door Force to close shipper door

r1 8 10.0 ±0.025 Centerline of KCP Cylindrical (Side) surface of KCP

r2 8 14.0 ± 0 Centerline of KCP Circle to define center of curvature of KCP contact surface

r3 8 30.0 ±0.05 Circle defined by r2 & z4 Contact surface of KCP

r4 8 15.0 ±0.05 Centerline of KCP & z3 Top surface of KCP (sphere)

r5 8 2.0 ±0.1 Blend radius Surface between KCP contact surface and adjacent surfaces

r6 28 ≥ 245 Origin Rear boundary of EE exclusion area

r7 16 ≥ 30 x26, y29 Cylindrical volume of hold-down feature

r8 11 ≤ 136 Origin Innermost end of Kinematic Coupling Groove for Front KCPs




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06


r9 11 ≥ 218 Origin Outermost end of Kinematic Coupling Groove for rear KCP

r10 6, 24, 28 ≤ 314 Origin Outer limit of carrier and conveyor rails

r11 24 ≥10 Blend Radius Blend radius of conveyor rail edges

r12 33, 34 227 +1/-0 x=0, y14 Radius of wafer set-down volume

r13 31, 32 ≤ 226 Origin Radius of wafer pick-up volume

r15 10 ≥ 15 N/A Lead in: Correctable 450 H-MAC misalignment in any horizontal direction

(r16) 11 (145) Origin Location of Rear Secondary KCP

r18 35, 36 ≥ r12 + 1.0 Origin Radius of wafer extraction volume

r19* A1-1, A1-2 ≤10 x=190, y=75 Blend radius

r20 6 ≤ 17 BP, y36 Outer surface of cylinder contains the center of gravity of the shipper

r21 13 ≥ 10.0 Center of Info, placement and Lock-Out pads

Extent of pad area

(r22) 11 (206.5) Origin Location of Front Primary KCPs

r23 21, 23 ≥ 14 latch key Clearance

r24 11 ≥ 231 Origin Outermost end of Kinematic Coupling Groove for Front KCPs

(r25) 11, A1-1 (225) Origin Radius of 450 mm diameter wafer

(r26) 11 (160) Origin Location of Front Secondary KCPs

(r27) 11 (194) Origin Location of Rear Primary KCP

r28 21 ≥ 30 x38,z31 Area reserved for vacuum pads

r29 21 ≥ 20 x44, CL & x45, CL Boundary of door sense area

r30 20 23.0 Blend radius Corners of door opening

r31 21 21.0 Blend radius Corners of door

r32 21 ≥ 19 Blend radius Edge of door seal area

r33 11 ≤121 Origin Innermost end of Kinematic Coupling Groove for Rear KCPs

r34 10 ≥ 23.5 KC Groove Centerline Effective half-width of KCP groove

r35 29 ≥ 200 Origin Inner boundary of wafer support

r36 28 ≥ 229 Origin Inner wall of H-MAC

Ra1 ¶ 9.1 ≤ 0.30 µm n/a Kinematic pin surface finish Roughness per ISO 4287

(x1) 1, 5, 11, 20, 28

(555) n/a Overall width of shipper

x2 6, 7, 20, 28, ≤ 277.5 BP Outer edge of shipper

x3 2 300±0.5 Width of automation flange

x4 5 150 ±1 BP Edge of automation flange on carrier

x5 5, 24,25 235 ± 1 BP Outer edge of side conveyor rail surface

x6 24 ≤220 BP Inner edge of side conveyor rail surface

x9 13 ≥ 220 BP Outer Edge of presence sense area




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06


x10 13 193±1 BP Center of placement sense area

x11 20, 28, 259 BP Opening for shipper door

x12 28, 37, A1-2

≥ 243. 5 BP Inner edge of EE exclusion area

x13 29, 37, ≥ 135 BP Inner extent of wafer support surface

x14 29, 37 ≤ 50 BP Extent of rear wafer support structure

x18 11 171.20±0.05 BP Location of front primary KCP

x19 11 132.65 ±0.05 BP Location of front secondary KCP

x20 13 ≤160 BP Inner edge of side presence sense area

x21 13 141±1

BP Center of invalid placement sense area

x22 13 ≥30 BP Edge of central presence sense area

x23 13 55±1 BP Center of rear placement sense area

x24 13 55±1 BP Center of lock-out pad (1 left / 2 right)

x25 13 85±1 BP Center of Info Pad (1 left / 4 right)

x26 13 115±1 BP Center of Info Pad ( 2 left / 5 right)

x27 13 145±1 BP Center of info Pad (3 left / 6 right)

