atn 910&910i&910b&950b v200r003c00 hardware description 01(cli)
DESCRIPTION
ATN 910&910I&910B&950BTRANSCRIPT
ATN 910&910I&910B&950B Multi-Service AccessEquipment
V200R003C00
Hardware Description
Issue 01
Date 2013-10-31
HUAWEI TECHNOLOGIES CO., LTD.
Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior writtenconsent of Huawei Technologies Co., Ltd. Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders. NoticeThe purchased products, services and features are stipulated by the contract made between Huawei and thecustomer. All or part of the products, services and features described in this document may not be within thepurchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,and recommendations in this document are provided "AS IS" without warranties, guarantees or representationsof any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but all statements, information, andrecommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.Address: Huawei Industrial Base
Bantian, LonggangShenzhen 518129People's Republic of China
Website: http://www.huawei.com
Email: [email protected]
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About This Document
Related VersionThe following table lists the product version related to this document.
Product Name Version
l ATN 910l ATN 910Il ATN 910Bl ATN 950B
V200R003C00
Intended AudienceThis document describes the equipment structure, chassis structure, and board classification.This document also describes each board of these classes in details.
This document helps you get the detailed information about the equipment hardware.
This document is intended for:
l Network planning engineersl Hardware installation engineersl System maintenance engineers
Symbol ConventionsSymbol Description
Indicates an imminently hazardous situation which, if notavoided, will result in death or serious injury.
Indicates a potentially hazardous situation which, if notavoided, could result in death or serious injury.
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Symbol Description
Indicates a potentially hazardous situation which, if notavoided, may result in minor or moderate injury.
Indicates a potentially hazardous situation which, if notavoided, could result in equipment damage, data loss,performance deterioration, or unanticipated results.NOTICE is used to address practices not related to personalinjury.
Calls attention to important information, best practices andtips.NOTE is used to address information not related to personalinjury, equipment damage, and environment deterioration.
Command ConventionsConvention Description
Boldface The keywords of a command line are in boldface.
Italic Command arguments are in italics.
[ ] Items (keywords or arguments) in brackets [ ] are optional.
{ x | y | ... } Optional items are grouped in braces and separated byvertical bars. One item is selected.
[ x | y | ... ] Optional items are grouped in brackets and separated byvertical bars. One item is selected or no item is selected.
{ x | y | ... }* Optional items are grouped in braces and separated byvertical bars. A minimum of one item or a maximum of allitems can be selected.
[ x | y | ... ]* Optional items are grouped in brackets and separated byvertical bars. Several items or no item can be selected.
GUI ConventionsConvention Description
Boldface Buttons, menus, parameters, tabs, window, and dialog titlesare in boldface. For example, click OK.
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Convention Description
> Multi-level menus are in boldface and separated by the ">"signs. For example, choose File > Create > Folder.
Change HistoryUpdates between document issues are cumulative. Therefore, the latest document issue containsall updates made in previous issues.
Changes in Issue 01 (2013-10-31)This document is the first release of the V200R003C00 version.
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Contents
About This Document.....................................................................................................................ii
1 ATN 910 Chassis............................................................................................................................11.1 Appearance.....................................................................................................................................................................21.2 Slot Distribution.............................................................................................................................................................21.3 Installation Information..................................................................................................................................................31.4 Heat Dissipation.............................................................................................................................................................71.5 Safety Labels..................................................................................................................................................................8
2 ATN 910I Chassis........................................................................................................................102.1 Appearance...................................................................................................................................................................112.2 Functions and Features.................................................................................................................................................122.3 Working Principle and Signal Flow.............................................................................................................................142.4 Panel.............................................................................................................................................................................162.5 Installation Information................................................................................................................................................222.6 Heat Dissipation...........................................................................................................................................................232.7 Safety Labels................................................................................................................................................................23
3 ATN 910B Chassis.......................................................................................................................263.1 Appearance...................................................................................................................................................................273.2 Functions and Features.................................................................................................................................................273.3 Working Principle and Signal Flow.............................................................................................................................293.4 Panel.............................................................................................................................................................................303.5 Installation Information................................................................................................................................................363.6 Heat Dissipation...........................................................................................................................................................373.7 Safety Labels................................................................................................................................................................37
4 ATN 950B Chassis.......................................................................................................................394.1 Appearance...................................................................................................................................................................404.2 Slot Distribution...........................................................................................................................................................404.3 Installation Information................................................................................................................................................424.4 Heat Dissipation...........................................................................................................................................................464.5 Safety Labels................................................................................................................................................................47
5 ATN 910 Boards...........................................................................................................................49
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5.1 Board Overview............................................................................................................................................................515.2 Board Type and Application.........................................................................................................................................535.2.1 Board Type................................................................................................................................................................535.2.2 Ethernet Service Interface Board...............................................................................................................................565.2.3 E1 Service Interface Board........................................................................................................................................565.2.4 xDSL Service Interface Board...................................................................................................................................595.3 ANC2CXPI/ANC2CXPL - System Control, Cross-connect, and Multi-protocol Process Unit..................................605.3.1 Front Panel.................................................................................................................................................................605.3.2 Functions and Features..............................................................................................................................................655.3.3 Working Principle and Signal Flow..........................................................................................................................675.3.4 CF Card and DIP Switch...........................................................................................................................................695.3.5 Technical Specifications ...........................................................................................................................................705.4 AND1EG4T - 4 Channels FE/GE Adaptive Electronic Interface Board.....................................................................735.4.1 Front Panel.................................................................................................................................................................735.4.2 Functions and Features..............................................................................................................................................755.4.3 Working Principle and Signal Flow..........................................................................................................................765.4.4 Technical Specifications............................................................................................................................................775.5 AND1EF8T - 8 Channels Fast Ethernet Electric Interface Board................................................................................785.5.1 Front Panel.................................................................................................................................................................785.5.2 Functions and Features..............................................................................................................................................795.5.3 Working Principle and Signal Flow..........................................................................................................................805.5.4 Technical Specifications............................................................................................................................................815.6 AND1EG2 - 2 Channels GE Optical Interface Board..................................................................................................825.6.1 Front Panel.................................................................................................................................................................825.6.2 Functions and Features..............................................................................................................................................835.6.3 Working Principle and Signal Flow..........................................................................................................................845.6.4 Technical Specifications............................................................................................................................................855.7 AND1EG4F - 4 Channels FE/GE Adaptive Optical Interface Board..........................................................................865.7.1 Front Panel.................................................................................................................................................................865.7.2 Functions and Features..............................................................................................................................................875.7.3 Working Principle and Signal Flow..........................................................................................................................885.7.4 Technical Specifications............................................................................................................................................905.8 AND1EF8F - 8 Channels Fast Ethernet Optical Interface Board.................................................................................925.8.1 Front Panel.................................................................................................................................................................925.8.2 Functions and Features..............................................................................................................................................935.8.3 Working Principle and Signal Flow..........................................................................................................................945.8.4 Technical Specifications............................................................................................................................................955.9 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board......................................................................965.9.1 Front Panel.................................................................................................................................................................965.9.2 Functions and Features..............................................................................................................................................985.9.3 Working Principle and Signal Flow........................................................................................................................100
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5.9.4 Specifications...........................................................................................................................................................1025.10 AND2ML1A/AND2ML1B - 16 Channels E1 Interface Board................................................................................1025.10.1 Front Panel.............................................................................................................................................................1035.10.2 Functions and Features..........................................................................................................................................1055.10.3 Working Principle and Signal Flow......................................................................................................................1065.10.4 Technical Specifications........................................................................................................................................1085.11 AND1MD1A/AND1MD1B - 32 Channels E1 Interface Board...............................................................................1095.11.1 Front Panel.............................................................................................................................................................1095.11.2 Functions and Features..........................................................................................................................................1125.11.3 Working Principle and Signal Flow......................................................................................................................1135.11.4 Technical Specifications........................................................................................................................................1155.12 AND1MO1C - 8 Channels T1 Interface Board .......................................................................................................1165.12.1 Front Panel.............................................................................................................................................................1165.12.2 Functions and Features..........................................................................................................................................1175.12.3 Working Principle and Signal Flow......................................................................................................................1185.12.4 Technical Specifications........................................................................................................................................1205.13 AND1AVD8A - 8 Channels ADSL2+ Service Interface Board..............................................................................1215.13.1 Front Panel.............................................................................................................................................................1215.13.2 Functions and Features..........................................................................................................................................1225.13.3 Working Principle and Signal Flow......................................................................................................................1235.13.4 Technical Specifications .......................................................................................................................................1255.14 AND1AVD8B - 8 Channels VDSL2 Service Interface Board.................................................................................1255.14.1 Front Panel.............................................................................................................................................................1255.14.2 Functions and Features..........................................................................................................................................1275.14.3 Working Principle and Signal Flow......................................................................................................................1275.14.4 Technical Specifications .......................................................................................................................................1295.15 AND1SHD4 - 4 Channels G.SHDSL Service Interface Board ...............................................................................1305.15.1 Front Panel.............................................................................................................................................................1305.15.2 Functions and Features..........................................................................................................................................1315.15.3 Working Principle and Signal Flow......................................................................................................................1325.15.4 Technical Specifications .......................................................................................................................................1335.16 AND1SHD4I - 4 Channels G.SHDSL Interface Board for IMA Mode ..................................................................1335.16.1 Front Panel.............................................................................................................................................................1335.16.2 Functions and Features..........................................................................................................................................1355.16.3 Working Principle and Signal Flow......................................................................................................................1355.16.4 Technical Specifications .......................................................................................................................................1385.17 TNC1PIU - Power Interface Board..........................................................................................................................1385.17.1 Front Panel.............................................................................................................................................................1385.17.2 Functions and Features..........................................................................................................................................1395.17.3 Working Principle and Signal Flow......................................................................................................................1405.17.4 Technical Specifications........................................................................................................................................141
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5.18 ANC1FAN - Fan Board............................................................................................................................................1415.18.1 Front Panel.............................................................................................................................................................1415.18.2 Functions and Features..........................................................................................................................................1425.18.3 Working Principle and Signal Flow......................................................................................................................1425.18.4 Technical Specifications........................................................................................................................................1435.19 Filler Panel................................................................................................................................................................1445.19.1 Appearance and Valid Slots..................................................................................................................................1445.19.2 Functions and Features..........................................................................................................................................144
6 ATN 910I Boards........................................................................................................................146
7 ATN 910B Boards.......................................................................................................................147
8 ATN 950B Boards.......................................................................................................................1488.1 Board Overview..........................................................................................................................................................1508.2 Board Type and Application.......................................................................................................................................1528.2.1 Board Type..............................................................................................................................................................1528.2.2 Ethernet Service Interface Board.............................................................................................................................1548.2.3 E1 Service Interface Board......................................................................................................................................1558.2.4 STM-1 Service Interface Board...............................................................................................................................1578.3 AND1CXPA/AND1CXPB - System Control, Cross-connect, and Multi-protocol Process Unit..............................1588.3.1 Front Panel...............................................................................................................................................................1598.3.2 Functions and Features............................................................................................................................................1628.3.3 Working Principle and Signal Flow........................................................................................................................1638.3.4 CF Card and DIP Switch.........................................................................................................................................1658.3.5 Technical Specifications..........................................................................................................................................1668.4 AND2CXPA/AND2CXPB/AND2CXPE - System Control, Cross-connect, and Multi-protocol Process Unit........1678.4.1 Front Panel...............................................................................................................................................................1678.4.2 Functions and Features............................................................................................................................................1718.4.3 Working Principle and Signal Flow........................................................................................................................1728.4.4 DIP Switch...............................................................................................................................................................1748.4.5 Technical Specifications..........................................................................................................................................1748.5 AND1EM4T - 4 Channels GE/FE Electrical Interface Board ...................................................................................1758.5.1 Front Panel...............................................................................................................................................................1758.5.2 Functions and Features............................................................................................................................................1768.5.3 Working Principle and Signal Flow........................................................................................................................1778.5.4 Technical Specifications..........................................................................................................................................1798.6 AND1EM8T - 8 Channels GE/FE Electric Interface Board .....................................................................................1798.6.1 Front Panel...............................................................................................................................................................1798.6.2 Functions and Features............................................................................................................................................1818.6.3 Working Principle and Signal Flow........................................................................................................................1818.6.4 Technical Specifications..........................................................................................................................................1838.7 AND1EM4F - 4 Channels GE/FE Optical Interface Board ......................................................................................184
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8.7.1 Front Panel...............................................................................................................................................................1848.7.2 Functions and Features............................................................................................................................................1858.7.3 Working Principle and Signal Flow........................................................................................................................1868.7.4 Technical Specifications..........................................................................................................................................1888.8 AND1EM4C: 4 Channels GE/FE Combo Board.......................................................................................................1898.8.1 Front Panel...............................................................................................................................................................1908.8.2 Functions and Features............................................................................................................................................1918.8.3 Working Principle and Signal Flow........................................................................................................................1928.8.4 Technical Specifications and Standards Compliance..............................................................................................1948.9 AND1EM8F - 8 Channels GE/FE Optical Interface Board ......................................................................................1968.9.1 Front Panel...............................................................................................................................................................1968.9.2 Functions and Features............................................................................................................................................1978.9.3 Working Principle and Signal Flow........................................................................................................................1988.9.4 Technical Specifications..........................................................................................................................................2008.10 AND1EX1 - 1 Channel 10 GE Optical Interface Board...........................................................................................2028.10.1 Front Panel.............................................................................................................................................................2028.10.2 Functions and Features..........................................................................................................................................2038.10.3 Working Principle and Signal Flow......................................................................................................................2038.10.4 Technical Specifications........................................................................................................................................2058.11 AND2CQ1B - 4 Channels Channelized OC-3c/STM-1c POS Optical Interface Board..........................................2068.11.1 Front Panel.............................................................................................................................................................2078.11.2 Functions and Features..........................................................................................................................................2088.11.3 Working Principle and Signal Flow......................................................................................................................2098.11.4 Technical Specifications........................................................................................................................................2128.12 AND2PQ1: 4 Channels OC-3/STM-1 POS Optical Interface Board.......................................................................2128.12.1 Front Panel.............................................................................................................................................................2128.12.2 Functions and Features..........................................................................................................................................2138.12.3 Working Principle and Signal Flow......................................................................................................................2148.12.4 Technical Specifications and Standards Compliance............................................................................................2158.13 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board..................................................................2168.13.1 Front Panel.............................................................................................................................................................2168.13.2 Functions and Features..........................................................................................................................................2198.13.3 Working Principle and Signal Flow......................................................................................................................2208.13.4 Specifications.........................................................................................................................................................2228.14 AND3ML1A/AND3ML1B - 16 Channels E1 Interface Board................................................................................2238.14.1 Front Panel.............................................................................................................................................................2238.14.2 Functions and Features..........................................................................................................................................2258.14.3 Working Principle and Signal Flow......................................................................................................................2278.14.4 Technical Specifications........................................................................................................................................2298.15 AND2MD1A/AND2MD1B - 32 Channels E1 Interface Board...............................................................................2308.15.1 Front Panel.............................................................................................................................................................230
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8.15.2 Functions and Features..........................................................................................................................................2328.15.3 Working Principle and Signal Flow......................................................................................................................2348.15.4 Technical Specifications........................................................................................................................................2368.16 TND1PIU - Power Interface Board..........................................................................................................................2368.16.1 Front Panel.............................................................................................................................................................2378.16.2 Functions and Features..........................................................................................................................................2388.16.3 Working Principle and Signal Flow......................................................................................................................2388.16.4 Specifications.........................................................................................................................................................2398.17 AND1FAN - Fan Board...........................................................................................................................................2408.17.1 Front Panel.............................................................................................................................................................2408.17.2 Functions and Features..........................................................................................................................................2418.17.3 Working Principle and Signal Flow......................................................................................................................2418.17.4 Specifications.........................................................................................................................................................2438.18 Filler Panel................................................................................................................................................................2438.18.1 Appearance and Valid Slots..................................................................................................................................2438.18.2 Functions and Features..........................................................................................................................................244
9 Swappable Optical/Electrical Modules.................................................................................2459.1 Overview....................................................................................................................................................................2469.2 FE Optical Module.....................................................................................................................................................2489.3 GE Optical Module.....................................................................................................................................................2509.4 10GE Optical Module.................................................................................................................................................2559.5 Electrical Module.......................................................................................................................................................257
10 Cables.........................................................................................................................................25910.1 Power Supply Cables and Ground Cables................................................................................................................26010.1.1 -48 V Power Supply Cable....................................................................................................................................26010.1.2 Power Cable...........................................................................................................................................................26110.1.3 PGND Cables........................................................................................................................................................26210.2 Management Cables.................................................................................................................................................26310.3 Alarm Input/Output Cables......................................................................................................................................26410.4 Clock Cables.............................................................................................................................................................26510.4.1 External Clock Cables...........................................................................................................................................26510.4.2 Clock Bridging Cable............................................................................................................................................26710.5 Service Cables..........................................................................................................................................................26910.5.1 Ethernet Cables......................................................................................................................................................26910.5.2 75-Ohm 8 x E1 Cables...........................................................................................................................................27310.5.3 120-Ohm 8 x E1 Cables.........................................................................................................................................27410.5.4 75-Ohm 16 x E1 Cables.........................................................................................................................................27710.5.5 120-Ohm 16 x E1 Cables.......................................................................................................................................28010.5.6 xDSL Cables..........................................................................................................................................................28310.6 Optical Fibers...........................................................................................................................................................285
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11 Equipment Support.................................................................................................................28711.1 Cabinet Support........................................................................................................................................................28811.1.1 APM30H Outdoor Cabinet....................................................................................................................................28811.1.2 IMB Network Cabinet...........................................................................................................................................28911.1.3 19-inch Open Rack................................................................................................................................................29111.1.4 N63E Cabinet........................................................................................................................................................29211.2 Power Distribution Equipment.................................................................................................................................29311.2.1 Power Distribution.................................................................................................................................................29311.2.2 EPS30-4815AF Power System..............................................................................................................................29411.2.3 27S48D Power System..........................................................................................................................................29911.2.4 HW-100-48AC14D-1 Power System....................................................................................................................30111.2.5 Lead-Acid Battery.................................................................................................................................................30211.3 Heater........................................................................................................................................................................303
12 Quick Reference.......................................................................................................................30512.1 Indicators..................................................................................................................................................................30612.2 Dimensions and Weight............................................................................................................................................31412.3 Power Consumption.................................................................................................................................................31712.4 Interface Specifications............................................................................................................................................32012.4.1 Specifications of STM-1 Optical Interfaces..........................................................................................................32012.4.2 Specifications of FE Optical Interfaces.................................................................................................................32212.4.3 Specifications of GE Optical Interfaces................................................................................................................32412.4.4 Specifications of 10GE Optical Interfaces............................................................................................................32912.4.5 Specifications of GE and FE Electrical Interfaces................................................................................................33112.4.6 Specifications of E1 Electrical Interfaces..............................................................................................................33112.4.7 Specifications of T1 Electrical Interfaces..............................................................................................................33212.4.8 Specifications of the ADSL2+ Interface...............................................................................................................33212.4.9 Specifications of the VDSL2 Interface..................................................................................................................33212.4.10 Specifications of the G.SHDSL Interface............................................................................................................333
A Acronyms and Abbreviations................................................................................................334
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1 ATN 910 Chassis
About This Chapter
The ATN 910 uses the chassis of 1 U high (1 U = 44.45 mm) and supports multiple installationmodes, which facilitates flexible deployment.
The ATN 910 can be flexibly deployed with high reliability and scalability. It has the followingfeatures:
l One power board provides two –48 V or –60 V DC power inputs, ensuring redundancybackup of input power.
l The fan board provides three fans, ensuring proper heat dissipation even when a fan isfaulty.
l Two slots can be flexibly configured with service boards.
1.1 AppearanceThe ATN 910 provides 6 slots and all boards are swappable. The ATN 910 provides six slotsand all boards are swappable. A chassis has a mounting ear at each side and can be installed indifferent cabinets and racks.
1.2 Slot DistributionThis section describes slot distribution on the ATN 910.
1.3 Installation InformationATN 910 provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 910 can be installed in multiple types of cabinets.
1.4 Heat DissipationATN 910 dissipates heat by drawing in air from the left and expelling out the air from the right.
1.5 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
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1.1 AppearanceThe ATN 910 provides 6 slots and all boards are swappable. The ATN 910 provides six slotsand all boards are swappable. A chassis has a mounting ear at each side and can be installed indifferent cabinets and racks.
Figure 1-1 shows the appearance of the ATN 910 that has boards fully configured.
Figure 1-1 Appearance of the ATN 910 that has boards fully configured
Figure 1-2 shows the appearance of the ATN 910 that does not have boards fully configured.
Figure 1-2 Appearance of the ATN 910 that does not have boards fully configured
1.2 Slot DistributionThis section describes slot distribution on the ATN 910.
Figure 1-3 shows the slot distribution on the ATN 910.
Figure 1-3 Slot distribution on the ATN 910
SLOT 1 and SLOT 2
SLOT 3 (2 x GE) SLOT 4 (2 x GE)SLOT 5
SLOT 6
Table 1-1 describes priorities of slots where boards supported by the ATN 910 can be inserted.
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Table 1-1 Priorities of available slots
Name Valid Slot Priorities of Slots (in DescendingOrder)
ANC2CXPI/ANC2CXPL slot 1 and slot 2 -
AND1EF8T/AND1EF8FAND1EG2AND1EG4F
slot 3 or slot 4 slot 3 - slot 4
AND2ML1A/AND2ML1BAND1MD1A/AND1MD1B
slot 3 or slot 4 slot 4 - slot 3
AND1MO1C slot 3 or slot 4 slot 3 - slot 4
AND1AVD8A/AND1AVD8BAND1SHD4/AND1SHD4I
slot 3 or slot 4 slot 3 - slot 4
TNC1PIU slot 5 -
ANC1FAN slot 6 -
Note: The ANC2CXPI or ANC2CXPL each house two slots. Slot 1 and slot 2 house oneANC2CXPI or ANC2CXPL.
1.3 Installation InformationATN 910 provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 910 can be installed in multiple types of cabinets.
As shown in Table 1-2, ATN 910 supports various mounting ears and can be installed in multipletypes of cabinets.
Table 1-2 Requirements on the cabinet and mounting ears
Mounting Ear ApplicableCabinetStandard
ApplicableHuawei Cabinet
Remarks
IEC60297 N66EN68EN610E19-inch open rackIMB networkcabinetAPM30H outdoorcabinet
The mounting earsare delivered withthe device.
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Mounting Ear ApplicableCabinetStandard
ApplicableHuawei Cabinet
Remarks
ETSI300-119 N63EN66T
The mounting earsare rack-mountingears that areinstalled on themounting earsdelivered with thedevice.
IEC60297 (23-inch)
- The mounting earsare for a 23-inchcabinet and are usedto substitute for themounting earsdelivered with thedevice when thedevice needs to beinstalled in a 23-inch cabinet.
ATN 910 provides three installation positions for mounting ears. Users can determine aninstallation position for mounting ears based on the depth of the cabinet. Figure 1-4 shows theinstallation positions of mounting ears. Position 1 shows a pair of mounting ears delivered withATN 910.
Figure 1-4 Installation positions of mounting ears
Position 3 for installing the mounting ears
Already installed mounting ears
Position 1 for installing the mounting ears
Position 2 for installing the mounting ears
Determine an installation position for mounting ears based on the cabinet depth. The followingfigures show the installation dimensions when mounting ears are installed in different positions.
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Figure 1-5 Determine an installation position for mounting ears (IEC)
31.8
220
224
Unit: mm
465.1
208
132.5
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Figure 1-6 Determine an installation position for mounting ears (ETSI)
25
220
241.5
Unit: mm
515
225.5
150
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Figure 1-7 Determine an installation position for mounting ears (23-inch)
31.8220
217.5
Unit: mm
566.7
201.5
126
NOTE
When installing the ATN 910 in the cabinet, reserve 80 mm space at the front of the panel for cabling.
1.4 Heat DissipationATN 910 dissipates heat by drawing in air from the left and expelling out the air from the right.
Figure 1-8 shows the system air duct.
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Figure 1-8 ATN 910 Air duct
l Heat dissipation holes of air intake and exhaust vents on ATN 910 must be kept clean andunblocked.
l A distance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 910to ensure good ventilation.
l Filler panels must be installed on unused slots. In addition, on ATN 910, heat must bedissipated by drawing in air from the left and expelling out the air from the right.
l The ambient temperature of ATN 910 must be within the range of -20°C to +60°C. WhenATN 910 is installed in a cabinet, temperature inside the cabinet must be within thetemperature range and the air duct of the cabinet must be consistent with that of ATN 910.
1.5 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
Label Position
Figure 1-9 shows positions of labels on the chassis.
Figure 1-9 Label position
合格证/QUALIFICATION CARD
华为技术有限公司 中国制作M ADE IN CHINAHUAW EI TECHNOLOGIES CO.,LTD.
HUAWEI
!
华为技术有限公司 中国制造
HUAWEI TECHNOLGIES CO. ,LTD. MADE IN CHINA
ATN 910POWER RATING: -48--60V;4A电源额定值
1类激光产品
Class 1 Laser ProductN14036
この装置は、クラスA情報技術装置です。この装置を家庭環境で使用すゐと電波妨害を引き起こすことがぁります。この場合には使用
者が適切な対策を講ずゐよぅ要求されゐことがぁります。 VCCI-A
Label Description
There are labels on the chassis and boards. See Table 1-3.
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Table 1-3 Label description
Figure Type Description
Backplane bar code label The bar code of the backplane will beretrieved by ATN 910 as the equipmentserial number (ESN).
ESD protection label The label suggests the electrostatic-sensitive equipment.
Chassis grounding label The label indicates the position of thegrounding terminal. When the equipmentis installed in a 19-inch cabinet, it isrecommended that you use the groundingterminal specified in this label.
Chassis grounding label The label indicates the position of thegeneral grounding terminal. When theequipment is installed in a cabinet ratherthan a 19-inch cabinet, it is recommendedthat you use the grounding terminalspecified in this label.
Fan warning label The label suggests that do not touch the fanleaves when the fan is rotating.
!Operation warning label The label indicates the precautions that
should be taken for operations on the PIUboard. For details, see Label.
合格证/QUALIFICATION CARD
华为技术有限公司 中国制造MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.
HUAWEI
Qualification label The equipment is qualified.
ATN 910电源额定值 POWER RATING: -48--60V;4A
华为技术有限公司 中国制造
HUAWEI TECHNOLGIES CO.,LTD. MADE IN CHINA
1类激光产品Class 1 Laser ProductN14036
この装置は、クラスA情報技術装置です。この装置を家庭環境で使用すゐと電波妨害を引き起こすことがぁります。この場合には使用者が適切な対策
を講ずゐよぅ要求されゐことがぁります。 VCCI-A
Product nameplate label(General)
The label suggests the product name andcertification.
N14036
华为技术有限公司 中国制造
HUAWEI TECHNOLGIES CO.,LTD. MADE IN CHINA
この装置は、クラスA情報技術装置です。この装置を家庭環境で使用すゐと電波妨害を引き起こすことがぁります。この場合には使用者が適切な対策を講ずゐよぅ要求されゐことがぁります。 V C C I ------ A
ATN 910电源额定值 POWER RATING: -48--60V;4A
1类激光产品Class 1 Laser Product
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1)this device may not cause harmful interference,and(2)this device must accept any interference received,including interference that may cause undesired operation.
Complles With 21 CFR Chapter I,Subchapter JULC US
LISTED
I.T.E.65JJ
E210619
Product nameplate label(North America)
The label suggests the product name andcertification.
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2 ATN 910I Chassis
About This Chapter
The ATN 910I uses the chassis of 1 U high (1 U = 44.45 mm) and supports multiple installationmodes, which facilitates flexible deployment.
2.1 AppearanceThe ATN 910I integrates boards and modules, which are not swappable. A chassis has amounting ear at each side and can be installed in different cabinets and racks.
2.2 Functions and FeaturesThe ATN 910I can receive and process FE, GE, and E1 service signals, implement servicescheduling, support system control, and provide system clock processing and auxiliary interfacefunctions.
2.3 Working Principle and Signal FlowThe ATN 910I consists of the ANF1CXPx, power module, and fan module.
2.4 PanelThere are indicators, buttons, and interfaces on the ATN 910I panel.
2.5 Installation InformationATN 910I provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 910I can be installed in multiple types of cabinets.
2.6 Heat DissipationATN 910I dissipates heat by drawing in air from the left and expelling out the air from the right.
2.7 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
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2.1 AppearanceThe ATN 910I integrates boards and modules, which are not swappable. A chassis has amounting ear at each side and can be installed in different cabinets and racks.
Table 2-1 describes multiple models of the ATN 910I.
Table 2-1 Description of the ATN 910I models
Model/Silkscreen
Built-inControlBoard
PowerSupply
Interface Temperature 1588ACR
POE
ATN 910I AC ANF1CXPI
AC 4GE(Oa)+4GE/FE(O)+4GE/FE(Eb)
-20ºC to +60ºC(fan cooling)
Notsupported
Notsupported
ATN 910I-CAC
ANF1CXPB
AC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
-20ºC to +60ºC(fan cooling)
Supported Notsupported
ATN 910I-POE
ANF2CXPA
AC 4GE(O)+4GE/FE(O)+4GE/FE(E)
-20ºC to +65ºC(fan cooling)
Notsupported
Supported
ATN 910I DC ANF1CXPI
DC 4GE(O)+4GE/FE(O)+4GE/FE(E)
-20ºC to +60ºC(fan cooling)
Notsupported
Notsupported
ANF1CXPA
DC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
-20ºC to +60ºC(fan cooling)
Notsupported
Notsupported
ATN 910I-TCDC
ANF1CXPB
DC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
-40ºC to +65ºC(fan cooling)
Supported Notsupported
NOTE
l (O) indicates an SPF cage.
l (E) indicates an RJ-45 electrical interface.
l (COMBO) indicates a COMBO interface.
The following figures show the appearance of the ATN 910I of different models.
Figure 2-1 Appearance of the ATN 910I AC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)
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Figure 2-2 Appearance of the ATN 910I-C AC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
Figure 2-3 Appearance of the ATN 910I-POE AC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)
Figure 2-4 Appearance of the ATN 910I DC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)
Figure 2-5 Appearance of the ATN 910I DC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
Figure 2-6 Appearance of the ATN 910I-TC DC with interfaces 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
2.2 Functions and FeaturesThe ATN 910I can receive and process FE, GE, and E1 service signals, implement servicescheduling, support system control, and provide system clock processing and auxiliary interfacefunctions.
Table 2-2 describes functions and features of the ATN 910I.
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Table 2-2 Functions and features of the ATN 910I
Function and Feature Description
Auxiliary interface function Provides one NM serial port or NM network port tocommunicate with the NMS so that the NMS can manage andquery the equipment.
Provides two interfaces for inputting and outputting theexternal clock/time to obtain the external clock/timeinformation.
Provides one alarm input/output interface. The interfaceprovides three inputs of alarm digital parameters.
Ethernet interface function FE SFP interfaces support FE optical modules and FEelectrical modules.GE SFP interfaces support GE optical modules and GEelectrical modules.FE/GE SFP interfaces support FE optical modules, FEelectrical modules, GE optical modules, and GE electricalmodules.
FE electrical interfaces support signals at 10 Mbit/s and 100Mbit/s.FE/GE electrical interfaces support signals at 10 Mbit/s, 100Mbit/s, and 1000 Mbit/s.Electrical interfaces support the PoE function and a maximumoutput power of 30 W (only on the ATN 910I-P AC).
Supports inloops and outloops.
GE interfaces support flow control.
Supports Layer 2 and Layer 3 working modes.
Supports physical-layer clock synchronization (synchronousEthernet).Supports IEEE 1588v2 and IEEE 1588 ACR.
E1 interface function Supports a 75-ohm or 120-ohm impedance value (based on theactual E1 cable)
Supports the E1 and CE1 modes.
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
Supports the ATM, TDM, and PPP protocols.
Supports physical-layer clock synchronization.
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Function and Feature Description
NOTE
l If the SFP interface houses an electrical module, the interface does not support synchronous Ethernetor IEEE 1588v2.
l When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernetclock or IEEE 1588v2.
l Only some models of the ATN 910I support the 1588 ACR clock. For details, see 2.1 Appearance.
2.3 Working Principle and Signal FlowThe ATN 910I consists of the ANF1CXPx, power module, and fan module.
Figure 2-7 describes the functional block diagram of the ATN 910I.
Figure 2-7 Functional block diagram of the ATN 910I
Service scheduling and
processing module
Clock module
Communication control module
Auxiliary interface module
Time/clock signals
FE pinch board
Power module
Fan module
Power supplyClock input/output interface
NM network interface/serial interface
Alarm input/output interface
Time input/output interface
4 x GE optical signals
4 x FE/GE optical signals
4 x FE/GE electrical signals
16 x E1 signals
4 x FE electrical signals
To other function modules
To other function modules
Transmit DirectionAfter buffering and scheduling the service packets, the service scheduling and processingmodule performs coding/decoding and serial/parallel conversion. Then the interfaces on thepanel send Ethernet electrical/optical signals and E1 signals out.
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Receive Direction
The service access interfaces on the panel receive Ethernet electrical/optical signals and E1signals. Then the service scheduling and processing module performs serial/parallel conversionand coding/decoding, and buffers and schedules service packets.
Auxiliary Interface Module
The auxiliary interface module provides the following interfaces:
l External time input/output interface
l External clock input/output interface
l NM serial interface/NM interface used to communicate with the NMS and to manage andquery network elements
l Alarm input/output interface
Communication Control Module
The communication control module provides the following functions:
l Configures and monitors the entire system.
l Provides an NM interface or NM serial interface for communication.
Service Scheduling and Processing Module
The service scheduling and processing module provides the following functions:
l Processes service signals received on the interface cards.
l Schedules services with the switching capacity of 12 Gbit/s in full duplex mode.
Clock Module
The clock module provides the following functions:
l Provides a working clock for each module on the board.
l Supports synchronous Ethernet and the SSM protocol.
l Supports IEEE 1588v2.
l Supports the 1588 ACR clock.
NOTE
Only some models of the ATN 910I support the 1588 ACR clock. For details, see 2.1 Appearance.
Power Module
The power module supplies power for other modules.
NOTE
The ATN 910I supports AC and DC power supplies. For details about power supplies supported by eachproduct model, see 2.1 Appearance.
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Fan ModuleThe fan module implements heat dissipation for the system.
2.4 PanelThere are indicators, buttons, and interfaces on the ATN 910I panel.
Appearance of the PanelFigure 2-8 shows the appearance of the ATN 910I panel.
Figure 2-8 Appearance of the ATN 910I panel (ATN 910I DC is used as an example)
GE0-GE3 FE/GE0-FE/GE3 FE/GE4-FE/GE7 E1(0-15)
ETH/OAM CLK TOD ALMI/ALMO
RST
ALMSTATPWR
IndicatorThe ATN 910I provides the following indicators:
System indicator
l PWRA/PWRB indicator, green, which indicates the power statusl STAT indicator, red, green, or orange, which indicates the working statusl ALM, red or orange, which indicates the alarm status.
Interface indicator
l LINK/ACT, green or orange, which indicates the connection status/data transceiving statuson the SFP interface.
l LINK indicator, green, which indicates the connection status of a service portl ACT indicator, orange, which indicates the receive/transmit status of a service port
ButtonThere is only one RST button on the ATN 910I for resetting the device.
The RST button can also be used to clear the passwords and configuration files on the ATN910I. Once you press the RST button, the device begins to reset. Then you press and hold downthe RST button for about 10s until the PWR, STA, and ALM indicators blink green. The devicebegins to automatically clear the passwords and configuration files. If you hold down the RSTbutton 15s or more than 15s, the device only resets and does not clear the passwords andconfiguration files.
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Interface
Table 2-3 describes the interfaces on the ATN 910I and their functions.
Table 2-3 Interfaces on the ATN 910I
InterfaceName
InterfaceType
Function Description about theCorresponding Cable
ETH/OAM RJ-45 10M/100M interface that canfunction as an NM interface orconsole interface
For details, see 10.2Management Cables.
CLK RJ-45 Clock input/output interface For details, see 10.4 ClockCables.
TOD RJ-45 Time input/output interface For details, see 10.4 ClockCables.
ALMI/O RJ-45 Alarm input/output interface -
GE0 to GE3 SFP GE service signal input/outputinterface
For details, see 10.6Optical Fibers or 10.5.1Ethernet Cables.
FE/GE0 toFE/GE3
SFP FE/GE service signal input/output interface
For details, see 10.6Optical Fibers or 10.5.1Ethernet Cables.
FE/GE4 toFE/GE7
RJ-45 FE/GE service signal input/output interface
For details, see 10.5.1Ethernet Cables.
E1 (0 to 15) Anea 96 E1 service signal input/outputinterface
For details, see 10.5.4 75-Ohm 16 x E1 Cables and10.5.5 120-Ohm 16 x E1Cables.
NOTEThe SFP interface can connect to cables only after an optical module or an electrical module is installed.
As shown in Table 2-5, the three groups of interfaces on the ATN 910I are controlled by thelicense (LANFGEPAYG01 and LANFCOMBO01).
l LANFGEPAYG01 is used for interfaces in group 1. Interfaces in group 1 can be normallyused only after this license is used.
l LANFCOMBO01 is used for interfaces in groups 2 and 3. Interfaces in groups 2 and 3can be divided into 4 pairs: FE/GE0, FE/GE1, FE/GE2, and FE/GE3. Each pair includesone SFP interface and one RJ-45 interface.
– When this license is not used, either the SFP or RJ-45 interface in each pair of interfacescan be used. Among the 8 interfaces in groups 2 and 3, a maximum of 4 interfaces canbe used.
– When this license is used, all of the 8 interfaces in groups 2 and 3 can be normally used.
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Figure 2-9 Three groups of interfaces on the ATN 910I
Group 1 Group 2 Group 3
FE/GE0 FE/GE1 FE/GE2 FE/GE3
Pin Assignments
Table 2-4 Pins for the ETH/OAM interface
Front View Pin Function
18 24 3567
1 Transmit positive pole of the NM interface
2 Transmit negative pole of the NM interface
3 Receive positive pole of the NM interface
4 Ground end of the console interface
5 Receive end of the console interface
6 Receive negative pole of the NM interface
7 Unspecified
8 Receive end of the console interface
Table 2-5 Pins for the CLK interface
Front View Pin Working Mode
18 24 3567
1 Receive negative pole of the CLK interface
2 Receive positive pole of the CLK interface
3 Unspecified
4 Transmit negative pole of the CLK interface
5 Transmit positive pole of the CLK interface
6 Unspecified
7 Unspecified
8 Unspecified
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Table 2-6 Pins for the TOD interface
Front View Pin Working Mode
External TimeInput(1 PPS+TimeInformation)
External TimeOutput(1 PPS+TimeInformation)
18 24 3567
1 Unspecified Unspecified
2 Unspecified Unspecified
3 Input negative pole of1 PPS signals(RS422 level)
Output negative poleof 1 PPS signals(RS422 level)
4 Ground end Ground end
5 Ground end Ground end
6 Input positive pole of1 PPS signals(RS422 level)
Output positive pole of1 PPS signals(RS422 level)
7 Input negative pole oftime information(RS422 level)
Output negative poleof time information(RS422 level)
8 Input positive pole oftime information(RS422 level)
Output positive pole oftime information(RS422 level)
NOTEThe TOD interface can work only in one mode.
Table 2-7 Pins for the ALMI/ALMO interface
Front View Pin Function
18 24 3567
1 Boolean input
2 Ground end
3 Boolean input
4 Boolean input
5 Ground end
6 Ground end
7 Boolean output positive pole
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Front View Pin Function
8 Boolean output negative pole
Table 2-8 Pins for the GE electrical interface
Front View Pin Usage
18 24 3567
1 Positive of twisted pair cable 1
2 Negative of twisted pair cable 1
3 Positive of twisted pair cable 2
4 Positive of twisted pair cable 3
5 Negative of twisted pair cable 3
6 Negative of twisted pair cable 2
7 Positive of twisted pair cable 4
8 Negative of twisted pair cable 4
Table 2-9 Pins for the FE interface
Front View Pin Function
18 24 3567
1 Positive pole of twisted pair cable 1
2 Negative pole of twisted pair cable 1
3 Positive pole of twisted pair cable 2
4 Unspecified
5 Unspecified
6 Negative pole of twisted pair cable 2
7 Unspecified
8 Unspecified
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Table 2-10 Pins of the Anea 96 interface
Front View Connector Pin Usage Connector Pin Usage
1 R x 0 25 T x 0
2 26
3 R x 1 27 T x 1
4 28
5 R x 2 29 T x 2
6 30
7 R x 3 31 T x 3
8 32
9 R x 4 33 T x 4
10 34
11 R x 5 35 T x 5
12 36
13 R x 6 37 T x 6
14 38
15 R x 7 39 T x 7
16 40
17 R x 8 41 T x 8
18 42
19 R x 9 43 T x 9
20 44
21 R x 10 45 T x 10
22 46
23 R x 11 47 T x 11
24 48
49 R x 12 73 T x 12
50 74
51 R x 13 75 T x 13
52 76
53 R x 14 77 T x 14
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Front View Connector Pin Usage Connector Pin Usage
54 78
55 R x 15 79 T x 15
56 80
2.5 Installation InformationATN 910I provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 910I can be installed in multiple types of cabinets.
As shown in Table 2-11, ATN 910I supports various mounting ears and can be installed inmultiple types of cabinets.
Table 2-11 Requirements on the cabinet and mounting ears
Mounting Ear ApplicableCabinetStandard
ApplicableHuawei Cabinet
Remarks
IEC60297 N66EN68EN610E19-inch open rackIMB networkcabinetAPM30H outdoorcabinet
The mounting earsare delivered withthe device.
ETSI300-119 N63EN66T
The mounting earsare rack-mountingears that areinstalled on themounting earsdelivered with thedevice.
IEC60297 (23-inch)
- The mounting earsare for a 23-inchcabinet and are usedto substitute for themounting earsdelivered with thedevice when thedevice needs to beinstalled in a 23-inch cabinet.
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2.6 Heat DissipationATN 910I dissipates heat by drawing in air from the left and expelling out the air from the right.
Figure 2-10 shows the ATN 910I air duct.
Figure 2-10 ATN 910I air duct
l Heat dissipation holes of air intake and exhaust vents on ATN 910I must be kept clean and
unblocked.l A clearance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 910I
to ensure good ventilation.l The ambient temperature of the ATN 910I-TC DC must be within the range of -40°C to
65°C, and that of ATN 910I in other models must be within the range of -20°C to +60°C.ATN 910I When ATN 910I is installed in a cabinet, temperature inside the cabinet mustbe within the permitted temperature range and the air duct of the cabinet must be consistentwith that of ATN 910I.
l When ATN 910I is installed in a cabinet, temperature inside the cabinet must be within thetemperature range and the air duct of the cabinet must be consistent with that of ATN 910I.For details about temperature range by each product model, see 2.1 Appearance.
2.7 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
Label PositionFigure 2-11 shows positions of labels on the chassis.
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Figure 2-11 Label position
合格证/QUALIFICATION CARD
华为技术有限公司 中国制作M ADE IN CHINAHUAW EI TECHNOLOGIES CO.,LTD.
HUAWEI
OptiX PTN 910-F电源额定值 POWER RATING:
华为技术有限公司 中国制造HUAWEI TECHNO LGIES CO .,LT D. MADE IN CHINA
~100-240V;50/60Hz;0.8A MAX
1类激光产品Class 1 Laser Product
N1 4036
Label DescriptionThere are labels on the chassis. See Table 2-12.
Table 2-12 Label description
Figure Type Description
Backplane bar code label The bar code of the backplane will beretrieved by ATN device as the equipmentserial number (ESN).
Chassis grounding label The label indicates the position of thegeneral grounding terminal. When theequipment is installed in a cabinet ratherthan a 19-inch cabinet, it is recommendedthat you use the grounding terminalspecified in this label.
Chassis grounding label The label indicates the position of thegrounding terminal. When the equipmentis installed in a 19-inch cabinet, it isrecommended that you use the groundingterminal specified in this label.
Operation warning label The label indicates the precautions thatshould be taken for operations.
合格证/QUALIFICATION CARD
华为技术有限公司 中国制造MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.
HUAWEI
Qualification label The equipment is qualified.
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Figure Type Description
Product nameplate label The label suggests the product name andcertification.
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3 ATN 910B Chassis
About This Chapter
The ATN 910B uses the chassis of 1 U high (1 U = 44.45 mm) and supports multiple installationmodes, which facilitates flexible deployment.
3.1 AppearanceThe ATN 910B integrates boards and modules, which are not swappable. A chassis has amounting ear at each side and can be installed in different cabinets and racks.
3.2 Functions and FeaturesThe ATN 910B can receive and process FE, GE, 10GE, and E1 service signals, implementservice scheduling, support system control, and provide system clock processing and auxiliaryinterface functions.
3.3 Working Principle and Signal FlowThe ATN 910B consists of the CXPx, power module, and fan module.
3.4 PanelThere are indicators, buttons, and interfaces on the ATN 910B panel.
3.5 Installation InformationATN 910B provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 910B can be installed in multiple types of cabinets.
3.6 Heat DissipationATN 910B dissipates heat by drawing in air from the left and expelling out the air from the right.
3.7 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
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3.1 AppearanceThe ATN 910B integrates boards and modules, which are not swappable. A chassis has amounting ear at each side and can be installed in different cabinets and racks.
Table 3-1 describes multiple models of the ATN 910B.
Table 3-1 Description of the ATN 910B models
Silkscreen Built-inControlBoard
Interface Cross-ConnectCapacity
1588 ACR
ATN 910B-A DC ANG1CXPA 2x10GE(O)+8xGE/FE(O)+8xFE/GE(E)+16E1
36 Gbit/s Supported
ATN 910B-B DC ANG1CXPB 2x10GE(O)+16xGE/FE(O)+8xFE/GE(E) 44 Gbit/s Notsupported
NOTE
l (O) indicates an XFP interface for 10GE services or an SFP interface for GE/FE services.
l (E) indicates an RJ-45 electrical interface.
Figure 3-1 and Figure 3-2 show the appearance of the ATN 910B of different models.
Figure 3-1 Appearance of the ATN 910B-A with interfaces 2x10GE(O)+8xGE/FE(O)+8xFE/GE(E)+16E1
Figure 3-2 Appearance of the ATN 910B-B with interfaces 2x10GE(O)+16xGE/FE(O)+8xFE/GE(E)
3.2 Functions and FeaturesThe ATN 910B can receive and process FE, GE, 10GE, and E1 service signals, implementservice scheduling, support system control, and provide system clock processing and auxiliaryinterface functions.
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Table 3-2 describes functions and features of the ATN 910B.
Table 3-2 Functions and features of the ATN 910B
Function and Feature Description
Auxiliary interface function Provides one NM serial port or NM network port tocommunicate with the NMS so that the NMS can manage andquery the equipment.
Provides two interfaces for inputting and outputting theexternal clock/time to obtain the external clock/timeinformation.
Provides one alarm input/output interface. The interfaceprovides three inputs of alarm digital parameters.
Ethernet interface function FE/GE SFP interfaces support FE optical modules, FEelectrical modules, GE optical modules, and GE electricalmodules.10GE XFP interfaces support 10GE optical modules.
FE/GE electrical interfaces support signals at 10 Mbit/s, 100Mbit/s, and 1000 Mbit/s.
Supports inloops and outloops.
GE interfaces support flow control.
Supports Layer 2 and Layer 3 working modes.
Supports physical-layer clock synchronization (synchronousEthernet).Supports IEEE 1588v2 and IEEE 1588 ACR.
E1 interface function Supports a 75-ohm or 120-ohm impedance value (based on theactual E1 cable)
Supports the E1 and CE1 modes.
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
Supports the ATM, TDM, and PPP protocols.
Supports physical-layer clock synchronization.
NOTE
l If the SFP interface houses an electrical module, the interface does not support synchronous Ethernetor IEEE 1588v2.
l When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernetclock or IEEE 1588v2.
l Among the two ATN 910B models, only ATN 910B-A supports 1588 ACR.
