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ATOMIC STRUCTURE AND INTERATOMIC BONDING Chapter 2

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  • ATOMIC STRUCTURE AND

    INTERATOMIC BONDING

    Chapter 2

  • INTERATOMIC BONDS

  • Comparison of Different Atomic Bonds

  • INTERATOMIC BONDS (1)

  • INTERATOMIC BONDS (2)

    FA – attractive force is defined by the nature of the

    bond (e.g. Coulomb force for the ionic bonding)

    FR – atomic repulsive force, when electron shells

    start to overlap

    Thus the net force FN (r) = FA + FR

    In equilibrium: FN (r0) = FA + FR =0

    Let us consider the same conditions

    but in the term of potential energy, E.

    By definition:

    minimum

    ,0,

    00

    0

    possessesEand

    mequilibriuinsystem

    Frratlyspecificalmore

    extremumhasEdr

    dEFif

    EEdrFdrFdrFE

    FdrE

    N

    N

    NN

    N

    RA

    r r

    RA

    r

    NN

    nR r

    BE

  • F

    bonds

    stretch

    return to

    initial

    1. Initial 2. Small load 3. Unload

    Elastic means reversible!

    F Linear- elastic

    Non-Linear-

    elastic

    ELASTIC DEFORMATION

    Strain

  • Stress Versus Strain:

    Elastic Deformation

    Typical Stress-Strain Diagram

    for one-dimensional tensile test Elastic Region

    Hooke's Law: s = E e

    E [N/m2; GPa] is Young’s modulus or modulus of elasticity

  • • Bond length, r

    • Bond energy, Uo

    F F

    r

    U o = “bond energy”

    Energy (r) = U(r)

    r o r

    unstretched length

    PROPERTIES FROM BONDING: E (1)

    • Elastic modulus, E

    L F

    Ao = E

    Lo

    Elastic modulus

  • • Elastic modulus, E

    L F

    Ao = E

    Lo

    Elastic modulus

    r

    larger Elastic Modulus

    smaller Elastic Modulus

    Energy

    ro unstretched length

    E is larger if Uo is larger.

    PROPERTIES FROM BONDING: E (2)

  • Atomic Mechanism of Elastic

    Deformation

    E~(dF/dr)r o

    ro- equilibrium

    Weaker bonds – the atoms easily move out from equilibrium position

  • r

    larger Elastic Modulus

    smaller Elastic Modulus

    Energy

    ro unstretched length

    • Elastic modulus, E

    • E ~ S=curvature of U at ro

    L F

    Ao = E

    Lo

    Elastic modulus

    PROPERTIES FROM BONDING: E (3)

    The “stiffness” (S) of the bond is given by:

    S=dF/dr=d2U/dr2

    So(d2U/dr2 )ro

    Show that E=(So/r0)

    U

  • Modulus of Elasticity for Different Metals

  • Young’s modulus

    Young’s modulus is a numerical constant, named for the 18th-century English

    physician and physicist Thomas Young, that describes the elastic properties of a

    solid undergoing tension or compression in only one direction.

    Higher E – higher “stiffness”

    http://www.britannica.com/needmore

  • 0.2

    8

    0.6

    1

    Magnesium,

    Aluminum

    Platinum

    Silver, Gold

    Tantalum

    Zinc, Ti

    Steel, Ni

    Molybdenum

    Graphite

    Si crystal

    Glass-soda

    Concrete

    Si nitrideAl oxide

    PC

    Wood( grain)

    AFRE( fibers)*

    CFRE*

    GFRE*

    Glass fibers only

    Carbon fibers only

    Aramid fibers only

    Epoxy only

    0.4

    0.8

    2

    4

    6

    10

    20

    40

    6080

    100

    200

    600800

    10001200

    400

    Tin

    Cu alloys

    Tungsten

    Si carbide

    Diamond

    PTFE

    HDPE

    LDPE

    PP

    Polyester

    PSPET

    CFRE( fibers)*

    GFRE( fibers)*

    GFRE(|| fibers)*

    AFRE(|| fibers)*

    CFRE(|| fibers)*

    Metals

    Alloys

    Graphite

    Ceramics

    Semicond

    Polymers Composites

    /fibers

    E(GPa)

    109 PaComposite data based on

    reinforced epoxy with 60 vol%

    of aligned

    carbon (CFRE),

    aramid (AFRE), or

    glass (GFRE)

    fibers.

    YOUNG’S MODULI: COMPARISON

  • HOT TOPIC

  • • Coefficient of thermal expansion, a

    a is larger if Uo is smaller.

    = a(T2-T1) L

    Lo

    coeff. thermal expansion

    PROPERTIES FROM BONDING: a

    .

    material CTE (ppm/°C)

    silicon 3.2

    alumina 6–7

    copper 16.7

    tin-lead solder 27

    E-glass 54

    S-glass 16

    epoxy resins 15–100

    silicone resins 30–300 • a ~ symmetry at ro

  • Relationships between properties

    Expansion coefficient and melting point

  • Engineering materials – the same

    dependence

  • • Melting Temperature, Tm

    r

    larger T m

    smaller T m

    Energy (r)

    r o

    Tm is larger if Uo is larger

    PROPERTIES FROM BONDING: TM

    *DNA melting temperature The Tm is defined as the temperature in degrees Celsius, at which 50%

    of all molecules of a given DNA sequence are hybridized into a double strand

    and 50% are present as single strands.

    Note that ‘melting’ in this sense is not a change of aggregate state,

    but simply the dissociation of the two molecules of the DNA double helix.

    The melting point of a solid is the temperature at which it changes state from

    solid to liquid at atmospheric pressure.

    At the melting point the solid and liquid phase exist in equilibrium.

    The Lindemann criterion states that melting is expected when the root mean

    square vibration amplitude exceeds a threshold value.

    Assuming that all atoms in a crystal vibrate with the same frequency ν,

    the average thermal energy can be estimated using the equipartition theorem:

    where m is the atomic mass, ν is the frequency, u is the average vibration

    amplitude, kB is the Boltzmann constant, and T is the absolute temperature

    If the threshold value of u2 is c2a2 where c is the Lindemann constant and

    a is the atomic spacing, then the melting point is estimated as

  • Relationships between properties

    Modulus and melting point

  • Engineering materials – the same

    dependence

  • Ceramics

    (Ionic & covalent bonding):

    Metals

    (Metallic bonding):

    Polymers

    (Covalent & Secondary):

    Large bond energy

    large Tm

    large E

    small a

    Variable bond energy

    moderate Tm

    moderate E

    moderate a

    Directional Properties

    Secondary bonding dominates

    small T

    small E

    large a

    SUMMARY: PRIMARY BONDS

  • Type

    Ionic

    Covalent

    Metallic

    Secondary

    Bond Energy

    Large!

    Variable

    large-Diamond

    small-Bismuth

    Variable

    large-Tungsten

    small-Mercury

    smallest

    Comments

    Nondirectional (ceramics)

    Directional

    (semiconductors, ceramics

    polymer chains)

    Nondirectional (metals)

    Directional

    inter-chain (polymer)

    inter-molecular

    SUMMARY: BONDING