x28 16 50 ±0.5 BP Center of hold-down feature

x29 13 25±1 BP Side of RFID placement volume

x30 2 50±0.5

BP Automation Flange Notch

x31 2 60 ±0.38 210 ±0.5

BP Automation Flange Notch

x32 2 12±1

Edge of flange Automation Flange chamfer

x33 2 250±0.5

BP Automation Flange notch

x34 5 ≤ 132 BP Side of automation flange neck

x37 24 450±1

Forklift pin hole

x38 21, 23 ≥ 10 Centered at x44, CL Width of latch key clearance

x40 23 ≥1.0 Centered at x41 Length of slot for frame pin

x41 23 272 ±0.25 BP Center of opening for frame pin r24

x42 23 ≥3.0 Centered at x43 Length of slot for door pin

x43 23 220 BP Center of opening for right door pin r22

x44 21,23 142 BP Latch key

x45 21 220 BP Left door pin

x46 20 272 ±0.25 BP Left frame pin

x47 21 257 BP Side of H-MAC door

x48 21 ≥2 BP door seal width

x49 21 200 BP Space reserved for vacuum pads

x50 5, 28 ≥ 229 BP Inner wall of shipper

x52 7 ≥ 250 BP Outer side of top front clamping feature




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06


x53 7 ≤ 210 BP Inner side of top front clamping feature

x54 7 ≤ 260 BP Inner side of optional forklift feature

x55 7 14 ± .5 Outer edge of carrier Depth of notch for forklift

x56 2 14 ± .5 edge of automation flange depth of notches

x57 27 ≥257 BP Outer side of bottom front clamp

x58 27 ≤ 217 BP Inner side of bottom front clamp

x59 24 470±1 Left side of conveyor guiding surface

Opposite side of conveyor guiding surface

x60 24 10 ±0.2 Left side of conveyor guiding surface

Left fork lift hole

x61 13 154 ±1 BP Inner center of placement sense pad

x62 13 102 ±1 BP Inner center of placement sense pad

x63 2 150 ±0.5 Right Side of automation flange

Front Notch

x64 20 ≥275.5 BP Outer side of frame seal area

x66 7 276 ±1 BP Outer surface of fork lift feature

(y1) 1, 11, 28, 31, 33, 35

(481.75) n/a Overall depth of shipper

y2 4, 6, 28 ≤ 235 FP Rear of shipper

y3 2, 3 150 ±0.5 300 ±0.5

Depthof handling flange

4, 6, , 28, 246.25 ±0.5 FP Front surface of shipper

y5 24, 25, 26 235 ±0.25 FP Outer edge of Front & Rear conveyor rail surface

y6 24 220 ±0.25 FP Inner edge of Front & Rear conveyor rail surface

y8 28, 29, 37, ≤ 180 FP Inner extent of IEE exclusion area between x12 and x13

y9 4, 28, 37, ≥ 211.25 FP Inner sealing surface to door

y10 22 3.25 ±0.25 3.00±0.25

Front surface of door (y4) Space for unobstructed rotation of latch keys

y11 28, 29, 37 ≥ 200 FP Extent of rear wafer support structure

y12 6 162 ±1 FP Front edge of automation flange

y14 32 >0, ≤3.0 FP Center of r12

y15 11 194 ±0.05 FP Location of Rear Primary KCP

y16 11 115.5 ±0.05 FP Location of front primary KCP

y17 11 89.5 ±0.05 FP Location of front secondary KCP

y18 11 145 ±0.05 FP Location of rear secondary KCP

y19 4, 28, 31, 33, 34, 35, 36,

≥ 228 FP Inner extent of IEE exclusion area near rear wafer support structure

y21 13 ≥ 30 FP Edges of side presence sense area

y22 13 151 ±1 FP Center of placement NOT sense area

y23 13 74 ±1 FP Center of placement sense area

y24 13 120 ±1 FP Row of Info and Lock Out pads

y25 13 194 ±1 FP Center of rear placement sense areas




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06


y26 4, 13, 15 ≥ 225 FP Front of RFID placement volume

y27 4, 13, 15 ≤ 230 FP Rear of RFID placement volume

y28 2 12 ±1

Edge of Automation Flange Automation Flange chamfer

y29 2 90 ±0.5

FP Automation Flange notch

y30 4 ≥ 195.75 FP Back of door flange

y31 2 14 ±0.5

Edge of automation flange Depth of notches

y32 24 450 ±1

FP Front and rear forklift holes

y34 16, 17 90 ±0.5 FP Front edge of hold-down opening

y35 16, 17 60 ±0.5 FP Rear edge of hold-down opening

y36 6 12 ±1 FP Center of cylinder containing the center of gravity

y37 3 ≤ 132 FP Front and rear of automation flange neck

y38 16, 17 75 ±0.5 FP Center of hold-down feature

y39 22 ≥ 12 Front Surface of Door Clearance for Latchkeys

y40 22 ≥ 12 Front Surface of Door Clearance for Door pin

y41 22 ≥ 12 Front Surface of Frame Clearance for Frame Pin

y43 7 3.5 ±0.5 Front Surface of H-MAC Frame

Front side of front clamping feature

y44 7 ≤ 222.75 FP Rear side of front clamping feature

y45 7 ≥180 FP Front side of forklift feature

y46 7 ≥ 120 FP Rear limit of surface for forklift

y47 27 3.5 ±0.5 Front Surface of H-MAC Frame

Front side of bottom front clamp

y48 27 ≥230 FP Rear side of bottom front clamp

y50 13 95 ±1 FP Placement Sense Pad for forklift

y51 24 10 ±0.2 Front of Conveyor guiding surface

Front fork lift pin hole

y52 13 125 ±1 FP Inner center of placement sense pad

y53 13 48 ±1 FP Inner center of placement sense pad

y54 2 150 ±0.5 Front of automation flange Notch

y55 4 ≤196.25 FP Rear of wafer mapping exclusion volume

y56 3 ≤120 FP Rear side of automation flange neck

y51 4 ≤ 52.25 Front Surface of FPSB Frame Thickness of Door

(z1) 1, 4, 5 (≤356) (≤404)

n/a Over all height of shipper




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06


z2 5 ≥ 17 Top of automation flange Bottom of centering depression

z3 8 15.0 ±0 HP Point on KCP centerline to define KCP top surface (r1)

z4 8 24.543 ±0 HP Center of radius r3

z5 7 ≥12 Top of Door Frame Bottom of upper front clamp feature

z6 17 11 ±0.5 HP Lower horizontal surface inside hold-down feature

z7 17 6 ±0.2 Lower horizontal surface inside hold-down feature

Lower edge of hold-own incline

z8 1, 4, 5 334 ±1 382 ±1

HP Top of shipper

z9 3, ≥ 21 Bottom surface of automation flange

Clearance for use of automation flange

z10 25, 26 ≥ 9

Conveyor running surface (z11)