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3.3 Working Principle and Signal FlowThe ATN 910B consists of the CXPx, power module, and fan module.
Figure 3-3 uses ATN 910B-A as an example to show the working principle and signal flow ofATN 910B.
Figure 3-3 Functional block diagram of the ATN 910B
Service scheduling and
processing module
Clock module
Communication control module
Auxiliary interface module
Time/clock signals
ANG1MO1 pinch board
Power module
Fan module
Power supplyClock input/output interface
NM network interface/serial interface
Alarm input/output interface
Time input/output interface
2 x 10GE optical signals
8 x FE/GE optical signals
8 x FE/GE electrical signals
16 x E1 signals
To other function modules
To other function modules
Transmit Direction
After buffering and scheduling the service packets, the service scheduling and processingmodule performs coding/decoding and serial/parallel conversion. Then the interfaces on thepanel send Ethernet electrical/optical signals and E1 signals out.
Receive Direction
The service access interfaces on the panel receive Ethernet electrical/optical signals and E1signals. Then the service scheduling and processing module performs serial/parallel conversionand coding/decoding, and buffers and schedules service packets.
Auxiliary Interface Module
The auxiliary interface module provides the following interfaces:
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l External time input/output interface
l External clock input/output interface
l NM serial interface/NM interface used to communicate with the NMS and to manage andquery network elements
l Alarm input/output interface
Communication Control Module
The communication control module provides the following functions:
l Configures and monitors the entire system.
l Provides an NM interface or NM serial interface for communication.
Service Scheduling and Processing Module
The service scheduling and processing module provides the following functions:
l Processes service signals received on the interface cards.
l Schedules services in full duplex mode.
Clock Module
The clock module provides the following functions:
l Provides a working clock for each module on the board.
l Supports synchronous Ethernet and the SSM protocol.
l Supports IEEE 1588v2.
l Supports the 1588 ACR clock.
Power Module
The power module supplies power for other modules.
Fan Module
The fan module implements heat dissipation for the system.
3.4 PanelThere are indicators, buttons, and interfaces on the ATN 910B panel.
Appearance of the Panel
Figure 3-4 uses ATN 910B-A as an example to show the panels of ATN 910Bl.
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Figure 3-4 Appearance of the ATN 910B panel
RST OUT0 IN0
OUT1 IN1
ALMI/ALMO
TOD
CLKETH/OAM
FE/GE: 0|2|4|6 E1(0-7)
E1(8-15)
LINK/ACT
STATPWR ALM
FE/GE: 8|10|12|14
FE/GE: 9|11|13|15FE/GE: 1|3|5|7
PWRAPWRB
IndicatorThe ATN 910B provides the following indicators:
System indicator
l PWRA/PWRB indicator, green, which indicates the power statusl STAT indicator, red, green, or orange, which indicates the working statusl ALM, red or orange, which indicates the alarm status.
Interface indicator
l LINK/ACT, green or orange, which indicates the connection status/data transceiving statuson the SFP interface and XFP interface.
l LINK indicator, green, which indicates the connection status of a service portl ACT indicator, orange, which indicates the receive/transmit status of a service port
ButtonThere is only one RST button on the ATN 910B for resetting the device.
The RST button can also be used to clear the passwords and configuration files on the ATN910B. Once you press the RST button, the device begins to reset. Then you press and hold downthe RST button for about 10s until the PWR, STA, and ALM indicators blink green. The devicebegins to automatically clear the passwords and configuration files. If you hold down the RSTbutton 15s or more than 15s, the device only resets and does not clear the passwords andconfiguration files.
InterfaceTable 3-3 describes the interfaces on the ATN 910B and their functions.
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Table 3-3 Interfaces on the ATN 910B
InterfaceName
InterfaceType
Function Description about theCorresponding Cable
ETH/OAM RJ-45 10M/100M interface that canfunction as an NM interface orconsole interface
For details, see 10.2Management Cables.
CLK RJ-45 Clock input/output interface For details, see 10.4 ClockCables.
TOD RJ-45 Time input/output interface For details, see 10.4 ClockCables.
ALMI/ALMO
RJ-45 Alarm input/output interface -
OUT0 IN0— OUT1IN1
XFP 10GE service signal input/output interface
For details, see 10.6Optical Fibers.
FE/GE0 —FE/GE7(ATN910B-A)
SFP FE/GE service signal input/output interface
For details, see 10.6Optical Fibers or 10.5.1Ethernet Cables.
FE/GE0 —FE/GE15(ATN910B-B)
SFP FE/GE service signal input/output interface
For details, see 10.6Optical Fibers or 10.5.1Ethernet Cables.
FE/GE8 —FE/GE15(ATN910B-A)
RJ-45 FE/GE service signal input/output interface
For details, see 10.5.1Ethernet Cables.
FE/GE16— FE/GE23 (ATN910B-B)
RJ-45 FE/GE service signal input/output interface
For details, see 10.5.1Ethernet Cables.
E1 (0–15)(ATN910B-A)
DB44 E1 service signal input/outputinterface
For details, see 10.5.2 75-Ohm 8 x E1 Cables and10.5.3 120-Ohm 8 x E1Cables.
NOTEThe SFP interface can connect to cables only after an optical module or an electrical module is installed.
The XFP interface can connect to cables only after an optical module is installed.
10GE interfaces on the ATN 910B are under license control (LANG2XGE01). If the license is not loaded,10GE interfaces are unavailable. GE interfaces are also under license control (LANGGEPAYG01 andLANG4GEPAYG01). If the license is not loaded, only a maximum of eight interfaces can be used.
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Pin Assignments
Table 3-4 Pins for the ETH/OAM interface
Front View Pin Function
18 24 3567
1 Transmit positive pole of the NM interface
2 Transmit negative pole of the NM interface
3 Receive positive pole of the NM interface
4 Ground end of the console interface
5 Receive end of the console interface
6 Receive negative pole of the NM interface
7 Unspecified
8 Receive end of the console interface
Table 3-5 Pins for the CLK interface
Front View Pin Working Mode
18 24 3567
1 Receive negative pole of the CLKinterface
2 Receive positive pole of the CLKinterface
3 Unspecified
4 Transmit negative pole of the CLKinterface
5 Transmit positive pole of the CLKinterface
6 Unspecified
7 Unspecified
8 Unspecified
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Table 3-6 Pins for the TOD interface
Front View Pin Working Mode
External TimeInput(1 PPS+TimeInformation)
External TimeOutput(1 PPS+TimeInformation)
18 24 3567
1 Unspecified Unspecified
2 Unspecified Unspecified
3 Input negative pole of1 PPS signals(RS422 level)
Output negative poleof 1 PPS signals(RS422 level)
4 Ground end Ground end
5 Ground end Ground end
6 Input positive pole of 1PPS signals(RS422 level)
Output positive pole of1 PPS signals(RS422 level)
7 Input negative pole oftime information(RS422 level)
Output negative poleof time information(RS422 level)
8 Input positive pole oftime information(RS422 level)
Output positive pole oftime information(RS422 level)
NOTEThe TOD interface can work only in one mode.
Table 3-7 Pins for the ALMI/ALMO interface
Front View Pin Function
18 24 3567
1 Boolean input
2 Ground end
3 Boolean input
4 Boolean input
5 Ground end
6 Ground end
7 Boolean output positive pole
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Front View Pin Function
8 Boolean output negative pole
Table 3-8 Pins for the GE electrical interface
Front View Pin Usage
18 24 3567
1 Positive of twisted pair cable 1
2 Negative of twisted pair cable 1
3 Positive of twisted pair cable 2
4 Positive of twisted pair cable 3
5 Negative of twisted pair cable 3
6 Negative of twisted pair cable 2
7 Positive of twisted pair cable 4
8 Negative of twisted pair cable 4
Table 3-9 Pins of the DB44 interface
Front View Pin Usage Pin Usage
1
44
38 R0 15 T0
23 30
37 R1 14 T1
22 29
36 R2 13 T2
21 28
35 R3 12 T3
20 27
34 R4 11 T4
19 26
33 R5 10 T5
18 25
32 R6 9 T6
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Front View Pin Usage Pin Usage
17 24
31 R7 8 T7
16 7
3.5 Installation InformationATN 910B provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 910B can be installed in multiple types of cabinets.
As shown in Table 3-10, ATN 910B supports various mounting ears and can be installed inmultiple types of cabinets.
Table 3-10 Requirements on the cabinet and mounting ears
Mounting Ear ApplicableCabinetStandard
ApplicableHuawei Cabinet
Remarks
IEC60297 N66EN68EN610E19-inch open rackIMB networkcabinetAPM30H outdoorcabinet
The mounting earsare delivered withthe device.
ETSI300-119 N63EN66T
The mounting earsare rack-mountingears that areinstalled on themounting earsdelivered with thedevice.
IEC60297 (23-inch)
- The mounting earsare for a 23-inchcabinet and are usedto substitute for themounting earsdelivered with thedevice when thedevice needs to beinstalled in a 23-inch cabinet.
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3.6 Heat DissipationATN 910B dissipates heat by drawing in air from the left and expelling out the air from the right.
Figure 3-5 shows the system air duct.
Figure 3-5 ATN 910B air duct
≥50 mm≥50 mm
l Heat dissipation holes of air intake and exhaust vents on ATN 910B must be kept clean
and unblocked.l A clearance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 910B
to ensure good ventilation.l The ambient temperature of ATN 910B must be within the range of -40 °C to +65 °C. When
ATN 910B is installed in a cabinet, temperature inside the cabinet must be within thepermitted temperature range and the air duct of the cabinet must be consistent with that ofATN 910B.
3.7 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
Label PositionFigure 3-6 shows positions of labels on the chassis.
Figure 3-6 Label position
合格证/QUALIFICATION CARD
华为技术有限公司 中国制作M ADE IN CHINAHUAW EI TECHNOLOGIES CO.,LTD.
HUAWEI
OptiX PTN 910-F电源额定值 POWER RATING:
华为技术有限公司 中国制造HUAWEI TECHNO LGIES CO .,LT D. MADE IN CHINA
~100-240V;50/60Hz;0.8A MAX
1类激光产品Class 1 Laser Product
N1 4036
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Label DescriptionThere are labels on the chassis. See Table 3-11.
Table 3-11 Label description
Figure Type Description
Backplane bar code label The bar code of the backplane will beretrieved by ATN device as the equipmentserial number (ESN).
Chassis grounding label The label indicates the position of thegeneral grounding terminal. When theequipment is installed in a cabinet ratherthan a 19-inch cabinet, it is recommendedthat you use the grounding terminalspecified in this label.
Chassis grounding label The label indicates the position of thegrounding terminal. When the equipmentis installed in a 19-inch cabinet, it isrecommended that you use the groundingterminal specified in this label.
Operation warning label The label indicates the precautions thatshould be taken for operations.
合格证/QUALIFICATION CARD
华为技术有限公司 中国制造MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.
HUAWEI
Qualification label The equipment is qualified.
Product nameplate label The label suggests the product name andcertification.
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4 ATN 950B Chassis
About This Chapter
The ATN 950B uses the chassis of 2 U high (1 U = 44.45 mm) and supports multiple installationmodes, which facilitates flexible deployment.
The ATN 950B can be flexibly deployed with high reliability and scalability. It has the followingfeatures:
l Two power boards are supported for redundancy protection.l Two control boards are supported for redundancy protection.l The fan board provides six fans, ensuring proper heat dissipation even when a fan is faulty.l Six slots can be flexibly configured with service boards.
4.1 AppearanceThe ATN 950B provides 11 slots and all boards are swappable. A chassis has a mounting ear ateach side and can be installed in different cabinets and racks.
4.2 Slot DistributionThis section describes slot distribution on the ATN 950B.
4.3 Installation InformationATN 950B provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 950B can be installed in multiple types of cabinets.
4.4 Heat DissipationATN 950B dissipates heat by drawing in air from the left and expelling out the air from the right.
4.5 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
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4.1 AppearanceThe ATN 950B provides 11 slots and all boards are swappable. A chassis has a mounting ear ateach side and can be installed in different cabinets and racks.
Figure 4-1 shows the appearance of the ATN 950B that has boards fully configured.
Figure 4-1 Appearance of the ATN 950B that has boards fully configured
Figure 4-2 shows the appearance of the ATN 950B that does not have boards fully configured.
Figure 4-2 Appearance of the ATN 950B that does not have boards fully configured
4.2 Slot DistributionThis section describes slot distribution on the ATN 950B.
Figure 4-3 shows the slot distribution of the ATN 950B equipped with the AND1CXPA orAND1CXPB board.
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Figure 4-3 Slot distribution of the ATN 950B equipped with AND1CXPA or AND1CXPB
SLOT 3 (10GE/4 x GE) SLOT 4 (10GE/4 x GE)
SLOT 1 (8 x GE) SLOT 2 (8 x GE)
SLOT 5 (10GE/GE) SLOT 6 (10GE/GE)
SLOT 7 SLOT 8SLOT 10
SLOT 9
SLOT 11
NOTE
When ATN 950B is equipped with the AND1CXPA board, each of slots 3 and 4 has a bandwidth of 4 xGE and does not support 10GE interface boards.
Figure 4-4 shows the slot distribution of the ATN 950B equipped with the AND2CXPA,AND2CXPB, or AND2CXPE board.
Figure 4-4 Slot distribution of the ATN 950B equipped with AND2CXPA/AND2CXPB/AND2CXPE
SLOT 3 (10GE/4 x GE) SLOT 4 (10GE/4 x GE)
SLOT 1 (10GE/8 x GE) SLOT 2 (10GE/8 x GE)
SLOT 5 (10GE/4 x GE) SLOT 6 (10GE/4 x GE)
SLOT 7 SLOT 8SLOT 10
SLOT 9
SLOT 11
Table 4-1 describes priorities of slots where boards supported by the ATN 950B can be inserted.
Table 4-1 Priorities of available slots
Name Valid Slot Priorities of Slots (in Descending Order)
AND1CXPA/AND1CXPBAND2CXPA/AND2CXPB/AND2CXPE
Slot 7, slot 8 slot 7 - slot 8
AND1EM8T/AND1EM8F
slot 1 or slot 2 slot 1 - slot 2
AND1EM4T/AND1EM4F/AND1EM4C
slot 1-4 (working with theAND1CXPA/AND1CXPB)slot 1-6 (working with theAND2CXPA/AND2CXPB/AND2CXPE)
slot 3- slot 4 - slot 1 - slot 2
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Name Valid Slot Priorities of Slots (in Descending Order)
AND2CQ1BAND2PQ1
slot 1 to slot 6 slot 3- slot 4 - slot 1 - slot 2 - slot 5 - slot 6
AND1EX1 slot 5-6 (working with theAND1CXPA)slot 3-6 (working with theAND1CXPB)slot 1-6 (working with theAND2CXPA/AND2CXPB/AND2CXPE)
slot 5 - slot 6 - slot 3 - slot 4
AND1ML1/AND1ML1AAND3ML1A/AND3ML1BAND2MD1A/AND2MD1B
slot 1 to slot 6 slot 4 - slot 6 - slot 3 - slot 5 - slot 2 - slot 1
TND1PIU Slot 9, slot 10 -
AND1FAN slot 11 -
4.3 Installation InformationATN 950B provides multiple installation positions for mounting ears and supports variousmounting ears, so ATN 950B can be installed in multiple types of cabinets.
As shown in Table 4-2, ATN 950B supports various mounting ears and can be installed inmultiple types of cabinets.
Table 4-2 Requirements on the cabinet and mounting ears
Mounting Ear ApplicableCabinetStandard
ApplicableHuawei Cabinet
Remarks
IEC60297 N66EN68EN610E19-inch open rackIMB networkcabinetAPM30H outdoorcabinet
The mounting earsare delivered withthe device.
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Mounting Ear ApplicableCabinetStandard
ApplicableHuawei Cabinet
Remarks
ETSI300-119 N63EN66T
The mounting earsare rack-mountingears that areinstalled on themounting earsdelivered with thedevice.
IEC60297 (23-inch)
- The mounting earsare for a 23-inchcabinet and are usedto substitute for themounting earsdelivered with thedevice when thedevice needs to beinstalled in a 23-inch cabinet.
ATN 950B provides three installation positions for mounting ears. Users can determine aninstallation position for mounting ears based on the depth of the cabinet. Figure 4-5 shows theinstallation positions of mounting ears. Position 1 shows a pair of mounting ears delivered withATN 950B.
Figure 4-5 Installation positions of mounting ears
Position 1 for installing the mounting ears
Already installed mounting ears
Position 2 for installing the mounting ears
Position 3 for installing the mounting ears
Determine an installation position for mounting ears based on the cabinet depth. The followingfigures show the installation dimensions when mounting ears are installed in different positions.
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Figure 4-6 Determine an installation position for mounting ears (IEC)
76.2
220
224
465.1
132.5
208
Unit: mm
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Figure 4-7 Determine an installation position for mounting ears (ETSI)
50
220
241.5
515
150
225.5
Unit: mm
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Figure 4-8 Determine an installation position for mounting ears (23-inch)
Unit: mm
76.2
220
218
566.7
126.5
202
NOTE
When installing the ATN 950B in the cabinet, reserve 80 mm space at the front of the panel for cabling.
4.4 Heat DissipationATN 950B dissipates heat by drawing in air from the left and expelling out the air from the right.
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Figure 4-9 shows the system air duct.
Figure 4-9 ATN 950B Air duct
l Heat dissipation holes of air intake and exhaust vents on ATN 950B must be kept cleanand unblocked.
l A distance of at least 50 mm must be reserved at the air intake/exhaust vent on ATN 950Bto ensure good ventilation.
l Filler panels must be installed on unused slots. In addition, on ATN 950B, heat must bedissipated by drawing in air from the left and expelling out the air from the right.
l The ambient temperature of ATN 950B must be within the range of -20°C to +60°C. WhenATN 950B is installed in a cabinet, temperature inside the cabinet must be within thetemperature range and the air duct of the cabinet must be consistent with that of ATN 950B.
4.5 Safety LabelsThe equipment has various safety labels. This section describes the suggestions and locationsof these safety labels.
Label Position
Figure 4-10 shows positions of labels on the chassis.
Figure 4-10 Label position
合格证/QUALIFICATION CARD
华为技术有限公司 中国制作M ADE IN CHINAHUAW EI TECHNOLOGIES CO.,LTD.
HUAWEI
!
华为技术有限公司 中国制造
HUAWEI TECHNOLGIES CO.,LTD . MADE IN CHINA
ATN 950POWER RATING: -48--60V;8A电源额定值
1类激光产品Class 1 Laser ProductN14036
この装置は、クラスA情報技術装置です。この装置を家庭環境で
使用すゐと電波妨害を引き起こすことがぁります。この場合には使用
者が適切な対策を講ずゐよぅ要求されゐことがぁります。 VCCI-A
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Label DescriptionThere are labels on the chassis and boards. See Table 4-3.
Table 4-3 Label description
Figure Type Description
Backplane bar code label The bar code of the backplane will beretrieved by ATN 950B as the equipmentserial number (ESN).
ESD protection label The label suggests the electrostatic-sensitive equipment.
Chassis grounding label The label indicates the position of thegrounding terminal. When the equipmentis installed in a 19-inch cabinet, it isrecommended that you use the groundingterminal specified in this label.
Chassis grounding label The label indicates the position of thegeneral grounding terminal. When theequipment is installed in a cabinet ratherthan a 19-inch cabinet, it is recommendedthat you use the grounding terminalspecified in this label.
Fan warning label The label suggests that do not touch the fanleaves when the fan is rotating.
!Operation warning label The label indicates the precautions that
should be taken for operations on the PIUboard. For details, see Label.
合格证/QUALIFICATION CARD
华为技术有限公司 中国制造MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.
HUAWEI
Qualification label The equipment is qualified.
Product nameplate label The label suggests the product name andcertification.
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5 ATN 910 Boards
About This Chapter
Boards on ATN 910 are used together to provide various functions.
5.1 Board OverviewA board mainly consists of the printed circuit board (PCB) and the front panel.
5.2 Board Type and ApplicationThis section describes the applications and differences between different types of PIC boards.
5.3 ANC2CXPI/ANC2CXPL - System Control, Cross-connect, and Multi-protocol Process UnitThe ANC2CXPI/ANC2CXPL (CXPI/CXPL for short) is a control, cross-connect, and protocolprocessing board. The function version of the ANC2CXPI/ANC2CXPL is ANC1. TheANC2CXPI/ANC2CXPL is housed in slots 1 and 2.
5.4 AND1EG4T - 4 Channels FE/GE Adaptive Electronic Interface BoardThe AND1EG4T board (EG4T for short) is a 4 channels FE/GE adaptive electrical interfaceboard whose functional version is AND1. The AND1EG4T board can be housed in any of slots3 and 4 in the chassis.
5.5 AND1EF8T - 8 Channels Fast Ethernet Electric Interface BoardThe AND1EF8T (EF8T for short) is an 8 channels Fast Ethernet electric interface board. Thefunction version of the EF8T is AND1. The EF8T is housed in slot 3 or slot 4.
5.6 AND1EG2 - 2 Channels GE Optical Interface BoardThe AND1EG2 (EG2 for short) is a two channels GE optical interface board. The functionversion of the EG2 is AND1. The AND1EG2 is housed in slot 3 or slot 4.
5.7 AND1EG4F - 4 Channels FE/GE Adaptive Optical Interface BoardThe AND1EG4F (EG4F for short) is a four channels FE/GE adaptive optical interface board .The function version of the EG4F is AND1. The AND1EG4F is housed in slot 3 or slot 4.
5.8 AND1EF8F - 8 Channels Fast Ethernet Optical Interface BoardThe AND1EF8F (EF8F for short) is an 8 channels Fast Ethernet optical interface board. Thefunction version of the EF8F is AND1. The AND1EF8F is housed in slot 3 or slot 4.
5.9 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface BoardThe functional version of the AND1ML1/AND1ML1A is AND1..
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5.10 AND2ML1A/AND2ML1B - 16 Channels E1 Interface BoardThe AND2ML1A/AND2ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board.The function version of the ML1A/ML1B is AND2. The AND2ML1A/AND2ML1B is housedin slot 3 or slot 4.
5.11 AND1MD1A/AND1MD1B - 32 Channels E1 Interface BoardThe AND1MD1A/AND1MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board.The function version of the MD1A/MD1B is AND1. The AND1MD1A/AND1MD1B is housedin slot 3 or slot 4.
5.12 AND1MO1C - 8 Channels T1 Interface BoardThe AND1MO1C (MO1C for short) is an 8-channel electrical interface board, whose functionalversion is AND1. The AND1MO1C can be housed in slot3, slot4.
5.13 AND1AVD8A - 8 Channels ADSL2+ Service Interface BoardThe AND1AVD8A (AVD8A for short) is an 8-channel ADSL2+ service interface board, whosefunctional version is AND1. The AND1AVD8A can be housed in slot3, slot4.
5.14 AND1AVD8B - 8 Channels VDSL2 Service Interface BoardThe AND1AVD8B (AVD8B for short) is an 8-channel VDSL2 service interface board, whosefunctional version is AND1. The AND1AVD8B can be housed in slot 3 or 4.
5.15 AND1SHD4 - 4 Channels G.SHDSL Service Interface BoardThe AND1SHD4 (SHD4 for short) is a 4-channel G.SHDSL service interface board, whosefunctional version is AND1. The AND1SHD4 can be housed in slot3, slot4.
5.16 AND1SHD4I - 4 Channels G.SHDSL Interface Board for IMA ModeThe AND1SHD4I (SHD4I for short) is a 4-channel G.SHDSL service interface board, whosefunctional version is AND1. The AND1SHD4I can be housed in slot3, slot4.
5.17 TNC1PIU - Power Interface BoardThe TNC1PIU (PIU for short) is a power interface board. The function version of the PIU isTNC1. The PIU is housed in slot 5.
5.18 ANC1FAN - Fan BoardThe ANC1FAN (FAN for short) is an FAN board. The function version of the FAN is ANC1.The FAN is housed in slot 6.
5.19 Filler PanelA filler panel is used to cover any vacant slot in a chassis.
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5.1 Board OverviewA board mainly consists of the printed circuit board (PCB) and the front panel.
Board StructureFigure 5-1 shows the structure of a board (using the AND1EG4F board as an example).
Figure 5-1 Board structure
A board mainly consists of the following parts:l PCB
The PCB houses various functional chips of the board and is the most important part of theboard. Through the front panel, the PCB provides indicators, buttons, and ports.
NOTE
Different boards provide different indicators, buttons, and ports; not all boards support a daughterboard. For details, see the description of each board.
l Front panel, including the captive screws, ejector levers, indicators, buttons, and interfaces.– Captive screws: secure the board in the subrack.– Ejector levers: used for inserting or removing the board. Bar codes are also attached on
the ejector levers.
NOTE
The ejector lever on the left side of the front panel of a board is attached with a label marking the bar codeof the board. The bar code of a control board will be retrieved by ATN 910 as the equipment serial number(ESN).
The ESN is used for applying for a license. ATN 910 automatically reads the bar code of the backplane orcontrol board as the device ESN. Generally, the bar code of the backplane takes precedence over that ofthe control board.
Board NamingNOTE
The preceding only describes how to roughly identify a board. For details on board specifications, see boarddescriptions.
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A board name mainly consists of the board functional version and short name. A short name canroughly identify a board. The short name of a control board, power board, and fan board is CXPx,PIU, and FAN respectively. The following mainly describes how to quickly identify a physicalinterface board through the short name of a board.
As shown in Figure 5-2, the short name of a board consists of an abbreviated board name andan extended name. An abbreviated board name includes the board type, interface quantity, andinterface rate. When boards have the same abbreviated board name, they can be differentiatedusing extended names. An extended name does not have special meanings and can be omitted.
Figure 5-2 Board short name (using ML1A as an example)
Extended name
M L 1 A
Interface rateInterface quantityBoard type
The following describes each part of an abbreviated board name:
l Board type M indicates an E-carrier or T-carrier interface board. The interface quantity isrepresented using O, L or D, indicating 8, 16 or 32 respectively. The interface rate isrepresented using 1, indicating E1 or T1.
l Board type AVD indicates an ADSL2+, VDSL2, or ADSL2+/VDSL2 interface board. Theinterface quality is represented using an Arabic numeral, but the interface rate is notrepresented.
l Board type SHD indicates a G.SHDSL interface board. The interface quality is representedusing an Arabic numeral, but the interface rate is not represented.
l Board type E indicates an Ethernet interface board. The interface quality is representedusing an Arabic numeral. The interface rate is represented using F or G, indicating FE orGE respectively. Extended name F or T is used to indicate an optical interface or electricalinterface respectively.
NOTE
For the name of an Ethernet interface board, the interface rate and quantity rate are in an order oppositeto those for the names of other boards. For example, in EG4F (a name of an Ethernet interface board),interface rate G comes before interface quantity 4.
Board RelationshipA control board mainly implements system control and service grooming, and receives andprocesses various services by working with physical interface boards. A power board providespower inputs for the system. A fan board blows air to dissipate heat generated during systemoperation. Figure 5-3 shows the board relationship.
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Figure 5-3 Board relationship
Control boardCXPI/CXPL
Control and management module
Service processing and
switching module
Clock module
EF8F/EF8T
ML1/ML1A/ML1B
EG2/EG4F
MD1A/MD1B
FE
GE
E1
FE
GE
E1
AVD8A
MO1CADSL2+
T1
EF8F/EF8T
ML1/ML1A/ML1B
EG2/EG4F
MD1A/MD1B
FE
GE
E1
FE
GE
E1
MO1CT1
AVD8B
SHD4/SHD4I
VDSL2
G.SHDSL
Power interface boardPIU
Fan boardFAN
Network sideUser side
5.2 Board Type and ApplicationThis section describes the applications and differences between different types of PIC boards.
5.2.1 Board TypeBoards are the key hardware components of the equipment. Boards on the ATN 910 are classifiedinto the following types: control board (CXP), physical interface card (PIC), power interfaceboard (PIU), and fan board (FAN).
Control Board (CXP)
The control board controls the system, grooms services, processes the clock, and providesauxiliary interfaces.
NOTE
The control board of the ATN 910 also provides the Ethernet service interface. For details about applicationsof the service interface boards, see the Ethernet service interface board.
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Table 5-1 Control boards supported by the ATN 910
Board Name Board Description SupportedVersion
ANC2CXPI System control, switching and timing board, with4 x FE service electrical interfaces, with 4 x FEservice optical interfaces, and 2 x GE serviceoptical interfaces
V200R002C00
ANC2CXPL System control, switching and timing board, with4 x FE/GE service electrical interfaces, with 4 x FE/GE service optical interfaces, and 2 x GE serviceoptical interfaces
V200R002C00
Physical Interface Card (PIC)
The physical interface boards process the services with the control board.
The physical interface boards are classified into the following types based on the service accessmode: Ethernet service interface boards, E1/T1 service interface boards, and xDSL serviceinterface boards.
Table 5-2 Ethernet service interface boards supported by the ATN 910
Board Name Board Description Supported Version
AND1EF8T 8 x FE service interface board (electricinterface)
V200R001C00
AND1EF8F 8 x FE service interface board (opticalinterface)
V200R001C00
AND1EG2 2 x GE service optical interface board V200R001C00
AND1EG4F 4 x FE/GE adaptive optical interface board V200R001C00
AND1EG4T 4 x FE/GE adaptive electric interface board V200R001C01
Table 5-3 E1/T1 service interface boards supported by the ATN 910
Board Name Board Description Supported Version
AND1ML1 16 x E1 service interface board (75 ohm) V200R001C01
AND1ML1A 16 x E1 service interface board (120 ohm) V200R001C01
AND2ML1A 16 x E1 service interface board (75 ohm) V200R001C00
AND2ML1B 16 x E1 service interface board (120 ohm) V200R001C00
AND1MD1A 32 x E1 service interface board (75 ohm) V200R001C00
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Board Name Board Description Supported Version
AND1MD1B 32 x E1 service interface board (120 ohm) V200R001C00
AND1MO1C 8 x T1 service interface board (100 ohm) V200R001C01
Table 5-4 xDSL service interface boards supported by the ATN 910
Board Name Board Description Supported Version
AND1AVD8A 8 x ADSL2+ interface board V200R001C01
AND1AVD8B 8 x VDSL2 interface board V200R003C00
AND1SHD4 4 x G.SHDSL interface board(supporting the ATM mode and EFMmode)
V200R001C01
AND1SHD4I 4 x G.SHDSL interface board(supporting the IMA mode)
V200R001C01
Power BoardPower boards lead in power for supplying power to the device. For details about powerdistribution, see Power Distribution.
Table 5-5 Power boards supported by the ATN 910
Board Name Board Description Supported Version
TNC1PIU Power interface board V200R001C00
Fan Board (FAN)The fan board exhausts hot air for heat dissipation. For details about air duct, see HeatDissipation.
Table 5-6 Fan board supported by the ATN 910
Board Name Board Description Supported Version
ANC1FAN Fan board V200R001C00
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5.2.2 Ethernet Service Interface BoardThe ATN 910 supports multiple types of Ethernet interface boards to address requirements forvarious interface quantities, interface rates, and interface types (optical/electrical).
Ethernet service interface boards are widely used in various network environments. They canaccept base station services on the user side, and transmit services upstream on the network side.The Ethernet service interface board supports Layer 2 services, Layer 3 services, and hybridtransmission of Layer 2 and Layer 3 services. (When the main interface is in Layer 2 mode,configure the sub-interface to transmit Layer 2/Layer 3 services.)
Table 5-7 shows the Ethernet service interface boards supported by the ATN 910 and thedifferences between the boards.
Table 5-7 Ethernet service interface boards
Board Interface Description
AND1EG4T 4 x FE/GE electrical interface
AND1EF4T 4 x FE electrical interface
AND1EG2 2 x GE SFP interface
AND1EG4F 4 x FE/GE SFP interface
AND1EF8F 8 x FE SFP interface
ANC2CXPI 4 x FE electrical interface4 x FE SFP interface2 x GE SFP interface
ANC2CXPL 4 x FE/GE electrical interface4 x FE/GE SFP interface2 x GE SFP interface
NOTE
l Electrical interfaces:
l FE electrical interfaces support signals at 10 Mbit/s and 100 Mbit/s.
l FE/GE electrical interfaces support signals at 10 Mbit/s and 100 Mbit/s and 1000 Mbit/s.
l SFP interfaces:
l FE SFP interfaces support FE optical modules and FE electrical modules.
l GE SFP interfaces support GE optical modules and GE electrical modules.
l FE/GE SFP interfaces support GE optical modules and GE electrical modules, FE opticalmodules and FE electrical modules.
5.2.3 E1 Service Interface BoardThe E1 service interface board supports ATM, PPP, and TDM link-layer protocols.
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ATMFigure 5-4 shows the application of the E1 service interface board using the ATM protocol.
Figure 5-4 Application of the E1 service interface board using the ATM protocol
An ATN device uses the E1 service interface board on the user side to support ATM over E1.When the ATM service access rate is between E1 and E3, multiple E1 links are bound into anIMA group to increase service bandwidth. On the network side, the E1 service interface boardimplements ATM service emulation and transparently transmits the ATM services over thepacket switched network (PSN), such as MPLS or Ethernet. For detailed information, see thechapter "ATM IMA application" in the Feature Description.
PPPFigure 5-5 and Figure 5-6 show the applications of the E1/T1 service interface board using thePPP protocol.
Figure 5-5 Application of the E1/T1 service interface board using the PPP protocol (user side)
Figure 5-6 Application of the E1 service interface board using the PPP protocol (network side)
The ATN device uses the E1/T1 service interface board to support IP/MPLS services carriedover ML-PPPs on both user side and network side. For example, in the Offload scenario, services(such as voice service) that require high reliability can be carried over an SDH network throughE1 private lines using ML-PPP.
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NOTE
An independent PPP link cannot carry service. PPP links must be added to an ML-PPP group to carryservices.
TDM
Figure 5-7 shows the application of the E1/T1 service interface board using the TDM protocol.
Figure 5-7 Application of the E1 service interface board using the TDM protocol
The ATN device uses the E1 service interface board to access the TDM service, encapsulate theservice signals into packets, and transparently transmit the packets through PWs over the PSNnetwork. This achieves CES service emulation. For detailed information, see the chapter "CESapplication" in the Feature Description.
Comparison Between E1 Service Interface Boards
Table 5-8 shows the E1/T1 service interface boards supported by the ATN device and thedifferences between the boards.
Table 5-8 E1/T1 service interface boards
Function AND1ML1AND1ML1A
AND2ML1AAND2ML1B
AND1MD1AAND1MD1B
AND1MO1C
Interfacetype
E1 E1 E1 T1
Number ofinterfaces
16 16 32 8
Interfaceimpedance
AND1ML1: 75 ohmAND1ML1A: 120ohm
AND2ML1A: 75 ohmAND2ML1B: 120ohm
AND1MD1A: 75 ohmAND1MD1B: 120ohm
100 ohm
Interfaceclock mode
Master clock mode Master/slave clockmode
Master/slave clockmode
Master/slave clockmode
Link-layerprotocols
ATM, PPP, TDM ATM, PPP, TDM ATM, PPP, TDM PPP, TDM
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Function AND1ML1AND1ML1A
AND2ML1AAND2ML1B
AND1MD1AAND1MD1B
AND1MO1C
Minimumnumber oftimeslots inCE1 mode
2 1 1 -
5.2.4 xDSL Service Interface BoardThe xDSL service interface board has similar functions to the xDSL modem, which enableshigher reliability and easy management. The xDSL service interface board on an ATN devicecan be configured on the network side to transmit services upstream through xDSL signals.
When no optical fiber is available, an ATN device can use the xDSL interface board to transmitbase station services upstream through the existing copper lines.
Figure 5-8 shows the position of the xDSL service interface board on a network.
Figure 5-8 Network application of xDSL services
ATN boards support the following xDSL technologies:
l ADSL2+: has a long delay and asymmetric upstream and downstream bandwidth. Thedownstream bandwidth is higher than the upstream bandwidth. Therefore, the ADSL2+ issuitable to carry data services, especially HSDPA services.
l VDSL2 is compatible with ADSL2+. VDSL2 has symmetrical upstream and downstreambandwidths, and 100 Mbit/s transmission in a short distance within 300 m. It is suitable tocarry voice services, data services, and video services.
l G.SHDSL: has a stable delay and symmetric upstream and downstream bandwidth.Compared with the ADSL2+, the G.SHDSL is suitable to carry high-priority services, suchas voice services.
The combination of ADSL2+ line and G.SHDSL line meets requirements on data and voiceservices access. In addition, the Offload is also an important scenario in the mobilecommunication network. In other words, the received base station services are classified andtransmitted by ATN devices. Traditional voice services (2G, 3G R99 CS) are transmitted usingthe E1 private line to ensure high QoS, low delay, and high reliability. High-bandwidth packetservices, such as HSDPA services with low requirements on delay, are backhauled using thexDSL technology. For detailed information, see the chapter "xDSL application" in the FeatureDescription.
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Table 5-9 shows the xDSL service interface boards supported by ATN devices and thedifferences between the boards.
Table 5-9 xDSL service interface boards
Item AND1AVD8A AND1AVD8A AND1SHD4 AND1SHD4I
xDSL technology ADSL2+ VDSL2 G.SHDSL G.SHDSL
Number ofinterfaces
8 8 4 4
Number of bindinggroups
4 4 1 1
Working mode ATM mode PTM mode ATM modeEFM mode
IMA mode
Maximum upstreamrate
1.024 Mbit/s 50 Mbit/s 5.7 Mbit/s 2.3 Mbit/s
Maximumdownstream rate
24 Mbit/s 100 Mbit/s 5.7 Mbit/s 2.3 Mbit/s
NTR clock Not supported Not supported Supported Supported
NOTEThe AND1SHD4 in ATM mode supports SHDSL.bis.
Both the AND1SHD4 and AND1SHD4I support one binding group. The difference is as follows:
l When the AND1SHD4 is in ATM mode, interface binding needs to be manually configured. When the AND1SHD4 is in EFMmode, the ATN device automatically adapts to the interface binding configuration on the DSLAM.
l The IMA binding group of the AND1SHD4I has a fixed number of member links, that is, 4. No manual configuration isrequired.
5.3 ANC2CXPI/ANC2CXPL - System Control, Cross-connect, and Multi-protocol Process Unit
The ANC2CXPI/ANC2CXPL (CXPI/CXPL for short) is a control, cross-connect, and protocolprocessing board. The function version of the ANC2CXPI/ANC2CXPL is ANC1. TheANC2CXPI/ANC2CXPL is housed in slots 1 and 2.
5.3.1 Front PanelOn the front panel of the ANC2CXPI/ANC2CXPL, there are indicators, buttons, and interfaces.
Appearance of the Front Panel
Figure 5-9 and Figure 5-10 show the appearances of the front panels of the ANC2CXPI/ANC2CXPL.
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Figure 5-9 Appearance of the front panel of the ANC2CXPI
Figure 5-10 Appearance of the front panel of the ANC2CXPL
Indicators
The following indicators are present on the front panel of the ANC1CXPI:
l STAT indicator, red, green, or orange, which indicates the working status
l PROG indicator, red or green, which indicates the running status of the program
l SYNC indicator, red or green, which indicates the clock synchronization status
l SRV indicator, which is reserved for later use
l CRIT indicator, red, which indicates critical alarms
l MAJ indicator, orange, which indicates major alarms
l MIN indicator, yellow, which indicates minor alarms
l GE L/A0 to GE L/A1, FE L/A0 to FE L/A3 indicators, orange or green, which indicate theconnection status of the port
NOTE
l Five pairs of Link and ACT indicators located above ETH/OAM interfaces and four FE serviceinterfaces on the ANC2CXPI, which indicate the connection status of the Ethernet interface.
l Five pairs of Link and ACT indicators located above ETH/OAM interfaces and four FE serviceinterfaces on the ANC2CXPL, which indicate the connection status of the Ethernet interface.
For details on indications of indicators, see 12.1 Indicators.
Buttons
The following buttons are present on the front panel of the ANC1CXPI:
l RST button, which is used for warm reset of the board. When you press the RST buttonand then release it, the board is reset (warm).
l CF RCV button, which is used to restore the configuration data from the CF card. Whenyou hold down the CF RCV button for five seconds, the equipment automatically restoresthe configuration data from the CF card.
l LAMP button, which is used to test the indicators. When you press the LAMP button,except the service port indicators on the AND1EF8T, AND1EF8F, AND1AVD8A,AND1SHD4, AND1SHD4I, all the board indicators on the NE are on.
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InterfacesTable 5-10 lists the types and usage of the interfaces on the ANC2CXPI/ANC2CXPL.
Table 5-10 Interfaces on the ANC2CXPI/ANC2CXPL
Board InterfaceName
InterfaceType
Usage CorrespondingCable
ANC2CXPIANC2CXPL
ETH/OAM RJ-45 10M/100M interface for NM networkport or NM serial port
For details, see 10.2Management Cables.
ANC2CXPIANC2CXPL
CLK0/TOD0CLK1/TOD1
RJ-45 External time/clock input/outputinterface
For details, see 10.4Clock Cables.
ANC2CXPIANC2CXPL
ALMI/O RJ-45 Alarm input/output interface -
ANC2CXPIANC2CXPL
GE0, GE1 SFP Input/output interface for GE optical/electrical signals
For details, see 10.6Optical Fibers and10.5.1 EthernetCables.
ANC2CXPI FE0 to FE3 SFP Input/output interface for FE opticalsignals
For details, see 10.6Optical Fibers.
ANC2CXPL FE/GE0 toFE/GE3
SFP Input/output interface for FE/GEoptical signals
For details, see 10.6Optical Fibers and10.5.1 EthernetCables.
ANC2CXPI FE4 to FE7 RJ-45 Input/output interface for FE electricalsignals
For details, see 10.5.1Ethernet Cables.
ANC2CXPL FE/GE4 toFE/GE7
RJ-45 Input/output interface for FE/GEelectrical signals
For details, see 10.5.1Ethernet Cables.
Table 5-11 Pins of the ETH/OAM interface
Front View Pin Usage
18 24 3567
1 Transmit positive of the NM network port
2 Transmit negative of the NM network port
3 Receive positive of the NM network port
4 Grounding end of the NM serial port
5 Receive end of the NM serial port
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Front View Pin Usage
6 Receive negative of the NM network port
7 Unspecified
8 Transmit end of the NM serial port
Table 5-12 Pins of the CLK0/TOD0 and CLK1/TOD1 interfaces
Front View Pin Working Mode
ExternalClock
External Time Input(1PPS + TimeInformation)
External Time Output(1PPS + TimeInformation)
18 24 3567
1 Receivenegative of theCLK
Unspecified Unspecified
2 Receivepositive of theCLK
Unspecified Unspecified
3 Unspecified Input negative for the1PPS signal(RS422 level)
Output negative for the1PPS signal(RS422 level)
4 Transmitnegative of theCLK
Grounding end Grounding end
5 Transmitpositive of theCLK
Grounding end Grounding end
6 Unspecified Input positive for the1PPS signal(RS422 level)
Output positive for the1PPS signal(RS422 level)
7 Unspecified Input negative for the timeinformation(RS422 level)
Output negative for thetime information(RS422 level)
8 Unspecified Input positive for the timeinformation(RS422 level)
Output positive for thetime information(RS422 level)
NOTEThe CLK0/TOD0 and CLK1/TOD1 interfaces can be configured so that they can work in one of the preceding three workingmodes.
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Table 5-13 Pins of the ALMI/O interface
Front View Pin Usage
18 24 3567
1 Input for the digital parameter
2 Grounding end
3 Input for the digital parameter
4 Input for the digital parameter
5 Grounding end
6 Grounding end
7 Positive output for the digitalparameter
8 Negative output for the digitalparameter
Table 5-14 Description of the SFP interface
Interface onthe FrontPanel
SupportedModules
InterfaceType
Usage
GE0, GE1 GE optical module LC Input/Output interfaces for GE optical signals
GE electricalinterface
RJ-45 Input/Output interfaces for GE electrical signals
FE0 to FE3 FE optical module LC Input/Output interfaces for FE optical signals
FE/GE0 to FE/GE3
FE optical module LC Input/Output interfaces for FE optical signals
GE optical module LC Input/Output interfaces for GE optical signals
GE electricalinterface
RJ-45 Input/Output interfaces for GE electrical signals
NOTEThe GE SFP interface on the front panel can function as either an optical interface or an electrical interface.
When the SFP interface functions as an optical interface, it needs to be used with an optical module; when the SFP interfacefunctions as an electrical interface, it needs to be used with an electrical module.
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Table 5-15 Pins of the FE electrical interface (FE4 to FE7)
Front View Pin Usage
18 24 3567
1 Positive of twisted pair 1
2 Negative of twisted pair 1
3 Positive of twisted pair 2
4 Unspecified
5 Unspecified
6 Negative of twisted pair 2
7 Unspecified
8 Unspecified
Table 5-16 Pins of the GE electrical interface (FE/GE4 to FE/GE7)
Front View Pin Usage
18 24 3567
1 Positive of twisted pair 1
2 Negative of twisted pair 1
3 Positive of twisted pair 2
4 Positive of twisted pair 3
5 Negative of twisted pair 3
6 Negative of twisted pair 2
7 Positive of twisted pair 4
8 Negative of twisted pair 4
5.3.2 Functions and FeaturesThe ANC2CXPI/ANC2CXPL transmits, accesses and processes FE/GE signals, groomsservices, performs the system control, processes the system clock, and provides auxiliaryinterfaces.
Table 5-17 lists the functions and features of the ANC2CXPI/ANC2CXPL.
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Table 5-17 Functions and features of the ANC2CXPI/ANC2CXPL
Function and Feature Description
Basic function Cross-connect capacity ANC2CXPI: 6.8 Gbit/sANC2CXPL: 12 Gbit/s
The ANC2CXPI provides four FE electrical interfaces, fourFE SFP interfaces, and two GE SFP interfaces.
The ANC2CXPL provides four FE/GE electrical interfaces,four FE/GE SFP interfaces, and two GE SFP interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Auxiliary interface function Provides one NM serial port or NM network port tocommunicate with the NMS so that the NMS can manage andquery the equipment.
Provides two interfaces for inputting and outputting theexternal clock/time to obtain the external clock/timeinformation.
Provides one alarm input/output interface. The interfaceprovides three inputs of alarm digital parameters.
Ethernet interface function FE SFP interfaces support FE optical modules and FEelectrical modules.GE SFP interfaces support GE optical modules and GEelectrical modules.FE/GE SFP interfaces support FE optical modules, FEelectrical modules, GE optical modules, and GE electricalmodules.
FE electrical interfaces support signals at 10 Mbit/s and 100Mbit/s.FE/GE electrical interfaces support signals at 10 Mbit/s, 100Mbit/s, and 1000 Mbit/s.
Supports inloops and outloops.
GE interfaces support the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Supports physical-layer clock synchronization (synchronousEthernet).Supports IEEE 1588v2 and IEEE 1588 ACR.
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Function and Feature Description
NOTE
l If the SFP interface houses an electrical module, the interface does not support synchronous Ethernetor IEEE 1588v2.
l When using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernetclock or IEEE 1588v2.
5.3.3 Working Principle and Signal FlowThe ANC2CXPI/ANC2CXPL consists of the auxiliary interface module, control andcommunication module, service grooming and processing module, clock module, and powersupply module.
Figure 5-11 shows the block diagram for the working principle (using an ANC2CXPL as anexample).
Figure 5-11 Block diagram for the working principle of the ANC1CXPL
Clock module
Power supply module
Control and communication
module
Auxiliary interface module
NMS network port or NMS serial port
Two external time/clock signals
Alarm signal
3.3V
12VFAN
Clock signal
Backplane
Working power supplyEach module on the board
Each module on the board
Two external time/clock input/output interfaces
Interface boards
Management bus
Management bus
-48V/-60V System power supply
-48V/-60V
Service grooming and
processing module4 x FE/GE electrical signals
Service bus
2 x GE signals
4 x FE/GE optical signals
Clock signal
NMS signal
Interface boards
Interface boards
Interface boards
System power supply
Alarm input/output interface
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Auxiliary Interface Module
This module performs the following functions:
l Provides two interfaces for inputting and outputting the external clock/time.
l Provides one NM serial port or NM network port for communicating with the NMS,managing the equipment, and querying the equipment.
l Reserves one alarm input/output interface.