Top edge of conveyor guiding surface

z12 4, 5 9, 10, 14, 25, 26

20 ±1 HP Bottom of KC Grooves

z13 3, 5 7.5±0.5 Top of carrier Bottom surface of automation flange

z14 4 36 ±0.0 HP Bottom nominal wafer seating plane

z15 4 ≥ 12

Height of first wafer slot top Clearance below top of first wafer slot

z16 30 ≥ 8

Top surface of each nominal wafer seating plane

Bottom surface of next higher wafer support

z17 30 12.0 ±0

Each nominal wafer seating plane

Adjacent nominal wafer seating planes (wafer pitch)

z18 4 ≥ 10 ≥ 8

Top surface of top wafer slot Any point above top nominal wafer seating plane

z20 4, 20, 26 Not shown

3 ±0.25 HP Bottom of shipper door opening

z21 30, 32 0 ±0.50 Each nominal wafer seating plane

Each actual nominal wafer seating plane

z22 34, 36 6.8 z49 above each nominal wafer seating plane

Top of wafer extraction and wafer set-down volumes

z23 14 20 ±0.5 HP Surface of placement sense pads

z24 add z27 z28

14 20

≤ 15 HP Top of space within placement sense hole and Lockout & Info pads when not active

z30 20, 21 178 HP CL – Horizontal Center Line of the door

z31 21 129 CL Center of space reserved for vacuum pads

z32 21 ≤ 2

CL Door seal area

z33 21 179

CL Top & bottom edges of door

z34 20 157 CL Top & bottom edges of door opening

(z35) 20 (190.0)

CL Bottom of carrier door flange

z36 7 ≥4 Bottom of door frame Top of lower front clamp feature




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06


z37 15 ≥ 5 HP Bottom of RFID placement volume

z38 15 ≤10 HP Top of RFID placement volume

z39 7 163 ±1

HP Top of forklift feature

z40 7 ≥10 Top of forklift feature Top of forklift retainer feature

(z42) 20 (12)

HP Bottom of door flange

z43 4, 20 376±1 HP Top of door flange

(z44) 4, 20 (362) n/a Height of door opening

(z45) 20 (388) n/a Height of door flange

z46 25 ≥ 9 Conveyor running surface Depth of opening for forklift pin

z48 17 ≥ 11 Lower horizontal surface inside hold-down feature

Upper horizontal surface inside hold-down feature

z49 34, 36 0.7 Each nominal wafer seating plane

Bottom of wafer extraction volume. (To center the extraction volume between slots)

z50 14 20 ±1 HP Height of info and lockout pads when active

z51 7 ≤74

HP Bottom of forklift feature

Unless otherwise noted, all dimensions are in mm.

Reference dimensions are in parentheses.

Measured values for dimensions without specified tolerance should be rounded up or down to the last significant figure of the dimension in accordance with good engineering practice.

Measured values for dimensions with specified tolerances should be rounded up or down to the last significant figure of the tolerance in accordance with good engineering practice.

Table 2 Derivation of Reference Dimensions

Symbol Used Value Formula (x1) (≤ 555) x2 + x2 (≤ 277.5 + ≤ 277.5) (x36) (518) x39 + x39 (259+259) (y1) (≤ 481.75) y2 + y4 (≤ 235 + 246.25 +0.5) (z1) (≤ 356) z8 + z12 (334 +1 + 20 +1) (z34) (157) z19 - z30 (311 - 154) (z35) (166) z30 + z42 (154 + 12) (z44) (314) z19 + z20 (311 + 3) (z45) (340) z42 + z43 (12 + 328)




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

APPENDIX 1 FIXTURES for MEASURING the HORIZONTAL PLANE

NOTICE: The material in this appendix is an official part of SEMI (doc#) and was approved by International Physical Interfaces & Carriers Committee vote procedures on (date of approval).

Introduction

There are at least two ways to implement a jig/fixture, for establishing the HP, depending on the expected purpose and accuracy.

A1-1 Top Surface of KCPs

A1-1.1 A simple fixture can establish the HP by setting a flat plate on top of the three KC pins. The lower surface would represent the HP with an accuracy limited by the tolerances of r15 and r3. Such a method will be suitable to determine the distance from the HP to the floor (e.g. for positioning equipment). See Figure A1-1.

Figure A1-1

Flat plate precision limited by tolerance stack-up

A1-2 Emulating KC Grooves

A1-2.1 A more precise fixture would emulate the KC grooves, where the upper surface may be designed to be at a position to reflect the height of the first wafer. Any method using KC grooves would cause similar tolerance stack-ups as a real 450 H-MAC, since it is resting on the same contact points of the KC pins.

A1-2.2 The tolerances of the radius on the upper points of the KC pins would not affect such a fixture. This type of fixture is needed for precise measurements and alignments.

A1-2.3 In the example in shown in Figure A1-2, the HP adjustment/alignment would be completely independent from the tolerance of the radius on top of the KC pins.

HP

r4=nominal r4=nominal

r3=Maximum r3=Minimum

Xmm from the HP

KC Plate

Level




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure A1-2 Precision is independent of KCP top surface

HP

r4=Maximum r4=Minimum

r3=Minimum r3=Maximum

Xmm from the HP

Level

KC Plate




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

APPENDIX 2 MEASUREMENT of WAFER SEATING PLANES


A2-1 Suggested Method for Measuring Wafer Seating Planes

A2-1.1 Although wafer seating plane measurement is not limited to any specific method, it is recommended that, for inspection purposes, the wafer seating plane can be measured at three points at the front of the H-MAC. One point is at the intersection of the front of the wafer and the BP and two points are at the intersection of the wafer and symmetric planes located 30 degrees from BP.

A2-1.2 Wafer height at each of the 25 slots is to be measured from HP, and single crystal wafers are to be used.

A2-1.3 Three front measurement points cannot characterize the entire wafer seating plane perfectly; therefore, this measurement method is recommended for the purpose of ongoing inspection during the manufacturing of a H-MAC. For qualification purposes, the carrier supplier may choose to provide more detailed wafer seating plane measurement data to the end user.

Figure A2-1

Wafer Plane Measurement




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

APPENDIX 3 METHOD FOR MEASURING CARRIER CENTER OF GRAVITY


A3-1 Suggested Method Using Load Cells

A3-1.1 The carrier’s COG (center of gravity) can be measured by using three load cells.

A3-1.2 Each of the load cells should provide a support point similar to the Kinematic Coupling Pins defined in this standard.

A3-1.3 The location of the pins should conform to the Relevant SEMI Standard for 450 mm Load Ports in order to provide a reference for the FP and BP.

A3-1.4 Variables

A3-1.4.1 F1, F2 & F3 – the downward force on each pin due to the weight of the carrier.

A3-1.4.2 Lx – the distance parallel to the FP between the front KCPs.

A3-1.4.3 Lx/2 –the distance from each front KCP to the BP

A3-1.4.4 Ly – the distance parallel to the BP between the front KCPs and the rear KCP

A3-1.4.5 Lx0 – the distance from the BP to the COG.

A3-1.4.6 Ly0 – the distance from the rear KCP to the COG.

A3-1.5 Derivation of Lx0 Calculation:

F1 × Lx0 + F3 × (Lx / 2 + Lx0) = F2 × (Lx / 2 - Lx0) F1 × Lx0 + F3 × Lx / 2 + F3 × Lx0 = F2 × Lx / 2 – F2 × Lx0 (F1 + F2 + F3) × Lx0 = (F2 - f3) × Lx / 2 Lx0 = Lx / 2 × (F2 - F3) / (F1 + F2 + F3)

A3-1.6 Derivation of Ly0 Calculation:

F1 × Ly0 = F2 × (Ly - Ly0) + F3 × (Ly - Ly0) F1 × Ly0 = F2 × Ly – F2 × Ly0 + F3 × Ly – F2 × Ly0 (F1 + F2 + F3) × Ly0 = (F2 – F3) × Ly Ly0 = Ly × (F2 – F3) / (F1 + F2 + F3)

NOTE 1: For the Primary KCPs Lx = 342.4 mm (x18 × 2) and Ly = 309.5 mm (y15 + y16). For the secondary KCPs Lx = 265.3 mm (x19 × 2) and Ly = 234.5 mm (y17 + y18).




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure A3-1 Center of Gravity Measurement




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

RELATED INFORMATION 1 APPLICATION NOTES

NOTICE: This related information is not an official part of SEMI (doc#) and was derived from the work of the International Physical Interfaces & Carriers Committee. This related information was approved for publication on (date of approval) by the International Physical Interfaces & Carriers Committee.

R1-1 Notes:

R1-1.1 The automation handling features do not need to be molded into the plastic shell of the H-MAC, but can be attached as a framework around the shell.

R1-1.2 Skewness, warp, rock, and stiffness are implicitly defined in the geometric tolerances.

R1-1.3 Dimension y4 is given as a maximum based on the maximum distance to the port door specified in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports.

R1-1.4 The position tolerance of the door of the H-MAC is likely to be much larger than the position tolerance of the door pins. To make both manual and automated door opening easier, it is recommended that the holes for the door pins on the door of the H-MAC have openings with a lead-in capability. NOTE 1: If the bottom of the H-MAC does not extend below the bottom conveyor rail, the conveyor rail may become contaminated and may distribute particles.

R1-1.5 Although both of the retaining features on the bottom of the H-MAC must be able to withstand a force in any direction of f001, continuously applied stress may result in plastic deformation.

R1-1.6 In order to minimize particle generation when the H-MAC door is opened or closed, it is recommended that the tolerance between the H-MAC door and its frame be larger than the tolerance between the H-MAC door pin holes and FIMS door pins.

R1-1.7 One type of carrier presence sensor uses a beam of light with an optical detector that is triggered when the beam of light is attenuated as it passes through the H-MAC shell.

R1-1.8 The use of the door pins for H-MAC door lead-in to the load port door is not recommended. The door pins should be only used to limit the maximum displacement of the H-MAC door while on the load port door. Neither the FOUP nor H-MAC door positions should change as a result of engaging or disengaging the door pins. When the Load port experiences utility loss (such as EMO, vacuum loss, electrical failure, etc.), the door pins may be used to maintain the H-MAC door’s position, and to ensure that the H-MAC door does not fall off. The clearance between the Door Pins and the Door Pin Holes should be less than the clearance between the outer edge of the H-MAC Door and the inner edge of the H-MAC Door Frame. Balancing these tolerances is a H-MAC design issue related to the Seal Area specified in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports. The diameter of the Door Pin Holes should be designed to accommodate the Door Pin tolerances defined by x239, z238 & d231 in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports, and the Door Pin Hole location tolerance in a H-MAC.