Control and Communication Module
This module performs the following functions:
l Configures and monitors the ANC2CXPI/ANC2CXPL and the entire system.
l Enables the communication through the NM serial port or NM network port.
Service Grooming and Processing Module
This module performs the following functions:
l Accesses and processes 2 x GE optical/electrical signals.
l Accesses and processes 4 x FE electrical signals.
l Accesses and processes 4 x FE optical signals.
l Processes the service signals accessed by the interface boards.
l Grooms services with 6.8 Gbit/s switching capacity in the full-duplex mode.
l Accesses and processes 4 x FE (ANC2CXPI) optical signals and 4 x FE/GE (ANC2CXPL)optical signals.
l Accesses and processes 4 x FE (ANC2CXPI) electrical signals and 4 x FE/GE(ANC2CXPL) electrical signals.
l Processes the service signals accessed by the interface boards.
l Grooms services with 6.8 Gbit/s (ANC2CXPI) and 12 Gbit/s (ANC2CXPL) switchingcapacity in the full-duplex mode.
Clock Module
This module performs the following functions:
l Provides the system clock signals and processes the clock signals from the service boardsand the external clock/time interfaces.
l Provides the working clock for each module on the CXPI.
l Supports the synchronous Ethernet and the SSM protocol.
l Supports the IEEE 1588V2 protocol.
l Supports the 1588 ACR clock.
Power Supply Module
This module performs the following functions:
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l Accesses two -48 V or -60 V DC power supplies.l Supplies working power for each module on the CXPI.l Supplies 12 V power for the FAN board.l Supplies 3.3 V power for the interface board.
5.3.4 CF Card and DIP SwitchA board has a set of DIP switches and a hot-swappable CF card.
CF Card and DIP Switch LocationsFigure 5-12 shows the locations of the CF card and DIP switches on ANC2CXPI/ANC2CXPL.
Figure 5-12 Locations of the CF card and DIP switches on ANC2CXPI/ANC2CXPL.
CF Card DIP Switch
O
ND
IP
12
34
CF CardThe size of the CF card on ANC2CXPI/ANC2CXPL is 512 MB. The CF card is used to backupdata and load packages.
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DIP Switch
NOTICEl This operation should be executed with caution. Use it under the guidance of technical
personnel.
l After the configuration file is deleted, reset the DIP switches to 0, 0, 0, and 0. In this way,you do not need to delete the configuration file at each startup.
l The numeral indicates 1, and the letter indicates 0.
l The device password is deleted when the configuration file is deleted.
You can use the DIP switches to delete the configuration file loaded on the device.
Set DIP switches on ANC2CXPI/ANC2CXPL to 1, 1, 0, and 1. During startup, the device deletesthe loaded configuration file based on the DIF switch status.After the password is deleted, youare required to enter a new password when a PC is connected to the device through the consoleinterface.
NOTE
If no PC is connected to the device through the console interface, you can check whether the password isdeleted based on the indicator status. The password is deleted at the stage when the BIOS is guiding theupper-layer software during the device startup. At this stage, the green PROG indicator is on for 300 msand off for 300 ms.
To reset the DIP switches to 0, 0, 0, and 0, you are advised to remove the board after the STAT and PROGindicators become green.
5.3.5 Technical SpecificationsThe technical specifications of the ANC2CXPI/ANC2CXPL cover the interface specifications,board dimensions, weight, and power consumption.
Interface Specificationsl For the specifications of the FE electrical interface, see Table 5-18.
l For the specifications of the FE/GE electrical interface, see Table 5-19.
l For the specification of the swappable FE optical/electrical modules supported at an FE(SFP) interface, see Table 5-20 and Table 5-22.
l For the specifications of the swappable GE optical/electrical modules supported at a GE(SFP) interface, see Table 5-21 and Table 5-23.
l For the specifications of the swappable FE/GE optical/electrical modules supported at anFE/GE (SFP) interface, see Table 5-20, Table 5-21, Table 5-22, and Table 5-23.
NOTE
The specifications of an SFP interface on a board depend on the optical/electrical module on the board.For the specifications of the optical/module modules on a board, see 9 Swappable Optical/ElectricalModules.
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Table 5-18 Specifications of the FE electrical interface
Item Specification Requirement
Interface rate 10 Mbit/s, 100 Mbit/s.
RJ-45 electrical interfacespecification
Complies with IEEE 802.3 and enterpriseregulations.
Table 5-19 Specifications of the FE/GE electrical interface
Item Specification Requirement
Interface rate 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.
RJ-45 electrical interfacespecification
Complies with IEEE 802.3 and enterpriseregulations.
Table 5-20 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectionalCommercial
S4015715 eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
Table 5-21 Information about GE optical modules
Code Optical Module Information Remarks
34060286 eSFP, 850 nm, LC, Multi-mode, 0.5 km Two-fiberbidirectionalCommercial
34060473 eSFP, 1310 nm, LC, Single-mode, 10 km
S4016954 eSFP, 1310 nm, LC, Single-mode, 40 km
34060360 eSFP, 1550 nm, LC, Single-mode, 80 km
34060483 eSFP, 1471nm, LC, Single-mode, 80 km Two-fiberbidirectionalCWDMCommercial
34060481 eSFP, 1491nm, LC, Single-mode, 80 km
34060479 eSFP, 1511nm, LC, Single-mode, 80 km
34060482 eSFP, 1521nm, LC, Single-mode, 80 km
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Code Optical Module Information Remarks
34060478 eSFP, 1551nm, LC, Single-mode, 80 km
34060476 eSFP, 1571nm, LC, Single-mode, 80 km
34060477 eSFP, 1591nm, LC, Single-mode, 80 km
34060480 eSFP, 1611nm, LC, Single-mode, 80 km
34060475 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060470 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km
34060539 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km
34060540 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km
34060595 eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km
34060596 eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km
Table 5-22 Information about FE Electrical Module
Code Electrical Module Information
34100101 100BASE-T, RJ45, SFP Electrical Module, 100 m
Table 5-23 Information about GE Electrical Module
Code Electrical Module Information
34100080 1000BASE-T, RJ45, SFP Electrical Module, 100 m
34100052 1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m
Other SpecificationsBoard dimensions (mm): 20.3 (H) x 226.0 (D) x 388.4 (W)(0.80 in.×8.90 in.×15.29 in.)
Board weight: 1.08 kg(2.38 lb)
Power consumption (W, room temperature): 28.0 (ANC2CXPI), 29.5 (ANC2CXPL)
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5.4 AND1EG4T - 4 Channels FE/GE Adaptive ElectronicInterface Board
The AND1EG4T board (EG4T for short) is a 4 channels FE/GE adaptive electrical interfaceboard whose functional version is AND1. The AND1EG4T board can be housed in any of slots3 and 4 in the chassis.
5.4.1 Front PanelOn the front panel of the AND1EG4T board, there are one indicator and four interfaces.
Appearance of the Front PanelFigure 5-13 shows the front panel of the AND1EG4T board.
Figure 5-13 Appearance of the front panel
IndicatorThe following indicators are present on the front panel of the AND1EG4T board:
l STAT indicator, red, green, or orange, which indicates the working statusl LINK indicator, green, which indicates the connection status of the portl ACT indicator, yellow, which indicates the data transceiving status of the port
NOTE
There are four LINK indicators and eight ACT indicators. One LINK indicator and one ACT indicator arepresent above each FE/GE service interface.
For details on the meaning of the indicators, see 12.1 Indicators.
InterfacesOn the AND1EG4T board, four interfaces are present. Table 5-24 lists the types and usage ofthe interfaces.
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Table 5-24 Types and usage of interfaces on the AND1EF4T
Interfaceon theFrontPanel
Interface Type
Usage Pin CorrespondingCable
FE/GE0-FE/GE3
RJ-45 Input/outputinterfaces for FE/GEelectrical signals
For details, seeTable 5-25 andTable 5-26.
For details,see10.5.1 EthernetCables.
Table 5-25 Pins for the FE electrical interface
Front View Pin Usage
18 24 3567
1 Positive of twisted pair cable 1
2 Negative of twisted pair cable 1
3 Positive of twisted pair cable 2
4 Unspecified
5 Unspecified
6 Negative of twisted pair cable 2
7 Unspecified
8 Unspecified
Table 5-26 Pins for the GE electrical interface
Front View Pin Usage
18 24 3567
1 Positive of twisted pair cable1
2 Negative of twisted paircable 1
3 Positive of twisted pair cable2
4 Positive of twisted pair cable3
5 Negative of twisted paircable 3
6 Negative of twisted paircable 2
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Front View Pin Usage
7 Positive of twisted pair cable4
8 Negative of twisted paircable 4
5.4.2 Functions and FeaturesThe AND1EG4T provides four FE/GE service interfaces (two groups) and works with thecontrol board to transmit, receive, and process four FE/GE electrical services.
Table 5-27 lists the functions and features of the AND1EG4T board.
Table 5-27 Functions and features of the AND1EG4T board
Function andFeature
Description
Basic function Provides four FE/GE electrical interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports signals at 10 Mbit/s, 100 Mbit/s and 1000 Mbit/s.
Supports inloops and outloops.
Supports the traffic control function.
Supports the master/slave port mode.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEWhen using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clockor IEEE 1588v2.
On the front panel of the AND1EG4T, the first two FE/GE interfaces are considered as one group and theother two FE/GE interfaces on the back are considered as another group.
The service access ability of the AND1EG4T is 2 Gbit/s and that of each interface group is 1 Gbit/s. Thetwo interfaces of each group share the group bandwidth.
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5.4.3 Working Principle and Signal FlowThe AND1EG4T board consists of the service access module, service processing module,management module, clock module, and power module.
Figure 5-14 shows the functional block diagram of the AND1EG4T board.
Figure 5-14 Functional block diagram of the AND1EG4T board
CXPService access
module
Clock module
Service processing
module
Management module
4 x FE/GE signals Service signalsService signals
Management bus
Management bus
-48 V/-60 V
-48 V/-60 V
3.3 V
1.2 V
System power supplyPower supply
module
Backplane
Clock signalsManagement bus
Clock signals
CXP
CXP
3.0 V2.5 VEach module on the board
System power supply
In the Transmit Direction
When receiving service packets from the control board, the EG4T board sends them to the serviceprocessing module through backplane interfaces. The service processing module identifies thedestination ports for the service packets, buffers and schedules them accordingly. Then theservice packets are sent to the service access module, where coding/decoding, parallel/serialconversion, and E/O conversion are performed. Finally, the service packets are sent through FE/GE ports on the front panel.
In the Receive Direction
The AND1EG4T board receives service packets from FE/GE ports on the front panel and sendsthem to the service access module, where coding/decoding, serial/parallel conversion, and O/Econversion are performed. Then the service packets are sent to the service processing module.When receiving the service packets, the service processing module buffers and schedules thembased on the service access capability of the AND1EG4T board and access bandwidthconfigurations at each port. Finally, the service packets are sent out through backplane interfaces.
Service Access Module
This module performs the following functions:
l In the receive direction, it receives FE/GE services through FE/GE ports on the front panel,performs O/E conversion, serial/parallel conversion, and coding/decoding, and then sendsthe service packets to the service processing module.
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l In the transmit direction, it receives the service packets from the service processing module,performs coding/decoding, parallel/serial conversion, and E/O conversion, and then sendsthe service packets through FE/GE ports on the front panel.
Service Processing Module
This module performs the following functions:
l In the receive direction, it receives and buffers service packets from the interface conversionmodule. Then, it schedules the service packets based on the service access capability of theEG4T board and access bandwidth configurations at each port. Finally, it sends the servicepackets through backplane interfaces.
l In the transmit direction, it receives service packets from the control board, identifies thedestination ports for the packets, buffers and schedules them based on the service accesscapability of the board and bandwidth configurations at each port. Finally, it sends theservice packets to the service access module.
l It extracts synchronous Ethernet clock signals.
l It extracts and inserts IEEE 1588v2 packets.
Management Module
This module works with the control board to manage and control each module on the board.
Clock Module
This module performs the following functions:
l Provides the working clock for each module on the EG4T board.
l Supports synchronous Ethernet and the SSM protocol.
l Supports the IEEE 1588v2 protocol.
l Supports the 1588 ACR clock.
Power Supply Module
This module provides the following DC voltages for the modules on the board:
l 3.3 V
l 3.0 V
l 2.5 V
l 1.2 V
5.4.4 Technical SpecificationsTechnical specifications of the AND1EG4T board include interface specifications and physicalspecifications.
Interface Specifications
Table 5-28 lists the specifications of the electrical interfaces on the AND1EG4T board.
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Table 5-28 Specifications of the FE/GE electrical interface
Item Specification Requirement
Interface rate 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.
RJ-45 electrical interfacespecification
Complies with IEEE 802.3 and enterpriseregulations.
Physical Specifications
Board dimensions (mm): 20.32 (height) x 225.75 (depth) x 193.8 (width)(0.80 in.×8.89 in.×7.63in.)
Weight (kg): 0.50(1.10 lb)
Power consumption at room temperature (W): 10.0
5.5 AND1EF8T - 8 Channels Fast Ethernet Electric InterfaceBoard
The AND1EF8T (EF8T for short) is an 8 channels Fast Ethernet electric interface board. Thefunction version of the EF8T is AND1. The EF8T is housed in slot 3 or slot 4.
5.5.1 Front PanelOn the front panel of the AND1EF8T, there are indicators and interfaces.
Appearance of the Front Panel
Figure 5-15 shows the appearance of the front panel of the AND1EF8T.
Figure 5-15 Font panel of the AND1EF8T
Indicator
The following indicators are present on the front panel of the AND1EF8T:
l STAT indicator, red, green, or orange, which indicates the working status
l LINK indicator, green, which indicates the connection status of the port
l ACT indicator, yellow, which indicates the data transceiving status of the port
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NOTE
There are eight LINK indicators and eight ACT indicators. One LINK indicator and one ACT indicatorare present above each FE service interface.
For details on meanings of indicators, see 12.1 Indicators.
Interface
Table 5-29 lists the types and usage of the interfaces on the AND1EF8T.
Table 5-29 Types and usage of interfaces on the AND1EF8T
Interface onthe FrontPanel
InterfaceType
Usage Pin Corresponding Cable
FE0 - FE7 RJ45 Input/output interfacesfor FE electrical signals
For details, seeTable 5-30.
For details, see10.5.1EthernetCables.
NOTEThe FE0 to FE7 interfaces support auto-adaptation to a straight-through cable or a crossover cable.
Table 5-30 Pins of the RJ45 connector of the AND1EF8T
Front View Pin Usage
18 24 3567
1 Positive of twisted pair 1
2 Negative of twisted pair 1
3 Positive of twisted pair 2
4 Unspecified
5 Unspecified
6 Negative of twisted pair 2
7 Unspecified
8 Unspecified
5.5.2 Functions and FeaturesThe AND1EF8T mainly transmits/accesses 8 x FE electrical signals, and processes the serviceswith the control board.
Table 5-31 lists the functions and features of the AND1EF8T.
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Table 5-31 Functions and features of the AND1EF8T
Function andFeature
Description
Basic function Provides eight FE electrical interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports signals at 10 Mbit/s and 100 Mbit/s.
Supports inloops and outloops.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEWhen using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clockor IEEE 1588v2/IEEE 1588 ACR.
5.5.3 Working Principle and Signal FlowThe AND1EF8T mainly consists of the access and convergence module, control driver module,clock module, and power supply module.
Figure 5-16 shows the block diagram for the functions of the AND1EF8T.
Figure 5-16 Block diagram for the functions of the AND1EF8T
Access and convergence
module
8 x FE electrical signals
Service bus
Control driver
module
Management bus
Service bus
Clock module
Power supply module
-48 V/-60 V
1.2 V
3.3 V
Clock signals
Backplane
Clock signals
System power supply
Each module on the board
Each module on the board-48 V/-60 V
Clock signals
CXP
CXP
CXP
System power supply
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Access and Convergence Module
This module performs the following functions:
l Transmits and receives 8 x FE electrical signals.
l Buffers FE signals to avoid packet loss.
l Provides flow control frames to control the number of packets.
l Processes the IEEE 1588V2 packets.
Control Driver Module
This module performs the following functions:
l Detects the system status through the management bus.
– Detects any fault of the system control board.
– Detects whether board is loosened from the slot.
– Detects the voltage and temperature.
l Realizes the hot swappable function of the board.
Clock Module
This module performs the following functions:
l Provides the working clock for each module on the board.
l Supports the synchronous Ethernet and the SSM protocol.
l Supports the IEEE 1588V2 protocol.
l Supports the 1588 ACR clock.
Power Supply Module
This module performs the following functions:
l Accesses two -48 V DC or -60 V DC power supplies.
l Supplies 3.3 V and 1.2 V power for the EF8T.
5.5.4 Technical SpecificationsThe technical specifications of the AND1EF8T include the interface specifications and physicalspecifications.
Interface Specifications
Table 5-32 lists the specifications of the electrical interfaces of the AND1EF8T.
Table 5-32 Specifications of the FE electrical interface
Item Specification Requirement
Interface rate 10 Mbit/s, 100 Mbit/s.
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Item Specification Requirement
RJ-45 electrical interfacespecification
Complies with IEEE 802.3 and enterpriseregulations.
Physical Specifications
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.53(1.17 lb)
Power consumption (W, room temperature): 9.0
5.6 AND1EG2 - 2 Channels GE Optical Interface BoardThe AND1EG2 (EG2 for short) is a two channels GE optical interface board. The functionversion of the EG2 is AND1. The AND1EG2 is housed in slot 3 or slot 4.
5.6.1 Front PanelOn the front panel of the AND1EG2, there are indicators and interfaces.
Appearance of the Front Panel
Figure 5-17 shows the appearance of the front panel of the AND1EG2.
Figure 5-17 Front panel of the AND1EG2
Indicators
The following indicators are present on the front panel of the AND1EG2.
l STAT indicator, red, green, or orange, which indicates the working status
l LINK0 to LINK1 indicators, green, which indicate the connection status of the port
l ACT0 to ACT1 indicators, yellow, which indicate the data transceiving status of the port
For details on meanings of indicators, see 12.1 Indicators.
Interfaces
Two SFP interfaces are present on the AND1EG2. Table 5-33 list the types and usage of theinterfaces on the AND1EG2.
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Table 5-33 Types and usage of optical interfaces on the AND1EG2
Interface on theFront Panel
InterfaceType
Usage Corresponding Fiber
Opticalmodule
IN0,IN1
LC When a two-fiber bidirectional opticalmodule is used, this interface is used as aninput interface for the GE optical signal.When a single-fiber bidirectional opticalmodule is used, this interface is not used.
For details,see 10.6OpticalFibers.
OUT0,OUT1
LC When a two-fiber bidirectional opticalmodule is used, this interface is used as anoutput interface for the GE optical signal.When a single-fiber bidirectional opticalmodule is used, this interface is used as aninput/output interface for the GE opticalsignal.
5.6.2 Functions and FeaturesThe AND1EG2 mainly transmits/receives 2 x GE signals, and processes the services with thecontrol board.
Table 5-34 lists the functions and features of the AND1EG2.
Table 5-34 Functions and Features of the AND1EG2
Function and Feature Description
Basic function Provides two GE interfaces (SFP).
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports only GE optical modules.
Supports inloops and outloops.
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
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5.6.3 Working Principle and Signal FlowThe AND1EG2 mainly consists of the interface conversion module, control driving module,clock module, and power supply module.
Figure 5-18 shows the block diagram for the functions of the AND1EG2.
Figure 5-18 Block diagram for the functions of the AND1EG2
Interface conversion
module
2 x GE signals Service bus Control driver
module
Management bus
Service bus
Clock module
Power supply module
-48 V/-60 V
1.2 V
3.3 V
Clock signals
Backplane
Clock signals
System power supplyEach module on the board
Each module on the board
CXP
-48 V/-60 V
Clock signals
CXP
CXP
System power supply
Interface Conversion Module
This module performs the following functions:
l Transmits and receives 2 x GE services.
l Supports SFP interfaces. Select a proper module for single-mode or multi-modetransmission over a specified distance.
Control Driving Module
This module performs the following functions:
l Detects the system status through the management bus.
– Detects any fault of the system control board.
– Detects whether board is loosened from the slot.
– Detects the voltage and temperature.
l Realizes the hot swappable function of the board.
Clock module
This module performs the following functions:
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l Provides the working clock for each module on the AND1EG2.l Supports the synchronous Ethernet and the SSM protocol.l Supports the IEEE 1588V2 protocol.l Supports the 1588 ACR clock.
Power Supply ModuleThis module performs the following functions:
l Accesses two -48 V DC or -60 V DC power supplies.l Supplies 3.3 V or 1.2 V power for each module on the AND1EG2.
5.6.4 Technical SpecificationsThe technical specifications of the AND1EG2 include the interface specifications and physicalspecifications.
Interface SpecificationsFor information about the swappable optical modules supported by SFP interfaces on theAND1EG2 board, see Table 5-35. The interface specifications depend on the optical moduleson the board. For details on the optical modules, see 9 Swappable Optical/ElectricalModules.
Table 5-35 Information about GE optical modules
Code Optical Module Information Remarks
34060286 eSFP, 850 nm, LC, Multi-mode, 0.5 km Two-fiberbidirectionalCommercial
34060473 eSFP, 1310 nm, LC, Single-mode, 10 km
S4016954 eSFP, 1310 nm, LC, Single-mode, 40 km
34060360 eSFP, 1550 nm, LC, Single-mode, 80 km
34060483 eSFP, 1471nm, LC, Single-mode, 80 km Two-fiberbidirectionalCWDMCommercial
34060481 eSFP, 1491nm, LC, Single-mode, 80 km
34060479 eSFP, 1511nm, LC, Single-mode, 80 km
34060482 eSFP, 1521nm, LC, Single-mode, 80 km
34060478 eSFP, 1551nm, LC, Single-mode, 80 km
34060476 eSFP, 1571nm, LC, Single-mode, 80 km
34060477 eSFP, 1591nm, LC, Single-mode, 80 km
34060480 eSFP, 1611nm, LC, Single-mode, 80 km
34060475 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km Single-fiberbidirectional
34060470 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km
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Code Optical Module Information Remarks
34060539 CommercialeSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km
34060540 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km
34060595 eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km
34060596 eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km
Physical Specifications
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W) (0.80 in. x 8.89 in. x 7.63 in.)
Weight (kg): 0.52(1.15 lb)
Power consumption (W, room temperature): 5.9
5.7 AND1EG4F - 4 Channels FE/GE Adaptive OpticalInterface Board
The AND1EG4F (EG4F for short) is a four channels FE/GE adaptive optical interface board .The function version of the EG4F is AND1. The AND1EG4F is housed in slot 3 or slot 4.
5.7.1 Front PanelOn the front panel of the AND1EG4F, there are indicators and interfaces.
Appearance of the Front Panel
Figure 5-19 shows the appearance of the front panel of the AND1EG4F.
Figure 5-19 Appearance of the front panel of the AND1EG4F
Indicators
The following indicators are present on the front panel of the AND1EG4F:
l STAT indicator, red, green, or orange, which indicates the working status
l L/A0 to L/A3 indicators, green or orange, which indicate the port connection status anddata transmit/receive status
For details on indications of the indicators, see 12.1 Indicators.
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InterfacesThere are four SFP interfaces on the AND1EG4F. Table 5-36 lists the types and usage of theinterfaces.
Table 5-36 Types and usage of interfaces on the AND1EG4F
Interface on the FrontPanel
InterfaceType
Usage CorrespondingCable
Opticalmodule
IN0 to IN3 LC When a two-fiber bidirectionaloptical module is used, thisinterface is used as an inputinterface for the FE/GE opticalsignal.When a single-fiber bidirectionaloptical module is used, thisinterface is not used.
For details,see 10.6OpticalFibers.
OUT0 toOUT3
LC When a two-fiber bidirectionaloptical module is used, thisinterface is used as an outputinterface for the FE/GE opticalsignal.When a single-fiber bidirectionaloptical module is used, thisinterface is used as an input/outputinterface for the FE/GE opticalsignal.
Electricalmodule
OUT0 IN0,OUT3 IN3
RJ-45 Input/Output interfaces for GEelectrical signals
For details,see 10.5.1EthernetCables.
NOTEThe GE SFP interface on the front panel can function as either an optical interface or an electrical interface.
When the SFP interface functions as an optical interface, it needs to be used with an optical module; whenthe SFP interface functions as an electrical interface, it needs to be used with an electrical module.
5.7.2 Functions and FeaturesThe AND1EG4F provides four FE/GE service interfaces (two groups). The AND1EG4F is usedwith the control board to transmit, receive, and process four channels of FE/GE optical services.
Table 5-37 lists the functions and features of the AND1EG4F.
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Table 5-37 Functions and features of the AND1EG4F
Function andFeature
Description
Basic function Provides four FE/GE interfaces (SFP).
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports FE optical modules, FE electrical modules, GE opticalmodules, GE electrical modules.
Supports inloops and outloops.
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEOn the front panel of the AND1EG4F, the first two FE/GE interfaces are considered as one group and theother two FE/GE interfaces on the back are considered as another group.
The service access ability of the AND1EG4F is 2 Gbit/s and that of each interface group is 1 Gbit/s. Thetwo interfaces of each group share the group bandwidth.
If the SFP interface houses an electrical module, the interface does not support synchronous Ethernet orIEEE 1588v2/IEEE 1588 ACR.
5.7.3 Working Principle and Signal FlowThe AND1EG4F consists of the service access module, service processing module, managementmodule, clock module, and power supply module.
Figure 5-20 shows the block diagram for the working principle of the AND1EG4F.
Figure 5-20 Block diagram for the working principle of the AND1EG4F
CXPService access
module
Clock module
Service processing
module
Management module
4 x FE/GE signals Service signalsService signals
Management bus
Management bus
-48 V/-60 V
-48 V/-60 V
3.3 V
1.2 V
System power supplyPower supply
module
Backplane
Clock signalsManagement bus
Clock signals
CXP
CXP
3.0 V2.5 VEach module on the board
System power supply
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Transmit Direction
The service packets from the control board are sent to the service processing module throughthe backplane-side interface of the AND1EG4F. The service processing module identifies thedestination interfaces for the packets, and buffers and schedules the packets. Then, the serviceprocessing module sends the processed packets to the service access module, where coding/decoding, serial/parallel conversion, and E/O conversion are performed. Finally, the serviceaccess module outputs the packets through the FE/GE interfaces on the front panel.
Receive Direction
The FE/GE interfaces on the front panel receive FE/GE service signals. Then, the service accessmodule performs O/E conversion, serial/parallel conversion, and coding/decoding on theservices, and then sends the services to the service processing module. The service processingmodule buffers the service packets, schedules the packets based on the service access capabilityof the EG4F and the access bandwidth setting at each interface, and finally outputs the packetsthrough the backplane-side interface.
Service Access Module
This module performs the following functions:
l In the receive direction, this module receives the FE/GE services from the interfaces on thefront panel, performs O/E conversion, serial/parallel conversion, and coding/decoding, andthen sends the services to the service processing module.
l In the transmit direction, this module receives the service packets from the serviceprocessing module, performs coding/decoding, serial/parallel conversion, and E/Oconversion on the packets, and then outputs the packets through the FE/GE interfaces onthe front panel.
Service Processing Module
This module performs the following functions:
l In the receive direction, this module receives and buffers the service packets from theinterface conversion module. Then, this module schedules packets from different interfacesbased on the access capability of the EG4F and the access bandwidth settings at theseinterfaces. Finally, this module outputs the packets through the backplane-side interface.
l In the transmit direction, this module receives service packets from the control board,identifies the destination interfaces of the packets, and buffers and schedules the packetsbased on the access capability of the EG4F and the access bandwidth setting at eachinterface. Finally, this module outputs the packets to the service access module.
l This module extracts the synchronous Ethernet clock.
l This module extracts and inserts IEEE 1588 V2 packets.
Management Module
This module is used with the control board to manage and control each module on the EG4F.
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Clock ModuleThis module performs the following functions:
l Provides the working clock for each module on the EG4F.l Supports the synchronous Ethernet and SSM protocols.l Supports the IEEE 1588 V2 protocol.l Supports the 1588 ACR clock.
Power Supply ModuleThis module provides the DC power of the following specifications to each module on the EG4F.
l 3.3 Vl 3.0 Vl 2.5 Vl 1.2 V
5.7.4 Technical SpecificationsThe technical specifications of the AND1EG4F include the interface specifications and physicalspecifications.
Interface SpecificationsFor information about the swappable FE/GE optical/electrical modules supported by SFPinterfaces on the AND1EG4F board, see Table 5-38, Table 5-39, Table 5-40, Table 5-40, andTable 5-41. The interface specifications depend on the optical/electrical modules on the board.For details on the optical/electrical modules, see 9 Swappable Optical/Electrical Modules.
Table 5-38 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectionalCommercial
S4015715 eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
Table 5-39 Information about GE optical modules
Code Optical Module Information Remarks
34060286 eSFP, 850 nm, LC, Multi-mode, 0.5 km Two-fiberbidirectional
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Code Optical Module Information Remarks
34060473 CommercialeSFP, 1310 nm, LC, Single-mode, 10 km
S4016954 eSFP, 1310 nm, LC, Single-mode, 40 km
34060360 eSFP, 1550 nm, LC, Single-mode, 80 km
34060483 eSFP, 1471nm, LC, Single-mode, 80 km Two-fiberbidirectionalCWDMCommercial
34060481 eSFP, 1491nm, LC, Single-mode, 80 km
34060479 eSFP, 1511nm, LC, Single-mode, 80 km
34060482 eSFP, 1521nm, LC, Single-mode, 80 km
34060478 eSFP, 1551nm, LC, Single-mode, 80 km
34060476 eSFP, 1571nm, LC, Single-mode, 80 km
34060477 eSFP, 1591nm, LC, Single-mode, 80 km
34060480 eSFP, 1611nm, LC, Single-mode, 80 km
34060475 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060470 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km
34060539 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km
34060540 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km
34060595 eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km
34060596 eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km
Table 5-40 Information about FE Electrical Module
Code Electrical Module Information
34100101 100BASE-T, RJ45, SFP Electrical Module, 100 m
Table 5-41 Information about GE Electrical Module
Code Electrical Module Information
34100080 1000BASE-T, RJ45, SFP Electrical Module, 100 m
34100052 1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m
Physical SpecificationsBoard dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W) (0.80 in. x 8.89 in. x 7.63 in.)
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Weight (kg): 0.50 (1.10 lb)
Power consumption (W, room temperature): 13.2
5.8 AND1EF8F - 8 Channels Fast Ethernet Optical InterfaceBoard
The AND1EF8F (EF8F for short) is an 8 channels Fast Ethernet optical interface board. Thefunction version of the EF8F is AND1. The AND1EF8F is housed in slot 3 or slot 4.
5.8.1 Front PanelOn the front panel of the AND1EF8F, there are indicators and interfaces.
Appearance of the Front PanelFigure 5-21 shows the appearance of the front panel of the AND1EF8F.
Figure 5-21 Font panel of the AND1EF8F
IndicatorsThe following indicators are present on the front panel of the AND1EF8F:
l STAT indicator, red, green, or orange, which indicates the working statusl LINK0 to LINK7 indicators, green, which indicate the connection status of the port
For details on meanings of indicators, see 12.1 Indicators.
InterfacesEight SFP interfaces are present on the AND1EF8F. Table 5-42 lists the types and usage of theinterfaces.
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Table 5-42 Interfaces of the AND1EF8F
Interfaceon theFrontPanel
InterfaceType
Usage CorrespondingFiber
IN0 - IN7 LC When a two-fiber bidirectional opticalmodule is used, this interface is used asan input interface for the FE opticalsignal.
For details, see 10.6Optical Fibers.
OUT0 -OUT7
LC When a two-fiber bidirectional opticalmodule is used, this interface is used asan output interface for the FE opticalsignal.
NOTEThe SFP interface should be used with an optical module.
l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left andright sides of the optical module. Each interface uses one fiber, which is used to transmit or receiveservice signals.
l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the leftside of the optical module. This optical interface uses only one fiber, which is used to transmit andreceive service signals at the same time.
5.8.2 Functions and FeaturesThe AND1EF8F mainly transmits/receives 8 x FE optical signals, and processes the serviceswith the control board.
Table 5-43 lists the functions and features of the AND1EF8F.
Table 5-43 Functions and features of the AND1EF8F
Function and Feature Description
Basic function Supports eight FE interfaces (SFP).
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports FE optical modulesand FE electrical modules.
Supports inloops and outloops.
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
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Function and Feature Description
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEIf the SFP interface houses an electrical module, the interface does not support synchronous Ethernet orIEEE 1588v2.
5.8.3 Working Principle and Signal FlowThe AND1EF8F mainly consists of the access and convergence module, control driver module,clock module, and power supply module.
Figure 5-22 shows the block diagram for the functions of the AND1EF8F.
Figure 5-22 Block diagram for the functions of the AND1EF8F
Access and convergence
module
8 x FE optical signals Service bus Control driver
module
Management bus
Service bus
Clock module
Power supply module
-48 V/-60 V
1.2 V
3.3 V
Clock signals
Backplane
Clock signals
System power supplyEach module on the board
Each module on the board -48 V/-60 V
Clock signals
CXP
CXP
CXP
System power supply
Access and Convergence Module
This module performs the following functions:
l Transmits/receives 8 x FE optical signals.
l Buffers FE signals to avoid packet loss.
l Provides flow control frames to control the number of packets.
l Processes the IEEE 1588V2 packets.
Control Driver Module
This module performs the following functions:
l Detects the system status through the management control bus.
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– Checks whether any fault occurs on the system control board.
– Detects whether board is loosened from the slot.
– Detects the voltage and temperature.
l Realizes the hot swappable function of the board.
Clock Module
This module performs the following functions:
l Provides the working clock for each module on the EF8F.
l Supports the synchronous Ethernet and the SSM protocol.
l Supports the IEEE 1588V2 protocol.
l Supports the 1588 ACR clock.
Power Supply Module
This module performs the following functions:
l Accesses two - 48 V DC or - 60 V DC power supplies.
l Supplies 3.3 V and 1.2 V power for the EF8F.
5.8.4 Technical SpecificationsThe technical specifications of the AND1EF8F include the interface specifications and physicalspecifications.
Interface Specifications
For information about the swappable FE/GE optical/electrical modules supported by SFPinterfaces on the AND1EF8F board, see Table 5-44 and Table 5-45. The interface specificationsdepend on the optical/electrical modules on the board. For details on the optical/electricalmodules, see 9 Swappable Optical/Electrical Modules.
Table 5-44 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectionalCommercial
S4015715 eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
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Table 5-45 Information about FE Electrical Module
Code Electrical Module Information
34100101 100BASE-T, RJ45, SFP Electrical Module, 100 m
Physical Specifications
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W) (0.80 in. x 8.89 in. x 7.63 in.)
Weight (kg): 0.55(1.21 lb)
Power consumption (W, room temperature): 12.9
5.9 AND1ML1/AND1ML1A - 16 Channels E1 ElectricalInterface Board
The functional version of the AND1ML1/AND1ML1A is AND1..
NOTE
The AND1ML1 and AND1ML1A have the same functions and features except for the matched impedance(AND1ML1: 75 ohms E1; AND1ML1A: 120 ohms E1).
5.9.1 Front PanelOn the front panel of the AND1ML1/AND1ML1A, there are indicators and interfaces.
Appearance of the Front Panel
Figure 5-23 shows the appearance of the front panel of the AND1ML1.
Figure 5-23 Front panel of the AND1ML1
Figure 5-24 shows the appearance of the front panel of the AND1ML1A.
Figure 5-24 Front panel of the AND1ML1A
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Indicators
The following indicators are present on the front panel of the AND1ML1/AND1ML1A:
l STAT indicator, red, green, or orange, which indicates the working status
For details on meanings of indicators, see 12.1 Indicators.
Interfaces
There is one Anea 96 interface on the front panel of the AND1ML1/AND1ML1A. Table5-46 lists the type and usage of the interface. For cables corresponding to the interfaces, see10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables.
Table 5-46 Type and usage of the interface on the front panel of the ML1
Interfaceon theFrontPanel
InterfaceType
Usage
AND1ML1 AND1ML1A
1 - 16 Anea 96 75-ohm interface, which is used totransmit or receive the first tosixteenth channels of E1 services.
120-ohm interface, which isused to transmit or receive thefirst to sixteenth channels ofE1 services.
Table 5-47 lists the pins of the Anea 96 interface.
Table 5-47 Pins of the Anea 96 interface
Front View Connector Pin Usage Connector Pin Usage
1 R x 0 25 T x 0
2 26
3 R x 1 27 T x 1
4 28
5 R x 2 29 T x 2
6 30
7 R x 3 31 T x 3
8 32
9 R x 4 33 T x 4
10 34
11 R x 5 35 T x 5
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Front View Connector Pin Usage Connector Pin Usage
12 36
13 R x 6 37 T x 6
14 38
15 R x 7 39 T x 7
16 40
17 R x 8 41 T x 8
18 42
19 R x 9 43 T x 9
20 44
21 R x 10 45 T x 10
22 46
23 R x 11 47 T x 11
24 48
49 R x 12 73 T x 12
50 74
51 R x 13 75 T x 13
52 76
53 R x 14 77 T x 14
54 78
55 R x 15 79 T x 15
56 80
5.9.2 Functions and FeaturesThe AND1ML1 is a 75-ohm E1 board and the AND1ML1A is a 120-ohm E1 board. TheAND1ML1/ML1A can access a maximum of 16 x E1 signals, supports flexible configurationof different services on each port, and is hot swappable.
Table 5-48 lists functions and features of the AND1ML1/AND1ML1A.
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Table 5-48 Functions and features of the AND1ML1/AND1ML1A
Function and Feature Remarks
Basic function Provides 16 E1 interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Impedance supported by theinterface
AND1ML1: 75 ohm
AND1ML1A: 120 ohm
Supports the E1 and CE1 modes.
Supports the master clock mode (unconfigurable).
Supports the HDB3 line coding (unconfigurable).
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
ATM Number of supported ATME1 services
16
Number of supported IMAgroups
16
Maximum number of E1links in each IMA group
16
Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N≤32) or 1-to-1 format.
Supports the ATM bundle function.
Number of supported PVCs/PVPs
256
Number of supported localATM CCCs
32
Number of supported remoteATM PWE3s
64
TDM Supports CES services in CESoPSN and SAToP modes.
Supports the timeslot compression function. For services inCESoPSN mode, a minimum of 2 timeslots can be bundledduring serial port configuration.
Supports the fractional E1. Different timeslots of an E1 canbe bound to different CES PWs.
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Function and Feature Remarks
Number of supported localTDM CCCs
8
Number of supported remoteTDM PWE3s
16
PPP Number of supported PPPlinks
16
Number of supported ML-PPP groups
8
Maximum number of linkssupported by each ML-PPPgroup
16
Clock Supports physical-layer clock synchronization.
5.9.3 Working Principle and Signal FlowThe AND1ML1/AND1ML1A mainly consists of the control module, line-side processingmodule, system-side processing module, backplane interface module, clock module, and powersupply module.
Figure 5-25shows the block diagram for the working principle of the AND1ML1/AND1ML1A.
Figure 5-25 Block diagram for the working principle of the AND1ML1/AND1ML1A
Backplane
Backplane interface module
Management bus
System-side processing module
Service bus
Serial management
bus
-48 V/-60 V
-48 V/-60 V
1.2 V
1.26 V2.5 V
16 x E1 signals Line-side processing
module
3.3 V
Clock signalsClock signals
Power supply module
Clock module
Control module
Management bus
3.3 V
Active CXP
Standby CXP
CXP
CXP
To each module
To each module
Service bus
Service bus
Service bus
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In Transmit Direction
The AND1ML1/AND1ML1A first distributes the signals in Ethernet packets from the backplaneto different protocol processing chips according to the service types. The system-side processingmodule decapsulates the concatenated services and buffers the services in queues. Then, thismodule schedules the egress queues according to the service types, processes and converts theservices, and finally sends the services to the line-side processing module. The line-sideprocessing module performs coding, dejitter, pulse shaping, and line driving for the services,and finally sends the services to E1 interfaces.
In Receive Direction
The line processing module performs impedance match, signal equalization, signal levelconversion, clock data recovery, dejitter, and decoding for the accessed E1 signals. Then, thesignals are sent into the system-side processing module, which frames the signals, encapsulatesthe IMA, CES, and ML-PPP services in PWE3, and schedules PWs. Finally, this module sendsthe signals in Ethernet packets to the backplane interface module.
Line-Side Processing Module
In the receive channel, this module performs impedance match, signal equalization, electricallevel conversion, clock data recovery, dejitter, and decoding to signals. In the transmit channel,this module performs encoding, dejitter, pulse shaping, and line driving to signals.
System-Side Processing Module
This module frames 16 x E1 signals, runs the CES, IMA, and ML-PPP protocols, and performsPWE3 encapsulation.
Backplane Interface Module
The service bus receives or transmits service signals.
Control Module
This module controls the reading and writing on the chip, resets the chip, and detects faults inthe chip. When used with the control board, this module controls the board.
Clock Module
This module provides various clock signals for the board to operate normally, detects clocks,and selects the line recovery clock.
Power Supply Module
This module converts the -48 V DC/-60 V DC voltage to DC voltages required by each moduleon the board.
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5.9.4 SpecificationsThe technical specifications of the AND1ML1/AND1ML1A include the interfacespecifications, dimensions, weight, and power consumption.
Table 5-49 lists the specifications of the interfaces on the AND1ML1/AND1ML1A.
Table 5-49 Specifications of the interfaces on the AND1ML1/AND1ML1A
Item Specification Requirement
Nominal bit rate (kbit/s) 2048
Interface impedance 75 ohms (AND1ML1)120 ohms (AND1ML1A)
Interface code HDB3
Pulse waveform at the outputinterface
Complies with ITU-T G.703
Attenuation tolerance of the inputinterface at the point with afrequency of 1024 kHz (dB)
0 to 6
Anti-interference capability of theinput interface
Complies with ITU-T G.703
Input jitter tolerance Complies with ITU-T G.823
Output jitter Complies with ITU-T G.823
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.56(1.23 lb)
Power consumption (W, room temperature): 13.1
5.10 AND2ML1A/AND2ML1B - 16 Channels E1 InterfaceBoard
The AND2ML1A/AND2ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board.The function version of the ML1A/ML1B is AND2. The AND2ML1A/AND2ML1B is housedin slot 3 or slot 4.
NOTE
The mapping impedance of an interface on the AND2ML1A is 75 ohm, and the mapping impedance of aninterface on the AND2ML1B is 120 ohm. Except the difference of mapping impedance, the functions andfeatures of the AND2ML1A and AND2ML1B are the same.
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5.10.1 Front PanelOn the front panel of the AND2ML1A/AND2ML1B, there are indicators and interfaces.
Appearances of the Front Panel
Figure 5-26 and Figure 5-27 show the appearances of the front panel of the AND2ML1A/AND2ML1B.
Figure 5-26 Front panels of the AND2ML1A
Figure 5-27 Front panels of the AND2ML1B
Indicators
The following indicators are present on the front panel of the AND2ML1A/AND2ML1B:
l STAT indicator, red, green, or orange, which indicates the working status
For details on meanings of indicators, see 12.1 Indicators.
Interfaces
There is one Anea 96 interface on the front panel of the AND2ML1A/AND2ML1B. Table5-50 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables list the cables corresponding to the interfaces.
Table 5-50 Type and usage of the interfaces on the front panel of the AND2ML1A/AND2ML1B
Interfaceon theFrontPanel
InterfaceType
Usage
AND2ML1A AND2ML1B
0 - 15 Anea 96 75-ohm interface, which is usedto transmit or receive the zeroto fifteenth channels of E1services.
120-ohm interface, which isused to transmit or receive thezero to fifteenth channels of E1services.
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Table 5-51 lists the pins of the Anea 96 interface.
Table 5-51 Pins of the Anea 96 interface
Front View Connector Pin Usage Connector Pin Usage
1 R x 0 25 T x 0
2 26
3 R x 1 27 T x 1
4 28
5 R x 2 29 T x 2
6 30
7 R x 3 31 T x 3
8 32
9 R x 4 33 T x 4
10 34
11 R x 5 35 T x 5
12 36
13 R x 6 37 T x 6
14 38
15 R x 7 39 T x 7
16 40
17 R x 8 41 T x 8
18 42
19 R x 9 43 T x 9
20 44
21 R x 10 45 T x 10
22 46
23 R x 11 47 T x 11
24 48
49 R x 12 73 T x 12
50 74
51 R x 13 75 T x 13
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Front View Connector Pin Usage Connector Pin Usage
52 76
53 R x 14 77 T x 14
54 78
55 R x 15 79 T x 15
56 80
5.10.2 Functions and FeaturesAND2ML1A is a 75-ohm E1 board and the AND2ML1B is a 120-ohm E1 board. TheAND2ML1A/AND2ML1B must be used with the system control board to access and process16 channels of E1 services. Services at interfaces on the AND2ML1A/AND2ML1B can beflexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported.
Table 5-52 lists the functions and features of the AND2ML1A/AND2ML1B.
Table 5-52 Functions and features of the AND2ML1A/AND2ML1B
Function and Feature Remarks
Basic function Provides 16 E1 interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Impedance supported by theinterface
AND2ML1A: 75 ohms
AND2ML1B: 120 ohms
Supports the E1 and CE1 modes.
Supports the master/slave clock mode.
Supports the HDB3 line coding (unconfigurable).
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
ATM Number of supported ATME1 services
16
Number of supported IMAgroups
16
Maximum number of E1links in each IMA group
16
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Function and Feature Remarks
Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N≤32) or 1-to-1 format.
Supports the ATM bundle function.
Number of supported PVCs/PVPs
256
Number of supported localATM CCCs
32
Number of supported remoteATM PWE3s
64
TDM Supports CES services in CESoPSN and SAToP modes.
Supports the timeslot compression function. For services inCESoPSN mode, a minimum of 1 timeslots can be bundledduring serial port configuration.
Supports the fractional E1. Different timeslots of an E1 canbe bound to different CES PWs.
Number of supported localTDM CCCs
8
Number of supported remoteTDM PWE3s
16
PPP Number of supported PPPlinks
16
Number of supported ML-PPP groups
8
Maximum number of linkssupported by each ML-PPPgroup
16
Clock Supports physical-layer clock synchronization.
5.10.3 Working Principle and Signal FlowThe AND2ML1A/AND2ML1B mainly consists of the service access module, serviceprocessing module, management module, clock module, and power supply module.
Figure 5-28 shows the functional block diagram of the AND2ML1A/AND2ML1B.
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Figure 5-28 Functional block diagram of the AND2ML1A/AND2ML1B
Clock module
Power supply module
Service access module
Management module
16 x E1 Service signal Service processing
module
Service signal
Backplane
3.3V
1V
.
.
.
.
.
.
-48V/-60V
-48V/-60V
Line clocks
Line clocksSystem clocks
Management bus
Management bus
CXP
CXP
CXPCXP
System power supply
System power supply
Transmit Direction
The service signals from the control board are sent to the service processing module. The serviceprocessing module performs PWE3 decapsulation and PW scheduling for the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performsthe E1 framing function, and sends the service signals to the service access module. The serviceaccess module performs encoding and line drive for the signals and outputs the signals throughthe backplane-side interfaces.
Receive Direction
The board accesses service signals through the backplane-side interfaces, and then the signalsare sent to the service access module. The service access module performs interference isolation,lightning-proof, impedance matching, level conversion, signal balancing, decoding, and thensends the processed signals to the service processing module. The service processing moduleperforms E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPPprotocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to thecontrol board through the backplane-side interfaces.