R1-1.9 It is recommended that the H-MAC have a capability to roughly position the H-MAC door in the H-MAC frame during the door close sequence (during either return of the H-MAC door or during latching of the H-MAC door). This positioning capability should keep the clearance between the H-MAC frame and the H-MAC door larger than sum of the H-MAC (self) tolerance and the door pin tolerance in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports along with the H-MAC door’s circumference. Possible methods for accomplishing this may include positioning by latch motion and positioning by a slope between the H-MAC frame and the H-MAC door.

R1-1.10 There is a gap between the load port door and door frame, which allows clean air from the EFEM minienvironment to displace the volume of the carrier door when it is opened. The size of the carrier door should be coordinated with the accuracy of its placement on the load port door, so this gap is kept clear on all sides when the carrier door is opened. The half-width of the load port door is x233 = 257±0.25 mm, and the half-height is z233 = 179±0.5, so the size of the carrier door plus its positioning error should be kept below these values. If the half-width plus placement error exceeds 257 mm a side gap may be partially covered. If the half width plus placement error exceeds 259 mm, a side gap may be completely covered. If the half-height plus placement error exceeds 179 mm the top and/or bottom air gap may be partially covered. If the half-height plus placement error exceeds 181 mm, the top and/or bottom air gap may be completely covered. Partial covering is shown in the yellow area of Figure R1-1, the red areas signifies complete covering. See Figure R1-1.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

R1-1.11 It is recommended that the H-MAC have a lead-in mechanism on its latch key holes. This lead-in mechanism should compensate for the H-MAC’s latch key hole location error. See Figure R1-2.

R1-1.12 It is recommended that the latch key hole mechanisms have some flexibility in their position for compliance with the latch key positions. The purpose of this is to adjust for any discrepancy in rotation axis between the latch key and the latch key hole mechanism. As shown in Figure A4-2, if only one side of the latch key pushes on the inside of the latch key hole, the latch key can not rotate more than half way.

R1-1.13 It is recommended that the torque required to rotate the H-MAC latch key holes be kept small enough that it will not produce movement of the H-MAC door in the x and z directions during latch key rotation.

R1-1.14 It is recommended that the latch key holes be maintained in the position that unlocks the H-MAC door from the H-MAC (ψ = 0 ± 1° as defined in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports while the H-MAC is open and in the position that locks the H-MAC door to the H-MAC (ψ = 90 ± 1°) while the H-MAC is closed. One method to accomplish this is to have the H-MAC latch key hole mechanisms snap into both end points of their rotation (ψ = 0 ± 1° and ψ = 90 ± 1°) using a detent mechanism. The torque required to overcome such a detent mechanism should not exceed f230 (as defined in Table 1of this document).

R1-1.15 It is recommended that the space approximately 2 mm above z18 (above the top wafer support) be kept clear of vertical surfaces so that if a wafer is inserted above the extraction volume, it will be forced down rather than collide.

`` Figure R1-1

Coordinating Carrier Door Size and Placement Accuracy

X:255.0 Z:177.0

X:256.0 Z:178.0

X:257.0 Z:179.0

2.00mm

1.00mm

0.00mm

Door size

Door position tolerance

Gap Clear

Partially Covered

Gap Covered

X:258.0Z:180.0

X:259.0Z:181.0

3.00 mm




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Top View Cross-Section

Front View

FOUP door cover

Latch key hole block

Latch key

Figure R1-2

Displacement Enabled by Flexibility Around Latch Key Hole Block

Latch key can rotate full 90°

Latch key rotation stops before 90°

Figure R1-3 Need for Latch Key Hole Flexibility

R1-2 Carrier Options Checklist

Table R1-1 can be used for communicating the compliance of H-MACs to this standard and the options chosen:




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Table R1-1

Section Optional Feature Choice

17.1 Rear wafer support yes or

no

11.3 info pad A height up (pad missing) or

down (pad present)

11.3 info pad B height up (pad missing) or

down (pad present)

11.3 info pad C height up (pad missing) or

down (pad present)

11.3 info pad D height up (pad missing) or

down (pad present)

11.3 info pad E height up (pad missing) or

down (pad present)

11.3 info pad F height up (pad missing) or

down (pad present)

11.3 Lockout Pad 1 up (pad missing) or

down (pad present)

11.3 Lockout Pad 2 up (pad missing) or

down (pad present)




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

RELATED INFORMATION 2 CONSIDERATIONS for DETERMINING DIMENSIONS


R2-1 Referenced Standards and Documents

R2-1.1 Semi Standards

SEMI M74 — Specification for 450 mm Diameter Mechanical Handling Polished Wafers

R2-2 Discussion

R2-2.1 The PIC committee considered the specifications in SEMI M74, the draft for the SEMI standard for 450 mm load ports, and this document to determine how much space between wafers and wafer supports is needed for safe handling of wafers. In addition, the following issues were considered:

R2-2.1.1 wafer deflection under gravity — the deflection caused by gravity of a wafer resting on the carrier supports directly above the end effector pick-up points and at a 30 degree angle from the line of end effector stroke. Once the wafer has been lifted by the end effector, the deflection will be determined by the design of the end effector and is not considered to add to the budget for the end effector with wafer. The reason for measuring at 30 degrees is that the height of the end effector pads allows for some droop between the pads without the wafer touching the end effector structure. Based on the measurements made by ISMI and simulations done by task force participants, the committee has used the value of 0.50 mm.

R2-2.1.2 process induced warp — 300 mm wafers have had process induced warp as great as 1 mm. When this is extrapolated to 450 mm wafer size, the warp would be 1.6mm. With 300 mm wafers, the warp has produced wafers with a convex top surface and a concave top surface. When an end effector is inserted between two wafers the clearance is reduced by 3.2 mm. Once a wafer has been picked up, the effect on clearance will be 1.6 mm since the end effector has moved up away from the wafer below.