Service Access Module
This module performs the following functions:
l In the receive direction, this module isolates common mode interference, protects circuitsagainst transient failures, matches the impedance in the receive direction with the internalimpedance, and performs level conversion, balancing, and decoding for the service signals.Finally, this module sends the processed signals to the service processing module.
l In the transmit direction, this module receives the service signals from the serviceprocessing module, encodes the signals, drives the line, and outputs the service signalsthrough the backplane-side interfaces.
l This module recovers the line clock.
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Service Processing Module
This module performs the following functions:
l In the receive direction, this module receives the signals from the service access moduleand performs E1 framing. This module also identifies protocol types of the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (forexample, addition and deletion of IMA group members, VP/VC switching andconcatenation of ATM cells, vacant slot compression of CES services, and setup of ML-PPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally,this module converts the processed signals to high-rate signals, and then sends the signalsto the control board through the backplane-side interfaces.
l In the transmit direction, this module receives the high-rate signals from the control boardthrough the backplane-side interfaces and recovers low-rate service signals. Then, thismodule performs PWE3 decapsulation, identifies different protocols and processes theservice signals, and completes E1 framing. Finally, this module sends the processed signalsto the service access module.
Management Module
This module manages and controls each module on the board.
Clock Module
This module performs the following functions:
l When used with the control board, processes the recovered line clock.
l Provides the working clock for each module on the board.
Power Supply Module
This module converts the input DC voltage into various DC voltages required by each moduleon the board.
5.10.4 Technical SpecificationsThe technical specifications of the AND2ML1A/AND2ML1B include the interfacespecifications and physical specifications.
Interface Specifications
Table 5-53 lists the specifications of the interfaces on the AND2ML1A/AND2ML1B.
Table 5-53 Specifications of the interfaces on the AND2ML1A/AND2ML1B
Item Specification Requirement
Nominal bit rate (kbit/s) 2048
Interface impedance 75 ohms (ML1A)120 ohms (ML1B)
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Item Specification Requirement
Interface code HDB3
Pulse waveform at the output interface Complies with ITU-T G.703
Attenuation tolerance of the input interface atthe point with a frequency of 1024 kHz (dB)
0 to 6
Anti-interference capability of the inputinterface
Complies with ITU-T G.703
Input jitter tolerance Complies with ITU-T G.823
Output jitter Complies with ITU-T G.823
Physical SpecificationsBoard dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.44(0.97 lb)
Power consumption (W, room temperature): 9.5
5.11 AND1MD1A/AND1MD1B - 32 Channels E1 InterfaceBoard
The AND1MD1A/AND1MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board.The function version of the MD1A/MD1B is AND1. The AND1MD1A/AND1MD1B is housedin slot 3 or slot 4.
NOTE
The mapping impedance of an interface on the AND1MD1A is 75 ohms, and the mapping impedance ofan interface on the AND1MD1B is 120 ohms. Except the difference of mapping impedance, the functionsand features of the AND1MD1A and AND1MD1B are the same.
5.11.1 Front PanelOn the front panel of the AND1MD1A/AND1MD1B, there are indicators and interfaces.
Appearances of the Front PanelFigure 5-29 shows the appearances of the front panel of the AND1MD1A/AND1MD1B.
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Figure 5-29 Front panels of the AND1MD1A/AND1MD1B
IndicatorsThe following indicators are present on the front panel of the AND1MD1A/AND1MD1B:
l STAT indicator, red, green, or orange, which indicates the working status
For details on meanings of indicators, see 12.1 Indicators.
InterfacesThere are two Anea 96 interfaces on the front panel of the AND1MD1A/AND1MD1B. Table5-54 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables list the cables corresponding to the interfaces.
Table 5-54 Type and usage of the interfaces on the front panel of the AND1MD1A/AND1MD1B
Interface on theFrontPanel
Interface Type
Usage
AND1MD1A AND1MD1B
0 to 15 Anea 96 75-ohm interface, which is usedto transmit or receive the zero tofifteenth channels of E1services.
120-ohm interface, which is usedto transmit or receive the zero tofifteenth channels of E1 services.
16 to 31 Anea 96 75-ohm interface, which is usedto transmit or receive thesixteenth to thirty-first channelsof E1 services.
120-ohm interface, which is usedto transmit or receive thesixteenth to thirty-first channelsof E1 services.
Table 5-55 lists the pins of the Anea 96 interface.
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Table 5-55 Pins of the Anea 96 interface
Front View Connector Pin Usage Connector Pin Usage
1 R x 0 25 T x 0
2 26
3 R x 1 27 T x 1
4 28
5 R x 2 29 T x 2
6 30
7 R x 3 31 T x 3
8 32
9 R x 4 33 T x 4
10 34
11 R x 5 35 T x 5
12 36
13 R x 6 37 T x 6
14 38
15 R x 7 39 T x 7
16 40
17 R x 8 41 T x 8
18 42
19 R x 9 43 T x 9
20 44
21 R x 10 45 T x 10
22 46
23 R x 11 47 T x 11
24 48
49 R x 12 73 T x 12
50 74
51 R x 13 75 T x 13
52 76
53 R x 14 77 T x 14
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Front View Connector Pin Usage Connector Pin Usage
54 78
55 R x 15 79 T x 15
56 80
5.11.2 Functions and FeaturesThe AND1MD1A is a 75-ohm E1 board and the AND1MD1B is a 120-ohm E1 board. TheAND1MD1A/AND1MD1B must be used with the system control board to access and process32 channels of E1 services. Services at interfaces on the AND1MD1A/AND1MD1B can beflexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported.
Table 5-56 lists the functions and features of the AND1MD1A/AND1MD1B.
Table 5-56 Functions and features of the AND1MD1A/AND1MD1B
Function and Feature Remarks
Basic function Provides 32 E1 interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Impedance supported by theinterface
AND1MD1A: 75 ohms
AND1MD1B: 120 ohms
Supports the E1 and CE1 modes.
Supports the master/slave clock mode.
Supports the HDB3 line coding (unconfigurable).
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
ATM Number of supported ATME1 services
32
Number of supported IMAgroups
32
Maximum number of E1links in each IMA group
16a
Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N≤32) or 1-to-1 format.
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Function and Feature Remarks
Supports the ATM bundle function.
Number of supported PVCs/PVPs
512
Number of supported localATM CCCs
64
Number of supported remoteATM PWE3s
128
TDM Supports CES services in CESoPSN and SAToP modes.
Supports the timeslot compression function. For services inCESoPSN mode, a minimum of 1 timeslots can be bundledduring serial port configuration.
Supports fractional E1. Different timeslots of an E1 can bebound to different CES PWs.
Number of supported localTDM CCCs
16
Number of supported remoteTDM PWE3s
32
PPP Number of supported PPPlinks
32
Number of supported ML-PPP groups
16
Maximum number of linkssupported by each ML-PPPgroup
16b
Clock Supports physical-layer clock synchronization.
NOTEa: In the case of the AND1MD1A/AND1MD1B, the links corresponding to the former 16 and latter 16 E1ports cannot be bundled to an IMA group.
b: In the case of the AND1MD1A/AND1MD1B, the links corresponding to the former 16 and latter 16 E1ports cannot be bundled to an ML-PPP group.
5.11.3 Working Principle and Signal FlowThe AND1MD1A/AND1MD1B mainly consists of the service access module, serviceprocessing module, management module, clock module, and power supply module.
Figure 5-30 shows the functional block diagram of the AND1MD1A/AND1MD1B.
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Figure 5-30 Functional block diagram of the AND1MD1A/AND1MD1B
Clock module
Power supply module
Service access module
Management module
32 x E1 Service signal Service processing
module
Service signal
Backplane
3.3V
1V
.
.
.
.
.
.
-48V/-60V
-48V/-60V
Line clocks
Line clocksSystem clocks
Management bus
Management bus
CXP
CXP
CXPCXP
System power supply
System power supply
Transmit Direction
The service signals from the control board are sent to the service processing module. The serviceprocessing module performs PWE3 decapsulation and PW scheduling for the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performsthe E1 framing function, and sends the service signals to the service access module. The serviceaccess module performs encoding and line drive for the signals and outputs the signals throughthe backplane-side interfaces.
Receive Direction
The board accesses service signals through the backplane-side interfaces, and then the signalsare sent to the service access module. The service access module performs interference isolation,lightning-proof, impedance matching, level conversion, signal balancing, decoding, and thensends the processed signals to the service processing module. The service processing moduleperforms E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPPprotocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to thecontrol board through the backplane-side interfaces.
Service Access Module
This module performs the following functions:
l In the receive direction, this module isolates common mode interference, protects circuitsagainst transient failures, matches the impedance in the receive direction with the internalimpedance, and performs level conversion, balancing, and decoding for the service signals.Finally, this module sends the processed signals to the service processing module.
l In the transmit direction, this module receives the service signals from the serviceprocessing module, encodes the signals, drives the line, and outputs the service signalsthrough the backplane-side interfaces.
l This module recovers the line clock.
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Service Processing Module
This module performs the following functions:
l In the receive direction, this module receives the signals from the service access moduleand performs E1 framing. This module also identifies protocol types of the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (forexample, addition and deletion of IMA group members, VP/VC switching andconcatenation of ATM cells, vacant slot compression of CES services, and setup of ML-PPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally,this module converts the processed signals to high-rate signals, and then sends the signalsto the control board through the backplane-side interfaces.
l In the transmit direction, this module receives the high-rate signals from the control boardthrough the backplane-side interfaces and recovers low-rate service signals. Then, thismodule performs PWE3 decapsulation, identifies different protocols and processes theservice signals, and completes E1 framing. Finally, this module sends the processed signalsto the service access module.
Management Module
This module manages and controls each module on the board.
Clock Module
This module performs the following functions:
l When used with the control board, processes the recovered line clock.
l Provides the working clock for each module on the board.
Power Supply Module
This module converts the input DC voltage into various DC voltages required by each moduleon the board.
5.11.4 Technical SpecificationsThe technical specifications of the AND1MD1A/AND1MD1B include the interfacespecifications and physical specifications.
Interface Specifications
Table 5-57 lists the specifications of the interfaces on the AND1MD1A/AND1MD1B.
Table 5-57 Specifications of the interfaces on the AND1MD1A/AND1MD1B
Item Specification Requirement
Nominal bit rate (kbit/s) 2048
Interface impedance 75 ohms (MD1A)120 ohms (MD1B)
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Item Specification Requirement
Interface code HDB3
Pulse waveform at the outputinterface
Complies with ITU-T G.703
Attenuation tolerance of the inputinterface at the point with afrequency of 1024 kHz (dB)
0 to 6
Anti-interference capability of theinput interface
Complies with ITU-T G.703
Input jitter tolerance Complies with ITU-T G.823
Output jitter Complies with ITU-T G.823
Physical Specifications
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.49(1.08 lb)
Power consumption (W, room temperature): 12.1
5.12 AND1MO1C - 8 Channels T1 Interface BoardThe AND1MO1C (MO1C for short) is an 8-channel electrical interface board, whose functionalversion is AND1. The AND1MO1C can be housed in slot3, slot4.
5.12.1 Front PanelOn the front panel of the AND1MO1C board, there are indicators and interfaces.
Appearance of the Front Panel
Figure 5-31 shows the appearance of the front panel of the AND1MO1C board.
Figure 5-31 Appearance of the front panel
Indicator
The following indicators are present on the front panel of the AND1MO1C board:
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l STAT indicator, red, green, or orange, which indicates the working status
For details on the meaning of indicators, see 12.1 Indicators.
Port NameTable 5-58 lists the number of interfaces, types, and usage of the interfaces on the AND1MO1Cboard.
Table 5-58 Interfaces on the AND1MO1C board
Interface on theFrontPanel
Interface Type
Usage Pin Required Cable
T1 0-T1 7 RJ-45 Input/outputinterfaces for T1electrical signals
For details, seeTable 5-59.
-
Table 5-59 Pins of the RJ-45 connector of the AND1MO1C board
Front View Pin No. Usage
18 24 3567
1 Transmit positive TTip
2 Transmit negative TRing
3 Unspecified
4 Receive positive RTip
5 Receive negative RRing
6 Unspecified
7 Grounding terminal
8 Grounding terminal
5.12.2 Functions and FeaturesThe AND1MO1C board receives 8 x T1 signals and works with the system control board toprocess the received signals. The AND1MO1C board supports various service types, includingCES and ML-PPP.
Table 5-60 lists the functions and features of the AND1MO1C board.
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Table 5-60 Functions and features of the AND1MO1C board
Function andFeature
Description
Basic function Provides eight T1 interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports the 100 ohm impedance.
Supports the T1 and CT1 modes.
Supports the master/slave clock mode.
Supports the AMI and B8ZS line coding.
Supports inloops and outloops.
Supports PRBS tests in framed or unframed mode for T1 interfacesin both the transmit and receive directions.
Supports the TDM and PPP protocols.
TDM Supports CES services in CESoPSN and SAToP modes.
Number of supported local TDMCCCs
4
Number of supported remoteTDM PWE3s
8
PPP Number of supported PPP links 8
Number of supported ML-PPPgroups
8
Maximum number of linkssupported by each ML-PPP group
8
Clock Supports physical-layer clock synchronization.
5.12.3 Working Principle and Signal FlowThe AND1MO1C board consists of the service access module, service processing module,management module, clock module, and power module.
Figure 5-32 shows the functional block diagram of the AND1MO1C board.
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Figure 5-32 Functional block diagram of the AND1MO1C board
Clock module
Power supply module
Service access module
Management module
8 x T1 Service signal Service processing
module
Service signal
Backplane
3.3V
1V
.
.
.
3.3V-48V/-60V
-48V/-60V
Line clocks
Line clocksSystem clocks
Management bus
Management bus
CXP
CXP
CXPCXP
System power supply
System power supply
2.5V1.8V1.2V
In the Transmit DirectionService signals from the control board are sent to the service processing module. When receivingthe service signals, the service processing module decapsulates and schedules PWs, processesCES and ML-PPP protocols, frames T1 signals, and then sends the framed T1 signals to theservice access module. The service access module encodes the T1 signals, drives the line, andoutputs the service signals through the interfaces on the front panel.
In the Receive DirectionT1 signals are received through interfaces on the front panel and are sent to the service accessmodule. When receiving the signals, the service access module isolates the signals frominterference, provides surge protection, matches resistance, converts signal levels, restores clockdata, balances signals, and decodes signals. Finally, the service access module sends the signalsto the service processing module. The service processing module frames T1 signals, processesthe signals according to CES and ML-PPP protocols, performs PWE3 encapsulation, schedulesPWs, and sends the signals to the control board through backplane interfaces.
Service Access ModuleThis module performs the following functions:
l In the receive direction, this module isolates signals from common-mode interference,protects circuit against transient states, matches resistance, converts signal levels, balancesand decodes the signals. Finally, this module sends the signals to the service processingmodule.
l In the transmit direction, this module receives service signals from the service processingmodule, encodes the signals, drives the line, and outputs signals through interfaces on thefront panel.
l This module also recovers the line clock.
Service Processing ModuleThis module performs the following functions:
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l In the receive direction, this module receives signals from the service access module andframes E1 signals. Then it identifies the protocol type of the signals and processes thesignals accordingly. For example, if the protocol type is ML-PPP, this module creates anML-PPP group. After that, it performs PWE3 encapsulation and schedules PWs. Finally,this module converts the signals into high-rate signals and sends them to the control boardthrough backplane interfaces.
l In the transmit direction, this module receives high-rate service signals from the controlboard through backplane interfaces and recovers low-rate service signals. Then it performsPWE3 decapsulation, identifies the protocol type, and processes the signals accordingly.Finally, this module frames T1 signals and sends the signals to the service access module.
Management Module
This module manages and controls other modules on the board.
Clock Module
This module performs the following functions:
l Works with the control board to process the recovered line clock signals.
l Provides working clock signals for each module on the board.
Power Supply Module
This module converts the input DC voltage into various DC voltages required by each moduleon the board.
5.12.4 Technical SpecificationsTechnical specifications of the AND1MO1C board include interface specifications and physicalspecifications.
Interface Specifications
Table 5-61 lists the specifications of interfaces on the AND1MO1C board.
Table 5-61 Specifications of interfaces on the AND1MO1C board
Item Specification
Nominal bit rate 1544 kbit/s
Interface impedance 100 ohm
Code B8ZS
Pulse shape at output port Compliant with ITU-T G.703
Anti-interference capability ofinput port
Compliant with ITU-T G.703
Input jitter tolerance Compliant with ITU-T G.824
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Item Specification
Output jitter Compliant with ITU-T G.824
Physical SpecificationsBoard dimensions (mm): 20.32 (height) x 225.75 (depth) x 193.8 (width)
Weight (kg): 0.59(1.30 lb)
Power consumption at room temperature (W): 10.6
5.13 AND1AVD8A - 8 Channels ADSL2+ Service InterfaceBoard
The AND1AVD8A (AVD8A for short) is an 8-channel ADSL2+ service interface board, whosefunctional version is AND1. The AND1AVD8A can be housed in slot3, slot4.
5.13.1 Front PanelOn the front panel of the AND1AVD8A, there are indicators and interfaces.
Front PanelFigure 5-33 shows the appearance of the front panel of the AND1AVD8A.
Figure 5-33 Front panel of the AND1AVD8A
IndicatorsThe following indicators are present on the front panel of the AND1AVD8A.
l STAT indicator, red, green, or orange, which indicates the working status
NOTE
There are eight LINK indicators, which are present above each service interface.
For details on indications of indicators, see 12.1 Indicators.
InterfacesThere are eight ADSL2+ interfaces on the front panel of the AND1AVD8A. Table 5-62 liststypes and usage of these interfaces.
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Table 5-62 Interfaces on the AND1AVD8A
Interface on theFront Panel
Interface Type Usage Cable
DSL0-DSL7 RJ-45 Accesses ADSL2+service signals.
For details, see10.5.6 xDSLCables.
Table 5-63 lists the pins of DSL1-DSL8 interfaces.
Table 5-63 Pins of DSL0-DSL7 interfaces
Front View Pin Description
18 24 3567
1 Unspecified
2 Unspecified
3 Unspecified
4 TIP
5 RING
6 Unspecified
7 Unspecified
8 Unspecified
5.13.2 Functions and FeaturesThe AND1AVD8A is an 8-channel ADSL2+ service interface board. The AND1AVD8A on thenetwork side must work with the control board to access and process ADSL2+ services. Inaddition, the AND1AVD8A supports the ADSL2+ bundling function.
Table 5-64 lists functions and features of the AND1AVD8A.
Table 5-64 Functions and features of the AND1AVD8A
Function and Feature Description
Basic function Provides eight ADSL2+ interfaces.
Used on the NNI side.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Provides 4 binding groups.
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Function and Feature Description
Supports the ETHoA-LLC and ETHoA-VCMUX modes.
Supports two xDSL protocol modes: Annex A and Annex M. (ThexDSL protocol mode is unconfigurable. The protocol modeconfigured on the DSLAM applies.)
NOTEThe following groups of ADSL2+ ports are present on the board:
l Group 1: port 0 and port 1
l Group 2: port 2 and port 3
l Group 3: port 4 and port 5
l Group 4: port 6 and port 7
The AND1AVD8A board provides insufficient upstream bandwidth and forwards packets with a longdelay, which may affect voice services carried on it. Therefore, it is not recommended to use theAND1AVD8A board to carry base station voice services.
5.13.3 Working Principle and Signal FlowThe AND1AVD8A mainly consists of the service access module, service processing module,management module, clock module, and power supply module.
Figure 5-34 shows the block diagram for the working principle of the AND1AVD8A.
Figure 5-34 Block diagram for the working principle of the AND1AVD8A
Clock moduleC
Service Access Module
Service processing
module
Management module
8 x ADSL2+ signals
NTR clock signal
Service signals Service signals
Backplane
Management bus
Management bus Management bus
Power supply module
Working clock signalsTo each module on the AVD8A
Clock signals
12V -48V/-60V
-48V/-60V
CXP
CXP
CXP
PIU
PIU1.2V
.
.
.To each module on the AVD8A
Transmit DirectionThe control board sends signals to the service processing module through the backplane-sideinterfaces. When receiving the service signals, the service processing module encapsulates theservice packets in ETHOA mode, and then sends the packets to the service access module, where
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encoding and D/A conversion are performed. Finally, the signals are output through thebackplane-side interfaces.
Receive DirectionThe service access module accesses ADSL2+ service signals through the backplane-sideinterfaces. The service access module performs A/D conversion and decoding on the signals,and then sends the signals to the service processing module. The service processing moduledecapsulates the service packets in ETHOA mode, and then sends the processed packets to thecontrol board.
Service Access ModuleThis module performs the following functions:
l In the receive direction, this module accesses ADSL2+ service signals through thebackplane-side interfaces, performs amplification, filtering, A/D conversion, balancing,decoding, and verification on the signals, and then sends the signals to the serviceprocessing module.
l In the transmit direction, this module receives the service signals from the serviceprocessing module, performs framing, encoding, D/A conversion, filtering, amplification,and line driving on the signals, and outputs the signals through the backplane-sideinterfaces.
l When the DSLTRUNK attribute of the interfaces on the board is Bundled Group, thismodule implements the ADSL link bundling function.
l This module extracts the NTR clock from the ADSL2+ service signals, and then sends theclock to the clock module.
Service Processing ModuleThis module performs the following functions:
l In the receive direction, this module receives signals from the service access module,extracts ATM cells, and rearranges service packets. Then, this module works with thecontrol board to decapsulate the service packets in ETHOA mode. Finally, this moduleoutputs the high-rate service packets through the backplane-side interfaces.
l In the transmit direction, this module receives the service packets accessed through thebackplane-side interfaces, performs AAL5 SAR on the service packets, and encapsulatesthe service packets into ATM cells. In this manner, this module encapsulates the servicepackets in ETHOA mode when working with the control board. Finally, this module outputsthe service packets to the service access module.
l This module controls the committed access rate (CAR).
Management ModuleWhen used with the system control board, this module manages and controls each module onthe AND1AVD8A.
Clock ModuleThis module performs the following functions:
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l Receives the NTR clock from the service access module, and processes the clock whenused with the control board.
l Provides the working clock to each module on the AND1AVD8A.
Power Supply ModuleThis module performs the following functions:
l Accesses two -48 V or -60 V DC power supplies.l Provides the working power for each module on the AVD8A.
5.13.4 Technical SpecificationsThe technical specifications of the AND1AVD8A include performance specifications,dimensions, weight, and power consumption.
Table 5-65 lists the performance specifications of the AND1AVD8A.
Table 5-65 Specifications of the ADSL2+ interfaces
Interface Max. Uplink Rate Max. Downlink Rate Max.TransmissionDistance
ADSL2+ 2.5 Mbit/s 24 Mbit/s 6.5 km
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.8 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.50(1.10 lb)
Power consumption at room temperature (W):19.6 W
5.14 AND1AVD8B - 8 Channels VDSL2 Service InterfaceBoard
The AND1AVD8B (AVD8B for short) is an 8-channel VDSL2 service interface board, whosefunctional version is AND1. The AND1AVD8B can be housed in slot 3 or 4.
5.14.1 Front PanelOn the front panel of the AND1AVD8B, there are indicators and interfaces.
Front PanelFigure 5-35 shows the appearance of the front panel of the AND1AVD8B.
Figure 5-35 Front panel of the AND1AVD8B
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IndicatorsThe following indicators are present on the front panel of the AND1AVD8B.
l STAT indicator, red, green, or orange, which indicates the working status
NOTE
There are eight LINK indicators, which are present above each service interface.
For details on indications of indicators, see 12.1 Indicators.
InterfacesThere are eight ADSL2+/VDSL2 interfaces on the front panel of the AND1AVD8B. Table5-66 lists types and usage of these interfaces.
Table 5-66 Interfaces on the AND1AVD8B
Interface on theFront Panel
Interface Type Usage Cable
DSL0-DSL7 RJ-45 Accesses VDSL2service signals.
For details, see10.5.6 xDSLCables.
Table 5-67 lists the pins of DSL1-DSL8 interfaces.
Table 5-67 Pins of DSL0-DSL7 interfaces
Front View Pin Description
18 24 3567
1 Unspecified
2 Unspecified
3 Unspecified
4 TIP
5 RING
6 Unspecified
7 Unspecified
8 Unspecified
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5.14.2 Functions and FeaturesThe AND1AVD8B is an 8-channel VDSL2 service interface board. The AND1AVD8B on thenetwork side must work with the control board to access and process VDSL2 services. Inaddition, the AND1AVD8B supports the VDSL2 bundling function.
Table 5-68 lists functions and features of the AND1AVD8B.
Table 5-68 Functions and features of the AND1AVD8B
Function and Feature Description
Basic function Provides eight VDSL2 interfaces.
Used on the NNI side.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Provides 4 binding groups.
Supports Vectoring.
Supports Annex B protocol mode.
NOTEThe following groups of VDSL2 ports are present on the board:
l Group 1: port 0 and port 1
l Group 2: port 2 and port 3
l Group 3: port 4 and port 5
l Group 4: port 6 and port 7
5.14.3 Working Principle and Signal FlowThe AND1AVD8B mainly consists of the service access module, service processing module,management module, clock module, and power supply module.
Figure 5-36 shows the block diagram for the working principle of the AND1AVD8B.
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Figure 5-36 Block diagram for the working principle of the AND1AVD8B
Clock moduleC
Service Access Module
Service processing
module
Management module
8 x VDSL2 signals Service signals Service signals
Backplane
Management bus
Management bus Management bus
Power supply module
Working clock signalsTo each module on the AVD8B
Clock signals
12V -48V/-60V
-48V/-60V
CXP
CXP
CXP
PIU
PIU1.2V
.
.
.To each module on the AVD8B
Transmit Direction
The control board sends signals to the service processing module through the backplane-sideinterfaces. When receiving the service signals, the service processing module encapsulates theservice packets, and then sends the packets to the service access module, where encoding andD/A conversion are performed. Finally, the signals are output through the backplane-sideinterfaces.
Receive Direction
The service access module accesses VDSL2 service signals through the backplane-sideinterfaces. The service access module performs A/D conversion and decoding on the signals,and then sends the signals to the service processing module. The service processing moduledecapsulates the service packets, and then sends the processed packets to the control board.
Service Access Module
This module performs the following functions:
l In the receive direction, this module accesses VDSL2 service signals through thebackplane-side interfaces, performs amplification, filtering, A/D conversion, balancing,decoding, and verification on the signals, and then sends the signals to the serviceprocessing module.
l In the transmit direction, this module receives the service signals from the serviceprocessing module, performs framing, encoding, D/A conversion, filtering, amplification,and line driving on the signals, and outputs the signals through the backplane-sideinterfaces.
Service Processing Module
This module performs the following functions:
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l In the receive direction, this module receives signals from the service access module,extracts PTM cells, and rearranges service packets. Then, this module works with thecontrol board to decapsulate the service packets. Finally, this module outputs the high-rateservice packets through the backplane-side interfaces.
l In the transmit direction, this module receives the service packets accessed through thebackplane-side interfaces, and encapsulates the service packets into PTM cells. In thismanner, this module encapsulates the service packets when working with the control board.Finally, this module outputs the service packets to the service access module.
Management Module
When used with the system control board, this module manages and controls each module onthe AND1AVD8B.
Clock Module
This module performs the following functions:
l Receives the NTR clock from the service access module, and processes the clock whenused with the control board.
l Provides the working clock to each module on the AND1AVD8B.
Power Supply Module
This module performs the following functions:
l Accesses two -48 V or -60 V DC power supplies.
l Provides the working power for each module on the AVD8B.
5.14.4 Technical SpecificationsThe technical specifications of the AND1AVD8B include performance specifications,dimensions, weight, and power consumption.
Table 5-69 lists the performance specifications of the AND1AVD8B.
Table 5-69 Specifications of the VDSL2 interfaces
Interface Max. Uplink Rate Max. Downlink Rate Max.TransmissionDistance
VDSL2 50 Mbit/s 100 Mbit/s 3.5 km
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.8 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.50(1.10 lb)
Power consumption at room temperature (W):19.6 W
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5.15 AND1SHD4 - 4 Channels G.SHDSL Service InterfaceBoard
The AND1SHD4 (SHD4 for short) is a 4-channel G.SHDSL service interface board, whosefunctional version is AND1. The AND1SHD4 can be housed in slot3, slot4.
5.15.1 Front PanelOn the front panel of the AND1SHD4, there are indicators, and interfaces.
Appearance of the Front Panel
Figure 5-37 shows the appearance of the front panel of the AND1SHD4.
Figure 5-37 Appearance of the front panel of the AND1SHD4
Indicatorsl STAT indicator, red, green, or orange, which indicates the working status
l LINK0/LINK1/LINK2/LINK3 indicators, green, which indicate the port connection status.
For details on indications of indicators, see 12.1 Indicators.
Interfaces
Table 5-70 lists the types of the interfaces on the AND1SHD4 and their respective usage.
Table 5-70 Types and usage of the interfaces on the AND1SHD4
Interfaceon theFront Panel
InterfaceType
Usage CorrespondingCable
SHDSL0 -SHDSL3
RJ-11 Accesses the first 4 x G.SHDSLservices.
For details, see 10.5.6xDSL Cables.
Table 5-71 lists the pins of theSHDSL0 - SHDSL3 interfaces.
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Table 5-71 Pins of the SHDSL0 - SHDSL3 interfaces on the AND1SHD4
Front View Pin No. Usage
6 5 4 3 2 1
1 Unspecified
2 Unspecified
3 TIP
4 RING
5 Unspecified
6 Unspecified
5.15.2 Functions and FeaturesUsed with the control board, the AND1SHD4 can process the G.991.2 single-pair high-speeddigital subscriber line (G.SHDSL) service.
Table 5-72 lists the functions and features of the AND1SHD4.
Table 5-72 Functions and features of the AND1SHD4
Function and Feature Description
Basic function Provides four G.SHDSL interfaces.
Used on the NNI side.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports one binding group.
Supports the ATM mode and the EFM mode.
Supports the extended attributes compliant with the ITU-T G.992.1.bis in ATM mode.
Supports the NTR clock.
NOTEThe AND1SHD4 supports one binding group.
l When the AND1SHD4 is in ATM mode, interface binding needs to be manually configured.
l When the AND1SHD4 is in EFM mode, the ATN device automatically adapts to the interface bindingconfiguration on the DSLAM.
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5.15.3 Working Principle and Signal FlowThe AND1SHD4 mainly consists of the service access module, interface converting module,clock module, and power supply module.
Figure 5-38 shows the block diagram for the working principle of the AND1SHD4.
Figure 5-38 Block diagram for the working principle of the AND1SHD4Backplane
Interface converting and control module
Logic control
unit
Service bus
Management bus
Service bus
Serial management bus
Status signal
Parallel/serial converting
module
Power supply module
1.2 V1.5 V3.3 V
Service access module
Service encapsulation and bundling
module
Clock signals
4 x G.SHDSL signals
Signal voltage
and performs protection
module
To each module
Clock moduleEach module of the board
-48V/-60V
-48V/-60V
System power supply
Clock signalsCXP
CXP
CXP
CXP
System power supply
In the Transmit Direction
The control board sends the service signals to the parallel/serial converting module and then tothe logic control unit, which processes the service signals. Finally, the service encapsulation andbundling module decapsulates the service signals and outputs the G.SHDSL service.
In the Receive Direction
The service board accesses the G.SHDSL signals and the service access module transforms thesignal voltage and performs protection for the signals. Then, the service encapsulation andbundling module encapsulates and bundles the signals, adjusts the signal rate, frames the signals,and then sends the signals to the logic control module, which processes the service signals.Finally, the parallel/serial converting module converts and sends the service signals to the controlboard.
Service Access Modulel The service access module transforms the signal voltage and performs protection for the
access signals. Then, the service encapsulation and bundling module bundles four channelsof G.SHDSL signals, strips the ATM AAL5 adaptation layer, and finally outputs the servicesignals.
l The interface converting and control module sends the service to the service encapsulationand bundling module, which then performs ATM AAL5 adaptation and encapsulation, andfinally outputs the G.SHDSL service.
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Interface Converting and Control Module
This module performs parallel/serial conversion for transporting the service between the systemcontrol board and the local board.
The system control board controls and manages the board through the serial management bus.In addition, the logic control unit detects alarms and reports them to the control board throughthe serial management bus.
Clock Module
The clock module provides working clock for each module on the AND1SHD4.
Power Supply Module
This module provides DC voltages required by each module on the board.
5.15.4 Technical SpecificationsThe technical specifications of the AND1SHD4 cover the performance specifications, boarddimensions, weight, and power consumption.
Table 5-73 lists the performance specifications of the AND1SHD4.
Table 5-73 Specifications of the interfaces on the AND1SHD4
Interface Max.UpstreamRate
Max.DownstreamRate
Max. Four-LineBundling Rate
Max.TransmissionDistance
G.SHDSL 5.7 Mbit/s 5.7 Mbit/s 23 Mbit/s 5.25 km
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.60(1.32 lb)
Power consumption (W, room temperature): 7.4
5.16 AND1SHD4I - 4 Channels G.SHDSL Interface Boardfor IMA Mode
The AND1SHD4I (SHD4I for short) is a 4-channel G.SHDSL service interface board, whosefunctional version is AND1. The AND1SHD4I can be housed in slot3, slot4.
5.16.1 Front PanelOn the front panel of the AND1SHD4I, there are indicators and interfaces.
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Appearance of the Front PanelFigure 5-39 shows the appearance of the front panel of the AND1SHD4I.
Figure 5-39 Appearance of the front panel of the AND1SHD4I
IndicatorThe following indicators are present on the front panel of the AND1SHD4I:
l STAT indicator, red, green, or orange, which indicates the working statusl LINK0, LINK1, LINK2 and LINK3 indicators, green, which indicate the port connection
status.
For details on indications of indicators, see 12.1 Indicators.
InterfaceTable 5-74 lists the types of the interfaces on the AND1SHD4I and their respective usage.
Table 5-74 Types and usage of the interfaces on the AND1SHD4I
Interface on theFront Panel
InterfaceType
Usage CorrespondingCable
SHDSL0-SHDSL3
RJ-11 Input and output G.SHDSLsignals.
For details, see 10.5.6xDSL Cables.
Table 5-75 lists the pins of the SHDSL1-SHDSL4 interfaces.
Table 5-75 Pins of the SHDSL0 - SHDSL3 interfaces on the AND1SHD4I
Front View Pin No. Usage
6 5 4 3 2 1
1 Unspecified
2 Unspecified
3 TIP
4 RING
5 Unspecified
6 Unspecified
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5.16.2 Functions and FeaturesThe AND1SHD4I can access four channels of G.SHDSL signals encapsulated in the IMA formatwhen it is used with the control board.
Table 5-76 lists the functions and features of the AND1SHD4I.
Table 5-76 Functions and features of the AND1SHD4I
Function andFeature
Description
Basic Function Provides four G.SHDSL interfaces.
Used on the NNI side.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports one binding group.
Supports the IMA mode.
Supports the NTR clock.
NOTEThe IMA binding group of the AND1SHD4I has a fixed number of member links, that is, 4. No manualconfiguration is required.
The AND1SHD4I supports one IMA binding group, but two VE interfaces can be created for the activeand standby service trails to protect services.
5.16.3 Working Principle and Signal FlowThe AND1SHD4I mainly consists of the service access module, interface converting and controlmodule, IMA processing module, clock module, and power supply module.
Figure 5-40 shows the block diagram for the working principle of the AND1SHD4I.
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Figure 5-40 Block diagram for the working principle of the AND1SHD4I
Service access module
Interface converting and control module
IMA processing module
Power supply module
Clock module
4 x G.SHDSL signals IMA service signals
IMA service signals
ATM cells
4 x NTR clock signalsClock signals
To each module on the SHD4I Working clock signals
Management and control bus
Management and control bus
Service signals
Serial management bus
Status signal bus
-48 V/-60 V
-48 V/-60 V3.3 V1.8 V1.5 V1.2 V
CXP
CXP
CXP
CXP
System power supply
System power supply
To each module on the SHD4I
Backplane
In the Receive Direction
The RJ-11 interfaces access the G.SHDSL signals to the service access module. Then, the serviceaccess module works with the IMA processing module to multiplexes the service signals, andsends the ATM cells to the interface converting and control module. The interface convertingand control module decapsulates the ATM frames, converts the parallel signals to serial signals,converges the serial signals to one channel service signal, and finally sends the service signal tothe backplane.
In the Transmit Direction
The interface converting and control module receives the service signal from the backplane,converts the serial signal to parallel signal, encapsulates the signals in the ATM frame format,and then sends the ATM frames to the service access module. The service access moduleprocesses the ATM cells and work with the IMA processing module to inversely multiplex theATM signals as IMA signals. Finally, the service access module sends the packets to theG.SHDSL interfaces.
Service Access Module
This module accesses the service packets in different modes according to the encapsulation modeof the G.SHDSL interfaces. In addition, this module has the thunder protection function.
l In the receive direction, this module converts the serial packets to parallel packets, andsends the parallel packets to the interface converting and control module.
l In the transmit direction, this module receives the IMA service signals from the interfaceconverting and control module, converts the serial IMA service signals to parallel IMAservice signals, and finally sends the parallel IMA service signals to the G.SHDSLinterfaces.
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l In addition, this module extracts the NTR clock signals from the G.SHDSL service signalsreceived and sends the clock signals to the clock module.
Interface Converting and Control Module
This module converges the G.SHDSL service signals to one channel service signal and workswith the control board to manage and control the SHD4I.
l In the receive direction, this module receives the IMA service signals from the serviceaccess module, converts the IMA service signals, and sends the service signals to the IMAprocessing module, which multiplexes the service signals. Then, this module receives theATM cells from the IMA processing module, decapsulates the ATM frames, converts theparallel signals to serial signals, converges the signals to one channel service signal, andfinally sends the service signal to the backplane.
l In the transmit direction, this module receives the service signal from the backplane,converts the serial signal to parallel signal, encapsulates the service signal into ATMframes, and sends the ATM cells to the IMA processing module, which inverselymultiplexes the ATM signals. Then, this module receives IMA signals from the IMAprocessing module and finally sends the IMA signals to the service access module.
l In addition, this module works with the control board to manage and control each moduleon the AND1SHD4I.
IMA Processing Module
This module performs the following functions:
l In the receive direction, this module receives the IMA service signals from the interfaceconverting and control module, multiplexes the service signals as ATM signals, and finallysends the ATM signals to the interface converting and control module, which convergesthe signals.
l In the transmit direction, this module receives the service signals from the backplane afterthe interface converting and control module processes the service signals. Then, this moduleinversely multiplexes the ATM signals and sends the IMA service signals to the interfaceconverting and control module.
Clock Module
This module performs the following functions:
l Selects a clock source from the four channels of NTR clock signals and uploads the clocksignals to the control board.
l Provides working clock signals for each module on the SHD4I board.
Power Supply Module
This module provides the following DC voltages for the modules on the AND1SHD4I board:
l 3.3 V
l 1.8 V
l 1.5 V
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l 1.2 V
5.16.4 Technical SpecificationsThe technical specifications of the AND1SHD4I cover the interface specifications, boarddimensions, weight, and power consumption.
Table 5-77 lists the specifications of the interfaces of the AND1SHD4I.
Table 5-77 Specifications of the interfaces on the AND1SHD4I
Interface Max.Upstream Rate(Mbit/s)
Max.DownstreamRate (Mbit/s)
Max. Rate ofFour BundledInterfaces(Mbit/s)
Max.TransmissionDistance (km)
G.SHDSL 2.3 2.3 9.2 5.25
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.82 (W)(0.80 in.×8.89 in.×7.63 in.)
Board weight (kg): 0.60(1.32 lb)
Power consumption (W, room temperature): 7.5
5.17 TNC1PIU - Power Interface BoardThe TNC1PIU (PIU for short) is a power interface board. The function version of the PIU isTNC1. The PIU is housed in slot 5.
5.17.1 Front PanelOn the front panel of the PIU, there are indicators, power supply interfaces, and a label.
Appearance of the Front PanelFigure 5-41 shows the appearance of the front panel of the PIU.
Figure 5-41 Appearance of the front panel of the PIU
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Indicators
The following indicator is present on the front panel of the PIU.
PWRA/PWRB, green, which indicates the power supply status. When PWRA/PWRB is on andgreen, it indicates that power is accessed.
For details on indications of indicators, see 12.1 Indicators.
Interfaces
The PIU accesses two power supplies. Table 5-78 lists the types of the interfaces on the PIUand their respective usage. For cable corresponding to the interfaces, see 10.1 Power SupplyCables and Ground Cables.
Table 5-78 Types and usage of the interfaces on the PIU
Interface on the Front Panel Usage
NEG1(-) -48 V power input interface
RTN1(+) BGND power input interface
NEG2(-) -48 V power input interface
RTN2(+) BGND power input interface
Label
Operation warning label: indicates the following precautions , which should be taken for removalor insertion of the PIU board.
NOTICEMultiple power supplies are accessed for the equipment. When powering off the equipment,make sure that these power supplies are disabled.
Do not remove or insert the board with power on.
5.17.2 Functions and FeaturesThe PIU, a power interface board, supports the functions and features such as power access,power protection, surge protection detection, and information reporting.
Table 5-79 lists functions and features of the PIU.
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Table 5-79 Functions and features of the PIU
Function and Feature Description
Power access PIU accesses two -48 V DC or -60 V DC power supplies for theequipment.
Power protection The PIU protects the power supply against overcurrent and shortcircuit. In this way, the overcurrent is prevented from shockingboard and components on it.
Surge protection The PIU protects the equipment against lightning and reports analarm if the protection fails.
Power backup The two DC power supplies back up each other.
5.17.3 Working Principle and Signal FlowThe PIU mainly consists of the surge protection and failure detection module, communicationunit module, and board in-position module.
Figure 5-42 shows the block diagram for the working principle of the PIU.
Figure 5-42 Block diagram for the working principle of the PIU
Surge protection and failure detection module
-48 V/-60 V
Communication
Board in-position module
Backplane
Inter-board communication bus CXP
CXP
-48 V/-60 V
Board in-position signals
Surge protection failure alarm signals
Each board
Each board
Surge protection failure alarm signalsSurge protection and failure
detection module
Surge Protection and Failure Detection Module
This module protects the equipment against lightning and detects the failure of the anti-lightningcircuit. If the surge protection fails, the PIU reports the alarm signals to the control board.
Communication Unit Module
This module has the function of reporting the board manufacturing information, PCB versioninformation, and alarm signals about the surge protection failure.
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Board In-Position ModuleThis module reports the board in-position signals to the control board.
5.17.4 Technical SpecificationsThe technical specifications of the PIU cover the board dimensions, weight, power consumption,and input voltage.
Table 5-80 lists the technical specifications of the PIU.
Table 5-80 Technical specifications of the PIU
Item Technical Specification
Board dimensions (mm) 41.4 (H) x 224.8 (D) x 21.0 (W)
Weight (kg) 0.12
Power consumption (W, room temperature) 0.5
Input voltage (V) -38.4 to -72.0
5.18 ANC1FAN - Fan BoardThe ANC1FAN (FAN for short) is an FAN board. The function version of the FAN is ANC1.The FAN is housed in slot 6.
5.18.1 Front PanelOn the front panel of the FAN, there are indicators, ESD wrist strap jack, handle, and labels.
Appearance of the Front PanelFigure 5-43 shows the appearance of the front panel of the FAN.
Figure 5-43 Appearance of the front panel
IndicatorsThe following indicators are present on the front panel of the FAN:
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ANC1FAN indicator, red or green, which indicates status of fans.
For details on indications of indicators, see 12.1 Indicators.
ESD Strap JackThe ESD wrist strap should be connected to this jack for proper grounding of the human body.
HandleThe handle is used for pushing the FAN into or pulling the FAN out of the chassis during boardreplacement.
LabelThe following labels are present on the front panel of the FAN:
l ESD protection label, which indicates that the equipment is static-sensitive.l Fan warning label, which says that do not touch the fan leaves before the fan stops rotating.
5.18.2 Functions and FeaturesThe FAN is used to adjust the fan rotating speed, detect and report status of fans.
The functions and features of the FAN are as follows:
l Accesses one 12 V power supply for driving three fans.l Provides start-delay for the power supply of the fans and protects fans against overcurrent.l Intelligently adjusts the rotating speed of fans to ensure proper heat dissipation of the
system.l Reports information about the fan rotating speed, environment temperature, alarms, version
number, and board in-position information.l Provides alarm indicators.
5.18.3 Working Principle and Signal FlowThe FAN mainly consists of the start-delay module, communication unit module, intelligent fanspeed adjustment module, and board in-position module.
Figure 5-44 shows the block diagram for the working principle of the FAN.
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Figure 5-44 Block diagram for the working principle of the ANC1FAN
Fans x 3
12 V power shut signals
12V
Inter-board communication bus
Board in-position module
PWM signals
Communication unit module
Start-delay module CXP
Fan-speed signals
Fan in-position signals
12 V
12 V
12 V
CXP
CXP
CXP
CXPIntelligent fan speed adjustment module
PWM driver module
Fan-speed reporting module
Backplane
Start-delay ModuleThis module has the function of provides start-delay to the power supply for fans and protectsfans against overcurrent.
Communication Unit ModuleThis module reports the board manufacturing information, PCB version, and environmenttemperature information. In addition, this module provides 12 V power shut signals to the start-delay module.
Intelligent Fan Speed Adjustment ModuleThis module reports information about the fan rotating speed to the control board and adjuststhe fan rotating speed according to the pulse-width modulation (PWM) signals received fromthe control board.
Board In-Position ModuleThis module reports the board in-position signals to the control board.
5.18.4 Technical SpecificationsThe technical specifications of the FAN cover the board dimensions, weight, powerconsumption, and input voltage.
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Table 5-81 lists the technical specifications of the FAN.
Table 5-81 Technical specifications of the FAN
Item Technical Specification
Board dimensions (mm) 42.0 (H) x 217.6 (D) x 28.5 (W)
Weight (kg) 0.20
Power consumption (W) l Low rate: 2.3l Medium rate: 6.1l High rate: 17
Working voltage (V) 12 V DC power
5.19 Filler PanelA filler panel is used to cover any vacant slot in a chassis.
5.19.1 Appearance and Valid SlotsThere is no indicator or interface on a filler panel.
Appearance
Figure 5-45 shows the appearance of a filler panel.
Figure 5-45 Appearance of a filler panel
Valid Slots
A filler panel can be housed in any of slots 3-4 of a chassis.
5.19.2 Functions and FeaturesA filler panel can be used to perform electromagnetic shielding, keep out foreign substances,and ensure proper ventilation.
Main functions of a filler panel are as follows:
l Performs electromagnetic shielding and ensures that the chassis meets the requirement ofelectromagnetic radiation.
l Prevents foreign substances from getting into the chassis.
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l Prevents internal voltage from being exposed.l Ensures proper ventilation of cooling current inside the chassis.
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6 ATN 910I Boards
ATN 910I has integrated with boards that are not swappable.
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7 ATN 910B Boards
ATN 910B has integrated with boards that are not swappable.
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8 ATN 950B Boards
About This Chapter
Boards on ATN 950B are used together to provide various functions.
8.1 Board OverviewA board mainly consists of the printed circuit board (PCB) and the front panel.
8.2 Board Type and ApplicationThis section describes the applications and differences between different types of PIC boards.
8.3 AND1CXPA/AND1CXPB - System Control, Cross-connect, and Multi-protocol ProcessUnitThe AND1CXPA/AND1CXPB (CXPA/CXPB for short) is a control, cross-connect, andprotocol processing board. The function version of the CXPA/CXPB is AND1. The CXPA/CXPB is housed in slot 7 or slot 8.
8.4 AND2CXPA/AND2CXPB/AND2CXPE - System Control, Cross-connect, and Multi-protocol Process UnitThe AND2CXPA/AND2CXPB/AND2CXPE (CXPA/CXPB/CXPE for short) is a control,cross-connect, and protocol processing board. The function version of the CXPA/CXPB/CXPEis AND1. The CXPA/CXPB/CXPE is housed in slot 7 or slot 8.