R2-2.1.3 carrier placement error — the maximum misalignment of the carrier that is expected, based on prototype testing, is 0.2 mm. This error results in the carrier not fully seating on the KC pins, so it is always a positive error.

R2-2.2 After testing and discussion the committee has settled on a wafer pitch of 12 mm.

R2-3 Height of wafer extraction and set-down volumes

R2-3.1 The height of extraction and set-down volumes dimensions is equal to the clearance between wafer supports minus to tolerance of the wafer planes and the carrier placement error. Since the carrier placement error serves to raise the wafer supports above their nominal position, it causes the volumes to be offset.. So the volumes start 0.7 mm above nominal wafer seating plane and extend to within 0.5 mm of the next wafer support.

R2-4 Kinematic Coupling System

R2-4.1 The central approach in scaling the kinematic coupling concept to the 450 H-MAC was to try to make the current 300 mm style of pin the plan if possible. While mass of fully loaded 300 mm carriers was 7.6 kg, the mass of 450 mm carriers is estimated to be 24 kg. The increased weight load of the 450 H-MAC meant that the existing 300 mm pin would have provided a contact pressure that could have exceeded safe deformation limits for the likely carrier materials.

R2-4.2 The key structure of the 450 H-MAC bottom consists of a pedestal extending below the lowest H-MAC door surface. A number of advantages can be obtained from this approach:

More vertical space can be used to increase the “lead-in” or capture area during handoff (more discussion of this in the detailed discussion of the groove below).

Provides separate heights for the conveying surfaces and the door features, so that both features can be better optimized for their intended purposes.

Conveyor rail can be moved inward from the edge, so that the conveying surface does not define the lateral envelope of the carrier (as both the conveyor rails and the forklift structures did in the 300 mm H-MAC).




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

The pedestal base (interior of the conveyor rails) can be made slightly lower (farther from HP) than the conveying surfaces, providing areas separate from transport structures that can be defined (in later ballots) for sensing features (presence, placement, lockout, info pad, etc.).

Adding these features below the plane of the kinematic coupling pins allows these advantages to be made without requiring additional height between the top of the kinematic coupling pins and the plane of the first (bottom-most) wafer. This is important because it is that dimension which defines the height of the wafer planes above the floor.

R2-4.3 The kinematic coupling pins themselves are similar in shape to those at 300 mm, but are scaled up to control the deformation created by the contact pressure between them and the carrier groove materials. Several different geometries were considered, geometry “B” was selected and is shown below, along with the geometry used for 300 mm systems.

R2-4.4 In all cases the materials analyzed were stainless steel for the KCPs and plastic for the grooves.

Table R2-1 Contact Stress at Kinematic Coupling Pins

Design 300 mm (Shape A) 450 mm (Shape B)

Description Current 300 mm KCP 20 mm pin with offset radius 4 mm transition

Pin Diameter (mm) 12 20

Radius Minor (mm) 7.127 11.585

Radius Major (mm) 15 30

Math. Equiv. 5 8

Applied angle 45 degrees 45 degrees

Carrier Mass (kg) 7.6 24

Force (Newtons) 74.53 235.54

Force per pin 24.84 78.52

Stress Ratio 0.92 0.92

Relative contact stress 53,071,124 53,783,837

Result Used for 300 mm 1.34% higher stress




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Shape A Shape B

Figure R2-1 Shapes from Table R2-2

R2-4.5 The goal is that even for the most heavily loaded 450 H-MAC, the relative contact stress should not exceed that for 300 mm. To that end, the contact radius is increased from 15 mm to 30 mm and the pin diameter is increased from 12 mm to 20 mm. The resulting wear on the grooves mating to the 450 mm kinematic coupling pins should thus be no worse than that of their 300 mm counterparts.

R2-4.6 One common issue for 300 mm FOUP was the occasional problem with the kinematic coupling caused by improper lead-in or “stickiness” that prevented the pin from seating properly. The lead-in issue caused issues with AMHS handoffs, and caused a need for additional axes of motion to rotate the FOUP around a vertical axis to ensure proper capture by the pins for an arbitrarily placed tool and load port. The stickiness issue causes improper seating and can cause bad wafer handling.

R2-4.7 To help address both of these issues, the approach in the 450 mm standard has been to define key aspects of the groove surface of the carrier which mates with the kinematic coupling pins. Doing so allows an increased height for improved range of lead-in, and specifying the groove angle at 45 ±6 degrees (θ1) allows for a good balance (trade-off) between capture range and increased H-MAC height. This results in a taller KCP height for the load port or shelf. Conversely, the distance can be thought of as specifying an upper plane of an exclusion volume from which load port or shelf features (unrelated to sensing) shall not enter.

Increased “capture” or “lead-in” of up to 15 mm (r15) in all directions when the H-MAC is oriented properly in angle

Rotations of the H-MAC around its z axis of a few degrees can still allow enough capture range so that 450 mm AMHS vehicles and systems may be able to have better speed and reliability for the factories.

R2-4.8 To describe the capture, consider figure R2-2:




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

Figure R2-2

Kinematic Coupling Pin and Groove Detail

R2-4.9 Figure R2-2 shows how the specification ensures that even a 15 mm offset can be captured. Note that because of the shape of the pin and the fact that the contact point is at the 45-degree plane, not at the tip of the point, so that the opening of the groove is larger than 15 mm to guarantee a 15 mm offset can be corrected.

R2-4.10 An angular misalignment of the H-MAC during handoff is also possible. Ensuring a 15 mm lead-in for the case which is properly aligned angularly will allow a greater tolerance for angular misalignment than in the 300 mm case.

R2-4.11 Another issue at 300 mm was the fact that the wafer center was not the center of mass of the carrier. Thus AMHS or other systems that handled the H-MAC had to deal with gravitational torques that changed in magnitude depending on the number of wafers in the carrier. This limited transfer speeds and added complexity to handling.

R2-4.12 At 450 mm, the approach has been to align the center of mass of the carrier with the center of the automation flange, and allow this to be forward of the FP and the center of the wafers. Doing so has the advantage not only of simpler H-MAC handling (the critical handling feature will all be weight-balanced for any number of wafers in the H-MAC), but also eliminates the need for a counterweight. To compensate for the change in center of gravity, the front kinematic coupling pins were moved forward to keep the loads on the pins approximately equal.

The location of the kinematic coupling pins was designed to allow a forklift to pass under the carrier from the front and from the side to transfer the carrier from primary to secondary pins.

R2-4.13 In keeping with the philosophy of explicitly designating guiding and sensing surfaces in the 450mm standards, the outside edges of the conveyor rails is called to be vertical surface at x5 and y5 with material (for guiding surface) extending at least 9mm up. No blend radius has yet been defined for the junction of the conveying surface and the vertical guiding surface, but that corner is meant to be relatively sharp (blend radius is suggested to




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

be less than 0.5mm). To provide a volume for the conveyor edge rails and any corresponding sensing mechanics, the volume external to x5 and y5 from the BP and FP is defined as clear of H-MAC features up to the height of at least 8mm. This is true not only for “pedestal” features but also for the bottom surface of any door flange of the shell.

R2-4.14 The conveyor rails have been defined as having a square footprint centered at the origin. This will allow conveyance of the H-MAC in any of the four orientations on the same conveyor unit, enabling possible new handling and loading approaches in the factory. Having the rails the same length and centered close to the carrier center of mass will avoid handling issues such as twisting or undulating, and should improve vibration performance during transport and handling.

R2-5 Forces on the Carrier Door

R2-5.1 The values in the following table are based on estimates provided by several parties. The highest values submitted were placed in the table. Table R2-2 Carrier Door Forces

Door Seal Gasket Forces

Door Seal Height (mm) 358 Blue Ballot Door Seal Width (mm) 514 Blue Ballot Door Seal Perimeter (mm) 1744 Calculated Door Seal Force/Length (N/mm) 0.06

Door Seal Total Force (N) 105

Shell Seal Gasket Forces

Shell Seal Height (mm) 342 Blue Ballot Shell Seal Width (mm) 560 Blue Ballot Shell Seal Perimeter (mm) 1804 Calculated

Shell Seal Force/Length (N/mm) 0.025 Should be determined by load port companies.

Shell Seal Total Force (N) 45.1

Wafer Retention Forces Shock Load Wafer Retention Capability Without Cross Slotting and Assurance That Wafers Will Be In Pick-Up Volume After Transport From Point A to Point B (G)

1

Wafer Retention Force 25 Wafers (N) 122 Transport Shock ‘Wafer Mass’ (N)

938

N

ot A

pplic

able

Dur

ing

Ope

n/C

lose

Cyc

le




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

R2-5.2 The Wafer Retention force and Door Seal Gasket force must be applied in order to close the carrier door. So the door closing force is 105 N plus 122 N or 227 N. The Internal Pressure and Shell Seal Gasket forces not apply to door closing.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

RELATED INFORMATION 3 CARRIER HOLD-DOWN FEATURE


R3-1 The hold-down features on the bottom of the 450 H-MAC are meant to interact with their counterparts on the load port and AMHS systems to provide multiple uses for hold-down and support, namely:

On load ports, Force for frame-to-shell seal

On load ports, Force to counter door-closing force during that action

On load ports and shelves, force to impede unauthorized removal

On AMHS transfer devices (robots, AGV, OHS, etc.), forces to avoid loss of H-MAC during rapid acceleration/deceleration/EMO

R3-1.1 Load Port Hold-Down Interactions. The load port is the primary user of the hold-down feature. In this Related Information, the Standards team felt it was important for prospective users of the standard to understand what the hold-down function WAS and WAS NOT. The hold-down is NOT intended to be a work-around for an otherwise non-functional kinematic coupling; that is, in the presence of only gravity, the carrier is always expected to slide down to the proper seated position without the need for other external forces. For example, following a small “upset” force (human push, cart bumping the load port, etc.) the 450 H-MAC should return to its proper seating on the pins without the need for external forces beyond gravity. This statement is also expected to be true for the case where the carrier is docked with its door OPEN and the (optional?) seal between the load port frame and carrier shell is maintained; any “maintenance” downward force exerted by the load-port hold-down device onto the carrier hold-down feature is expected to be small (actual values are not yet defined, but expected to no more than 20N to 40N, or well under 10% of the loaded carrier weight). This force is meant to be kept relatively small so that neither the carrier shell nor the wafer support plane is altered by the hold-down.

R3-1.2 During door opening (and especially door closing) there may be substantial forces being applied to the H-MAC shell. At 300mm, these were 9N for FOUP and up to 110N for FOSBs. At 450mm the values are still not set, and may depend on the type of seal needed to hold environment inside the carrier, In fact, given some minimum “lead-in” for the 450 H-MAC door into its shell, some slight horizontal motion may occur during the door closing process. Multiple designs could accomplish this, such as the various physical analogs of the force profile of one light spring (for the constant force) in parallel with a heavy spring with a non-elastic slack (so that a large force can be applied but only after some small motion). The direction of the resultant force would be downward and toward the door, to act against the tendency of the door-closing operation to push the front Kinematic Coupling Grooves up off their seated position on the pins.