8.5 AND1EM4T - 4 Channels GE/FE Electrical Interface BoardThe AND1EM4T (EM4T for short) is a four channels FE/GE adaptive electrical interface board.The function version of the EM4T is AND1. The AND1EM4T is housed in any of slots 1 to 4(when working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when workingwith the AND2CXPA/AND2CXPB/AND2CXPE).
8.6 AND1EM8T - 8 Channels GE/FE Electric Interface BoardThe AND1EM8T (EM8T for short) is an eight channels FE/GE adaptive electrical interfaceboard. The function version of the EM8T is AND1. The AND1EM8T is housed in any of slots1 to 2.
8.7 AND1EM4F - 4 Channels GE/FE Optical Interface BoardThe AND1EM4F (EM4F for short) is a four channels FE/GE optical interface board. Thefunction version of the EM4F is AND1. The AND1EM4F is housed in any of slots 1 to 4 (when
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working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with theAND2CXPA/AND2CXPB/AND2CXPE).
8.8 AND1EM4C: 4 Channels GE/FE Combo BoardThe AND1EM4C (EM4C for short) board is a 4 x FE/GE Combo board and its functional versionis AND1. The AND1EM4C is housed in any of slots 1 to 4 (when working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE).
8.9 AND1EM8F - 8 Channels GE/FE Optical Interface BoardThe AND1EM8F (EM8F for short) is an eight channels FE/GE optical interface board. Thefunction version of the EM8F is AND1. The AND1EM8F is housed in any of slots 1 to 2.
8.10 AND1EX1 - 1 Channel 10 GE Optical Interface BoardThe AND1EX1 (EX1 for short) is a one channel 10 GE optical interface board. The functionversion of the EX1 is AND1. The AND1EX1 is housed in any of slots 5 to 6 (when workingwith the AND1CXPA), in any of slots 3 to 6 (when working with the AND1CXPB), and in anyof slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE).
8.11 AND2CQ1B - 4 Channels Channelized OC-3c/STM-1c POS Optical Interface BoardThis section describes the AND2CQ1B, a 4 channels channelized OC-3c/STM-1c POS opticalinterface board, in terms of the overview, functions, features, working principle, front panel, andtechnical specifications.
8.12 AND2PQ1: 4 Channels OC-3/STM-1 POS Optical Interface BoardThe AND2PQ1 (PQ1 for short) board is a 4 x OC-3/STM-1 POS optical interface board and itsfunctional version is AND2. It is configured in any of slots 1 to 6 in a chassis.
8.13 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface BoardThe functional version of the AND1ML1/AND1ML1A is AND1..
8.14 AND3ML1A/AND3ML1B - 16 Channels E1 Interface BoardThe AND3ML1A/AND3ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board.The function version of the ML1A/ML1B is AND3. The AND3ML1A/AND3ML1B is housedin slots 1 to 6.
8.15 AND2MD1A/AND2MD1B - 32 Channels E1 Interface BoardThe AND2MD1A/AND2MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board.The function version of the MD1A/MD1B is AND2. The AND2MD1A/AND2MD1B is housedin slots 1 to 6.
8.16 TND1PIU - Power Interface BoardThe TND1PIU (PIU for short) is a power interface board. The function version of the PIU isTND1. The PIU is housed in slot 9 or slot 10.
8.17 AND1FAN - Fan BoardThe AND1FAN (FAN for short) is an FAN board. The function version of the FAN is AND1.The FAN is housed in slot 11.
8.18 Filler PanelA filler panel is used to cover any vacant slot in a chassis.
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8.1 Board OverviewA board mainly consists of the printed circuit board (PCB) and the front panel.
Board StructureFigure 8-1 shows the structure of a board (using the AND1EM4F board as an example).
Figure 8-1 Board structure
A board mainly consists of the following parts:l PCB
The PCB houses various functional chips of the board and is the most important part of theboard. Through the front panel, the PCB provides indicators, buttons, and ports.
NOTE
Different boards provide different indicators, buttons, and ports; not all boards support a daughterboard. For details, see the description of each board.
l Front panel, including the captive screws, ejector levers, indicators, buttons, and interfaces.– Captive screws: secure the board in the subrack.– Ejector levers: used for inserting or removing the board. Bar codes are also attached on
the ejector levers.
NOTE
The ejector lever on the left side of the front panel of a board is attached with a label marking the bar codeof the board (for a control board, the bar code label is above the ejector level on the front panel). The barcode of a control board will be retrieved by ATN 950B as the equipment serial number (ESN).
The ESN is used for applying for a license. ATN 950B automatically reads the bar code of the backplaneor control board as the device ESN. Generally, the bar code of the backplane takes precedence over thatof the control board.
Board NamingNOTE
The preceding only describes how to roughly identify a board. For details on board specifications, see boarddescriptions.
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A board name mainly consists of the board functional version and short name. A short name canroughly identify a board. The short name of a control board, power board, and fan board is CXPx,PIU, and FAN respectively. The following mainly describes how to quickly identify a physicalinterface board through the short name of a board.
As shown in Figure 8-2, the short name of a board consists of an abbreviated board name andan extended name. An abbreviated board name includes the board type, interface quantity, andinterface rate. When boards have the same abbreviated board name, they can be differentiatedusing extended names. An extended name does not have special meanings and can be omitted.
Figure 8-2 Board short name (using ML1A as an example)
Extended name
M L 1 A
Interface rateInterface quantityBoard type
The following describes each part of an abbreviated board name:
l Board type M indicates an E-carrier interface board. The interface quantity is representedusing L or D, indicating 16 or 32 respectively. The interface rate is represented using 1,indicating E1.
l Board type C indicates a CPOS interface board. The interface quantity is represented usingQ, indicating 4. The interface rate is represented using 1, indicating STM-1.
l Board type P indicates a POS interface board. The interface quantity is represented usingQ, indicating 4. The interface rate is represented using 1, indicating STM-1.
l Board type E indicates an Ethernet interface board. The interface quality is representedusing an Arabic numeral. The interface rate is represented using M or X, indicating FE/GEor 10GE respectively. Extended name F or T is used to indicate an optical interface orelectrical interface respectively.
NOTE
For the name of an Ethernet interface board, the interface rate and quantity rate are in an order oppositeto those for the names of other boards. For example, in EM4F (a name of an Ethernet interface board),interface rate M comes before interface quantity 4.
Board RelationshipA control board mainly implements system control and service grooming, and receives andprocesses various services by working with physical interface boards. A power board providespower inputs for the system. A fan board blows air to dissipate heat generated during systemoperation. Figure 8-3 shows the board relationship.
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Figure 8-3 Board relationship
Control boardCXPA/CXPB/CXPE
Control and management module
Service processing and
switching module
Clock module
EM4F/EM4T
EX1
EM8F/EM8T
ML1/ML1A/ML1B
10GE
FE/GE
FE/GE
E1
MD1A/MD1BE1
EM4F/EM4T
EX1
EM8F/EM8T
ML1/ML1A/ML1B
MD1A/MD1B
10GE
FE/GE
FE/GE
E1
E1
CQ1BCPOSSTM-1
CQ1BCPOSSTM-1
PQ1POS
STM-1PQ1
POSSTM-1
Power interface boardPIU
Fan boardFAN
Network sideUser side
ATN 950B is equipped with active and standby control boards, which form a hot backup. A dualfeeding and selective receiving mechanism is used for service interaction between physicalinterface boards and the two control boards.
8.2 Board Type and ApplicationThis section describes the applications and differences between different types of PIC boards.
8.2.1 Board TypeBoards are the key hardware components of the equipment. Boards on the ATN 950B areclassified into the following types: control board (CXP), physical interface card (PIC), powerinterface board (PIU), and fan board (FAN).
Control Board (CXP)The control board controls the system, grooms services, processes the clock, and providesauxiliary interfaces.
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Table 8-1 Control boards supported by the ATN 950B
Board Name Board Description Supported Version
AND1CXPA System control, switching and timing board V200R001C02
AND2CXPA System control, switching and timing board V200R003C00
AND1CXPB System control, switching and timing board V200R001C02
AND2CXPB System control, switching and timing board V200R003C00
AND2CXPE System control, switching and timing board V200R003C00
Physical Interface Card (PIC)
The physical interface boards process the services with the control board.
The physical interface boards are classified into the following types based on the service accessmode: Ethernet service interface boards, E1 service interface boards, STM-1 serviceinterface boards.
Table 8-2 Ethernet service interface boards supported by the ATN 950B
Board Name Board Description Supported Version
AND1EM4T 4 Channels GE/FE Electric Interface Board V200R001C02
AND1EM8T 8 Channels GE/FE Electric Interface Board V200R001C02
AND1EM4F 4 Channels GE/FE Optical Interface Board V200R001C02
AND1EM8F 8 Channels GE/FE Optical Interface Board V200R001C02
AND2EM4C 4 Channels GE/FE Combo Board V200R003C10
AND1EX1 1 Channel 10GE Optical Interface Board V200R001C02
Table 8-3 E1 service interface boards Supported by the ATN 950B and Valid Slots
Board Name Board Description Supported Version
AND1ML1 16 Channels E1 Electrical Interface Board(75 ohm)
V200R001C02
AND1ML1A 16 Channels E1 Electrical Interface Board(120 ohm)
V200R001C02
AND3ML1A 16 Channels E1 Electrical Interface Board(75 ohm)
V200R001C02
AND3ML1B 16 Channels E1 Electrical Interface Board(120 ohm)
V200R001C02
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Board Name Board Description Supported Version
AND2MD1A 32 Channels E1 Electrical Interface Board(75 ohm)
V200R001C02
AND2MD1B 32 Channels E1 Electrical Interface Board(120 ohm)
V200R001C02
Table 8-4 STM-1 service interface boards supported by the ATN 950B
Board Name Board Description Supported Version
AND2CQ1B 4 Channels Channelized OC-3c/STM-1cPOS Optical Interface Board
V200R002C00
AND2PQ1 4 Channels OC-3/STM-1 POS OpticalInterface Board
V200R002C01
Power BoardPower boards lead in power for supplying power to the device. For details about powerdistribution, see Power Distribution.
Table 8-5 Power boards supported by the ATN 950B
Board Name Board Description Supported Version
TND1PIU Power interface board V200R001C02
Fan Board (FAN)The fan board exhausts hot air for heat dissipation. For details about air duct, see HeatDissipation.
Table 8-6 Fan boards supported by the ATN 950B
Board Name Board Description Supported Version
AND1FAN Fan board V200R001C02
8.2.2 Ethernet Service Interface BoardThe ATN 950B supports multiple types of Ethernet interface boards to address requirements forvarious interface quantities, interface rates, and interface types (optical/electrical).
Ethernet service interface boards are widely used in various network environments. They canaccept base station services on the user side, and transmit services upstream on the network side.
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The Ethernet service interface board supports Layer 2 services, Layer 3 services, and hybridtransmission of Layer 2 and Layer 3 services. (When the main interface is in Layer 2 mode,configure the sub-interface to transmit Layer 2/Layer 3 services.)
Table 8-7 shows the Ethernet service interface boards supported by the ATN 950B and thedifferences between the boards.
Table 8-7 Ethernet service interface boards
Board Interface Description
AND1EM4T 4 x FE/GE electrical interface
AND1EM8T 8 x FE/GE electrical interface
AND1EM4F 4 x FE/GE SFP interface
AND1EM8F 8 x FE/GE SFP interface
AND1EX1 1 x 10 GE XFP interface
NOTEEthernet service interface boards have similar service functions, but differ in the interface quantity andinterface type.
l FE/GE electrical interfaces support signals at 10 Mbit/s, 100 Mbit/s and 1000 Mbit/s.
l FE/GE SFP interfaces support GE optical modules, GE electrical modules, FE optical modules, andFE electrical modules.
l 10GE XFP interfaces support 10GE optical modules.
8.2.3 E1 Service Interface BoardThe E1 service interface board supports ATM, PPP, and TDM link-layer protocols.
ATMFigure 8-4 shows the application of the E1 service interface board using the ATM protocol.
Figure 8-4 Application of the E1 service interface board using the ATM protocol
An ATN device uses the E1 service interface board on the user side to support ATM over E1.When the ATM service access rate is between E1 and E3, multiple E1 links are bound into anIMA group to increase service bandwidth. On the network side, the E1 service interface boardimplements ATM service emulation and transparently transmits the ATM services over the
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packet switched network (PSN), such as MPLS or Ethernet. For detailed information, see thechapter "ATM IMA application" in the Feature Description.
PPP
Figure 8-5 shows the application of the E1 service interface board using the PPP protocol.
Figure 8-5 Application of the E1 service interface board using the PPP protocol (user side)
The ATN device uses the E1 service interface board to support IP services carried over ML-PPPs on user side.
NOTE
An independent PPP link cannot carry service. PPP links must be added to an ML-PPP group to carryservices.
An ML-PPP does not support MPLS services.
TDM
Figure 8-6 shows the application of the E1 service interface board using the TDM protocol.
Figure 8-6 Application of the E1 service interface board using the TDM protocol
The ATN device uses the E1 service interface board to access the TDM service, encapsulate theservice signals into packets, and transparently transmit the packets through PWs over the PSNnetwork. This achieves CES service emulation. For detailed information, see the chapter "CESapplication" in the Feature Description.
Comparison Between E1 Service Interface Boards
Table 8-8 shows the E1 service interface boards supported by the ATN 950B and the differencesbetween the boards.
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Table 8-8 E1 service interface boards
Function AND1ML1AND1ML1A
AND2ML1AAND2ML1B
AND1MD1AAND1MD1B
Interface type E1 E1 E1
Number ofinterfaces
16 16 32
Interfaceimpedance
AND1ML1: 75 ohmAND1ML1A: 120 ohm
AND2ML1A: 75 ohmAND2ML1B: 120 ohm
AND1MD1A: 75 ohmAND1MD1B: 120 ohm
Interface clockmode
Master clock mode Master/slave clock mode Master/slave clock mode
Link-layerprotocols
ATM, PPP, TDM ATM, PPP, TDM ATM, PPP, TDM
Minimumnumber oftimeslots in CE1mode
2 1 1
8.2.4 STM-1 Service Interface BoardATN devices support STM-1 POS interfaces and CPOS interfaces. A POS interface directlymaps data packets of variable length into SONET payload and uses the SONET physical-layertransmission standard. A CPOS interface is a channelized POS interface.
Figure 8-7 and Figure 8-8 show the applications of STM-1 service interface boards on anetwork.
Figure 8-7 Application of the STM-1 service interface board (user side)
PICCXPSTM-1Board
ATN CX600
Node B
RNC
MSTP
Node B
POS/CPOS
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Figure 8-8 Application of the STM-1 service interface board (network side)
CXP STM-1Board
ATN CX600Node B RNC
PIC
CX600
POS/CPOS
The AND2CQ1B on the ATN 950B is used as the STM-1 service interface board, which providesfour CPOS interfaces. Each CPOS interface supports 63 E1 channels. The supported servicesare almost the same as those of the E1 service interface board.
On ATN 950B, AND2PQ1 and AND2CQ1B are the interface boards that support STM-1services. The AND2PQ1 board provides 4 POS interfaces. It uses the SONET as the physical-layer protocol and PPP to control links at the data link layer. The AND2PQ1 board runs IPservices at the network layer. The AND2CQ1B board provides 4 CPOS interfaces. The CPOSphysical ports are no longer used as service ports, but the channelized 63 E1 channels are usedas synchronization serial ports that support the same services as an E1 service interface board.
l The AND2PQ1 board can be used on the user or network side. It carries IP services overPOS interfaces.
l The AND2CQ1B board can be used on the user or network side. It supports ML-PPP andcarries IP services over E1 channels on CPOS interfaces.
l The AND2CQ1B board on the user side can access and converge ATM and TDM servicesover E1 channels on CPOS interfaces. It implements service emulation and transparenttransmission over a packet switched network, achieving ATM PWE3 and TDM PWE3(CES) services.
NOTE
Services supported by the E1 channel on the CPOS interface are basically the same as those provided bythe E1 service interface board. The differences are listed as follows:
l The E1 channel of the AND2CQ1B supports IP and MPLS services carried over ML-PPPs; the E1service interface board only supports IP services.
l The E1 channel of the AND2CQ1B does not support fractional E1; the E1 service interface boardsupports fractional E1 when the TDM protocol is used.
8.3 AND1CXPA/AND1CXPB - System Control, Cross-connect, and Multi-protocol Process Unit
The AND1CXPA/AND1CXPB (CXPA/CXPB for short) is a control, cross-connect, andprotocol processing board. The function version of the CXPA/CXPB is AND1. The CXPA/CXPB is housed in slot 7 or slot 8.
Table 8-9 provides comparison between AND1CXPA and AND1CXPB.
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Table 8-9 Board comparison
Board Type Cross-Connect Capacity 1588 ACR
AND1CXPA 44 Gbit/s Supported
AND1CXPB 56 Gbit/s Supported
8.3.1 Front PanelOn the front panel of the AND1CXPA/AND1CXPB, there are indicators, buttons, switch forthe ejector lever, and interfaces.
Appearance of the Front PanelFigure 8-9 and Figure 8-10 show the appearance of the front panel of the AND1CXPA/AND1CXPB.
Figure 8-9 Front panel of the AND1CXPA
Figure 8-10 Front panel of the AND1CXPB
IndicatorThe following indicators are present on the front panel of the AND1CXPA/AND1CXPB:
l STAT indicator, red, green, or orange, which indicates the working statusl PROG indicator, red or green, which indicates the running status of the programl SYNC indicator, red or green, which indicates the clock synchronization statusl ACTX indicator, green, which indicates the cross-connection or clock active/standby statusl ACTC indicator, green, which indicates the active/standby system control board
For details on meanings of indicators, see 12.1 Indicators.
ButtonThe following buttons are present on the front panel of the AND1CXPA/AND1CXPB:
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l CF RCV button, which is reserved for later use.
l RRST button, which is used for reset on the board. When you press the RST button andthen release it, the board is reset.
l LAMP button, which is used to test the indicators. When you press the LAMP button, allthe board indicators on the NE are on.
Switch for the Ejector Lever
On the front panel, there are two switches for the two ejector levers on the front panel. To removea board, you need to push the two switches to the middle and then rotate the ejector levers.
Interface
Table 8-10 lists the types and usage of the interfaces on the AND1CXPA/AND1CXPB.
Table 8-10 Types and usage of the interfaces on the AND1CXPA/AND1CXPB
Interfaceon theFrontPanel
InterfaceType
Usage Pin Corresponding Cable
ETH/OAM
RJ45 10M/100M auto-sensingEthernet NM interface orConsole interface
Refer to Table8-11.
Refer to 10.2ManagementCables.
CLK RJ45 Clock input/output interface Refer to Table8-12.
Refer to 10.4Clock Cables.
TOD RJ45 Time input/output interface Refer to Table8-13.
Refer to 10.4Clock Cables.
ALMI/O RJ45 Alarm input/output interface Refer to Table8-14.
-
Table 8-11 Pins of the ETH/OAM interface
Front View Pin Usage
18 24 3567
1 Transmit positive of the NM interface
2 Transmit negative of the NM interface
3 Receive positive of the NM interface
4 Grounding end of the Console interface
5 Receive end of the Console interface
6 Receive negative of the NM interface
7 Unspecified
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Front View Pin Usage
8 Transmit end of the Console interface
Table 8-12 Pins of the CLK interface
Front View Pin Usage
18 24 3567
1 Negative receive end of external clock
2 Positive receive end of external clock
3 Unspecified
4 Negative transmit end of external clock
5 Positive transmit end of external clock
6 Unspecified
7 Unspecified
8 Unspecified
Table 8-13 Pins of the TOD interface
Front View Pin Working Mode
External Time Input(1PPS + TimeInformation)
External Time Output(1PPS + TimeInformation)
18 24 3567
1 Unspecified Unspecified
2 Unspecified Unspecified
3 Negative input for the 1ppssignal(RS422 level)
Negative output for the 1ppssignal(RS422 level)
4 Grounding end Grounding end
5 Grounding end Grounding end
6 Positive input for the 1ppssignal(RS422 level)
Positive output for the 1ppssignal(RS422 level)
7 Negative input for timeinformation(RS422 level)
Negative output for timeinformation(RS422 level)
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Front View Pin Working Mode
External Time Input(1PPS + TimeInformation)
External Time Output(1PPS + TimeInformation)
8 Positive input for timeinformation(RS422 level)
Positive output for timeinformation(RS422 level)
NOTEThe TOD interfaces can be configured so that they can work in one of the preceding two working modes.
Table 8-14 Pins of the ALMI/O interface
Front View Pin Usage
18 24 3567
1 Input for the digital parameter
2 Grounding end
3 Input for the digital parameter
4 Input for the digital parameter
5 Grounding end
6 Grounding end
7 Positive output for the digitalparameter
8 Negative output for the digitalparameter
8.3.2 Functions and FeaturesThe AND1CXPA/AND1CXPB controls the system, grooms services, processes the clock, andprovides auxiliary interfaces.
Table 8-15 lists the functions and features of the AND1CXPA/AND1CXPB.
Table 8-15 Functions and Features of the AND1CXPA/AND1CXPB
Function and Feature Description
Basic funtion Cross-connect capacity AND1CXPA: 44 Gbit/sAND1CXPB: 56 Gbit/s
Supports switching, control, and clock management.
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Function and Feature Description
Supports the board-level 1+1 backup function.
Auxiliary interface function Provides one 10 Mbit/s or 100 Mbit/s auto-sensing EthernetNM interface or Console interface for communication withthe NMS.
Provides one time input/output interface and provides thesynchronization time source for the equipment.
Provides one clock input/output interface and provides thesynchronization clock source for the equipment.
Provides one alarm input/output interface. The interfaceprovides three inputs of alarm digital parameters.
Tact switches Provides two tact switches. When you rotate the ejector leversto remove the board, the two tact switches are triggered tostart the active/standby protection switching.
NOTEWhen you rotate only one ejector lever, the protection switching is not triggered. The protection switchingis triggered only when you rotate the two ejector levers.
8.3.3 Working Principle and Signal FlowThe AND1CXPA/AND1CXPB mainly consists of the service processing and grooming module,system control module, clock processing module, auxiliary interface module, and power supplymodule.
Figure 8-11 shows the block diagram for the working principle of the AND1CXPA/AND1CXPB.
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Figure 8-11 Block diagram for the functions of the AND1CXPA/AND1CXPB
Auxiliary interface module
Clock input/output interface
NM network interface/serial
interface
Alarm input/output interface
Clock processing
module
System control module
Service processing and grooming module
NM communication
Service signals
Power supply module
-48V/-60V
12V
3.3V
System power supply
FAN
Interface cards
Under-voltage/over-voltage detection bus
CPU control unit
Logic control unit
NMserial interface
Active/standby board communication bus
Management bus
Management bus
Time signals
Service communication bus
The other CXPNM pass-through
PICs
-48V/-60V
Time input/output interface
Time signals
Clock signals
Back plane
Clock signals
The other CXP
PICs
The other CXP
System power supply
Serial management bus
Service Processing and Grooming Module
This module performs the following functions:
l Grooms services with switching capacity.
l Supports automatic switching and manual switching of the active and standby boards.
System Control Module
This module mainly consists of the CPU control unit and logic control unit, which perform thefollowing functions:
l The CPU control unit works with the logic control unit to detects alarms and hardwarefaults, control boards, process overhead, and manage the equipment.
l The logic control unit provides interfaces through which the CPU control unit connects toother chips on the board. The logic control unit specifies the working states of chips,initializes chips, and operates the register. In addition, the logic control unit achieves logcontrol on active/standby switching, monitors the working state of the board, and detectsthe states of other boards.
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Clock Processing ModuleThis module performs the following functions:
l Provides working clock signals for the key chips on the AND1CXPA/AND1CXPB.l Supports the physical-layer clock synchronization, and provides system clock signals for
each boards.l Processes the IEEE 1588V2 protocol to achieve clock/time synchronization.l Supports the 1588 ACR clock.l Supports the NTP clock.
Auxiliary Interface ModuleThis module performs the following functions:
l Provides one NM Ethernet interface or console interface.l Provides one time input/output interface and one time input/output interface.l Provides one alarm input/output interface.
Power Supply ModuleThis module performs the following functions:
l Accesses two -48 V DC/-60 V DC power supplies.l Detects and reports overvoltage and undervoltage of two input power supplies.l Supplies 12 V power for the FAN board.l Supplies 3.3 V working power for the local board and the PIC boards in a centralized
manner.
8.3.4 CF Card and DIP SwitchA board has a set of DIP switches and a hot-swappable CF card.
CF Card and DIP Switch LocationsFigure 8-12 shows the locations of the CF card and DIP switches on AND1CXPA/AND1CXPB.
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Figure 8-12 Locations of the CF card and DIP switches on AND1CXPA/AND1CXPB.
CF CardDIP Switch
O
ND
IP
12
34
CF Card
The size of the CF card on AND1CXPA/AND1CXPB is 512 MB. The CF card is used to backupdata and load packages.
DIP Switch
You can use the DIP switches to delete the configuration file loaded on the device.
Set DIP switches on AND1CXPA/AND1CXPB to 1, 1, 0, and 1. During startup, the devicedeletes the loaded configuration file based on the DIF switch status.
NOTICEl This operation should be executed with caution. Use it under the guidance of technical
personnel.
l After the configuration file is deleted, reset the DIF switches to 0, 0, 0, and 0. In this way,you do not need to delete the configuration file at each startup.
l The numeral indicates 1, and the letter indicates 0.
l The device password is deleted when the configuration file is deleted.
8.3.5 Technical SpecificationsThe technical specifications of the AND1CXPA/AND1CXPB include board dimensions,weight, and power consumption.
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Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W)
Weight (kg): 0.68
Power consumption (W, room temperature): 27.3
8.4 AND2CXPA/AND2CXPB/AND2CXPE - System Control,Cross-connect, and Multi-protocol Process Unit
The AND2CXPA/AND2CXPB/AND2CXPE (CXPA/CXPB/CXPE for short) is a control,cross-connect, and protocol processing board. The function version of the CXPA/CXPB/CXPEis AND1. The CXPA/CXPB/CXPE is housed in slot 7 or slot 8.
Table 8-16 provides comparison between AND2CXPA, AND2CXPB, and AND2CXPE.
Table 8-16 Board Comparison
Board Type Cross-Connect Capacity 1588 ACR
AND2CXPA 44 Gbit/s Not supported
AND2CXPB 56 Gbit/s Not supported
AND2CXPE 56 Gbit/s Supported
8.4.1 Front PanelOn the front panel of the AND2CXPA/AND2CXPB/AND2CXPE, there are indicators, buttons,switch for the ejector lever, and interfaces.
Appearance of the Front Panel
Figure 8-13, Figure 8-14 and Figure 8-15 show the appearance of the front panel of theAND2CXPA/AND2CXPB/AND2CXPE.
Figure 8-13 Front panel of the AND2CXPA
Figure 8-14 Front panel of the AND2CXPB
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Figure 8-15 Front panel of the AND2CXPE
IndicatorThe following indicators are present on the front panel of the AND2CXPA/AND2CXPB/AND2CXPE:
l STAT indicator, red, green, or orange, which indicates the working statusl PROG indicator, red or green, which indicates the running status of the programl SYNC indicator, red or green, which indicates the clock synchronization statusl ACTX indicator, green, which indicates the cross-connection or clock active/standby statusl ACTC indicator, green, which indicates the active/standby system control board
For details on meanings of indicators, see 12.1 Indicators.
ButtonThe following buttons are present on the front panel of the AND2CXPA/AND2CXPB/AND2CXPE:
l CF RCV button, which is reserved for later use.l RRST button, which is used for reset on the board. When you press the RST button and
then release it, the board is reset.l LAMP button, which is used to test the indicators. When you press the LAMP button, all
the board indicators on the NE are on.
Switch for the Ejector LeverOn the front panel, there are two switches for the two ejector levers on the front panel. To removea board, you need to push the two switches to the middle and then rotate the ejector levers.
InterfaceTable 8-17 lists the types and usage of the interfaces on the AND2CXPA/AND2CXPB/AND2CXPE.
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Table 8-17 Types and usage of the interfaces on the AND2CXPA/AND2CXPB/AND2CXPE
Interfaceon theFrontPanel
InterfaceType
Usage Pin Corresponding Cable
ETH/OAM
RJ45 10M/100M auto-sensingEthernet NM interface orConsole interface
Refer to Table8-18.
Refer to 10.2ManagementCables.
CLK RJ45 Clock input/output interface Refer to Table8-19.
Refer to 10.4Clock Cables.
TOD RJ45 Time input/output interface Refer to Table8-20.
Refer to 10.4Clock Cables.
ALMI/O RJ45 Alarm input/output interface Refer to Table8-21.
-
Table 8-18 Pins of the ETH/OAM interface
Front View Pin Usage
18 24 3567
1 Transmit positive of the NM interface
2 Transmit negative of the NM interface
3 Receive positive of the NM interface
4 Grounding end of the Console interface
5 Receive end of the Console interface
6 Receive negative of the NM interface
7 Unspecified
8 Transmit end of the Console interface
Table 8-19 Pins of the CLK interface
Front View Pin Usage
18 24 3567
1 Negative receive end of external clock
2 Positive receive end of external clock
3 Unspecified
4 Negative transmit end of external clock
5 Positive transmit end of external clock
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Front View Pin Usage
6 Unspecified
7 Unspecified
8 Unspecified
Table 8-20 Pins of the TOD interface
Front View Pin Working Mode
External Time Input(1PPS + TimeInformation)
External Time Output(1PPS + TimeInformation)
18 24 3567
1 Unspecified Unspecified
2 Unspecified Unspecified
3 Negative input for the 1ppssignal(RS422 level)
Negative output for the 1ppssignal(RS422 level)
4 Grounding end Grounding end
5 Grounding end Grounding end
6 Positive input for the 1ppssignal(RS422 level)
Positive output for the 1ppssignal(RS422 level)
7 Negative input for timeinformation(RS422 level)
Negative output for timeinformation(RS422 level)
8 Positive input for timeinformation(RS422 level)
Positive output for timeinformation(RS422 level)
NOTEThe TOD interfaces can be configured so that they can work in one of the preceding two working modes.
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Table 8-21 Pins of the ALMI/O interface
Front View Pin Usage
18 24 3567
1 Input for the digital parameter
2 Grounding end
3 Input for the digital parameter
4 Input for the digital parameter
5 Grounding end
6 Grounding end
7 Positive output for the digitalparameter
8 Negative output for the digitalparameter
8.4.2 Functions and FeaturesThe AND2CXPA/AND2CXPB/AND2CXPE controls the system, grooms services, processesthe clock, and provides auxiliary interfaces.
Table 8-22 lists the functions and features of the AND2CXPA/AND2CXPB/AND2CXPE.
Table 8-22 Functions and Features of the AND2CXPA/AND2CXPB/AND2CXPE
Function and Feature Description
Basic function Cross-connect capacity AND1CXPA: 44 Gbit/sAND1CXPB: 56 Gbit/sAND1CXPE: 56 Gbit/s
Supports switching, control, and clock management.
Supports the board-level 1+1 backup function.
Auxiliary interface function Provides one 10 Mbit/s or 100 Mbit/s auto-sensing EthernetNM interface or Console interface for communication withthe NMS.
Provides one time input/output interface and provides thesynchronization time source for the equipment.
Provides one clock input/output interface and provides thesynchronization clock source for the equipment.
Provides one alarm input/output interface. The interfaceprovides three inputs of alarm digital parameters.
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Function and Feature Description
Tact switches Provides two tact switches. When you rotate the ejector leversto remove the board, the two tact switches are triggered tostart the active/standby protection switching.
NOTEWhen you rotate only one ejector lever, the protection switching is not triggered. The protection switchingis triggered only when you rotate the two ejector levers.
8.4.3 Working Principle and Signal FlowThe AND2CXPA/AND2CXPB/AND2CXPE mainly consists of the service processing andgrooming module, system control module, clock processing module, auxiliary interface module,and power supply module.
Figure 8-16 shows the block diagram for the working principle of the AND2CXPA/AND2CXPB/AND2CXPE.
Figure 8-16 Block diagram for the functions of the AND2CXPA/AND2CXPB/AND2CXPE
Auxiliary interface module
Clock input/output interface
NM network interface/serial
interface
Alarm input/output interface
Clock processing
module
System control module
Service processing and grooming module
NM communication
Service signals
Power supply module
-48V/-60V
12V
3.3V
System power supply
FAN
Interface cards
Under-voltage/over-voltage detection bus
CPU control unit
Logic control unit
NMserial interface
Active/standby board communication bus
Management bus
Management bus
Time signals
Service communication bus
The other CXPNM pass-through
PICs
-48V/-60V
Time input/output interface
Time signals
Clock signals
Back plane
Clock signals
The other CXP
PICs
The other CXP
System power supply
Serial management bus
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Service Processing and Grooming Module
This module performs the following functions:
l Grooms services with switching capacity.
l Supports automatic switching and manual switching of the active and standby boards.
System Control Module
This module mainly consists of the CPU control unit and logic control unit, which perform thefollowing functions:
l The CPU control unit works with the logic control unit to detects alarms and hardwarefaults, control boards, process overhead, and manage the equipment.
l The logic control unit provides interfaces through which the CPU control unit connects toother chips on the board. The logic control unit specifies the working states of chips,initializes chips, and operates the register. In addition, the logic control unit achieves logcontrol on active/standby switching, monitors the working state of the board, and detectsthe states of other boards.
Clock Processing Module
This module performs the following functions:
l Provides working clock signals for the key chips on the AND2CXPA/AND2CXPB/AND2CXPE.
l Supports the physical-layer clock synchronization, and provides system clock signals foreach boards.
l Processes the IEEE 1588V2 protocol to achieve clock/time synchronization.
l Supports the 1588 ACR clock (supported by AND2CXPE).
l Supports the NTP clock.
Auxiliary Interface Module
This module performs the following functions:
l Provides one NM Ethernet interface or console interface.
l Provides one time input/output interface and one time input/output interface.
l Provides one alarm input/output interface.
Power Supply Module
This module performs the following functions:
l Accesses two -48 V DC/-60 V DC power supplies.
l Detects and reports overvoltage and undervoltage of two input power supplies.
l Supplies 12 V power for the FAN board.
l Supplies 3.3 V working power for the local board and the PIC boards in a centralizedmanner.
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8.4.4 DIP SwitchA board has a set of DIP switches.
Figure 8-17 shows the locations of the DIP switches on AND2CXPA/AND2CXPB/AND2CXPE.
Figure 8-17 Locations of the DIP switches on AND2CXPA/AND2CXPB/AND2CXPE.
拨码开关
O
ND
IP
12
34
You can use the DIP switches to delete the configuration file loaded on the device.
Set DIP switches on AND2CXPA/AND2CXPB/AND2CXPE to 1, 1, 0, and 1. During startup,the device deletes the loaded configuration file based on the DIF switch status.
NOTICEl This operation should be executed with caution. Use it under the guidance of technical
personnel.l After the configuration file is deleted, reset the DIF switches to 0, 0, 0, and 0. In this way,
you do not need to delete the configuration file at each startup.l The numeral indicates 1, and the letter indicates 0.l The device password is deleted when the configuration file is deleted.
8.4.5 Technical SpecificationsThe technical specifications of the AND2CXPA/AND2CXPB/AND2CXPE include boarddimensions, weight, and power consumption.
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Board dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W)
Weight (kg): 0.68
Power consumption (W, room temperature): 23.6 (AND2CXPA), 28.5 (AND2CXPB/AND2CXPE)
8.5 AND1EM4T - 4 Channels GE/FE Electrical InterfaceBoard
The AND1EM4T (EM4T for short) is a four channels FE/GE adaptive electrical interface board.The function version of the EM4T is AND1. The AND1EM4T is housed in any of slots 1 to 4(when working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when workingwith the AND2CXPA/AND2CXPB/AND2CXPE).
8.5.1 Front PanelOn the front panel of the AND1EM4T, there are indicators and interfaces.
Appearance of the Front Panel
Figure 8-18 shows the appearance of the front panel of the AND1EM4T.
Figure 8-18 Front panel of the AND1EM4T
Indicator
The following indicators are present on the front panel of the AND1EM4T:
l STAT indicator, red, green, or orange, which indicates the working status
l LINK indicator, green, which indicates the connection status of the port
l ACT indicator, yellow, which indicates the data transceiving status of the port
NOTE
Above each service interface, there is a service port connection status indicator (LINK) and a service porttransmit/receive status indicator (ACT).
For details on meanings of indicators, see 12.1 Indicators.
Interface
Table 8-23 lists the types and usage of the interfaces on the AND1EM4T.
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Table 8-23 Types and usage of the interfaces on the AND1EM4T
Interface on theFrontPanel
Interface Type
Usage Pin CorrespondingCable
FE/GE0to FE/GE3
RJ45 FE/GE auto-sensingelectrical interface
Refer to Table 8-24. Refer to 10.5.1Ethernet Cables.
Table 8-24 Pins of the FE/GE electrical interfaces
Front View Pin Usage
18 24 3567
1 Positive of twisted pair 1
2 Negative of twisted pair 1
3 Positive of twisted pair 2
4 Positive of twisted pair 3
5 Negative of twisted pair 3
6 Negative of twisted pair 2
7 Positive of twisted pair 4
8 Negative of twisted pair 4
8.5.2 Functions and FeaturesThe AND1EM4T mainly accesses 4 x FE/GE electrical signals, and processes the services withthe control board.
Table 8-25 lists the functions and features of the AND1EM4T.
Table 8-25 Functions and features of the AND1EM4T
Function andFeature
Description
Basic function Provides four FE/GE electrical interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports signals at 100 Mbit/s and 1000 Mbit/s.
Supports inloops and outloops.
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Function andFeature
Description
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEWhen using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clockor IEEE 1588v2.
8.5.3 Working Principle and Signal FlowThe AND1EM4T mainly consists of the service access module, service processing module,management module, clock module, and power supply module
Figure 8-19 shows the block diagram for the functions of the AND1EM4T.
Figure 8-19 Block diagram for the functions of the AND1EM4T
CXPService access
module
Clock module
Service processing
module
Management module
4 x FE/GE electrical signals Service signals
Management bus
-48V/-60V
-48V/-60V
Power supply module
Back plane
Clock signals
CXP
CXP
Each module on the board
Service signals
Management bus
Management bus
Clock signals
System power supply
System power supply3.0V
2.5V
3.3V
1.2V
Transmit Direction
The service packets from AND1CXPA/AND1CXPB are sent to the service processing modulethrough the backplane-side interface of the AND1EM4T. The service processing moduleidentifies the destination interfaces for the packets, and buffers and schedules the packets. Then,the service processing module sends the processed packets to the service access module, wherecoding/decoding and serial/parallel conversion are performed. Finally, the service access moduleoutputs the packets through the GE/FE interfaces on the front panel.
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Receive DirectionThe GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service accessmodule performs serial/parallel conversion and coding/decoding on the services, and then sendsthe services to the service processing module. The service processing module buffers the servicepackets, schedules the packets, and finally outputs the packets through the backplane-sideinterface.
Service Access ModuleThis module performs the following functions:
l In the receive direction, this module receives the GE/FE services from the interfaces on thefront panel, performs serial/parallel conversion and coding/decoding, and then sends theservices to the service processing module.
l In the transmit direction, this module receives the service packets from the serviceprocessing module, performs coding/decoding, and serial/parallel conversion on thepackets, and then outputs the packets through the GE/FE interfaces on the front panel.
l This module extracts the synchronous Ethernet clock.
Service Processing ModuleThis module performs the following functions:
l In the receive direction, this module receives and buffers the service packets from theinterface conversion module. Then, this module schedules packets from differentinterfaces. Finally, this module outputs the packets through the backplane-side interface.
l In the transmit direction, this module receives service packets from the AND1CXPA/AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedulesthe packets based on the access capability of the EM4T and the access bandwidth settingat each interface. Finally, this module outputs the packets to the service access module.
l This module extracts and inserts IEEE 1588 V2 packets.
Management ModuleThis module is used with the CXP to manage and control each module on the EM4T.
Clock ModuleThis module performs the following functions:
l Provides the working clock for each module on the EM4T.l Supports the synchronous Ethernet and SSM protocols.l Supports the IEEE 1588 V2 protocol.l Supports the 1588 ACR clock.
Power Supply ModuleThis module provides the DC power of the following specifications to each module on the EM4T.
l 3.3 V
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l 3.0 Vl 2.5 Vl 1.2 V
8.5.4 Technical SpecificationsTechnical specifications of the AND1EM4T board include interface specifications and physicalspecifications.
Interface SpecificationsTable 8-26 lists the specifications of the electrical interfaces on the AND1EM4T board.
Table 8-26 Specifications of the FE/GE electrical interface
Item Specification Requirement
Interface rate 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.
RJ-45 electrical interfacespecification
Complies with IEEE 802.3 and enterpriseregulations.
Physical SpecificationsBoard dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W)
Weight (kg): 0.44
Power consumption (W, room temperature): 10.4
8.6 AND1EM8T - 8 Channels GE/FE Electric Interface BoardThe AND1EM8T (EM8T for short) is an eight channels FE/GE adaptive electrical interfaceboard. The function version of the EM8T is AND1. The AND1EM8T is housed in any of slots1 to 2.
8.6.1 Front PanelOn the front panel of the AND1EM8T, there are indicators and interfaces.
Appearance of the Front PanelFigure 8-20 shows the appearance of the front panel of the AND1EM8T.
Figure 8-20 Front panel of the AND1EM8T
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Indicator
The following indicators are present on the front panel of the AND1EM8T:
l STAT indicator, red, green, or orange, which indicates the working status
l LINK indicator, green, which indicates the connection status of the port
l ACT indicator, yellow, which indicates the data transceiving status of the port
NOTE
Above each service interface, there is a service port connection status indicator (LINK) and a service porttransmit/receive status indicator (ACT).
For details on meanings of indicators, see 12.1 Indicators.
Interface
Table 8-27 lists the types and usage of the interfaces on the AND1EM8T.
Table 8-27 Types and usage of the interfaces on the AND1EM8T
Interface on theFrontPanel
Interface Type
Usage Pin CorrespondingCable
FE/GE0to FE/GE7
RJ45 FE/GE auto-sensingelectrical interface
Refer to Table 8-28. Refer to 10.5.1Ethernet Cables.
Table 8-28 Pins of the FE/GE electrical interfaces
Front View Pin Usage
18 24 3567
1 Positive of twisted pair 1
2 Negative of twisted pair 1
3 Positive of twisted pair 2
4 Positive of twisted pair 3
5 Negative of twisted pair 3
6 Negative of twisted pair 2
7 Positive of twisted pair 4
8 Negative of twisted pair 4
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8.6.2 Functions and FeaturesThe AND1EM8T mainly accesses 8 x FE/GE electrical signals, and processes the services withthe AND1CXPA/AND1CXPB.
Table 8-29 lists the functions and features of the AND1EM8T.
Table 8-29 Functions and features of the AND1EM8T
Function andFeature
Description
Basic function Provides eight FE/GE electrical interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports signals at 100 Mbit/s and 1000 Mbit/s.
Supports inloops and outloops.
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEWhen using an electrical interface at 10 Mbit/s, the interface does not support synchronous Ethernet clockor IEEE 1588v2.
8.6.3 Working Principle and Signal FlowThe AND1EM8T mainly consists of the service access module, service processing module,management module, clock module, and power supply module.
Figure 8-21 shows the block diagram for the functions of the AND1EM8T.
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Figure 8-21 Block diagram for the functions of the AND1EM8T
CXPService access
module
Clock module
Service processing
module
Management module
8 x FE/GE electrical signals Service signals
Management bus
-48V/-60V
-48V/-60V
Power supply module
Back plane
Clock signals
CXP
CXP
Each module on the board
Service signals
Management bus
Management bus
Clock signals
System power supply
System power supply3.0V
1.8V2.5V
3.3V
1.2V
Transmit Direction
The service packets from AND1CXPA/AND1CXPB are sent to the service processing modulethrough the backplane-side interface of the AND1EM8T. The service processing moduleidentifies the destination interfaces for the packets, and buffers and schedules the packets. Then,the service processing module sends the processed packets to the service access module, wherecoding/decoding and serial/parallel conversion are performed. Finally, the service access moduleoutputs the packets through the GE/FE interfaces on the front panel.
Receive Direction
The GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service accessmodule performs serial/parallel conversion and coding/decoding on the services, and then sendsthe services to the service processing module. The service processing module buffers the servicepackets, schedules the packets, and finally outputs the packets through the backplane-sideinterface.
Service Access Module
This module performs the following functions:
l In the receive direction, this module receives the GE/FE services from the interfaces on thefront panel, performs serial/parallel conversion and coding/decoding, and then sends theservices to the service processing module.
l In the transmit direction, this module receives the service packets from the serviceprocessing module, performs coding/decoding, and serial/parallel conversion on thepackets, and then outputs the packets through the GE/FE interfaces on the front panel.
l This module extracts the synchronous Ethernet clock.
Service Processing Module
This module performs the following functions:
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l In the receive direction, this module receives and buffers the service packets from theinterface conversion module. Then, this module schedules packets from differentinterfaces. Finally, this module outputs the packets through the backplane-side interface.
l In the transmit direction, this module receives service packets from the AND1CXPA/AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedulesthe packets based on the access capability of the EM8T and the access bandwidth settingat each interface. Finally, this module outputs the packets to the service access module.
l This module extracts and inserts IEEE 1588 V2 packets.
Management ModuleThis module is used with the CXP to manage and control each module on the EM8T.
Clock ModuleThis module performs the following functions:
l Provides the working clock for each module on the EM8T.l Supports the synchronous Ethernet and SSM protocols.l Supports the IEEE 1588 V2 protocol.l Supports the 1588 ACR clock.
Power Supply ModuleThis module provides the DC power of the following specifications to each module on the EM8T.
l 3.3 Vl 3.0 Vl 2.5 Vl 1.8 Vl 1.2 V
8.6.4 Technical SpecificationsTechnical specifications of the AND1EM8T board include interface specifications and physicalspecifications.
Interface SpecificationsTable 8-30 lists the specifications of the electrical interfaces on the AND1EM8T board.
Table 8-30 Specifications of the FE/GE electrical interface
Item Specification Requirement
Interface rate 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.
RJ-45 electrical interfacespecification
Complies with IEEE 802.3 and enterpriseregulations.
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Physical SpecificationsBoard dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W)
Weight (kg): 0.46
Power consumption (W, room temperature): 21.1
8.7 AND1EM4F - 4 Channels GE/FE Optical Interface BoardThe AND1EM4F (EM4F for short) is a four channels FE/GE optical interface board. Thefunction version of the EM4F is AND1. The AND1EM4F is housed in any of slots 1 to 4 (whenworking with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with theAND2CXPA/AND2CXPB/AND2CXPE).
8.7.1 Front PanelOn the front panel of the AND1EM4F, there are indicators and interfaces.
Appearance of the Front PanelFigure 8-22shows the appearance of the front panel of the AND1EM4F.
Figure 8-22 Front panel of the AND1EM4F
IndicatorThe following indicators are present on the front panel of the AND1EM4F:
l STAT indicator, red, green, or orange, which indicates the working statusl L/A0 to L/A3 indicators, green or orange, which indicate the port connection status and
data transmit/receive status
For details on meanings of indicators, see 12.1 Indicators.
InterfaceFour SFP interfaces are present on the EM4F. Table 8-31 lists the types and usage of theinterfaces on the EM4F.
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Table 8-31 Types and usage of the interfaces on the AND1EM4F
Interface on the FrontPanel
InterfaceType
Usage CorrespondingFiber
Opticalmodule
IN0 to IN3 LC When a two-fiber bidirectionaloptical module is used, thisinterface is used as an inputinterface for the GE optical signal.When a single-fiber bidirectionaloptical module is used, thisinterface is not used.
Refer to10.6OpticalFibers.
OUT0 toOUT3
LC When a two-fiber bidirectionaloptical module is used, thisinterface is used as an outputinterface for the GE/FE opticalsignal.When a single-fiber bidirectionaloptical module is used, thisinterface is used as an input/outputinterface for the GE/FE opticalsignal.
Electricalmodule
OUT0 IN0,OUT3 IN3
RJ-45 Input/Output interfaces for GEelectrical signals
For details,see 10.5.1EthernetCables.
NOTEThe GE SFP interface on the front panel can function as either an optical interface or an electrical interface.
When the SFP interface functions as an optical interface, it needs to be used with an optical module; whenthe SFP interface functions as an electrical interface, it needs to be used with an electrical module.
8.7.2 Functions and FeaturesThe AND1EM4F mainly accesses 4 x FE/GE optical signals, and processes the services withthe control board.
Table 8-32 lists the functions and features of the AND1EM4F.
Table 8-32 Functions and features of the AND1EM4F
Basic function Description
Basic function Supports four FE/GE interfaces (SFP).
Supports the hot swappable function.
Detects the temperature and voltage of the board.
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Basic function Description
Interface function Supports FE optical modules, FE electrical modules, GE opticalmodules and GE electrical modules.
Supports inloops and outloops.
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEIf the SFP interface houses an electrical module, the interface does not support synchronous Ethernet orIEEE 1588v2.
8.7.3 Working Principle and Signal FlowThe AND1EM4F mainly consists of the service access module, service processing module,management module, clock module, and power supply module.
Figure 8-23 shows the block diagram for the functions of the AND1EM4F.
Figure 8-23 Block diagram for the functions of the AND1EM4F
CXPService access
module
Clock module
Service processing
module
Management module
4 x FE/GE optical signals Service signals
Management bus
-48V/-60V
-48V/-60V
3.0V Power supply module
Back plane
Clock signals
CXP
CXP
2.5VEach module on the board
3.3V
1.2V
Service signals
Management bus
Management bus
Clock signals
System power supply
System power supply
Transmit Direction
The service packets from AND1CXPA/AND1CXPB are sent to the service processing modulethrough the backplane-side interface of the EM4F. The service processing module identifies thedestination interfaces for the packets, and buffers and schedules the packets. Then, the serviceprocessing module sends the processed packets to the service access module, where coding/
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decoding, serial/parallel conversion, and E/O conversion are performed. Finally, the serviceaccess module outputs the packets through the GE/FE interfaces on the front panel.
Receive Direction
The GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service accessmodule performs O/E conversion, serial/parallel conversion, and coding/decoding on theservices, and then sends the services to the service processing module. The service processingmodule buffers the service packets, schedules the packets, and finally outputs the packets throughthe backplane-side interface.
Service Access Module
This module performs the following functions:
l In the receive direction, this module receives the GE/FE services from the interfaces on thefront panel, performs O/E conversion, serial/parallel conversion, and coding/decoding, andthen sends the services to the service processing module.
l In the transmit direction, this module receives the service packets from the serviceprocessing module, performs coding/decoding, serial/parallel conversion, and E/Oconversion on the packets, and then outputs the packets through the GE/FE interfaces onthe front panel.
l This module extracts the synchronous Ethernet clock.
Service Processing Module
This module performs the following functions:
l In the receive direction, this module receives and buffers the service packets from theservice access module. Then, this module schedules packets from different interfaces.Finally, this module outputs the packets through the backplane-side interface.
l In the transmit direction, this module receives service packets from the AND1CXPA/AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedulesthe packets. Finally, this module outputs the packets to the service access module.
l This module extracts and inserts IEEE 1588 V2 packets.
Management Module
This module is used with the AND1CXPA/AND1CXPB to manage and control each module onthe EM4F.
Clock Module
This module performs the following functions:
l Provides the working clock for each module on the EM4F.
l Supports the synchronous Ethernet and SSM protocols.
l Supports the IEEE 1588 V2 protocol.
l Supports the 1588 ACR clock.
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Power Supply Module
This module provides the DC power of the following specifications to each module on the EM4F.
l 3.3 V
l 3.0 V
l 2.5 V
l 1.2 V
8.7.4 Technical SpecificationsTechnical specifications of the AND1EM4F board include interface specifications and physicalspecifications.
For information about the swappable optical/electrical FE/GE optical modules supported at SFPinterfaces on the AND1EM4F board, see Table 8-33, Table 8-34, Table 8-35, and Table8-36. The interface specifications depend on the optical/electrical modules on the board. Fordetails on the specifications of optical/electrical modules, see 9 Swappable Optical/ElectricalModules.
Table 8-33 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectionalCommercial
S4015715 eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
Table 8-34 Information about GE optical modules
Code Optical Module Information Remarks
34060286 eSFP, 850 nm, LC, Multi-mode, 0.5 km Two-fiberbidirectionalCommercial
34060473 eSFP, 1310 nm, LC, Single-mode, 10 km
S4016954 eSFP, 1310 nm, LC, Single-mode, 40 km
34060360 eSFP, 1550 nm, LC, Single-mode, 80 km
34060483 eSFP, 1471nm, LC, Single-mode, 80 km Two-fiberbidirectionalCWDMCommercial
34060481 eSFP, 1491nm, LC, Single-mode, 80 km
34060479 eSFP, 1511nm, LC, Single-mode, 80 km
34060482 eSFP, 1521nm, LC, Single-mode, 80 km
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Code Optical Module Information Remarks
34060478 eSFP, 1551nm, LC, Single-mode, 80 km
34060476 eSFP, 1571nm, LC, Single-mode, 80 km
34060477 eSFP, 1591nm, LC, Single-mode, 80 km
34060480 eSFP, 1611nm, LC, Single-mode, 80 km
34060475 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060470 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km
34060539 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km
34060540 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km
34060595 eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km
34060596 eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km
Table 8-35 Information about FE Electrical Module
Code Electrical Module Information
34100101 100BASE-T, RJ45, SFP Electrical Module, 100 m
Table 8-36 Information about GE Electrical Module
Code Electrical Module Information
34100080 1000BASE-T, RJ45, SFP Electrical Module, 100 m
34100052 1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m
Physical SpecificationsBoard dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W)
Weight (kg): 0.44
Power consumption (W, room temperature): 12.0
8.8 AND1EM4C: 4 Channels GE/FE Combo BoardThe AND1EM4C (EM4C for short) board is a 4 x FE/GE Combo board and its functional versionis AND1. The AND1EM4C is housed in any of slots 1 to 4 (when working with the AND1CXPA/AND1CXPB) and in any of slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE).
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8.8.1 Front PanelOn the front panel of the AND1EM4C (EM4C for short) board, there are indicators andinterfaces.
Appearance
Figure 8-24 shows the appearance of the front panel of the EM4C board.
Figure 8-24 Front panel of the EM4C board
Indicators
The following indicators are present on the front panel of the EM4C board:
l STAT indicator, red, green, or orange, which indicates the working status
l Status indicators (L/A0 to L/A3), green or orange, which indicate the port connection statusand data receiving and transmission status
l LINK indicator, green, which indicates the port connection status
l ACT indicator, yellow, which indicates the data receiving and transmission status of theport
NOTE
There are four LINK indicators and four ACT indicators on the EM4C board. One LINK indicator and oneACT indicator are present above each FE/GE electrical interface (RJ-45).
For the descriptions of the indicators, see 12.1 Indicators.
Interfaces
Table 8-37 describes the types and functions of the interfaces on the EM4C board.
Table 8-37 Interfaces on the EM4C board
Interfaces InterfaceType
Function Required Cable
OUT0 IN0 toOUT3 IN3
SFP FE/GE signal input/outputinterfaces
For details, see 10.6 OpticalFibers.
FE/GE0 to FE/GE3
RJ-45 FE/GE electrical signal input/output interfaces
For details, see 10.5.1 EthernetCables.
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NOTE
The four SFP interfaces and four electrical interfaces are numbered from 0 to 3. Each SFP interfacecorresponds to the electrical interface with the same number and the two interfaces are considered as agroup (for example, OUT0 IN0 and FE/GE0). The two interfaces in each group cannot be used at the sametime.
Table 8-38 SFP interfaces
Interfaces
SupportedPluggableModules
InterfaceType
Function
OUT0 IN0to OUT3IN3
FE opticalmodulesGE opticalmodules
LC FE/GE optical signal input/output interfaces
Table 8-39 Pins of FE/GE electrical interfaces
Front View Pin Function
18 24 3567
1 Positive of twisted pair 1
2 Negative of twisted pair 1
3 Positive of twisted pair 2
4 Positive of twisted pair 3
5 Negative of twisted pair 3
6 Negative of twisted pair 2
7 Positive of twisted pair 4
8 Negative of twisted pair 4
8.8.2 Functions and FeaturesThe AND1EM4C (EM4C for short) board provides four FE/GE SFP interfaces and four FE/GEelectrical interfaces, and it works with the system control board to transceive and process 4 xFE/GE services.
Table 8-40 describes the functions and features of the EM4C board.
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Table 8-40 Functions and features of the EM4C board
Functions and Features Description
Basic functions Provides four FE/GE SFP interfaces and four FE/GE electricalinterfaces.
Supports the hot swappable function.
Supports temperature and voltage detection.
Interfaces FE/GE SFP interfaces support FE optical modules and GEoptical modules.
FE/GE electrical interfaces support signals at 10 Mbit/s, 100Mbit/s, and 1000 Mbit/s.
Supports inloops and outloops.
Supports flow control.
Supports Layer 2 and Layer 3 working modes.
Clocks Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTE
l The four FE/GE SFP interfaces and four FE/GE electrical interfaces are numbered from 0 to 3. EachFE/GE SFP interface corresponds to the FE/GE electrical interface with the same number and the twointerfaces are considered as a group (for example, OUT0 IN0 and FE/GE0). The two interfaces in eachgroup cannot be used at the same time.
l When using a 10 Mbit/s electrical interface, the board does not support synchronous Ethernet or IEEE1588v2.
8.8.3 Working Principle and Signal FlowThe AND1EM4C (EM4C for short) board consists of interfaces, an ETH module, a logic module,a clock module, and a power module.
Figure 8-25 illustrates the working principle of the EM4C board.
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Figure 8-25 Working principle of the EM4C board
Signal selection
Logic Module
Control
CLK
4 x GE
1 x GE
CLK
CXP
CXP
CXP
SFPSFPSFPSFP
AND1EM4C
ETH Module
Service logic
Control logic
Clock Module
Power Module
PIU-48V/-60V PIU
-48V/-60V
ETH Module
ETH Module
ETH Module
RJ-45RJ-45RJ-45RJ-45
CLK
CLK
CLK
Backplane
1 x GE
1 x GE
1 x GE
In the Receive DirectionAfter the EM4C board receives FE/GE services through the SFP or electrical interfaces, theEthernet processing module performs encoding, decoding, and serial/parallel conversion of theservice data, extracts synchronous Ethernet clock signals, and transmits the service data to thelogic module. Then the service logic in the logic module buffers and schedules the service data,processes synchronous Ethernet clock signals and IEEE 1588v2 packets, and transmits theprocessed data to the active and standby system control boards.
In the Transmit DirectionAfter the EM4C board receives the service data from the active system control board, the servicelogic in the logic module identifies the target interfaces of the service data, buffers and schedulesthe service data, processes synchronous Ethernet clock signals and IEEE 1588v2 packets, andtransmits the processed data to the Ethernet processing module. Then the Ethernet processingmodule performs encoding, decoding, and serial/parallel conversion of the service data, deliverssynchronous Ethernet clock signals downstream, and transmits the processed data through thepre-determined SFP or electrical interfaces on the board.
ETH ModuleThe Ethernet processing module performs the following functions:
l Processes information on physical interfaces.l Performs encoding, decoding, and serial/parallel conversion of service data.l Extracts synchronous Ethernet clock signals.
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Logic Module
The logic module includes a service logic and a control logic.
l The service logic performs the following functions:
– Buffers and schedules service data.
– Identifies the target interfaces of the service data.
– Exchanges service data with the active and standby system control boards using thedual-fed and selective receiving function.
– Supports synchronous Ethernet and IEEE 1588v2.
l The control logic works with the system control boards to manage and control each moduleon the board.
Clock Module
The clock module provides the working clock for each module on the board.
Power Module
The power module provides a DC voltage for each module on the board.
8.8.4 Technical Specifications and Standards ComplianceTechnical specifications of the AND1EM4C (EM4C for short) board include interfacespecifications and physical specifications.
Interface Specificationsl For the specifications of FE/GE electrical interfaces, see Table 8-41.
l For information about the swappable FE/GE optical modules supported at FE/GE (SFP)interfaces, see Table 8-42 and Table 8-43. The interface specifications depend on theoptical/electrical modules on the board. For details on the specifications of optical/electricalmodules, see 9 Swappable Optical/Electrical Modules.
Table 8-41 Specifications of the FE/GE electrical interface
Item Specification Requirement
Interface rate 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s.
RJ-45 electrical interfacespecification
Complies with IEEE 802.3 and enterpriseregulations.
Table 8-42 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectional
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Code Optical Module Information Remarks
S4015715 CommercialeSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
Table 8-43 Information about GE optical modules
Code Optical Module Information Remarks
34060286 eSFP, 850 nm, LC, Multi-mode, 0.5 km Two-fiberbidirectionalCommercial
34060473 eSFP, 1310 nm, LC, Single-mode, 10 km
S4016954 eSFP, 1310 nm, LC, Single-mode, 40 km
34060360 eSFP, 1550 nm, LC, Single-mode, 80 km
34060483 eSFP, 1471nm, LC, Single-mode, 80 km Two-fiberbidirectionalCWDMCommercial
34060481 eSFP, 1491nm, LC, Single-mode, 80 km
34060479 eSFP, 1511nm, LC, Single-mode, 80 km
34060482 eSFP, 1521nm, LC, Single-mode, 80 km
34060478 eSFP, 1551nm, LC, Single-mode, 80 km
34060476 eSFP, 1571nm, LC, Single-mode, 80 km
34060477 eSFP, 1591nm, LC, Single-mode, 80 km
34060480 eSFP, 1611nm, LC, Single-mode, 80 km
34060475 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060470 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km
34060539 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km
34060540 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km
34060595 eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km
34060596 eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km
Physical SpecificationsDimensions (mm): 20.32 (H) x 193.80 (W) x 225.75 (D)
Weight (kg): 0.46
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Power consumption under room temperature (W): 9.4
8.9 AND1EM8F - 8 Channels GE/FE Optical Interface BoardThe AND1EM8F (EM8F for short) is an eight channels FE/GE optical interface board. Thefunction version of the EM8F is AND1. The AND1EM8F is housed in any of slots 1 to 2.
8.9.1 Front PanelOn the front panel of the AND1EM8F, there are indicators and interfaces.
Appearance of the Front PanelFigure 8-26 shows the appearance of the front panel of the AND1EM8F.
Figure 8-26 Front panel of the AND1EM8F
IndicatorThe following indicators are present on the front panel of the AND1EM8F:
l STAT indicator, red, green, or orange, which indicates the working statusl L/A0 to L/A7 indicators, green or orange, which indicate the port connection status and
data transmit/receive status
For details on meanings of indicators, see 12.1 Indicators.
InterfaceEight SFP interfaces are present on the EM8F. Table 8-44 lists the types and usage of theinterfaces on the EM8F.
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Table 8-44 Types and usage of the interfaces on the AND1EM8F
Interface on the FrontPanel
InterfaceType
Usage CorrespondingCableFiber
Opticalinterface
IN0 to IN7 LC When a two-fiber bidirectionaloptical module is used, thisinterface is used as an inputinterface for the GE optical signal.When a single-fiber bidirectionaloptical module is used, thisinterface is not used.
Refer to10.6OpticalFibers.
OUT0 toOUT7
LC When a two-fiber bidirectionaloptical module is used, thisinterface is used as an outputinterface for the GE/FE opticalsignal.When a single-fiber bidirectionaloptical module is used, thisinterface is used as an input/outputinterface for the GE/FE opticalsignal.
Electricalmodule
OUT0 IN0,OUT7 IN7
RJ-45 Input/Output interfaces for GEelectrical signals
For details,see 10.5.1EthernetCables.
NOTEThe GE SFP interface on the front panel can function as either an optical interface or an electrical interface.
When the SFP interface functions as an optical interface, it needs to be used with an optical module; whenthe SFP interface functions as an electrical interface, it needs to be used with an electrical module.
8.9.2 Functions and FeaturesThe AND1EM8F mainly accesses 8 x FE/GE optical signals, and processes the services withthe AND1CXPA/AND1CXPB.
Table 8-45 lists the functions and features of the AND1CXPA/AND1EM8F.
Table 8-45 Functions and features of the AND1EM8F
Function and Feature Description
Basic function Supports eight FE/GE interfaces (SFP).
Supports the hot swappable function.
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Function and Feature Description
Detects the temperature and voltage of the board.
Interface function Supports FE optical modules, FE electrical modules, GEoptical modules and GE electrical modules.
Supports inloops and outloops.
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization (synchronousEthernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
NOTEIf the SFP interface houses an electrical module, the interface does not support synchronous Ethernet orIEEE 1588v2.
8.9.3 Working Principle and Signal FlowThe AND1EM8F mainly consists of the service access module, service processing module,management module, clock module, and power supply module.
Figure 8-27 shows the block diagram for the functions of the AND1EM8F.
Figure 8-27 Block diagram for the functions of the AND1EM8F
CXPService access
module
Clock module
Service processing
module
Management module
8 x FE/GE optical signals Service signals
Management bus
-48V/-60V
-48V/-60V
3.0V
1.8V
Power supply module
Back plane
Clock signals
CXP
CXP
2.5VEach module on the board
3.3V
1.2V
Service signals
Management bus
Management bus
Clock signals
System power supply
System power supply
Transmit DirectionThe service packets from AND1CXPA/AND1CXPB are sent to the service processing modulethrough the backplane-side interface of the EM8F. The service processing module identifies thedestination interfaces for the packets, and buffers and schedules the packets. Then, the service
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processing module sends the processed packets to the service access module, where coding/decoding, serial/parallel conversion, and E/O conversion are performed. Finally, the serviceaccess module outputs the packets through the GE/FE interfaces on the front panel.
Receive Direction
The GE/FE interfaces on the front panel receive GE/FE service signals. Then, the service accessmodule performs O/E conversion, serial/parallel conversion, and coding/decoding on theservices, and then sends the services to the service processing module. The service processingmodule buffers the service packets, schedules the packets, and finally outputs the packets throughthe backplane-side interface.
Service Access Module
This module performs the following functions:
l In the receive direction, this module receives the GE/FE services from the interfaces on thefront panel, performs O/E conversion, serial/parallel conversion, and coding/decoding, andthen sends the services to the service processing module.
l In the transmit direction, this module receives the service packets from the serviceprocessing module, performs coding/decoding, serial/parallel conversion, and E/Oconversion on the packets, and then outputs the packets through the GE/FE interfaces onthe front panel.
l This module extracts the synchronous Ethernet clock.
Service Processing Module
This module performs the following functions:
l In the receive direction, this module receives and buffers the service packets from theservice access module. Then, this module schedules packets from different interfaces.Finally, this module outputs the packets through the backplane-side interface.
l In the transmit direction, this module receives service packets from the AND1CXPA/AND1CXPB, identifies the destination interfaces of the packets, and buffers and schedulesthe packets. Finally, this module outputs the packets to the service access module.
l This module extracts and inserts IEEE 1588 V2 packets.
Management Module
This module is used with the AND1CXPA/AND1CXPB to manage and control each module onthe EM8F.
Clock Module
This module performs the following functions:
l Provides the working clock for each module on the EM8F.
l Supports the synchronous Ethernet and SSM protocols.
l Supports the IEEE 1588 V2 protocol.
l Supports the 1588 ACR clock.
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Power Supply Module
This module provides the DC power of the following specifications to each module on the EM8F.
l 3.3 V
l 3.0 V
l 2.5 V
l 1.8 V
l 1.2 V
8.9.4 Technical SpecificationsTechnical specifications of the AND1EM8F board include interface specifications and physicalspecifications.
Interface Specifications
For information about the swappable FE/GE optical/electrical modules supported at SFPinterfaces on the AND1EM8F board, see Table 8-46, Table 8-47, Table 8-48, and Table8-49. The interface specifications depend on the optical/electrical modules on the board. Fordetails on the specifications of optical/electrical modules, see 9 Swappable Optical/ElectricalModules.
Table 8-46 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectionalCommercial
S4015715 eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
Table 8-47 Information about GE optical modules
Code Optical Module Information Remarks
34060286 eSFP, 850 nm, LC, Multi-mode, 0.5 km Two-fiberbidirectionalCommercial
34060473 eSFP, 1310 nm, LC, Single-mode, 10 km
S4016954 eSFP, 1310 nm, LC, Single-mode, 40 km
34060360 eSFP, 1550 nm, LC, Single-mode, 80 km
34060483 eSFP, 1471nm, LC, Single-mode, 80 km Two-fiberbidirectional
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Code Optical Module Information Remarks
34060481 CWDMCommercial
eSFP, 1491nm, LC, Single-mode, 80 km
34060479 eSFP, 1511nm, LC, Single-mode, 80 km
34060482 eSFP, 1521nm, LC, Single-mode, 80 km
34060478 eSFP, 1551nm, LC, Single-mode, 80 km
34060476 eSFP, 1571nm, LC, Single-mode, 80 km
34060477 eSFP, 1591nm, LC, Single-mode, 80 km
34060480 eSFP, 1611nm, LC, Single-mode, 80 km
34060475 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060470 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 10 km
34060539 eSFP, Tx 1310 nm/Rx 1490 nm, LC, Single-mode, 40 km
34060540 eSFP, Tx 1490 nm/Rx 1310 nm, LC, Single-mode, 40 km
34060595 eSFP, Tx 1570 nm/Rx 1490 nm, LC, Single-mode, 80 km
34060596 eSFP, Tx 1490 nm/Rx 1570 nm, LC, Single-mode, 80 km
Table 8-48 Information about FE Electrical Module
Code Electrical Module Information
34100101 100BASE-T, RJ45, SFP Electrical Module, 100 m
Table 8-49 Information about GE Electrical Module
Code Electrical Module Information
34100080 1000BASE-T, RJ45, SFP Electrical Module, 100 m
34100052 1000BASE-T, RJ45, SFP Electrical Module, Auto Negotiate, 100 m
Physical SpecificationsBoard dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W)
Weight (kg): 0.46
Power consumption (W, room temperature): 18.7
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8.10 AND1EX1 - 1 Channel 10 GE Optical Interface BoardThe AND1EX1 (EX1 for short) is a one channel 10 GE optical interface board. The functionversion of the EX1 is AND1. The AND1EX1 is housed in any of slots 5 to 6 (when workingwith the AND1CXPA), in any of slots 3 to 6 (when working with the AND1CXPB), and in anyof slots 1 to 6 (when working with the AND2CXPA/AND2CXPB/AND2CXPE).
8.10.1 Front PanelOn the front panel of the AND1EX1, there are indicators and an interface.
Appearance of the Front PanelFigure 8-28 shows the appearance of the front panel of the AND1EX1.
Figure 8-28 Front panel of the AND1EX1
IndicatorThe following indicators are present on the front panel of the AND1EX1:
l STAT indicator, red, green, or orange, which indicates the working statusl L/A indicators, green or orange, which indicate the port connection status and data transmit/
receive status
For details on meanings of indicators, see 12.1 Indicators.
InterfaceOne SFP interface is present on the AND1EX1. Table 8-50 lists the types and usage of theinterfaces on the AND1EX1.
Table 8-50 Types and usage of the interfaces on the AND1EX1
Interface on the FrontPanel
InterfaceType
Usage CorrespondingFiber
Opticalinterface
IN LC Input interface for the 10GEoptical signal
Refer to10.6OpticalFibers.OUT LC Output interface for the 10GE
optical signal
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8.10.2 Functions and FeaturesThe AND1EX1 mainly accesses one channel of 10 GE signal, and processes the services withthe control board.
Table 8-51 lists the functions and features of the AND1EX1.
Table 8-51 Functions and features of the AND1EX1
Function and Feature Description
Basic function Supports one 10GE interfaces (XFP).
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Supports 10GE optical modules.
Supports inloops and outloops.
Supports the traffic control function.
Supports Layer 2 and Layer 3 working modes.
Clock Supports physical-layer clock synchronization(synchronous Ethernet).
Supports IEEE 1588v2 and IEEE 1588 ACR.
8.10.3 Working Principle and Signal FlowAND1EX1 mainly consists of the service access module, service processing module,management module, clock module, and power supply module
Figure 8-29 shows the block diagram for the functions of the AND1EX1.
Figure 8-29 Block diagram for the functions of the AND1EX1
CXPService access
module
Clock module
Service processing
module
Management module
1 x 10GE signal Service signals
Management bus
-48V/-60V
-48V/-60V1.8V
Power supply module
Back plane
Clock signals
CXP
CXP
3.3VEach module on the board
5.0V
1.2V
Service signals
Management bus
Management bus
Clock signals
System power supply
System power supply
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Transmit DirectionThe service packets from AND1CXPA/AND1CXPB are sent to the service processing modulethrough the backplane-side interface of the EX1. The service processing module buffers andschedules the packets. Then, the service processing module sends the processed packets to theservice access module, where coding/decoding, and serial/parallel conversion are performed.Finally, the service access module outputs the packets through the 10 GE interface on the frontpanel.
Receive DirectionThe 10 GE interface on the front panel receives 10 GE service signals. Then, the service accessmodule performs serial/parallel conversion, and coding/decoding on the services, and then sendsthe services to the service processing module. The service processing module buffers andschedules the service packets, and finally outputs the packets through the backplane-sideinterface.
Service Access ModuleThis module performs the following functions:
l In the receive direction, this module receives the 10 GE services from the interfaces on thefront panel, performs serial/parallel conversion, and coding/decoding, and then sends theservices to the service processing module.
l In the transmit direction, this module receives the service packets from the serviceprocessing module, performs coding/decoding, and serial/parallel conversion on thepackets, and then outputs the packets through the 10 GE interfaces on the front panel.
l This module extracts the synchronous Ethernet clock.
Service Processing ModuleThis module performs the following functions:
l In the receive direction, this module receives and buffers the service packets from theinterface conversion module. Then, this module schedules packets based on the accesscapability of the EX1 and the access bandwidth settings at the interface. Finally, this moduleoutputs the packets through the backplane-side interface.
l In the transmit direction, this module receives service packets from the AND1CXPA/AND1CXPB, buffers and schedules the packets. Finally, this module outputs the packetsto the service access module.
l This module extracts and inserts IEEE 1588 V2 packets.
Management ModuleThis module is used with the AND1CXPA/AND1CXPB to manage and control each module onthe EX1.
Clock ModuleThis module performs the following functions:
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l Provides the working clock for each module on the EX1.
l Supports the synchronous Ethernet and SSM protocols.
l Supports the IEEE 1588 V2 protocol.
l Supports the 1588 ACR clock.
Power Supply Module
This module provides the DC power of the following specifications to each module on the EX1.
l 5.0 V
l 3.3 V
l 1.8 V
l 1.2 V
8.10.4 Technical SpecificationsTechnical specifications of the AND1EX1 board include interface specifications and physicalspecifications.
Interface Specifications
For information about the swappable optical modules supported at XFP interfaces on theAND1EX1 board, see Table 8-52. The interface specifications depend on the optical moduleson the board. For details on the specifications of optical modules, see 9 Swappable Optical/Electrical Modules.
Table 8-52 Information about 10GE optical modules
Code Optical Module Information Remarks
S4015772 XFP, 1310 nm, LC, Singlemode, 10 km Two-fiberbidirectionalCommercial
S4015776 XFP, 1550 nm, LC, Singlemode, 40 km
S4015794 XFP, 1550 nm, LC, Singlemode, 80 km
34060547 XFP, 1471 nm, LC, Singlemode, 70 km Two-fiberbidirectionalCWDMCommercial
34060548 XFP, 1491 nm, LC, Singlemode, 70 km
34060549 XFP, 1511 nm, LC, Singlemode, 70 km
34060550 XFP, 1531 nm, LC, Singlemode, 70 km
34060551 XFP, 1551 nm, LC, Singlemode, 70 km
34060552 XFP, 1571 nm, LC, Singlemode, 70 km
34060553 XFP, 1591 nm, LC, Singlemode, 70 km
34060554 XFP, 1611 nm, LC, Singlemode, 70 km
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Code Optical Module Information Remarks
34060568 TXFP, 1529.163 nm to 1560.606 nm (wavelength tunable),LC, Singlemode, 40 km
Two-fiberbidirectionalDWDMCommercial
34060532 XFP, 1529.55 nm, LC, Singlemode, 80 km
34060515 XFP, 1530.33 nm, LC, Singlemode, 80 km
34060504 XFP, 1531.12 nm, LC, Singlemode, 80 km
34060503 XFP, 1531.90 nm, LC, Singlemode, 80 km
34060534 XFP, 1532.68 nm, LC, Singlemode, 80 km
34060628 XFP, 1533.47 nm, LC, Singlemode, 80 km
34060627 XFP, 1534.25 nm, LC, Singlemode, 80 km
34060626 XFP, 1535.04 nm, LC, Singlemode, 80 km
34060531 XFP, 1548.51 nm, LC, Singlemode, 80 km
34060514 XFP, 1549.32 nm, LC, Singlemode, 80 km
34060502 XFP, 1550.12 nm, LC, Singlemode, 80 km
34060501 XFP, 1550.92 nm, LC, Singlemode, 80 km
34060533 XFP, 1551.72 nm, LC, Singlemode, 80 km
34060625 XFP, 1552.52 nm, LC, Singlemode, 80 km
34060624 XFP, 1553.33 nm, LC, Singlemode, 80 km
34060623 XFP, 1554.13 nm, LC, Singlemode, 80 km
Physical SpecificationsBoard dimensions (mm): 22.86 (H) x 225.75 (D) x 193.80 (W)
Weight (kg): 0.42
Power consumption (W, room temperature): 13.1
8.11 AND2CQ1B - 4 Channels Channelized OC-3c/STM-1cPOS Optical Interface Board
This section describes the AND2CQ1B, a 4 channels channelized OC-3c/STM-1c POS opticalinterface board, in terms of the overview, functions, features, working principle, front panel, andtechnical specifications.
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8.11.1 Front PanelOn the front panel of the AND2CQ1B board, there are indicators and interfaces.
Appearance of the Front Panel
Figure 8-30 shows the front panel of the AND2CQ1B board.
Figure 8-30 Front panel of the AND2CQ1B board
Indicator
The following indicators are present on the front panel of the AND2CQ1B board:
l STAT indicator, red, green, or orange, which indicates the working status
l LOS1 to LOS4 indicators, red or green, which indicate the port status
For details on meanings of the indicators, see 12.1 Indicators.
Interfaces
Four SFP interfaces are present on the front panel of the AND2CQ1B board. Table 8-53 liststhe types and usage of the interfaces. For details on fiber connections to these interfaces, see10.6 Optical Fibers.
Table 8-53 Types and usage of the interfaces on the AND2CQ1B board
Interface on the FrontPanel
Interface Type Usage
IN0 to IN1 LC Input interface for STM-1(VC12) optical signals
OUT0 to OUT1 LC Output interface for STM-1(VC12) optical signals
NOTEThe SFP interface should be used with an optical module.
l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left andright sides of the optical module. Each interface uses one fiber, which is used to transmit or receiveservice signals.
l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the leftside of the optical module. This optical interface uses only one fiber, which is used to transmit andreceive service signals at the same time.
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8.11.2 Functions and FeaturesWhen working with the main control board, the AND2CQ1B board receives and processes 4channels STM-1(VC12) signals.
Table 8-54 lists the functions and features of the AND2CQ1B.
Table 8-54 Functions and features of the AND2CQ1B
Function andFeature
Remarks
Basic function Provides four channelized STM-1 optical interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
CPOS interfacefunction
The CPOS interface supports FE optical modules.
The CPOS interface supports inloops and outloops.
The E1 channel supports the PRBS test.
The E1 channel supports inloops and outloops.
The E1 channel supports the master/slave clock modes.
The E1 channel supports the serial interface in the E1 and CE1 modes.
The serial interface supports the ATM, TDM, and PPP protocols.
CPOS-Trunkinterface
Number of CPOS-Trunkmember interfaces
2
The E1 channel supports the serial interface in the E1 and CE1 modes.
The Trunk-serial interface supports the TDM and PPP protocols.
Supports the APS protocol. 1+1 unidirectional protection
ATM Number of supported ATME1 services
252
Number of supported IMAgroups
128
Maximum number of E1links supported by eachIMA group
32
Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N≤32) or 1-to-1 format.
Supports the ATM bundle function.
Number of supportedPVCs/PVPs
1024
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Function andFeature
Remarks
Number of supported localATM CCCs
128
Number of supportedremote ATM PWE3s
256
TDM Supports CES services in CESoPSN and SAToP modes.
Number of supported localTDM CCCs
126
Number of supportedremote TDM PWE3s
252
PPP Number of supported PPPlinks
252
Number of supported ML-PPP groups
64
Maximum number of linkssupported by each ML-PPPgroup
16
Number of supported globalMP groups
64
Maximum number of linkssupported by each globalMP group
16
8.11.3 Working Principle and Signal FlowThe AND2CQ1B board consists of an SDH processing module, a logic processing module, adata processing module, a management module, a clock module, and a power supply module.
Figure 8-31 shows the functional block diagram of the AND2CQ1B board.
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Figure 8-31 Functional block diagram of the AND2CQ1B board
Clock module
Power supply module
-48 V/-60 V
-48 V/-60 V
Service signals
PIU
PIU
CXP
CXP A
System clock signals
Backplane
CXP BService signals
Logic processing module
SDH processing
module
Data processing module
Management module
Management bus
Management bus
4 xSTM-1(VC12)signals Service signal
Service signal
Management bus Management bus
CXP
3.3 V
1.2 V
0.75 V
3.0 V2.5 V1.5V
1.0 V
Upstream Direction
In the receive direction, the SDH processing module accesses 4 x channelized STM-1 servicesthrough the interface on the front panel. This module decapsulates the VC-12 timeslots from theSTM-1 signals, recovers the E1 signals, processes the overhead bytes, pointers, and alarmsignals, and sends the processed signals to the logic processing module. Then, the logicprocessing module rearranges the E1 frames, processes the rearranged signals, and sends thesignals to the data processing module for PWE3 encapsulation and PW scheduling. Finally, thesignals are sent to the main control board through the interface on the backplane.
Transmit Direction
In the transmit direction, the data processing module receives the signals from the the maincontrol board, identifies the signals, performs the PWE3 decapsulation, and then sends thesignals to the logic processing module. The logic processing module processes various signals,schedules queues, and sends the processed signals to the SDH processing module. The SDHprocessing module maps the E1 signals to the VC-12 timeslots, multiplexes the VC-12 timeslotsto the STM-1 signals, adds the overhead bytes and pointers, processes the alarm signals, andsends out the STM-1 signals through the interface on the front panel.
SDH Processing Module
This module performs the following functions:
l In the receive direction, this module recovers clock or data from the received 4 channelsSTM-1(VC12) signals, align frames, descrambles signals, processes SOHs, adjustspointers, processes POHs. Then it sends the signals to the logic processing module over abus for further processing.
l In the transmit direction, this module receives service signals from the logic processingmodule, reframes VC-3 or VC-4 signals, adds overheads and pointers, processes alarms,
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and sends 4 channels STM-1(VC12) signals to other boards through the interfaces on thefront panel.
l This module performs LMSP protection switching to protect services against failures.l This module extracts and recovers the line clock.
logic Processing ModuleThis module performs the following functions:
l In the receive direction, this module receives the signals from the SDH processing module,rearranges the frames of the E1 signals, performs processing and suppression of timeslotsof the CES services. Then, the processed signals are sent to the data processing module.
l In the transmit direction, this module receives the signals from the data processing module,and sends the processed signals to the SDH processing module.
Data Processing ModuleThis module performs the following functions.
l In the receive direction, this module obtains PW information about the service, encapsulatessignals in PWE3, schedules PWs, and sends the signals to main control board through thebackplane-side interfaces.
l In the transmit direction, this module receives service signals from main control board,determines the service signal type, decapsulates PWE3 signals, and schedules the signals.
Management ModuleThis module works with main control board to manage and control other modules on the board.
Clock ModuleThis module performs the following functions:
l Processes the line clock.l Receives the system clock from main control board and provides the working clock for
each module on the board.l Supports the synchronization status message (SSM) protocol.
Power Supply ModuleThis module provides required voltages for other modules on the board.
l 3.3 Vl 3.0 Vl 2.5 Vl 1.5 Vl 1.2 Vl 1.0 Vl 0.75 V
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8.11.4 Technical SpecificationsThe technical specifications of the AND1CQ1B board cover interface specifications, boarddimensions, weight, and power consumption.
Interface Specifications
For information about the swappable optical modules supported by SFP interfaces on theAND2CQ1B board, see Table 8-55. The interface specifications depend on the optical moduleson the board. For details on the optical modules, see 9 Swappable Optical/ElectricalModules.
Table 8-55 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectionalCommercial
S4015715 eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
Other Specifications
Board dimensions (mm): 20.32 (H) x 193.80 (W) x 225.75 (D)
Weight (kg): 0.47
Power consumption (W): 11.50
8.12 AND2PQ1: 4 Channels OC-3/STM-1 POS OpticalInterface Board
The AND2PQ1 (PQ1 for short) board is a 4 x OC-3/STM-1 POS optical interface board and itsfunctional version is AND2. It is configured in any of slots 1 to 6 in a chassis.
8.12.1 Front PanelOn the front panel of the AND2PQ1 (PQ1 for short) board, there are indicators and four opticalinterfaces.
Appearance
Figure 8-32 shows the appearance of the front panel of the PQ1 board.
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Figure 8-32 Front panel of the PQ1 board
IndicatorsThe following indicators are present on the front panel of the PQ1 board:
l STAT indicator, red, green, or orange, which indicates the working statusl LOS0, LOS1, LOS2, and LOS3, red or green, which indicate the port status
For the descriptions of the indicators, see 12.1 Indicators.
InterfacesThere are four SFP interfaces on the PQ1 board. Table 8-56 describes the types and functionsof the interfaces. For details on the required optical fibers, see 10.6 Optical Fibers.
Table 8-56 Interfaces on the PQ1 board
Interfaces Interface Type Function
IN0 to IN3 LC STM-1 optical signal inputinterfaces
OUT0 to OUT3 LC STM-1 optical signal outputinterfaces
NOTEThe SFP interface should be used with an optical module.
l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left andright sides of the optical module. Each interface uses one fiber, which is used to transmit or receiveservice signals.
l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the leftside of the optical module. This optical interface uses only one fiber, which is used to transmit andreceive service signals at the same time.
8.12.2 Functions and FeaturesThe AND2PQ1 (PQ1 for short) board works with the system control board to transceive andprocess 4 x STM-1 (POS) data services.
Table 8-57 describes the functions and features of the PQ1 board.
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Table 8-57 Functions and features of the PQ1 board
Functions andFeatures
Description
Basic functions Provides four POS optical interfaces.
Supports the hot swappable function.
Supports temperature and voltage detection.
Interfaces Supports FE optical modules.
Supports the Point-to-Point Protocol (PPP).
Supports the master clock mode (unconfigurable).
Supports inloops and outloops.
8.12.3 Working Principle and Signal FlowThe AND2PQ1 (PQ1 for short) board consists of interfaces, an SDH processing module, a logicmodule, a data processing module, a clock module, and a power module.
Figure 8-33 illustrates the working principle of the PQ1 board.
Figure 8-33 Working principle of the PQ1 board
Logic Module
Control
CXP
CXP
SFP
SFP
SFP
SFP
AND2PQ1
Service logic
Control logic
Clock Module
Power Module
SDH Module
PIU-48V/-60V PIU
-48V/-60V
STM-1
STM-1
STM-1
STM-1
Data Module
1 x GE4 x VC4
Backplane
4 x VC4
Signal selection
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In the Receive DirectionThe SDH processing module receives 4 x channelized STM-1 services through the interface onthe front panel, processes STM-1 section and channel overheads, pointers, and alarms, andtransmits the scrambled signals to the logic module. The service logic of the logic moduletransparently transmits VC-4 services. Then the data processing module encapsulates the servicesignals into frames and transmits the frames to the active and standby system control boardsthrough GE channels.
In the Transmit DirectionThe PQ1 board receives service data from the active system control board, decapsulates theservice data, and transmits the processed data to the logic module. The service logic of the logicmodule transparently transmits VC-4 services. Then the SDH processing module encapsulatesthe service signals into STM-1 signals, adds overheads and pointers to the signals, processesalarms, and transmits the STM-1 signals through the interfaces on the front panel.
SDH Processing ModuleThe SDH processing module processes STM-1 section and channel overheads, pointers, andalarms.
Logic ModuleThe service logic of the logic module transparently transmits VC-4 services.
The control logic works with the system control boards to manage and control each module onthe board.
Data Processing ModuleThe data processing module performs the following functions.
l Encapsulates and decapsulates VC-4 service signals.l Dually transmits and selectively receives data from/to the active and standby system control
boards.
Clock ModuleThe clock module provides the working clock for each module on the board.
Power ModuleThe power module provides a DC voltage for each module on the board.
8.12.4 Technical Specifications and Standards ComplianceTechnical specifications of the AND2PQ1 (PQ1 for short) board include interface specifications,board dimensions, weight, and power consumption.
Interface SpecificationsFor information about the swappable optical modules supported at SFP interfaces on theAND2PQ1 board, see Table 8-58. The interface specifications depend on the optical modules
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on the board. For details on the specifications of optical modules, see 9 Swappable Optical/Electrical Modules.
Table 8-58 Information about FE optical modules
Code Optical Module Information Remarks
S4015755 eSFP, 1310 nm, STM-1, LC, Single-mode, 15 km Two-fiberbidirectionalCommercial
S4015715 eSFP, 1310 nm, STM-1, LC, Single-mode, 40 km
34060282 eSFP, 1550 nm, STM-1, LC, Single-mode, 80 km
34060363 eSFP, Tx 1310 nm/Rx 1550 nm, LC, Single-mode, 10 km Single-fiberbidirectionalCommercial
34060364 eSFP, Tx 1550 nm/Rx 1310 nm, LC, Single-mode, 10 km
Other SpecificationsDimensions (mm): 20.32 (H) x 193.80 (W) x 225.75 (D)
Weight (kg): 0.47
Power consumption (W): 11.50
8.13 AND1ML1/AND1ML1A - 16 Channels E1 ElectricalInterface Board
The functional version of the AND1ML1/AND1ML1A is AND1..
NOTE
The AND1ML1 and AND1ML1A have the same functions and features except for the matched impedance(AND1ML1: 75 ohms E1; AND1ML1A: 120 ohms E1).
8.13.1 Front PanelOn the front panel of the AND1ML1/AND1ML1A, there are indicators and interfaces.
Appearance of the Front PanelFigure 8-34 shows the appearance of the front panel of the AND1ML1.
Figure 8-34 Front panel of the AND1ML1
Figure 8-35 shows the appearance of the front panel of the AND1ML1A.
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Figure 8-35 Front panel of the AND1ML1A
Indicators
The following indicators are present on the front panel of the AND1ML1/AND1ML1A:
l STAT indicator, red, green, or orange, which indicates the working status
For details on meanings of indicators, see 12.1 Indicators.
Interfaces
There is one Anea 96 interface on the front panel of the AND1ML1/AND1ML1A. Table8-59 lists the type and usage of the interface. For cables corresponding to the interfaces, see10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables.
Table 8-59 Type and usage of the interface on the front panel of the ML1
Interfaceon theFrontPanel
InterfaceType
Usage
AND1ML1 AND1ML1A
1 - 16 Anea 96 75-ohm interface, which is used totransmit or receive the first tosixteenth channels of E1 services.
120-ohm interface, which isused to transmit or receive thefirst to sixteenth channels ofE1 services.
Table 8-60 lists the pins of the Anea 96 interface.
Table 8-60 Pins of the Anea 96 interface
Front View Connector Pin Usage Connector Pin Usage
1 R x 0 25 T x 0
2 26
3 R x 1 27 T x 1
4 28
5 R x 2 29 T x 2
6 30
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Front View Connector Pin Usage Connector Pin Usage
7 R x 3 31 T x 3
8 32
9 R x 4 33 T x 4
10 34
11 R x 5 35 T x 5
12 36
13 R x 6 37 T x 6
14 38
15 R x 7 39 T x 7
16 40
17 R x 8 41 T x 8
18 42
19 R x 9 43 T x 9
20 44
21 R x 10 45 T x 10
22 46
23 R x 11 47 T x 11
24 48
49 R x 12 73 T x 12
50 74
51 R x 13 75 T x 13
52 76
53 R x 14 77 T x 14
54 78
55 R x 15 79 T x 15
56 80
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8.13.2 Functions and FeaturesThe AND1ML1 is a 75-ohm E1 board and the AND1ML1A is a 120-ohm E1 board. TheAND1ML1/ML1A can access a maximum of 16 x E1 signals, supports flexible configurationof different services on each port, and is hot swappable.
Table 8-61 lists functions and features of the AND1ML1/AND1ML1A.
Table 8-61 Functions and features of the AND1ML1/AND1ML1A
Function and Feature Remarks
Basic function Provides 16 E1 interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Impedance supported by theinterface
AND1ML1: 75 ohm
AND1ML1A: 120 ohm
Supports the E1 and CE1 modes.
Supports the master clock mode (unconfigurable).
Supports the HDB3 line coding (unconfigurable).
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
ATM Number of supported ATME1 services
16
Number of supported IMAgroups
16
Maximum number of E1links in each IMA group
16
Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N≤32) or 1-to-1 format.
Supports the ATM bundle function.
Number of supported PVCs/PVPs
256
Number of supported localATM CCCs
32
Number of supported remoteATM PWE3s
64
TDM Supports CES services in CESoPSN and SAToP modes.
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Function and Feature Remarks
Supports the timeslot compression function. For services inCESoPSN mode, a minimum of 2 timeslots can be bundledduring serial port configuration.
Supports the fractional E1. Different timeslots of an E1 canbe bound to different CES PWs.
Number of supported localTDM CCCs
8
Number of supported remoteTDM PWE3s
16
PPP Number of supported PPPlinks
16
Number of supported ML-PPP groups
8
Maximum number of linkssupported by each ML-PPPgroup
16
Clock Supports physical-layer clock synchronization.
8.13.3 Working Principle and Signal FlowThe AND1ML1/AND1ML1A mainly consists of the control module, line-side processingmodule, system-side processing module, backplane interface module, clock module, and powersupply module.
Figure 8-36shows the block diagram for the working principle of the AND1ML1/AND1ML1A.
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Figure 8-36 Block diagram for the working principle of the AND1ML1/AND1ML1A
Backplane
Backplane interface module
Management bus
System-side processing module
Service bus
Serial management
bus
-48 V/-60 V
-48 V/-60 V
1.2 V
1.26 V2.5 V
16 x E1 signals Line-side processing
module
3.3 V
Clock signalsClock signals
Power supply module
Clock module
Control module
Management bus
3.3 V
Active CXP
Standby CXP
CXP
CXP
To each module
To each module
Service bus
Service bus
Service bus
In Transmit DirectionThe AND1ML1/AND1ML1A first distributes the signals in Ethernet packets from the backplaneto different protocol processing chips according to the service types. The system-side processingmodule decapsulates the concatenated services and buffers the services in queues. Then, thismodule schedules the egress queues according to the service types, processes and converts theservices, and finally sends the services to the line-side processing module. The line-sideprocessing module performs coding, dejitter, pulse shaping, and line driving for the services,and finally sends the services to E1 interfaces.
In Receive DirectionThe line processing module performs impedance match, signal equalization, signal levelconversion, clock data recovery, dejitter, and decoding for the accessed E1 signals. Then, thesignals are sent into the system-side processing module, which frames the signals, encapsulatesthe IMA, CES, and ML-PPP services in PWE3, and schedules PWs. Finally, this module sendsthe signals in Ethernet packets to the backplane interface module.
Line-Side Processing ModuleIn the receive channel, this module performs impedance match, signal equalization, electricallevel conversion, clock data recovery, dejitter, and decoding to signals. In the transmit channel,this module performs encoding, dejitter, pulse shaping, and line driving to signals.
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System-Side Processing Module
This module frames 16 x E1 signals, runs the CES, IMA, and ML-PPP protocols, and performsPWE3 encapsulation.