R3-1.3 The final Load-Port hold-down functionality is to prevent unauthorized removal of the carrier during use. While automated systems should be able to avoid this through the (to-be-developed) next generation handoff protocol, there is still an opportunity for carriers to be removed in a “semi-automated” fashion (using a mechanically assisted lifting cart, for example). If these semi-automatic lifters had a force-actuated switch, it could trigger an alarm when attempting to operate against a hold-down. This functionality would imply that the switch force would have to be set at a force significantly above the maximum weight of a loaded 450 H-MAC (say 130%?). Conversely, this sets a minimum “tear away” force on the hold-down feature on the carrier, which should be the maximum “alarm” force times a safety factor. One possible value would be 200% of the maximum carrier weight. This value is consistent with the “emergency stop” function described in the next paragraph

R3-2 AMHS Hold-Down Interactions. AMHS systems (such as RGV, AGV, stocker crane end effectors, or other robotic lifters) may need to hold the 450 H-MAC by the secondary kinematic coupling pins. The Hold-down features are also designed to be used by the AMHS system to help prevent unwanted tipping or sliding of the carrier, perhaps during a robotic EMO event. The forces from these events may be in different directions, depending upon the direction of robotic motion at the time of the EMO. In the worst case of the fastest robot, this deceleration could be on the order of several “g” so that the holder would need to maintain multiple carrier weights (if it is to be the only feature used for retention during such an event).




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

R3-2.1 Hold-Down Feature Shape to Support Different Hold-Down Elements. The shape and size of the 450 H-MAC hold-down feature is designed to allow differing access methods for differing applications, in keeping with the 450mm standards philosophy of using fewer features to do multiple functions to simply the standards and implementation. The front (door-side) feature, with its 30-degree slope and shelf, will support a “hook” style retainer facing toward the carrier door, in a way that supports downward and forward forces to be applied by the hooks. The “mirroring” of this feature to the rear would allow access by “V”-shaped keys which rotate about their vertical access, or for “T” shape keys, similar in shape to the E62 keys (but with different forces and motions, of course). The point of this related information of the standard is not to pick a design, but to allow multiple innovations to address the problem but understand the basic multiple requirements.




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

RELATED INFORMATION 4 CARRIER PRESENCE AND PLACEMENT AREAS


R4-1 One of the key “Lessons Learned” from the 300mm standards was that considerable problems were created by leaving sensing areas undefined in location and purpose, as load port and AMHS makers used locations and methods that did not always have a corresponding feature on the carrier side.

R4-1.1 This 450mm standard, defines specific locations and characteristics for sensing and information. One example of these is the presence and placement sensing areas on the carrier bottom.

R4-1.2 The purpose of Presence sensing is to alert the manipulating device (load port, robot, AMHS device) that a carrier (or something) is present, but may or may not be correctly placed and loaded yet for processing or handoff.

R4-1.3 In the case of a load port, the presence sensing is primarily to ensure that automated deliveries do not occur to an occupied location, even if the carrier occupying that location is misplaced. It must therefore still be functional even if the carrier were, say, sitting atop the pins but not seated in the grooves. Even though carriers will not be “hand-delivered” at 450mm, they may be “semi-automatically” delivered (using human-steered lifting assistance). Thus the load port still needs to be able to detect when a 450 H-MAC is misplaced. The approach taken in the 450mm standard is to define a flat, opaque (at least to red and infrared, the most common LED sensor wavelengths) spot about the center of the wafer.

R4-1.4 Typical tests used are to move the carrier:

R4-1.4.1 Leftward or rightward a fixed distance from seated, and still be detectable. The area centered on the FP and BP allows a full 19 cm in either direction to be detected. An alternate proposal that limits the band to 5 cm either side of the BP would allow motion of 5 cm either left or right to be detected (more if sensors were angled).

R4-1.4.2 Forward a fixed distance. The band proposed in this ballot would extend 30mm from the FP, so that a sensor at the H-MAC center could see a 3 cm forward movement and still be detectable (note under the current likely load port proposal the carrier would then be touching the load port door already).

R4-1.4.3 Backward a fixed distance. Again, the band would ensure detection up to a motion of 3 cm away from the door. Misplacement farther than that would require a larger dark spot / bottom plate, or an opaque substrate in or near the bottom slot of the carrier.

R4-1.4.4 Rotations about the carrier center (of a few degrees, or a right angle, or reversed). The band at the carrier center (and the corresponding sensor likewise on the load port) will allow the carrier to be detected with arbitrary angular orientation (although it should be noticed that on a load port only a few degrees of misalignment would be possible before the carrier would interfere with the load port door or the carrier on the adjacent load port.

R4-2 Placement sensing false positive

R4-2.1 A carrier placement false positive may occur due to offset placement of a carrier on the load port if the KC pins slip into open cavities in the carrier bottom.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any particular application. The determination of the suitability of the standard is solely the responsibility of the user. Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. These standards are subject to change without notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted material or of an invention covered by patent rights. Entegris, Inc. has filed a statement with SEMI asserting that licenses will be made available to applicants throughout the world for the purpose of implementing this standard without unfair discrimination. Attention is also drawn to the possibility that some elements of this standard may be subject to patented technology or copyrighted items other than those identified above. Semiconductor Equipment and Materials International (SEMI) shall not be held responsible for identifying any or all such patented technology or copyrighted items. By publication of this standard, SEMI takes no position respecting the validity of any patent




INF

OR

MA

TIO

NA

L B

AL

LO

T


Date: 2009/08/06

rights or copyrights asserted in connection with any item mentioned in this standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights and the risk of infringement of such rights are entirely their own responsibility.