Backplane Interface Module
The service bus receives or transmits service signals.
Control Module
This module controls the reading and writing on the chip, resets the chip, and detects faults inthe chip. When used with the control board, this module controls the board.
Clock Module
This module provides various clock signals for the board to operate normally, detects clocks,and selects the line recovery clock.
Power Supply Module
This module converts the -48 V DC/-60 V DC voltage to DC voltages required by each moduleon the board.
8.13.4 SpecificationsThe technical specifications of the AND1ML1/AND1ML1A include the interfacespecifications, dimensions, weight, and power consumption.
Table 8-62 lists the specifications of the interfaces on the AND1ML1/AND1ML1A.
Table 8-62 Specifications of the interfaces on the AND1ML1/AND1ML1A
Item Specification Requirement
Nominal bit rate (kbit/s) 2048
Interface impedance 75 ohms (AND1ML1)120 ohms (AND1ML1A)
Interface code HDB3
Pulse waveform at the outputinterface
Complies with ITU-T G.703
Attenuation tolerance of the inputinterface at the point with afrequency of 1024 kHz (dB)
0 to 6
Anti-interference capability of theinput interface
Complies with ITU-T G.703
Input jitter tolerance Complies with ITU-T G.823
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Item Specification Requirement
Output jitter Complies with ITU-T G.823
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.56(1.23 lb)
Power consumption (W, room temperature): 13.1
8.14 AND3ML1A/AND3ML1B - 16 Channels E1 InterfaceBoard
The AND3ML1A/AND3ML1B (ML1A/ML1B for short) is a 16 channels E1 interface board.The function version of the ML1A/ML1B is AND3. The AND3ML1A/AND3ML1B is housedin slots 1 to 6.
NOTE
The mapping impedance of an interface on the AND3ML1A is 75 ohm, and the mapping impedance of aninterface on the AND3ML1B is 120 ohm. Except the difference of mapping impedance, the functions andfeatures of the AND3ML1A and AND3ML1B are the same.
8.14.1 Front PanelOn the front panel of the AND3ML1A/AND3ML1B, there are indicators and interfaces.
Appearances of the Front Panel
Figure 8-37 and Figure 8-38 show the appearances of the front panel of the AND3ML1A/AND3ML1B.
Figure 8-37 Front panels of the AND3ML1A
Figure 8-38 Front panels of the AND3ML1B
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Indicators
The following indicators are present on the front panel of the AND3ML1A/AND3ML1B:
l STAT indicator, red, green, or orange, which indicates the working status
For details on meanings of indicators, see 12.1 Indicators.
Interfaces
There is one Anea 96 interface on the front panel of the AND3ML1A/AND3ML1B. Table8-63 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables list the cables corresponding to the interfaces.
Table 8-63 Type and usage of the interfaces on the front panel of the AND3ML1A/AND3ML1B
Interfaceon theFrontPanel
InterfaceType
Usage
AND3ML1A AND3ML1B
0 - 15 Anea 96 75-ohm interface, which is usedto transmit or receive the zeroto fifteenth channels of E1services.
120-ohm interface, which isused to transmit or receive thezero to fifteenth channels of E1services.
Table 8-64 lists the pins of the Anea 96 interface.
Table 8-64 Pins of the Anea 96 interface
Front View Connector Pin Usage Connector Pin Usage
1 R x 0 25 T x 0
2 26
3 R x 1 27 T x 1
4 28
5 R x 2 29 T x 2
6 30
7 R x 3 31 T x 3
8 32
9 R x 4 33 T x 4
10 34
11 R x 5 35 T x 5
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Front View Connector Pin Usage Connector Pin Usage
12 36
13 R x 6 37 T x 6
14 38
15 R x 7 39 T x 7
16 40
17 R x 8 41 T x 8
18 42
19 R x 9 43 T x 9
20 44
21 R x 10 45 T x 10
22 46
23 R x 11 47 T x 11
24 48
49 R x 12 73 T x 12
50 74
51 R x 13 75 T x 13
52 76
53 R x 14 77 T x 14
54 78
55 R x 15 79 T x 15
56 80
8.14.2 Functions and FeaturesAND3ML1A is a 75-ohm E1 board and the AND3ML1B is a 120-ohm E1 board. TheAND3ML1A/AND3ML1B must be used with the system control board to access and process16 channels of E1 services. Services at interfaces on the AND3ML1A/AND3ML1B can beflexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported.
Table 8-65 lists the functions and features of the AND3ML1A/AND3ML1B.
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Table 8-65 Functions and features of the AND3ML1A/AND3ML1B
Function and Feature Remarks
Basic function Provides 16 E1 interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Impedance supported by theinterface
AND3ML1A: 75 ohm
AND3ML1B: 120 ohm
Supports the E1 and CE1 modes.
Supports the master/slave clock mode.
Supports the HDB3 line coding (unconfigurable).
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
ATM Number of supported ATME1 services
16
Number of supported IMAgroups
16
Maximum number of E1links in each IMA group
16
Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N≤32) or 1-to-1 format.
Supports the ATM bundle function.
Number of supported PVCs/PVPs
256
Number of supported localATM CCCs
32
Number of supported remoteATM PWE3s
64
TDM Supports CES services in CESoPSN and SAToP modes.
Supports the timeslot compression function. For services inCESoPSN mode, a minimum of 1 timeslots can be bundledduring serial port configuration.
Supports the fractional E1. Different timeslots of an E1 canbe bound to different CES PWs.
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Function and Feature Remarks
Number of supported localTDM CCCs
8
Number of supported remoteTDM PWE3s
16
PPP Number of supported PPPlinks
16
Number of supported ML-PPP groups
8
Maximum number of linkssupported by each ML-PPPgroup
16
Clock Supports physical-layer clock synchronization.
8.14.3 Working Principle and Signal FlowThe AND3ML1A/AND3ML1B mainly consists of the service access module, serviceprocessing module, management module, clock module, and power supply module.
Figure 8-39 shows the functional block diagram of the AND3ML1A/AND3ML1B.
Figure 8-39 Functional block diagram of the AND3ML1A/AND3ML1B
Clock module
Power supply module
Service access module
Management module
16 x E1 Service signal Service processing
module
Service signal
Backplane
3.3V
1V
.
.
.
.
.
.
-48V/-60V
-48V/-60V
Line clocks
Line clocksSystem clocks
Management bus
Management bus
CXP
CXP
CXPCXP
System power supply
System power supply
Transmit DirectionThe service signals from the control board are sent to the service processing module. The serviceprocessing module performs PWE3 decapsulation and PW scheduling for the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performs
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the E1 framing function, and sends the service signals to the service access module. The serviceaccess module performs encoding and line drive for the signals and outputs the signals throughthe backplane-side interfaces.
Receive DirectionThe board accesses service signals through the backplane-side interfaces, and then the signalsare sent to the service access module. The service access module performs interference isolation,lightning-proof, impedance matching, level conversion, signal balancing, decoding, and thensends the processed signals to the service processing module. The service processing moduleperforms E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPPprotocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to thecontrol board through the backplane-side interfaces.
Service Access ModuleThis module performs the following functions:
l In the receive direction, this module isolates common mode interference, protects circuitsagainst transient failures, matches the impedance in the receive direction with the internalimpedance, and performs level conversion, balancing, and decoding for the service signals.Finally, this module sends the processed signals to the service processing module.
l In the transmit direction, this module receives the service signals from the serviceprocessing module, encodes the signals, drives the line, and outputs the service signalsthrough the backplane-side interfaces.
l This module recovers the line clock.
Service Processing ModuleThis module performs the following functions:
l In the receive direction, this module receives the signals from the service access moduleand performs E1 framing. This module also identifies protocol types of the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (forexample, addition and deletion of IMA group members, VP/VC switching andconcatenation of ATM cells, vacant slot compression of CES services, and setup of ML-PPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally,this module converts the processed signals to high-rate signals, and then sends the signalsto the control board through the backplane-side interfaces.
l In the transmit direction, this module receives the high-rate signals from the control boardthrough the backplane-side interfaces and recovers low-rate service signals. Then, thismodule performs PWE3 decapsulation, identifies different protocols and processes theservice signals, and completes E1 framing. Finally, this module sends the processed signalsto the service access module.
Management ModuleThis module manages and controls each module on the board.
Clock ModuleThis module performs the following functions:
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l When used with the control board, processes the recovered line clock.l Provides the working clock for each module on the board.
Power Supply ModuleThis module converts the input DC voltage into various DC voltages required by each moduleon the board.
8.14.4 Technical SpecificationsThe technical specifications of the AND3ML1A/AND3ML1B include the interfacespecifications and physical specifications.
Interface SpecificationsTable 8-66 lists the specifications of the interfaces on the AND3ML1A/AND3ML1B.
Table 8-66 Specifications of the interfaces on the AND3ML1A/AND3ML1B
Item Specification Requirement
Nominal bit rate (kbit/s) 2048
Interface impedance 75 ohm (ML1A)120 ohm (ML1B)
Interface code HDB3
Pulse waveform at the output interface Complies with ITU-T G.703
Attenuation tolerance of the input interface atthe point with a frequency of 1024 kHz (dB)
0 to 6
Anti-interference capability of the inputinterface
Complies with ITU-T G.703
Input jitter tolerance Complies with ITU-T G.823
Output jitter Complies with ITU-T G.823
Physical SpecificationsBoard dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.44(0.97 lb)
Power consumption (W, room temperature): 9.5
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8.15 AND2MD1A/AND2MD1B - 32 Channels E1 InterfaceBoard
The AND2MD1A/AND2MD1B (MD1A/MD1B for short) is a 32 channels E1 interface board.The function version of the MD1A/MD1B is AND2. The AND2MD1A/AND2MD1B is housedin slots 1 to 6.
NOTE
The mapping impedance of an interface on the AND2MD1A is 75 ohm, and the mapping impedance of aninterface on the AND2MD1B is 120 ohm. Except the difference of mapping impedance, the functions andfeatures of the AND2MD1A and AND2MD1B are the same.
8.15.1 Front PanelOn the front panel of the AND2MD1A/AND2MD1B, there are indicators and interfaces.
Appearances of the Front Panel
Figure 8-40 shows the appearances of the front panel of the AND2MD1A/AND2MD1B.
Figure 8-40 Front panels of the AND2MD1A/AND2MD1B
Indicators
The following indicators are present on the front panel of the AND2MD1A/AND2MD1B:
l STAT indicator, red, green, or orange, which indicates the working status
For details on meanings of indicators, see 12.1 Indicators.
Interfaces
There are two Anea 96 interfaces on the front panel of the AND2MD1A/AND2MD1B. Table8-67 lists the type and usage of the interfaces. 10.5.4 75-Ohm 16 x E1 Cables and 10.5.5 120-Ohm 16 x E1 Cables list the cables corresponding to the interfaces.
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Table 8-67 Type and usage of the interfaces on the front panel of the AND2MD1A/AND2MD1B
Interface on theFrontPanel
Interface Type
Usage
AND2MD1A AND2MD1B
0 to 15 Anea 96 75-ohm interface, which is usedto transmit or receive the zero tofifteenth channels of E1services.
120-ohm interface, which is usedto transmit or receive the zero tofifteenth channels of E1 services.
16 to 31 Anea 96 75-ohm interface, which is usedto transmit or receive thesixteenth to thirty-first channelsof E1 services.
120-ohm interface, which is usedto transmit or receive thesixteenth to thirty-first channelsof E1 services.
Table 8-68 lists the pins of the Anea 96 interface.
Table 8-68 Pins of the Anea 96 interface
Front View Connector Pin Usage Connector Pin Usage
1 R x 0 25 T x 0
2 26
3 R x 1 27 T x 1
4 28
5 R x 2 29 T x 2
6 30
7 R x 3 31 T x 3
8 32
9 R x 4 33 T x 4
10 34
11 R x 5 35 T x 5
12 36
13 R x 6 37 T x 6
14 38
15 R x 7 39 T x 7
16 40
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Front View Connector Pin Usage Connector Pin Usage
17 R x 8 41 T x 8
18 42
19 R x 9 43 T x 9
20 44
21 R x 10 45 T x 10
22 46
23 R x 11 47 T x 11
24 48
49 R x 12 73 T x 12
50 74
51 R x 13 75 T x 13
52 76
53 R x 14 77 T x 14
54 78
55 R x 15 79 T x 15
56 80
8.15.2 Functions and FeaturesThe AND2MD1A is a 75-ohm E1 board and the AND2MD1B is a 120-ohm E1 board. TheAND2MD1A/AND2MD1B must be used with the system control board to access and process32 channels of E1 services. Services at interfaces on the AND2MD1A/AND2MD1B can beflexibly configured, and protocols such as ATM E1, IMA, CES, and ML-PPP are supported.
Table 8-69 lists the functions and features of the AND2MD1A/AND2MD1B.
Table 8-69 Functions and features of the AND2MD1A/AND2MD1B
Function and Feature Remarks
Basic function Provides 32 E1 interfaces.
Supports the hot swappable function.
Detects the temperature and voltage of the board.
Interface function Impedance supported by theinterface
AND2MD1A: 75 ohm
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Function and Feature Remarks
AND2MD1B: 120 ohm
Supports the E1 and CE1 modes.
Supports the master/slave clock mode.
Supports the HDB3 line coding (unconfigurable).
Supports inloops and outloops.
Supports the PRBS function in framed or unframed mode ofan E1 interface in the receive/transmit direction.
ATM Number of supported ATME1 services
32
Number of supported IMAgroups
32
Maximum number of E1links in each IMA group
16a
Encapsulates ATM VPC/VCC service to the PWE3 in the N-to-1 (N≤32) or 1-to-1 format.
Supports the ATM bundle function.
Number of supported PVCs/PVPs
512
Number of supported localATM CCCs
64
Number of supported remoteATM PWE3s
128
TDM Supports CES services in CESoPSN and SAToP modes.
Supports the timeslot compression function. For services inCESoPSN mode, a minimum of 1 timeslots can be bundledduring serial port configuration.
Supports fractional E1. Different timeslots of an E1 can bebound to different CES PWs.
Number of supported localTDM CCCs
16
Number of supported remoteTDM PWE3s
32
PPP Number of supported PPPlinks
32
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Function and Feature Remarks
Number of supported ML-PPP groups
16
Maximum number of linkssupported by each ML-PPPgroup
16b
Clock Supports physical-layer clock synchronization.
NOTEa: In the case of the AND2MD1A/AND2MD1B, the links corresponding to the former 16 and latter 16 E1ports cannot be bundled to an IMA group.
b: In the case of the AND2MD1A/AND2MD1B, the links corresponding to the former 16 and latter 16 E1ports cannot be bundled to an ML-PPP group.
8.15.3 Working Principle and Signal FlowThe AND2MD1A/AND2MD1B mainly consists of the service access module, serviceprocessing module, management module, clock module, and power supply module.
Figure 8-41 shows the functional block diagram of the AND2MD1A/AND2MD1B.
Figure 8-41 Functional block diagram of the AND2MD1A/AND2MD1B
Clock module
Power supply module
Service access module
Management module
32 x E1 Service signal Service processing
module
Service signal
Backplane
3.3V
1V
.
.
.
.
.
.
-48V/-60V
-48V/-60V
Line clocks
Line clocksSystem clocks
Management bus
Management bus
CXP
CXP
CXPCXP
System power supply
System power supply
Transmit DirectionThe service signals from the control board are sent to the service processing module. The serviceprocessing module performs PWE3 decapsulation and PW scheduling for the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols, performsthe E1 framing function, and sends the service signals to the service access module. The serviceaccess module performs encoding and line drive for the signals and outputs the signals throughthe backplane-side interfaces.
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Receive Direction
The board accesses service signals through the backplane-side interfaces, and then the signalsare sent to the service access module. The service access module performs interference isolation,lightning-proof, impedance matching, level conversion, signal balancing, decoding, and thensends the processed signals to the service processing module. The service processing moduleperforms E1 framing, processes service signals based on the IMA/ATM, CES, and ML-PPPprotocols, implements PWE3 encapsulation and PW scheduling, and sends the signals to thecontrol board through the backplane-side interfaces.
Service Access Module
This module performs the following functions:
l In the receive direction, this module isolates common mode interference, protects circuitsagainst transient failures, matches the impedance in the receive direction with the internalimpedance, and performs level conversion, balancing, and decoding for the service signals.Finally, this module sends the processed signals to the service processing module.
l In the transmit direction, this module receives the service signals from the serviceprocessing module, encodes the signals, drives the line, and outputs the service signalsthrough the backplane-side interfaces.
l This module recovers the line clock.
Service Processing Module
This module performs the following functions:
l In the receive direction, this module receives the signals from the service access moduleand performs E1 framing. This module also identifies protocol types of the service signals,processes the service signals based on the IMA/ATM, CES, and ML-PPP protocols (forexample, addition and deletion of IMA group members, VP/VC switching andconcatenation of ATM cells, vacant slot compression of CES services, and setup of ML-PPP groups). Then, this module performs PWE3 encapsulation and PW scheduling, Finally,this module converts the processed signals to high-rate signals, and then sends the signalsto the control board through the backplane-side interfaces.
l In the transmit direction, this module receives the high-rate signals from the control boardthrough the backplane-side interfaces and recovers low-rate service signals. Then, thismodule performs PWE3 decapsulation, identifies different protocols and processes theservice signals, and completes E1 framing. Finally, this module sends the processed signalsto the service access module.
Management Module
This module manages and controls each module on the board.
Clock Module
This module performs the following functions:
l When used with the control board, processes the recovered line clock.
l Provides the working clock for each module on the board.
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Power Supply Module
This module converts the input DC voltage into various DC voltages required by each moduleon the board.
8.15.4 Technical SpecificationsThe technical specifications of the include the interface specifications and physicalspecifications.
Interface Specifications
Table 8-70 lists the specifications of the interfaces on the .
Table 8-70 Specifications of the interfaces on the
Item Specification Requirement
Nominal bit rate (kbit/s) 2048
Interface impedance 75 ohm (MD1A)120 ohm (MD1B)
Interface code HDB3
Pulse waveform at the outputinterface
Complies with ITU-T G.703
Attenuation tolerance of the inputinterface at the point with afrequency of 1024 kHz (dB)
0 to 6
Anti-interference capability of theinput interface
Complies with ITU-T G.703
Input jitter tolerance Complies with ITU-T G.823
Output jitter Complies with ITU-T G.823
Physical Specifications
Board dimensions (mm): 20.32 (H) x 225.75 (D) x 193.80 (W)(0.80 in.×8.89 in.×7.63 in.)
Weight (kg): 0.49(1.08 lb)
Power consumption (W, room temperature): 12.1
8.16 TND1PIU - Power Interface BoardThe TND1PIU (PIU for short) is a power interface board. The function version of the PIU isTND1. The PIU is housed in slot 9 or slot 10.
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8.16.1 Front PanelOn the front panel of the PIU, there are indicators, power supply interfaces, and a label.
Appearance of the Front Panel
Figure 8-42 shows the appearance of the front panel of the PIU.
Figure 8-42 Appearance of the front panel of the PIU
Indicators
The following indicator is present on the front panel of the PIU.
PWR, green, which indicates the power supply status. When PWR is on and green, it indicatesthat power is accessed.
For details on indications of indicators, see 12.1 Indicators.
Interfaces
The PIU accesses one power supply. Table 8-71 lists the types of the interfaces on the PIU andtheir respective usage. For cable corresponding to the interfaces, see 10.1 Power Supply Cablesand Ground Cables.
Table 8-71 Types and usage of the interfaces on the PIU
Interface on the FrontPanel
Usage
NEG(-) -48 V power input interface
RTN(+) BGND power input interface
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LabelOperation warning label: indicates the following precautions , which should be taken for removalor insertion of the PIU board.
NOTICEMultiple power supplies are accessed for the equipment. When powering off the equipment,make sure that these power supplies are disabled.Before removing the PIU board, ensure that all power inputs are disconnected from the board.
8.16.2 Functions and FeaturesThe PIU, a power interface board, supports the functions and features such as power access,power protection, surge protection detection, and information reporting.
Table 8-72 lists functions and features of the PIU.
Table 8-72 Functions and features of the PIU
Function and Feature Description
Power access Each of the two PIU accesses one -48 V DC (or -60 V DC) powersupply for the equipment.
Power protection The PIU protects the power supply against overcurrent and shortcircuit. In this way, the overcurrent is prevented from shockingboard and components on it.
Surge protection The PIU protects the equipment against lightning and reports analarm if the protection fails.
Power backup Two PIUs for a hot backup. One PIU is capable of supplying powerfor the entire chassis.
8.16.3 Working Principle and Signal FlowThe PIU mainly consists of the surge protection and failure detection module, communicationunit module, slot ID module, and board in-position module.
Figure 8-43 shows the block diagram for the working principle of the PIU.
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Figure 8-43 Block diagram for the working principle of the PIU
Board in-position module
Communication unit module
Backplane
Inter-board communication busSurge protection and failure
detection module
-48 V/-60 V
Board in-position signals
Slot ID signals
CXP
CXP
CXP
Each board
Surge protection failure alarm signals
Slot ID module
Surge Protection and Failure Detection Module
This module protects the equipment against lightning and detects the failure of the anti-lightningcircuit. If the surge protection fails, the PIU reports the alarm signals to the control board.
Communication Unit Module
This module has the function of reporting the board manufacturing information, PCB versioninformation, and alarm signals about the surge protection failure.
Slot ID Module
This module reports the slot ID information to the control board.
Board In-Position Module
This module reports the board in-position signals to the control board.
8.16.4 SpecificationsThe technical specifications of the PIU cover the board dimensions, weight, power consumption,and input voltage.
Table 8-73 lists the technical specifications of the PIU.
Table 8-73 Technical specifications of the PIU
Item Technical Specification
Board dimensions (mm) 41.4 (H) x 229.9 (D) x 21.0 (W)
Weight (kg) 0.12
Power consumption (W, room temperature) 0.5
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Item Technical Specification
Input voltage (V) -38.4 to -72.0
8.17 AND1FAN - Fan BoardThe AND1FAN (FAN for short) is an FAN board. The function version of the FAN is AND1.The FAN is housed in slot 11.
8.17.1 Front PanelOn the front panel of the FAN, there are indicators, ESD wrist strap jack, handle, and labels.
Appearance of the Front PanelFigure 8-44 shows the appearance of the front panel of the FAN.
Figure 8-44 Appearance of the front panel
IndicatorsThe following indicators are present on the front panel of the FAN:
l FAN indicator, red or green, which indicates status of fans.l CRIT indicator, red, which indicates critical alarms.l MAJ indicator, orange, which indicates major alarms.l MIN indicator, yellow, which indicates minor alarms.
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The CRIT, MAJ, and MIN indicators on the front panel of the FAN indicate the current alarmseverity of the subrack.
For details on indications of indicators, see 12.1 Indicators.
ESD Strap JackThe ESD wrist strap should be connected to this jack for proper grounding of the human body.
HandleThe handle is used for pushing the FAN into or pulling the FAN out of the chassis during boardreplacement.
LabelThe following labels are present on the front panel of the FAN:
l ESD protection label, which indicates that the equipment is static-sensitive.l Fan warning label, which says that do not touch the fan leaves before the fan stops rotating.
8.17.2 Functions and FeaturesThe FAN is used to adjust the fan rotating speed, detect and report status of fans.
The functions and features of the FAN are as follows:
l Accesses two 12 V power supplies for driving six fans.l Provides start-delay for the power supply of the fans, protects fans against overcurrent, and
filters the lower frequency.l Intelligently adjusts the rotating speed of fans to ensure proper heat dissipation of the
system.l Reports information about the fan rotating speed, environment temperature, alarms, version
number, and board in-position information.l Provides alarm indicators.
8.17.3 Working Principle and Signal FlowThe FAN mainly consists of the combiner/start-delay module, filter module, communicationunit module, intelligent fan speed adjustment module, and board in-position module.
Figure 8-45 shows the block diagram for the working principle of the FAN.
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Figure 8-45 Block diagram for the working principle of the AND1FAN
Fans x 6
12 V power shut signals
12 V
Inter-board communication bus
Board in-position module
PWM signals
Communication unit module
CXP
Fan rotating speed signals
Fan in-position signals
12 V
12 V
12 V
Filter module
CXP
CXP
CXP
CXP
CombinerStart-delay
12 V
CXP
Intelligent fan speed adjustment module
PWM driver module
Fan speed reporting module
Combiner/soft-start module
Start-delay/Combiner Module
This module provides start delay to the combined two 12 V power supplies and protecting fansagainst overcurrent.
Filter Module
This module filters the LC low frequency to enhance the EMC feature of the system.
Communication Unit Module
This module reports the board manufacturing information, PCB version, and environmenttemperature information. In addition, this module provides 12 V power shut signals to the start-delay module.
Intelligent Fan Speed Adjustment Module
This module reports information about the fan rotating speed to the control board and adjuststhe fan rotating speed according to the pulse-width modulation (PWM) signals received fromthe control board.
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Board In-Position ModuleThis module reports the board in-position signals to the control board.
8.17.4 SpecificationsThe technical specifications of the FAN cover the board dimensions, weight, powerconsumption, and input voltage.
Table 8-74 lists the technical specifications of the FAN.
Table 8-74 Technical specifications of the FAN
Item Technical Specification
Board dimensions (mm) 86.2 (H) x 217.6 (D) x 28.5 (W)
Weight (kg) 0.302
Power consumption (W) l Low rate: 4.1l Medium rate: 13.6l High rate: 29.6
Working voltage (V) 12 V DC power
8.18 Filler PanelA filler panel is used to cover any vacant slot in a chassis.
8.18.1 Appearance and Valid SlotsThere is no indicator or interface on a filler panel.
AppearanceFigure 8-46 shows the appearance of a filler panel.
Figure 8-46 Appearance of a filler panel
Valid SlotsThe filler panel of a control board can be housed in slot 7 or 8 of a chassis and the filler panelof an interface board can be housed in any of slots 1-6 of a chassis. Table 8-75 provides thedimensions of the filler panel for a control board and dimensions of the filler panel for an interfaceboard.
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Table 8-75 Filler panel dimensions
Type Dimensions (H x W x D)
Filler panel for a control board 22.86 mm x 193.80 mm x 23.5 mm
Filler panel for an interface board 20.32 mm x 193.80 mm x 23.2 mm
8.18.2 Functions and FeaturesA filler panel can be used to perform electromagnetic shielding, keep out foreign substances,and ensure proper ventilation.
Main functions of a filler panel are as follows:
l Performs electromagnetic shielding and ensures that the chassis meets the requirement ofelectromagnetic radiation.
l Prevents foreign substances from getting into the chassis.l Prevents internal voltage from being exposed.l Ensures proper ventilation of cooling current inside the chassis.
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9 Swappable Optical/Electrical Modules
About This Chapter
The ATN device does not provide optical interfaces, whereas the panel provides interfaces forinstalling optical modules. The optical modules receive and transmit optical signals and convertelectrical and optical signals. The interfaces for installing optical modules can also be used forinstalling electrical modules to transmit electrical signals.
9.1 OverviewOptical and electrical modules for ATN devices are hot swappable. Optical modules transmitservices using optical signals over fibers and electrical modules transmit services using electricalsignals over Ethernet cables.
9.2 FE Optical Module
9.3 GE Optical Module
9.4 10GE Optical Module
9.5 Electrical Module
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9.1 OverviewOptical and electrical modules for ATN devices are hot swappable. Optical modules transmitservices using optical signals over fibers and electrical modules transmit services using electricalsignals over Ethernet cables.
ClassificationOptical modules for ATN devices can be classified as follows:
l By service and rate: FE, GE, 10GE optical modulesl By packaging: SFP, eSFP, XFP, TXFP optical modules
– SFP optical modules are used to support FE and GE services. eSFP optical modules areenhanced SFP optical modules. They provide the same functions as SFP modules exceptthat eSFP optical modules are added with the performance reporting function.
– XFP optical modules are used to support 10GE services. TXFP optical modules are onetype of XFP optical modules and support wavelength adjustment.
l By usage scenario: business and industry modules
– If the operating temperature for an ATN device is within the range of -20 °C to +60 °C, business modules apply.
– If the operating temperature for an ATN device is outside the range of -20 °C to +60 °C, industry modules apply.
l By WDM application: colorless and colored optical modules
– Colorless (or gray) optical modules are common optical modules. They supportwavelengths within a specific range.
– Colored optical modules support a specific wavelength (with a small tolerance). Onthem, wavelength conversion can be ignored and the wavelength can be directly addedto a multiplexer/demultiplexer board. Colored optical modules are classified into coarsewavelength division multiplexing (CWDM) and dense wavelength divisionmultiplexing (DWDM) optical modules by the wavelength division density.
l By fiber carrier: two-fiber bidirectional and single-fiber bidirectional optical modules
– A single-fiber bidirectional module provides only one LC interface for connecting toone fiber. It receives and sends optical signals in one fiber but over two differentwavelengths.
– A two-fiber bidirectional module provides two LC interfaces for connecting to twofibers. It receives and sends optical signals in two different fibers.
Electrical modules for ATN devices are all SFP modules, which are used to support FE or GEservices.
AppearanceOptical and electrical modules have different appearance because they use different packagingand cable interfaces.
SFP and eSFP optical modules have the same appearance. Currently eSFP optical modules areused on most of ATN devices. Figure 9-1 shows the eSFP optical module appearance.
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Figure 9-1 eSFP optical module appearance
Single-fiber bidirectional
Two-fiber bidirectional
Figure 9-2 shows the SFP electrical module appearance.
Figure 9-2 SFP electrical module appearance
Figure 9-3 shows the XFP optical module appearance.
Figure 9-3 XFP optical module appearance
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Application
An optical or electrical module can be used at an optical interface if its packaging and servicerate can match the interface.
Packaging:
l SFP optical interfaces use SFP/eSFP optical or electrical modules.
l XFP optical interfaces use XFP optical modules.
Service rate:
l FE and STM-1 optical interfaces match FE optical or electrical modules.
l GE optical interfaces match GE optical or electrical modules.
l FE/GE optical interfaces match FE/GE optical or electrical modules.
l 10GE optical interfaces match 10GE optical modules.
NOTE
In most cases, an optical or electrical module can be used at an optical interface if its packaging and servicerate can match the interface. Certain boards may not support electrical modules. For information about themodules that a board supports, see the Functions and Features topic for the board.
9.2 FE Optical Module
FE Optical Module (commercial)
Table 9-1 Technical specifications of the FE optical interface (two-fiber bidirectional)
Item Specification
Optical interfacetype
Two-fiber bidirectional interface
100BASE-FX(15 km)
100BASE-FX(40 km)
100BASE-FX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
Working wavelengthrange (nm)
1261 to 1360 1263 to 1360 1480 to 1580
Mean launchedoptical power (dBm)
-15 to -8 -5 to 0 -5 to 0
Receiving sensitivity(dBm)
-28 -34 -34
Minimum overload(dBm)
-8 -10 -10
Minimum extinctionratio (dB)
8.2 10 10
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Item Specification
Optical module code S4015755 S4015715 34060282
Table 9-2 Technical specifications of the GE optical interface (single-fiber bidirectional)
Item Specification
Optical interface type LC, single-fiber bidirectional interface
100BASE-FXSTM-1(15 km)
100BASE-FXSTM-1(10 km)
Encapsulation type eSFP eSFP
Fiber type Single-mode Single-mode
Working wavelength range(nm)
Tx: 1260 to 1360Rx: 1480 to 1500
Tx: 1480 to 1500Rx: 1260 to 1360
Mean launched optical power(dBm)
-15 to -8 -15 to -8
Receiving sensitivity (dBm) -32 -32
Minimum overload (dBm) -8 -8
Minimum extinction ratio(dB)
8.5 8.5
Optical module code 34060363 34060364
Usage description Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 9-2, 34060363 and34060364 are used together.
FE Optical Module (industry)
Table 9-3 Technical specifications of the FE optical interface
Item Specification
Optical interfacetype
Two-fiber bidirectional interface
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Item Specification
100BASE-FX(15 km)
100BASE-FX(40 km)
100BASE-FX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
Working wavelengthrange (nm)
1261 to 1360 1263 to 1360 1480 to 1580
Mean launchedoptical power (dBm)
-15 to -8 -5 to 0 -5 to 0
Receiving sensitivity(dBm)
-28 -34 -34
Minimum overload(dBm)
-8 -10 -10
Minimum extinctionratio (dB)
8.2 10 10
Optical module code S4015755 S4015715 34060282
9.3 GE Optical Module
FE/GE Optical Module (commercial)
Table 9-4 Technical specifications of the FE/GE optical interface (single-fiber bidirectional)
Item Specification
Optical interface type LC, single-fiber bidirectional interface
1000BASE-BX40-U(40 km)
1000BASE-BX40-D(40 km)
Encapsulation type eSFP eSFP
Fiber type Single-mode Single-mode
Working wavelength range(nm)
Tx: 1260 to 1360Rx: 1480 to 1580
Tx: 1480 to 1580Rx: 1260 to 1360
Mean launched optical power(dBm)
-3 to 2 -3 to 2
Receiving sensitivity (dBm) -24 -24
Minimum overload (dBm) -3 -3
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Item Specification
Minimum extinction ratio(dB)
8 8
Optical module code 34060638 34060639
Usage description Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 9-4, 34060638 and34060639 are used together.
GE Optical Module (commercial)
Table 9-5 Technical specifications of the GE optical interface (two-fiber bidirectional)
Item Specification
Opticalinterface type
LC, two-fiber bidirectional interface
1000BASE-SX(0.5 km)
1000BASE-LX(10 km)
1000BASE-VX(40 km)
1000BASE-ZX(80 km)
1000BASE-CWDM(80 km)
Encapsulation type
eSFP eSFP eSFP eSFP eSFP
Fiber type Multi-mode Single-mode Single-mode Single-mode Single-mode
Workingwavelengthrange (nm)
770 to 860 1270 to 1360 1260 to 1360 1500 to 1580 For details,seewavelengthallocation of1000BASE-CWDMopticalinterfacesand relatedopticalmodule code.
Meanlaunchedoptical power(dBm)
-9.5 to 0 -11 to -3 -5 to 0 -2 to 5 0 to 5
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Item Specification
Receivingsensitivity(dBm)
-17 -19 -23 -23 -28
Minimumoverload(dBm)
0 -3 -3 -3 -9
Minimumextinctionratio (dB)
9 9 9 9 8.2
Opticalmodule code
34060286 34060473 S4016954 34060360 For details,seewavelengthallocation of1000BASE-CWDMopticalinterfacesand relatedopticalmodule code.
Table 9-6 Wavelength allocation of 1000BASE-CWDM optical interfaces and related optical module code
SN Opticalmodule code
Wavelength (nm) SN Opticalmodule code
Wavelength (nm)
1 34060483 1464.5 to 1477.5 5 34060478 1544.5 to 1557.5
2 34060481 1484.5 to 1497.5 6 34060476 1564.5 to 1577.5
3 34060479 1504.5 to 1517.5 7 34060477 1584.5 to 1597.5
4 34060482 1524.5 to 1537.5 8 34060480 1604.5 to 1617.5
Table 9-7 Technical specifications of the GE optical interface (single-fiber bidirectional)
Item Specification
Opticalinterface type
LC, single-fiber bidirectional interface
1000BASE-BX10-U(10 km)
1000BASE-BX10-D(10 km)
1000BASE-BX40-U(40 km)
1000BASE-BX40-D(40 km)
1000BASE-BX(80 km)
1000BASE-BX(80 km)
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Item Specification
Encapsulationtype
eSFP eSFP eSFP eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode Single-mode Single-mode Single-mode
Workingwavelengthrange (nm)
Tx: 1260 to1360Rx: 1480 to1500
Tx: 1480 to1500Rx: 1260 to1360
Tx: 1260 to1360Rx: 1480 to1500
Tx: 1480 to1500Rx: 1260 to1360
Tx: 1260 to1360Rx: 1480 to1500
Tx: 1480 to1500Rx: 1260 to1360
Meanlaunchedoptical power(dBm)
-9 to -3 -9 to -3 -3 to 5 -3 to 5 -2 to 4 -2 to 4
Receivingsensitivity(dBm)
-19.5 -19.5 -23 -23 -26 -26
Minimumoverload(dBm)
-3 -3 -3 -3 -3 -3
Minimumextinctionratio (dB)
6 6 6 6 9 9
Opticalmodule code
34060470 34060475 34060539 34060540 34060595 34060596
Usagedescription
Used together. Used together. Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 9-7, 34060470 and34060475 are used together, 34060595 and 34060596 are used together, and 34060539 and 34060540 areused together.
GE Optical Module (industry)
Table 9-8 Technical specifications of the GE optical interface (two-fiber bidirectional)
Item Specification
Optical interface type LC, two-fiber bidirectional interface
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Item Specification
1000BASE-LX(10 km)
1000BASE-VX(40 km)
1000BASE-ZX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
Working wavelengthrange (nm)
1280 to 1350 1260 to 1360 1500 to 1580
Mean launched opticalpower (dBm)
-11 to -3 -5 to 3 -2 to 5
Receiving sensitivity(dBm)
–19 –23 –23
Minimum overload(dBm)
-3 -3 -3
Minimum extinctionratio (dB)
9 9 9
Optical module code 34060290 34060320 34060324
Table 9-9 Technical specifications of the GE optical interface (single-fiber bidirectional)
Item Specification
Optical interface type LC, single-fiber bidirectional interface
1000BASE-BX10-U(10 km)
1000BASE-BX10-D(10 km)
Encapsulation type eSFP eSFP
Fiber type Single-mode Single-mode
Working wavelength range(nm)
Tx: 1260 to 1360Rx: 1480 to 1500
Tx: 1480 to 1500Rx: 1260 to 1360
Mean launched optical power(dBm)
-9 to -3 -9 to -3
Receiving sensitivity (dBm) -19.5 -19.5
Minimum overload (dBm) -3 -3
Minimum extinction ratio(dB)
6 6
Optical module code 34060644 34060676
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Item Specification
Usage description Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 9-9, 34060644 and34060676 are used together.
9.4 10GE Optical Module
10GE Optical Module (commercial)
Table 9-10 Technical specifications of the 10GE optical interface
Item Specification
Opticalinterfacetype
LC, two-fiber bidirectional interface
10GE(10 km)
10GE(40 km)
10GE(80 km)
10GE(CWDM)(70 km)
10GE(DWDM)(40 km)
10GE(DWDM)(80 km)
Encapsulation type
XFP XFP XFP XFP TXFP XFP
Fiber type Single-mode
Single-mode
Single-mode
Single-mode
Single-mode
Single-mode
Workingwavelength range(nm)
1310 1550 1550 For details,seewavelengthallocationof 10GE(CWDM)opticalinterfacesand relatedopticalmodulecode.
1529.163to1560.606(wavelength tunable)
For details,seewavelengthallocationof 10GE(DWDM)opticalinterfacesand relatedopticalmodulecode.
Meanlaunchedopticalpower(dBm)
-6 to -1 -1 to 2 0 to 4 0 to 4 -1 to 2 -1 to 3
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Item Specification
Receivingsensitivity(dBm)
-14.4 -15 -24 -24 -16 -24
Minimumoverload(dBm)
0.5 -1 -7 -9 0 -9
Minimumextinctionratio (dB)
6 8.2 9 8 10.5 8.2
Opticalmodulecode
S4015772 S4015776 S4015794 For details,seewavelengthallocationof 10GE(CWDM)opticalinterfacesand relatedopticalmodulecode.
34060568 For details,seewavelengthallocationof 10GE(DWDM)opticalinterfacesand relatedopticalmodulecode.
Table 9-11 Wavelength allocation of 1000BASE-CWDM optical interfaces and related opticalmodule code
SN Opticalmodule code
Wavelength(nm)
SN Opticalmodulecode
Wavelength (nm)
1 34060547 1471 5 34060551 1551
2 34060548 1491 6 34060552 1571
3 34060549 1511 7 34060553 1591
4 34060550 1531 8 34060554 1611
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Table 9-12 Wavelength allocation of 1000BASE-DWDM optical interfaces and related opticalmodule code
SN Opticalmodule code
Wavelength(nm)
SN Opticalmodulecode
Wavelength (nm)
1 34060532 1529.55 9 34060531 1548.51
2 34060515 1530.33 10 34060514 1549.32
3 34060504 1531.12 11 34060502 1550.12
4 34060503 1531.90 12 34060501 1550.92
5 34060534 1532.68 13 34060533 1551.72
6 34060628 1533.47 14 34060625 1552.52
7 34060627 1534.25 15 34060624 1553.33
8 34060626 1535.04 16 34060623 1554.13
9.5 Electrical Module
FE Electrical Module (commercial)
Table 9-13 Technical specifications of the FE electrical interface
Item Specification
Interface rate 100 Mbit/s
Encapsulation type SFP
RJ-45 electrical interfacespecification
Compliance with IEEE 802.3
Electrical module code 34100101
GE Electrical Module (commercial)
Table 9-14 Technical specifications of the GE electrical interface
Item Specification
Interface rate 1000 Mbit/s 10 Mbit/s, 100 Mbit/s, 1000Mbit/s
Encapsulation type SFP SFP
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Item Specification
RJ-45 electrical interfacespecification
Compliance with IEEE 802.3 Compliance with IEEE 802.3
Electrical module code 34100080 34100052
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10 Cables
About This Chapter
This chapter describes various optical fibers and cables used on the equipment.
10.1 Power Supply Cables and Ground CablesThis section describes power supply cables and ground cables used on the equipment.
10.2 Management CablesOn an ATN device, Ethernet cables are used to input and output NM signals.
10.3 Alarm Input/Output CablesOn ATN devices, the RJ-45 connectors are used to input the alarm signals from the externalequipment and output the local alarm signals to the equipment that monitors all the alarms.
10.4 Clock CablesThe clock cables used on ATN devices include external clock cables and 120-to-75-ohm clockcables.
10.5 Service CablesThe service cables include Ethernet cables, 75-ohm 16 x E1 cables, and 120-ohm 16 x E1cables, xDSL cables.
10.6 Optical FibersOn an ATN device, optical fibers are used to input and output Ethernet service signals.
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10.1 Power Supply Cables and Ground CablesThis section describes power supply cables and ground cables used on the equipment.
10.1.1 -48 V Power Supply CableATN devices use DC power cables to connect to external power supplies.
Power cables need to be produced on site. The power cables are made of DC connectors, singlecord end terminals, and wires. Figure 10-1 shows the appearance of the power cable intendedfor a 1 U chassis. Table 10-1 provides the technical specifications of the power cable for a 1 Uchassis. Figure 10-2 shows the appearance of the power cable intended for a 2 U chassis. Table10-2 provides the technical specifications of the power cable for a 2 U chassis.
Figure 10-1 Appearance of the power cable intended for a 1 U chassis
1U DC connector
Single cord end terminal
Power cable
Figure 10-2 Appearance of the power cable intended for a 2 U chassis
screwdriver
2 U DC connector
-48V cable(blue)
0 V cable (black)
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Table 10-1 Technical specifications of the power cable intended for a 1 U chassis
Item Wire Related Parameter Terminal Related Parameter
2.5 mm2
(0.004 in.2)power cableand terminal
Electronic/Electric wire, 450 V/750V, H07Z, K, 2.5 mm2(0.004in.2), blue/black green, fireresistant cable with low smokeand no halogen
Bare crimp terminal, single cord endterminal, 2.5 mm2(0.004 in.2), 12.5 A, tinplating, 8 mm(0.31 in.) deep, blue
Table 10-2 Technical specifications of the power cable intended for a 2 U chassis
Item Wire Related Parameter Terminal Related Parameter
4 mm2 (0.006in.2) powercable andterminal
Electronic/Electric wire, 450 V/750V, H07Z, K, 4 mm2(0.006in.2), blue/black green, fireresistant cable with low smokeand no halogen
Bare crimp terminal, single cord endterminal, 4 mm2(0.006 in.2), 20 A, tinplating, 10 mm(0.39 in.) deep, gray
10.1.2 Power CableATN devices input external power supplies through AC power cables.
AppearanceFigure 10-3 shows an AC input power cable of an ATN device.
Figure 10-3 Appearance of the AC input power cable
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Technical Specifications
Cable Item Description
Power cable forinputting the mains
Cable type (PI Straight Male)-(227IEC53-1.0^2(3C))-(C13 Straight Female)
Technicalspecifications of thecable
International AC 250 V 10 A-3.00 m-3 x 1.0mm2-Black
Fireproof class CM
Note 1: A power cable is named in the format of "Connector 1 Type-Cable Material Type-Connector 2 Type".Note 2: The specifications of power cables for inputting the mains vary in different countriesor regions. In this document, the AC power cables complying with international standards areconsidered as examples.
10.1.3 PGND CablesPGND cables are used to ground the ATN device.
PGND cables are made of wires and OT terminals. Figure 10-4 shows the appearance of a PGNDcable. The technical specifications of the PGND cable are listed in Table 10-3.
Figure 10-4 Appearance of the PGND cable
Table 10-3 Technical specifications of the PGND cable
Wire Related Parameter Terminal Related Parameter
Electronic/Electric wire, 450 V/750 V, H07Z,K, 4 mm2(0.006 in.2), yellow green, fireresistant cable with low smoke and nohalogen
General terminal, OT, 6 mm2(0.009 in.2), tinplating, pre-insulated ring terminal,12-10AWG, yellow
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10.2 Management CablesOn an ATN device, Ethernet cables are used to input and output NM signals.
The management cables for ATN devices include Ethernet cables.
Ethernet cables are classified into straight-through cables and crossover cables, and are used forcommunication between the equipment and the NMS computer. The NM interface on theequipment is adaptive to a straight-through cable or a crossover cable.
Figure 10-5 shows an RJ45 connector used at the end of the Ethernet cable.
When the cable is connected to the ETH/OAM interface, the pin assignment of the RJ45connector is as listed in Table 10-4.
Table 10-5 lists the technical specifications of the Ethernet cable.
Figure 10-5 RJ45 connector
PIN#1PIN#8
Table 10-4 Pin assignment of the RJ45 connector (ETH/OAM)
Connector Pin
Color Relation Usage
1 White-orange Twisted pair Transmit positive of the NM interface
2 Orange Transmit negative of the NM interface
3 White-green Twisted pair Receive positive of the NM interface
6 Green Receive negative of the NM interface
4 Blue Twisted pair Grounding end of the console interface
5 White-blue Receive end of the console interface
7 White-brown Twisted pair Unspecified
8 Brown Transmit end of the console interface
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Table 10-5 Technical specifications of the Ethernet cable
Item Specification
Connector Network Interface Connector, 8-Bit 8-Pin, Crystal Plug
Cable type Twisted-Pair Cable, 100 ohm,Category 5e UTP, 0.51 mm(0.0200 in.),24AWG, 8 Cores, PANTONE 430U
Number of cores Eight
10.3 Alarm Input/Output CablesOn ATN devices, the RJ-45 connectors are used to input the alarm signals from the externalequipment and output the local alarm signals to the equipment that monitors all the alarms.
At one end of the alarm input/output cable, the RJ-45 connector is used to connect to the ALMI/O interface on the equipment; at the other end, a connector (made as required on site) is used toconnect to the external equipment or the equipment that monitors all the alarms.
StructureFigure 10-6 shows the structure of the alarm input/output cable.
Figure 10-6 Structure of the alarm input/output cable
Main label
W
X1
8
1
RJ-45 Connector
Pin AssignmentTable 10-6 lists the pin assignment of the alarm input/output alarm cable connector.
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Table 10-6 Pin assignment of the alarm input/output cable connector
ConnectorPin
Color Relation Description
1 White-orange Twisted pair Alarm input 1
2 Orange Ground for alarm input 1
3 White-green Twisted pair Alarm input 2
6 Green Ground for alarm input 2
4 Blue Twisted pair Alarm input 3
5 White-blue Ground for alarm input 3
7 White- brown Twisted pair Alarm output positive
8 Brown Alarm output negative
Technical Specifications
Table 10-7 lists the technical specifications of the alarm input/output cable.
Table 10-7 Technical specifications of the alarm input/output cable
Item Specification
Connector X1 Network Interface Connector, 8-Bit 8PIN, Crystal Model Connector
Cable type Twisted-Pair Cable, 100 ohm, Category 5e, 0.52 mm, 24AWG, 8 Cores, 4Pairs, PANTONE 430U
10.4 Clock CablesThe clock cables used on ATN devices include external clock cables and 120-to-75-ohm clockcables.
10.4.1 External Clock CablesOn the ATN device, the external clock cables with RJ45 connectors are used to input and outputthe external clock or time signals.
The external clock cables can be connected to the CLK0/TOD0, CLK1/TOD1, CLK, and TODinterfaces on an ATN device.
Structure
Figure 10-7 shows the structure of the RJ45 connector used on the external clock cable.
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Figure 10-7 Structure of the RJ45 Connector
PIN#1PIN#8
Pin AssignmentThe external clock cables must be made on the equipment installation site. When the CLK0/TOD0, CLK1/TOD1, CLK, and TOD interfaces are used as external clock interfaces, the pinassignment of the RJ45 connector is as listed in Table 10-8; when the CLK0/TOD0, CLK1/TOD1, CLK, and TOD interfaces are used as external time interfaces, the pin assignment of theRJ45 connector is as listed in Table 10-9.
Table 10-8 Pin assignment of the RJ45 connector (external clock mode)
ConnectorPin
Color Relation Description
1 White-orange Twisted pair Receive negative of CLK
2 Orange Receive positive of CLK
3 White-green Twisted pair Unspecified
6 Green Unspecified
4 Blue Twisted pair Transmit negative of CLK
5 White-blue Transmit positive of CLK
7 White- brown Twisted pair Unspecified
8 Brown Unspecified
Table 10-9 Pin assignment of the RJ45 connector (external time mode)
Connector Pin
Color Relation Description
1PPS + TimeInformation Mode
DCLS Mode
1 White-orange Twisted pair Unspecified Unspecified
2 Orange Unspecified Unspecified
3 White-green Twisted pair Negative of 1PPSsignals
Negative of DCLSsignals
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Connector Pin
Color Relation Description
1PPS + TimeInformation Mode
DCLS Mode
6 Green Positive of 1PPSsignals
Positive of DCLSsignals
4 Blue Twisted pair Grounding terminal Grounding terminal
5 White-blue Grounding terminal Grounding terminal
7 White-brown Twisted pair Negative of timeinformation
Unspecified
8 Brown Positive of timeinformation
Unspecified
Technical SpecificationsTable 10-10 and Table 10-11 lists the technical specifications of the external clock cable.
Table 10-10 Technical specifications of the external shielded clock cable
Item Specification
Connector Network Interface Connector,8-Bit 8PIN,Shielded,Crystal ModelConnector,24-26AWG,Leads Single Solide Cabl
Cable type Twisted-Pair Cable,100ohm,Category 5e,FTP,0.52mm(0.0205 in.),24AWG,8Cores,4Pairs,PANTONE 430U
Number ofcores
Eight
Table 10-11 Technical specifications of the external non-shielded clock cable
Item Specification
Connector Network Interface Connector,8-Bit 8Pin,Non-Shielded,Crystal Plug
Cable type Twisted-Pair Cable,100ohm,,Category 5e UTP,0.51mm(0.0200 in.),24AWG,8Cores,PANTONE 430U
Number ofcores
Eight
10.4.2 Clock Bridging CableOn an ATN device, the 120-to-75-ohm clock cable is used as the clock bridging cable.
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StructureFigure 10-8 shows the structure of the 120-to-75-ohm clock bridging cable.
Figure 10-8 Structure of the clock bridging cable
RJ-45 connector
Main label Heat-shrink tube
120-ohm or 75-ohm conversion
connector Label
View A
18
30 m
W1
W2
W3
W4
W5A
X1
Heat-shrink tube
Heat-shrink tube
Pin AssignmentTable 10-12 lists the pin assignment of the clock bridging cable connector.
Table 10-12 Pin assignment of the clock bridging cable connector
120-Ohm Cable 75-Ohm Cable
Connector Pin Color Relation Core No.
X1.1 Orange Twisted pair W1
X1.2 White
X1.4 Blue Twisted pair W2
X1.5 White
X1.3 Green Twisted pair W3
X1.6 White
X1.7 White Twisted pair W4
X1.8 Brown
Technical SpecificationsTable 10-13 lists the technical specifications of the clock bridging cable.
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Table 10-13 Technical specifications of the clock bridging cable
Item Specification
Cable Single Cable, 120 ohm To 75 ohm Clock Cable, 30 m, MP8-II,120CC4P0.4P430U(S)+4*SYV75-2/0.34(S)
Connector X1type
Network Interface Connector, 8-Bit 8PIN, Crystal Model Connector
120-ohm cabletype
Twisted-Pair Cable, 120 ohm, SEYVP, 0.4 mm(0.02 in.), 26AWG, 4Pairs,Pantone 430U
75-ohm cabletype
Coaxial Cable, SYV-75-2-2(4.0Z)-1/0.34 mm, OD3.9 mm(0.15 in.),Double-Layer Copper Braid Shielded
10.5 Service CablesThe service cables include Ethernet cables, 75-ohm 16 x E1 cables, and 120-ohm 16 x E1cables, xDSL cables.
10.5.1 Ethernet CablesOn an ATN device, Ethernet cables are used to input and output Ethernet service signals.
Ethernet cables are also referred to as network cables and can be classified into straight-throughcables and crossover cables according to the connection sequence of the copper cores in thecables.
A network cable with a shield layer is a shielded cable and that without a shield layer is a non-shielded cable.
The Ethernet service interfaces on the equipment are adaptive to the straight-through cables andcrossover cables. Hence, you can connect either type of the network cables to the Ethernet serviceinterfaces as required.
Ethernet cables need to be made on site.
StructureFigure 10-9 shows the appearance of the shield layer.
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Figure 10-9 Appearance of the shield layer
Figure 10-10 shows the appearance of the non-shielded cable.
Figure 10-10 Appearance of the non-shielded cable
RJ45 connectors are used at both ends of a network cable. Figure 10-11 shows an RJ45 connectorand Figure 10-12 shows the structure of the network cable.
Figure 10-11 RJ45 connector
PIN#1PIN#8
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Figure 10-12 Structure of the network cable
W
X1 X2
8
1
8
1
RJ-45 network interface connector Label 1 Main label Label 2
NOTE
For a crossover cable, pins 1 and 2 of the RJ45 connector at one end must be cross-connected to pins 3 and6 of the RJ45 connector at the other end respectively.
Pin Assignment
Table 10-14 and Table 10-15 list the pin assignment of the network cable connector.
Table 10-14 Pin assignment of the straight-through cable connector
straight-through Cable
Connector X1 Pin Connector X2 Pin Color Relationship
X1.1 X2.1 White-orange Twisted pair
X1.2 X2.2 Orange
X1.3 X2.3 White-green Twisted pair
X1.6 X2.6 Green
X1.4 X2.4 Blue Twisted pair
X1.5 X2.5 White-blue
X1.7 X2.7 White-brown Twisted pair
X1.8 X2.8 Brown
Table 10-15 Pin assignment of the crossover cable connector
Crossover Cable for FE Interface Crossover Cable for GE Interface
Connector X1 Pin
Connector X2 Pin
Color Relationship
ConnectorX1 Pin
Connector X2 Pin
Color Relationship
X1.1 X2.3 White-orange Twistedpair
X1.1 X2.3 White-orange Twistedpair
X1.2 X2.6 Orange X1.2 X2.6 Orange
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Crossover Cable for FE Interface Crossover Cable for GE Interface
Connector X1 Pin
Connector X2 Pin
Color Relationship
ConnectorX1 Pin
Connector X2 Pin
Color Relationship
X1.3 X2.1 White-green Twistedpair
X1.3 X2.1 White-green Twistedpair
X1.6 X2.2 Green X1.6 X2.2 Green
X1.4 X2.4 Blue Twistedpair
X1.4 X2.7 Blue Twistedpair
X1.5 X2.5 White-blue X1.5 X2.8 White-blue
X1.7 X2.7 White-brown Twistedpair
X1.7 X2.4 White-brown Twistedpair
X1.8 X2.8 Brown X1.8 X2.5 Brown
Technical Specifications
Table 10-16 lists the technical specifications of the shielded cable.
Table 10-16 Technical specifications of the shielded cable
Item Specification
ConnectorX1/X2
Network Interface Connector,8-Bit 8PIN,Shielded,Crystal ModelConnector,24-26AWG,Leads Single Solide Cabl
Cable type Twisted-Pair Cable,100ohm,Category 5e,FTP,0.52mm(0.0205 in.),24AWG,8Cores,4Pairs,PANTONE 430U
Number ofcores
Eight
Table 10-17 lists the technical specifications of the non-shielded cable.
Table 10-17 Technical specifications of the non-shielded cable
Item Specification
ConnectorX1/X2
Network Interface Connector,8-Bit 8Pin,Non-Shielded,Crystal Plug
Cable type Twisted-Pair Cable,100ohm,,Category 5e UTP,0.51mm(0.0200 in.),24AWG,8Cores,PANTONE 430U
Number ofcores
Eight
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10.5.2 75-Ohm 8 x E1 CablesThe 75-ohm 8 x E1 cable is used to input and output E1 signals.
Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interfaceboard. Use a connector to connect the other end to the digital distribution frame (DDF). Theconnector should be made according to the on-site requirements.
Structure
Figure 10-13 shows the structure of the 75-ohm 8 x E1 cable.
Figure 10-13 Structure of the 75-ohm 8 x E1 cable
Pos.44 A-A
Cable connector- D type-44PIN-male
Pos.1A
Main label
W
X
Pin Assignment
Table 10-18 lists the pin assignment of the 75-ohm 8 x E1 cable connector.
Table 10-18 Pin assignment of the 75-ohm 8 x E1 cable connector
Connector Pin
Cable Remarks Connector Pin
Cable Remarks
Core Serial No. Core Serial No.
38 Ring 1 R0 34 Ring 9 R4
23 Tip 19 Tip
37 Ring 3 R1 33 Ring 11 R5
22 Tip 18 Tip
36 Ring 5 R2 32 Ring 13 R6
21 Tip 17 Tip
35 Ring 7 R3 31 Ring 15 R7
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Connector Pin
Cable Remarks Connector Pin
Cable Remarks
Core Serial No. Core Serial No.
20 Tip 16 Tip
15 Ring 2 T0 11 Ring 10 T4
30 Tip 26 Tip
14 Ring 4 T1 10 Ring 12 T5
29 Tip 25 Tip
13 Ring 6 T2 9 Ring 14 T6
28 Tip 24 Tip
12 Ring 8 T3 8 Ring 16 T7
27 Tip 7 Tip
Shell External braid shield layer
Technical Specifications
Table 10-19 Technical specifications of the 75-ohm 8 x E1 cable
Item Specification
Cable Trunk Cable, 75-ohm, 8E1, 2.2 mm, D44M-I,SYFVZP75-1.2/0.25*16(S)-I, -45 degTrunk Cable, 75-ohm, 8E1, 2.2 mm, D44M-I,SYFVZP75-1.2/0.25*16(S)-I, +45 deg
Connector Cable connector-D type-44PIN-male
Cable type Coaxial Cable, SYFVZP-LC 75-1-1*16, 75–ohm, 13.10 mm, 1.2mm, 0.254 mm, Pantone Warm Gray 1U
Fireproof class CM
Number of cores 16
Cover diameter-insulation diameter-conductor diameter
13.1 mm - 1.2 mm - 0.254 mm
10.5.3 120-Ohm 8 x E1 CablesThe 120-ohm 8 x E1 cable is used to input and output E1 signals.
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Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interfaceboard. Use a connector to connect the other end to the DDF. The connector should be madeaccording to the on-site requirements.
StructureFigure 10-14 shows the appearance of the 120-ohm 8 x E1 cable and Figure 10-15 shows thestructure of the cable.
Figure 10-14 Appearance of the 120-ohm 8 x E1 cable
Figure 10-15 Structure of the 120-ohm 8 x E1 cable
Main lable
W1
APos.44
Pos.1A-A
Cable connector-D type-44PIN-male
X
Lable 1
W2
Lable 2
Pin assignmentTable 10-20 lists the pin assignment of the 120-ohm 8 x E1 cable connector.
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Table 10-20 Pin assignment of the 120-ohm E1 cable connector
Connector Pin Cable Remarks Connector Pin Cable Remarks
Core Core
15 Blue R0 38 Blue T0
30 White 23 White
14 Orange R1 37 Orange T1
29 White 22 White
13 Green R2 36 Green T2
28 White 21 White
12 Brown R3 35 Brown T3
27 White 20 White
11 Grey R4 34 Grey T4
26 White 19 White
10 Blue R5 33 Blue T5
25 Red 18 Red
9 Orange R6 32 Orange T6
24 Red 17 Red
8 Green R7 31 Green T7
7 Red 16 Red
Shell External braid shield layer Shell External braid shield layer
Technical Specifications
Table 10-21 Technical specifications of the 120-ohm 8 x E1 cable
Item Specification
Cable Trunk Cable, 120-ohm, 8E1, 0.4 mm, D44M-I,2*120CC8P0.4P430U(S), -45degTrunk Cable, 120-ohm, 8E1, 0.4 mm, D44M-I,2*120CC8P0.4P430U(S), 45deg
Connector Cable connector-D type-44PIN-male
Cable type Communication cable-120 ohm-SEYVP-24AWG-16 core-PANTONE 430U
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Item Specification
Number of cores 16 twisted pairs
Inner conductordiameter
0.4 mm(0.02 in.)
Fireproof class CM
10.5.4 75-Ohm 16 x E1 CablesOn an ATN device, Anea96 connectors are used to input and output 75-ohm E1 signals.
At one end of the 75-ohm 16 x E1 cable, the Anea96 connector is used to connect the 75-ohmE1 electrical interface on the board; the other end is connected to the digital distribution frame(DDF). Make the connector as required on site.
NOTE
The 75-ohm 16 x E1 cable of other types of ATN equipment cannot be used for the ATN 910I. Otherwise,the device cannot correctly identify the impedance.
StructureFigure 10-16 shows the appearance of the 75-ohm 16 x E1 cable and Figure 10-17 shows thestructure of the cable.
Figure 10-16 Appearance of the 75-ohm 16 x E1 cable
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Figure 10-17 Structure of the 75-ohm 16 x E1 cable
Main label
1W
X1 A
View A
Pos .1
Pos.96Cable Connector, Anea, 96PIN,
Female Connector
Pin Assignment
Table 10-22 lists the pin assignment of the 75-ohm 16 x E1 cable connector.
Table 10-22 Pin assignment of the 75-ohm E1 cable connector
Connector Pin
Cable Remarks Connector Pin
Cable Remarks
Core Serial No. Core Serial No.
1 Tip 1 R0 25 Tip 2 T0
2 Ring 26 Ring
3 Tip 3 R1 27 Tip 4 T1
4 Ring 28 Ring
5 Tip 5 R2 29 Tip 6 T2
6 Ring 30 Ring
7 Tip 7 R3 31 Tip 8 T3
8 Ring 32 Ring
9 Tip 9 R4 33 Tip 10 T4
10 Ring 34 Ring
11 Tip 11 R5 35 Tip 12 T5
12 Ring 36 Ring
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Connector Pin
Cable Remarks Connector Pin
Cable Remarks
Core Serial No. Core Serial No.
13 Tip 13 R6 37 Tip 14 T6
14 Ring 38 Ring
15 Tip 15 R7 39 Tip 16 T7
16 Ring 40 Ring
17 Tip 17 R8 41 Tip 18 T8
18 Ring 42 Ring
19 Tip 19 R9 43 Tip 20 T9
20 Ring 44 Ring
21 Tip 21 R10 45 Tip 22 T10
22 Ring 46 Ring
23 Tip 23 R11 47 Tip 24 T11
24 Ring 48 Ring
49 Tip 25 R12 73 Tip 26 T12
50 Ring 74 Ring
51 Tip 27 R13 75 Tip 28 T13
52 Ring 76 Ring
53 Tip 29 R14 77 Tip 30 T14
54 Ring 78 Ring
55 Tip 31 R15 79 Tip 32 T15
56 Ring 80 Ring
Shell External braid shield layer
Technical Specifications
Table 10-23 Technical specifications of the 75-ohm 16 x E1 cable
Item Specification
Cable Trunk Cable, 75ohm, 16E1, 1.6mm,Anea 96F-I,SYFVZP75-1.1/0.26*32(S), +45deg
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Item Specification
Connector Cable Connector, Anea, 96PIN, Suite Of Female Connector AndShielding Case, IDC Type, For 28-30 AWG Solid Wire, 1 A
Cable type Coaxial Cable, SYFVZP-MC 75-1-1*32, 75 ohm, 12.40 mm(0.49in.), 1.1 mm(0.04 in.), 0.26 mm(0.01 in.), Pantone Warm Gray 1U,Only for OEM
Diameter of the shieldlayer - diameter of theinternal insulationlayer - diameter of theinternal conductor
12.4 mm(0.49 in.) - 1.6 mm(0.06 in.) - 0.26 mm(0.01 in.)
Number of cores 32
Available length 5 m, 10 m, 15 m, 20 m, 25 m, 30 m, 35 m, 40 m, 45 m, 50 m16.40 ft.,32.80 ft.,49.21 ft.,65.62 ft.,82.02 ft.,98.42 ft.,114.83 ft.,131.23 ft.147.64 ft.,164.04 ft.
10.5.5 120-Ohm 16 x E1 CablesOn an ATN device, Anea96 connectors are used to input and output 120-ohm E1 signals.
At one end of the a 120-ohm 16 x E1 cable, the Anea96 connector is used to connect the 120-ohm E1 electrical interface on the board; the other end is connected to the DDF. Make theconnector as required on site.
StructureFigure 10-18 shows the appearance of the 120-ohm 16 x E1 cable and Figure 10-19 shows thestructure of the cable.
Figure 10-18 Appearance of the 120-ohm 16 x E1 cable
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Figure 10-19 Structure of the 120-ohm 16 x E1 cable
Main label
1W
X1 A
View A
Pos .1
Pos.96Cable Connector, Anea, 96PIN,
Female Connector
Pin assignment
Table 10-24 lists the pin assignment of the 120-ohm 16 x E1 cable connector.
Table 10-24 Pin assignment of the 120-ohm E1 cable connector
Connector Pin
Cable Remarks Connector Pin
Cable Remarks
Core Bundle Core Bundle
1 White Blue R0 25 White Blue T0
2 Blue 26 Orange
3 White R1 27 White T1
4 Green 28 Brown
5 White R2 29 Red T2
6 Grey 30 Blue
7 Red R3 31 Red T3
8 Orange 32 Green
9 Red R4 33 Red T4
10 Brown 34 Grey
11 Black R5 35 Black T5
12 Blue 36 Orange
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Connector Pin
Cable Remarks Connector Pin
Cable Remarks
Core Bundle Core Bundle
13 Black R6 37 Black T6
14 Green 38 Brown
15 Black R7 39 Yellow T7
16 Grey 40 Blue
17 White Orange R8 41 White Orange T8
18 Blue 42 Orange
19 White R9 43 White T9
20 Green 44 Brown
21 White R10 45 Red T10
22 Grey 46 Blue
23 Red R11 47 Red T11
24 Orange 48 Green
49 Red R12 73 Red T12
50 Brown 74 Grey
51 Black R13 75 Black T13
52 Blue 76 Orange
53 Black R14 77 Black T14
54 Green 78 Brown
55 Black R15 79 Yellow T15
56 Grey 80 Blue
Shell External braid shield layer
Technical Specifications
Table 10-25 Technical specifications of the 120-ohm 16 x E1 cable
Item Specification
Cable Trunk Cable, 120 ohm, 16E1, 0.4 mm(0.02 in.), Anea 96F,120CC32P0.4P430U(S), +45deg
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Item Specification
Connector Cable Connector, Anea, 96PIN, Suite Of Female Connector AndShielding Case, IDC Type, For 24-26 AWG Solid Wire - 1 A
Cable type Twisted-Pair Cable, 120 ohm, SEYVP, 0.4 mm(0.02 in.), 26AWG,32Pairs, Pantone 430U
Core diameter of theinner conductor
0.4 mm(0.02 in.)
Number of cores 32 twisted pairs
10.5.6 xDSL CablesOn an ATN devices, the telephone wires with RJ-11/RJ-45 connectors are used to input andoutput ADSL and G.SHDSL service signals.
The connectors at both ends of the cable applicable to the AND1SHD4, and AND1SHD4I areRJ-11 connectors.
The connectors at both ends of the cable applicable to the AND1AVD8A are RJ-45 connectors.
Structure
Figure 10-20 shows the structure of the telephone wire used as an xDSL cable.
Figure 10-20 Structure of the telephone wire
6
1
6
1
1 Main label
W
X2X1
15 m
1. Telephone wire RJ-11 crystal connector
8
1
8
1
1 Main label
W
X2X1
15 m
1. Telephone wire RJ-45 crystal connector
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Pin AssignmentTable 10-26 lists the pin assignment of the ADSL cable connector and Table 10-27 lists the pinassignment of the G.SHDSL cable connector.
Table 10-26 Pin assignment of the ADSL cable connector (RJ-45)
Connector X1 Connector X2 Description
X1.1 X2.1 Unspecified
X1.2 X2.2 Unspecified
X1.3 X2.3 Unspecified
X1.4 X2.4 Ring
X1.5 X2.5 Tip
X1.6 X2.6 Unspecified
X1.7 X2.7 Unspecified
X1.8 X2.8 Unspecified
Table 10-27 Pin assignment of the G.SHDSL cable connector
Connector X1 Connector X2 Description
X1.1 X2.1 Unspecified
X1.2 X2.2 Unspecified
X1.3 X2.3 Tip
X1.4 X2.4 Ring
X1.5 X2.5 Unspecified
X1.6 X2.6 Unspecified
Technical SpecificationsTable 10-28 lists the technical specifications of the xDSL cable (telephone wire).
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Table 10-28 Technical specifications of the xDSL cable
Item Specification
RJ-11 Connector X1/X2
Network Interface Connector, 6-Bit 4PIN, Crystal ModelConnector, Matching 26-28AWG
RJ-45 Connector X1/X2
Network Interface Connector, 8-Bit 8PIN, Shielded, Crystal ModelConnector
Cable Electronic and Power Cable, 150 V,UL20251, 28AWG, Black, 1 A,2 Cores Telephone Cable
Number of cores 2
10.6 Optical FibersOn an ATN device, optical fibers are used to input and output Ethernet service signals.
Indoor optical fibers include single-mode optical fibers and multi-mode optical fibers. Theappearances of a single-mode optical fiber and a multi-mode optical fiber are the same, but theircolors are different. The single-mode optical fiber is yellow, and the multi-mode optical fiber isorange.
Figure 10-21 shows the appearance of a single-mode optical fiber.
Figure 10-21 Appearance of a single-mode optical fiber with LC/PC connectors
LC/PC connectors are used at both ends of the optical fiber shown in Figure 10-21. For an opticalfiber that connects an optical port on an ATN device to an optical port of another type on the
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peer device, an LC/PC connector is used at one end and a connector of another type is used atthe other end. Table 10-29 lists the common optical connectors.
Table 10-29 Common optical connectors
Appearance Type Description
SC/PC connector Plug-in square fiber connector/protruding polished
FC/PC connector Round fiber connector/protrudingpolished
ST/PC connector Square fiber connector/protrudingpolished
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11 Equipment Support
About This Chapter
ATN devices can work with various equipment to implement various applications.
11.1 Cabinet SupportThis section provides common cabinets that can house ATN devices.
11.2 Power Distribution EquipmentThis section introduces equipment that supplies power to ATN devices.
11.3 HeaterThe ATN 910I-TC DC operates at a temperature that ranges from -40ºC to 65ºC. When thetemperature falls below -20ºC, the heater starts working.
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11.1 Cabinet SupportThis section provides common cabinets that can house ATN devices.
11.1.1 APM30H Outdoor CabinetThe APM30H outdoor cabinet supports IP55 protection rating and can be used outdoors.
The APM30H is an outdoor cabinet with heat exchangers. It supports AC power supply and DCpower distribution, and can provide a 7 U installation space for user devices. Figure 11-1 andFigure 11-2 show the appearance and internal structure of an APM30H outdoor cabinet.
Figure 11-1 Appearance of an APM30H outdoor cabinet
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Figure 11-2 Internal structure of an APM30H outdoor cabinet
7 U
Table 11-1 lists the technical specifications of the APM30H outdoor cabinet.
Table 11-1 Technical specifications of the APM30H outdoor cabinet
Item Specifications
Dimensions (H x W x D) 700 mm x 600 mm x 480 mm
Available installationspace
7 U (1 U = 44.45 mm)
Allowable internal heatconsumption
≤ 700 W
Protection rating IP55
11.1.2 IMB Network CabinetThe IMB network cabinet supports the IP31 protection rating, and can be wall mounted indoors,in the corridor, and in the weak current well.
A small-sized IMB network cabinet has a compact structure and occupies only a little installationspace. In addition, it can be installed on an uneven wall with an undulation smaller than 10 mm,so it has low requirements on site selection.
The IMB network cabinet provides a 3 U installation space for user devices. The internal 2 Uinstallation space is for an ATN device and the external 1 U installation space is for a powersupply device. Figure 11-3 and Figure 11-4 show the appearance and structure of an IMBnetwork cabinet.
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Figure 11-3 Appearance of an IMB network cabinet
Figure 11-4 Internal structure of an IMB network cabinet
Table 11-2 lists the technical specifications of the IMB network cabinet.
Table 11-2 Technical specifications of the IMB network cabinet
Item Specifications
Dimensions (H x W x D) 560 mm x 180 mm x 425 mm
Available installation space 3 U (1 U = 44.45 mm)
Allowable internal heatconsumption
≤ 300 W
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Item Specifications
Protection rating IP31
11.1.3 19-inch Open Rack19-inch open racks apply to Class-A indoor installation environment.
A 19-inch open rack provides a 45 U installation space for user devices. Figure 11-5 shows theappearance of a 19-inch open rack.
Figure 11-5 Appearance of a 19-inch open rack
Table 11-3 lists the technical specifications of the 19-inch open rack.
Table 11-3 Technical specifications of the 19-inch open rack
Item Specifications
Dimensions (H x W x D) 2,200 mm x 600 mm x 600 mm
Available installation space 45 U (1 U = 44.45 mm)
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11.1.4 N63E CabinetN63E-22 cabinet apply to Class-A indoor installation environment.
The N63E-22 cabinet has a height of 2.2 m. Figure 11-6 shows the appearance of a N63E-22cabinet.
Figure 11-6 Appearance of a N63E-22 cabinet
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Table 11-4 lists the technical specifications of the N63E-22 cabinet.
Table 11-4 Technical specifications of the N63E-22 cabinet
Item Specifications
Standard compliance ETSI cabinet (21-inch): ETSI 300 119-3
Weight (empty cabinet) 45 kg
Dimensions (W x D x H) 600 mm x 300 mm x 2200 mm
Distance between mountingbar holes
1 SU = 25 mm. (SU: Standard U.)
Available space 83 SU
Fixing centers 515 mm
11.2 Power Distribution EquipmentThis section introduces equipment that supplies power to ATN devices.
11.2.1 Power DistributionThis section describes power distribution for ATN devices in AC and DC scenarios.
DC ScenarioThe rated voltage and current of ATN 910 are -48 V/-60 V DC and 4 A, respectively.
The rated voltage and current of an ATN 910I DC device are -48 V/-60 V DC and 1.5 A,respectively.
NOTE
An ATN 910I AC device using AC power supplies cannot be used in the DC scenario.
The rated voltage and current of ATN 910B are -48 V/-60 V DC and 4 A, respectively.
The rated voltage and current of ATN 950B are -48 V/-60 V DC and 8 A, respectively.
In DC scenarios, an ATN device can be directly used under the rated voltage of -48 V/-60 V DCor used with a 27S48D power system under the rated voltage of +24 V DC. Figure 11-7 andFigure 11-8 show the power distribution for an ATN device.
Figure 11-7 Power distribution for an ATN device under the voltage of -48 V/-60 V DC
ATN -48 V DC/-60 V DC
-48 V DC/-60 V DC
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NOTE
For the capacity of circuit breakers or fuses on an ATN device, refer to the Quick Installation Guide of theATN device.
Figure 11-8 Power distribution for an ATN device under the voltage of +24 V DC
ATN+24 V DC
-48 V DC
27S48D -48 V DC+24 V DC
AC Scenario
The input AC voltage of An ATN 910I AC device is from 100 V to 240 V AC and the ratedcurrent is 0.6 A.An ATN 910I AC device can be directly used in AC scenarios. Figure 11-9shows the power distribution for an ATN 910I AC device.
Figure 11-9 AC power distribution
ATN220 V AC
When using AC power supplies, the ATN DC device can be used with an EPS30-4815AF powersystem. Figure 11-10 shows the power distribution for an ATN DC device.
Figure 11-10 AC power distribution
ATN-48 V DC
EPS30-4815AF -48 V DC220 V AC
Lead-acid battery
-48V DC
11.2.2 EPS30-4815AF Power SystemThe EPS30-4815AF external power system converts input 220 V AC power to -53.5 V DC powerand supplies power to an ATN device. When the 220 V AC input power supply fails, theEPS30-4815AF automatically supplies to the ATN device the backup power of storage batteries.An EPS30-4815AF power system consists of a rectifier module, monitoring module, and AC/DC power distribution frame.
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AppearanceFigure 11-11 and Table 11-5 show the appearance and structure of an EPS30-4815AF,respectively.
Figure 11-11 Appearance of an EPS30-4815AF
NOTICEInterfaces on the monitoring module are reserved temporarily. Do not use these interfaces.Otherwise, the power system may be reset or damaged.
Table 11-5 Structure of an EPS30-4815AF
Component Description
Rectifier module Converts AC power to DC power. One or two rectifier modulescan be configured in an EPS30-4815AF power system.
Monitoring module Detects the status of the power system and storage batteries. TwoRS232/RS485 communication interfaces and one DB50interface are reserved on the monitoring module.
AC/DC power distributionframe
Provides AC power input interface, load interfaces, storagebattery interface, and replaceable fuses.
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IndicatorsIndicators for the rectifier and monitoring modules are present on the front panel of theEPS30-4815AF. Table 11-6 and Table 11-7 list the indications of indicators for the rectifierand monitoring modules respectively.
Table 11-6 Indicators for the rectifier modules
Indicator Indication Color NormalState
AbnormalState
Cause of Exception
RUN Runningindicator
Green On Off The rectifier modules are runningnormally.
ALM Protectionindicator
Yellow Off On A fault that can be rectified occurs ona rectifier module.
Blinking Communication on a rectifier moduleis interrupted.
FAULT Faultindicator
Red Off On A fault that cannot be rectified occurson a rectifier module.
Note 1: When a severe fault occurs, the indicator (red) is on and the indicators (yellow and green) are off. Theindicators (yellow and green) are on only when the indicator (red) is off.Note 2: The indicator (yellow) is always on when communication on a rectifier module is interrupted, a rectifiermodule is overheated or endures overcurrent or undercurrent, or a rectifier module is disabled.
Table 11-7 Indicators for the monitoring module
Indicator
Indication
Color NormalState
Abnormal State
Cause of Exception
RUN Runningindicator
Green Blinkingregularly
Off The monitoring module isrunning abnormally.
Fastblinking
Abnormal communication
ALM Alarmindicator
Red Off On The EPS30-4815AF reports analarm.
InterfacesTable 11-8 lists types and usage of the interfaces on the front panel of the EPS30-4815AF.
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Table 11-8 Interfaces on the front panel of the EPS30-4815AF
InterfaceName
Number ofInterfaces
InterfaceType
Description Remarks
AC INPUT 1 - 220 V AC power inputinterface
-
RS232/RS485 2 RJ-45 RS232/RS485communication interfaces.The monitoring modulecommunicates with theequipment, reports alarms,and implements remotecontrol through theseinterfaces.The interface on the left is theactive interface and theinterface on the right is thestandby interface. The activeand standby interfaces cannotbe used at the same time.
Reserved interfaces
COM 1 DB50 The monitoring module isconnected to various sensorsthrough the COM interface.
Reserved interface
LOAD1 1 - Output interface for load 1 LOAD1 and LOAD2 provide DCpower for two PIUs. For how toconnect the load interfaces to thePIUs, see the Installation Guide.The pins marked with + and - areconnected to the 48V+ and 48V-poles of the cable connectorrespectively.Table 11-9 lists the relationships ofthe load output interfaces, interfacefor connecting to the storagebatteries, and fuses.
LOAD2 1 - Output interface for load 2
BATT 1 - Interface for connecting to thestorage batteries
Output branch fusesThere are three replaceable fuses on the front panel of the EPS30-4815AF. The fuses disable/enable the load and storage batteries, and provide overload and short-circuit protection for theload and storage batteries.
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Table 11-9 Relationships of the load output interfaces, interface for connecting to the storagebatteries, and fuses
Output Branch Fuse Load Branch
FU-1 (10 A) LOAD1 (10 A)
FU-2 (20 A) LOAD2 (20 A)
FU-BT (20 A) BATT (20 A)
DIP SwitchThere is a DIP switch on the monitoring module of the EPS30-4815AF. Figure 11-12 showsthe default setting and location of the DIP switch.
Figure 11-12 Default setting and location of the DIP switch
NOTICEDo not change the default setting of the DIP switch. Otherwise, the EPS30-4815AF is affected.
The DIP switch indicates eight bits in binary format (on: 1; off: 0). The default value of the eightbits is 00000100. The functions of the eight bits are as follows:
l The first five bits indicate the local and remote power addresses. Bit 5 is the highest bit andbit 1 is the lowest bit.
l Bit 6 sets the baud rate of communication between the monitoring module and equipment.When bit 6 is 1, the baud rate is 9600 bit/s; when bit 6 is 0, the baud rate is 19200 bit/s.
l Bits 7 and 8 are reserved.
Technical SpecificationsTable 11-10 lists the technical specifications of the EPS30-4815AF.
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Table 11-10 Technical specifications of the EPS30-4815AF
Item Specification
AC input Rated input voltage 220 (90 to 280) V AC
Maximum inputcurrent
10 A
Frequency 50/60 Hz
Battery input Rated input voltage -48 V
Capacity 40 Ah
Number ofbatteries
4
DC output Rated outputvoltage
-53.5 V DC
Output current LOAD1: 10 A (determined by the fuse)LOAD 2: 20 A (determined by the fuse)
Dimensions of the EPS30-4815AF(mounting ears included)
43.6 mm (H) x 482.6 mm (W) x 270 mm (D)
Weight of the EPS30-4815AF < 10 kg
11.2.3 27S48D Power SystemThe 27S48D power system converts input +24 V DC power to -53.5 V DC power and suppliespower to an ATN device.
AppearanceFigure 11-13 shows the appearance of a 27S48D power system.
Figure 11-13 Appearance of a 27S48D power system
FunctionsThe 27S48D power system accepts power in the range of 19 V to 30 V, and outputs -53.5 Vrated voltage and 7 A rated current.
In terms of electrical performance and structure, the 27S48D power system is divided into twoindependent -53.5 V/5.6 A power modules. They are separated using an output diode and
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installed in the same cabinet. Their currents are combined into a 7 A one through powerdistribution, and the 7 A current is supplied to equipment. The 27S48D power system providesfunctions such as short-circuit protection, overcurrent protection, output overvoltage protection,and overheat protection.
IndicatorTable 11-11 lists the meaning of each 27S48D power indicator status.
Table 11-11 Indicator description
Indicator Color Normal State Description
RUN Green On When the module receives 24 V power, theindicator is on and green.
STAND-BY Yellow Off When there is no output power, the indicatoris on and yellow.
ALM Red Off When protection is triggered or a faultoccurs, the indicator is on and red.
InterfaceTable 11-12 lists the types and functions of 27S48D power interfaces.
Table 11-12 Description of 27S48D power interfaces
InterfaceName
Quantity
Description Remarks
INPUT 2 24 V DC power inputinterface
Each power module has one inputinterface to receive powerindependently.
OUTPUT 6 -48 V DC power outputinterface
Two terminals are used: NEG(-)and RTN(+). There are altogethersix power outputs.
ALM 1 Alarm output terminal Dry contact output: off (abnormal)or on (normal)
Technical SpecificationsTable 11-13 lists the technical specifications of the 27S48D power system.
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Table 11-13 Technical specifications of the 27S48D power system
Item Value
DC power supply Rated input voltage 24 V (19 V to 30 V) DC
Maximum inputcurrent
20 A
DC power supply Rated outputvoltage
-53.5 V DC
Output current 7 A
Dimensions (with mounting ears) (H x Wx D)
43.4 mm x 482.6 mm x 244 mm
Weight < 7 kg
11.2.4 HW-100-48AC14D-1 Power SystemThe HW-100-48AC14D-1 power system receives and converts 110 V or 220 V AC power to-48 V DC power for an ATN device.
AppearanceFigure 11-14 shows the appearance of the HW-100-48AC14D-1 power system.
Figure 11-14 Appearance of the HW-100-48AC14D-1 power system
FunctionsThe HW-100-48AC14D-1 power system supports AC power ranging from 90 V to 264 V, andoutputs -48 V DC power in natural heat dissipation mode. The output power is 100 W. This
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power system supports protection against output overcurrent, output undervoltage, output shortcircuit, and overtemperature.
Technical Specifications
Table 11-14 provides the technical specifications of the HW-100-48AC14D-1 power system.
Table 11-14 Technical specification of the HW-100-48AC14D-1 power system
Item Specifications
AC power input Rated input voltage 100/220 V (100 V to 240 V) AC
Maximum inputcurrent
2 A
DC output Rated outputvoltage
-48 V DC
Rated outputpower
100 W
Dimensions (H x W x D) 40 mm x 171 mm x 72 mm
Weight < 1 kg
Ambient temperature -20 °C to +40 °C
11.2.5 Lead-Acid BatteryAn ATN device uses valve regulated lead-acid batteries to provide backup power.
Appearance
Figure 11-15 shows the appearance of a lead-acid battery.
Figure 11-15 Appearance of a lead-acid battery
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NOTE
The appearance, dimensions, and weight of lead-acid batteries are provided only for reference and thoseof the delivered batteries prevail.
Technical Specifications
Table 11-15 shows the technical specifications of the lead-acid battery.
Table 11-15 Technical specifications of the lead-acid battery
Item Specifications
Rated working voltage (fourbatteries cascaded in a group)
-48 V DC
Rated capacity (four batteriescascaded in a group)
40 Ah (NP38-12RFR)40 Ah (BPL40-12)
Float charging voltage (fourbatteries cascaded in a group)
-53.5 V DC
Maximum charge current (fourbatteries cascaded in a group)
9.5 A (NP38-12RFR)12 A (BPL40-12)
Operating temperature -15°C to +50°C (NP38-12RFR)-20°C to +50°C (BPL40-12)
Weight ≤ 15 kg
11.3 HeaterThe ATN 910I-TC DC operates at a temperature that ranges from -40ºC to 65ºC. When thetemperature falls below -20ºC, the heater starts working.
The dimensions of the heater (without mounting ears) are 420 mm (width) x 250 mm (depth) x41.6 mm (height). Figure 11-16 shows the heater.
Figure 11-16 Heater
The technical specifications of the heater are as follows:
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l When the temperature in the cabinet is lower than +1ºC (with ±6ºC offset considered), theheater starts working. When the temperature in the cabinet is higher than +15ºC (with ±3ºCoffset considered), the heater stops working.
l The rated heating power of the heater is 330 W.
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12 Quick Reference
About This Chapter
12.1 IndicatorsThis topic describes the names of various indicators and their indications.
12.2 Dimensions and WeightThis chapter lists the dimensions and weight of each board used for an ATN device.
12.3 Power ConsumptionThis chapter lists the power consumption of each board used for ATN devices.
12.4 Interface SpecificationsThis chapter presents the list of Interface Specifications.
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12.1 IndicatorsThis topic describes the names of various indicators and their indications.
Index of IndicatorsFor boards and their indicators, see Boards and Their Indicators.
For board status indicators, see:
l Description of the Board Status Indicator (STAT)l Description of the Program Running Indicator (PROG)l Description of the Synchronization Status Indicator (SYNC)l Description of the Service Status Indicator (SRV)l Description of the CXP Switching Status Indicator (ACTX)l Description of the CXP Control Status Indicator (ACTC)l Description of the Power Supply Status Indicator (PWRA/PWRB/PWR)l Description of the Fan Status Indicator (FAN)
For service port status indicators, see:
l Description of the Service Port Transmitting/Receiving Status Indicator (ACT)l Description of the Ethernet Electrical Interface Connection Status Indicator (LINK)l Description of the Ethernet Optical Interface Connection/Data Transmission Status
Indicator (L/A or LINK/ACT)l Description of the EF8F/EG2 Port Connection Status Indicator (LINK)l Description of the CQ1B/PQ1 Port Status Indicator (LOS1 to LOS4)
For system alarm indicators, see:
l Description of the Critical Alarm Indicator (CRIT)l Description of the Major Alarm Indicator (MAJ)l Description of the Minor Alarm Indicator (MIN)
For combination of indicators in different start statuses on the system control board, seeDescription of the Start Status Indicator Combination on the System Control Board.
Boards and Their Indicators
ATN 910 Board Name Indicator
ANC2CXPI/ANC2CXPL STAT, PROG, SYNC, SRV, CRIT, MAJ, MIN, L/A0, L/A1,LINK, and ACT
AND1EF8T STAT, LINK, ACT
AND1EF8F STAT, LINK0 to LINK7
AND1EG2 STAT, LINK0, LINK1, ACT0, and ACT1
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ATN 910 Board Name Indicator
AND1EG4F STAT, L/A0 to L/A3
AND1EG4T STAT
AND1MO1C STAT
AND1AVD8A/AND1AVD8B
STAT
AND1SHD4 STAT, LINK0 to LINK3
AND1SHD4I STAT, LINK0 to LINK3
AND1ML1/ML1A STAT
AND2ML1A/ML1B STAT
AND1MD1A/MD1B STAT
ANC1PIU PWRA, PWRB
ANC1FAN FAN
ATN 950B Board Name Indicator
AND1CXPA/AND1CXPB/AND2CXPA/AND2CXPB/AND2CXPE
STAT, PROG, SYNC, ACTX, and ACTC
AND1EM4T STAT
AND1EM8T STAT
AND1EX1 L/A
AND1EM4F STAT, L/A0 to L/A3
AND1EM8F STAT, L/A0 to L/A7
AND2CQ1B/AND2PQ1 STAT, LOS0 to LOS3
AND1ML1/ML1A STAT
AND3ML1A/ML1B STAT
AND2MD1A/MD1B STAT
AND1PIU/AND2PIU PWR
AND1FAN/AND2FAN CRIT, MAJ, MIN, and FAN
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Description of the Board Status Indicator (STAT)
Status Indication
On (green) The board is working normally.
On (red) The board hardware is faulty.
On (orange) The interface board is not loaded with the logic.
Off l No power is input.l The board is not running.
Description of the Program Running Indicator (PROG)
Status Indication
On (green) l The board software is being initialized.l The board software is normally initialized, and the board
software is running normally.
On (red) l The memory self-check fails.l The board software or the logic file is lost.l Loading of the board software fails.
On for 100 ms and off for100 ms alternately (green)
Loading of the board software is in process.
On for 300 ms and off for300 ms alternately (green)
The BIOS is guiding the upper-layer software.
On for 100 ms and off for100 ms alternately (red)
The BIOS self-check fails.
Off No power is input.
Description of the Synchronization Status Indicator (SYNC)
Status Indication
On (green) l The clock works in free-run mode and the system clockpriority list is not set. By default, the system clock prioritylist contains only internal sources.
l The clock works in locked mode and is tracing a clock sourceother than the internal sources in the priority list.
l The system clock is working in time synchronization mode,and the PTP time and system clock are in the tracing state.
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Status Indication
On (red) l The system clock priority list is set. All the clock sources,however, are lost except for the internal clock sources. Theclock works in holdover mode or free-run mode.
l The system clock is working in time synchronization mode,but no synchronization source is available. The system clockand PTP time are working in holdover or free-run mode.
Description of the Service Status Indicator (SRV)This indicator is reserved for later use.
Description of the CXP Switching Status Indicator (ACTX)
Status Indication
On (green) The board is in the working switching state.
Off The board is in the protection switching state.
Description of the CXP Control Status Indicator (ACTC)
Status Indication
On (green) The board is in the working control state.
On for 100 ms and off for 100 ms alternately(green)
The data of the equipment is backed up inbatch.
Off The board is in the protection control state.
Description of the Power Supply Status Indicator (PWRA/PWRB/PWR)
Status Indication
On (green) Power is accessed.
Off l No power is accessed.l The power supply poles are inversely connected.
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Description of the Alarm Indicator (ALM)
Status Indication
On (red) Critical alarms are generated in the equipment.
On (yellow) Major or minor alarms are generated in the equipment.
Off No alarms are generated in the equipment.
Description of the Fan Status Indicator (FAN)
Status Indication
On (green) The fans are working normally.
On (red) The fans are working abnormally.
Off The fans are not powered.
Description of the Service Port Transmitting/Receiving Status Indicator (ACT)
Status Indication
Blinking (orange) The data interface is transmitting or receiving data.
Off The data interface is not transmitting or receiving data.
Description of the Ethernet Electrical Interface Connection Status Indicator (LINK)
Status Indication
On (green) The physical port connection is normal.
Off The physical port connection fails.
Description of the Ethernet Optical Interface Connection/Data TransmissionStatus Indicator (L/A or LINK/ACT)
Status Indication
On (green) The connection on the physical port isnormal.
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Status Indication
Blinking (orange) The connection on the physical port isnormal, and data is received or transmitted onthe port.
Off The physical connection fails.
Description of the EF8F/EG2 Port Connection Status Indicator (LINK)
Status Indication
On (green) The physical connection of the port is normal.
Off The physical connection of the port is faulty.
Description of the CQ1B/PQ1 Port Status Indicator (LOS1 to LOS4)
Status Indication
On (green) The signal on the port is normal.
On (red) The signal on the port is lost.
Off The optical module is offline.
Description of the PoE Status Indicator
Status Indication
On (green) The PoE port outputs power normally.
On (red) A PoE power output alarm is generated.The peer is a non-standard PD.
On (orange) Negotiation with the peer PD is in progress.
Off No PD is installed at the peer end and the PoEport does not output power.
Description of the Critical Alarm Indicator (CRIT)
Status Indication
On (red) Critical alarms are generated in the equipment.
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Status Indication
Off No critical alarms are generated in the equipment.
Description of the Major Alarm Indicator (MAJ)
Status Indication
On (orange) Major alarms are generated in the equipment.
Off No major alarms are generated in the equipment.
Description of the Minor Alarm Indicator (MIN)
Status Indication
On (yellow) Minor alarms are generated in the equipment.
Off No minor alarms are generated in the equipment.
Description of the Start Status Indicator Combination on the System Control Board
Table 12-1 describes the status and meaning of the start status indicator combination of the ATN910 control board from the time when it is powered on to the time when it is workingproperly.Table 12-2 describes the status and meaning of the start status indicator combinationof the ATN 950B control board from the time when it is powered on to the time when it isworking properly.
Table 12-1 Start status indicator combination
SN Status Indicator
STAT PROG
1 The system control board is not poweredon.
Off Off
2 The BIOS is being started. Off Green
3 The BIOS is started, and guides and loadsthe board software.
Off Blinking (green)
4 The upper-layer software is beinginitialized.
Green Green
5 The upper-layer software initialization iscomplete, but the system control board isnot running.
Green Green
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SN Status Indicator
STAT PROG
6 The system control board is running. Green Green
NOTEThe STAT and PROG indicators provide the control board status indication as well as the DCN availabilityindication. By default, after the ATN is powered on and automatically goes online in DCN mode, TheSTAT and PROG indicators are both blinking green for 3s, indicating that the ATN has gone online. Thenthe STAT and PROG indicators restore the control board status indication, and the status indication lastsfor 7s. After the DCN availability indication and status indication are alternately displayed for 10 minutes,the STAT and PROG indicators no longer provide the DCN availability indication and only provide thestatus indication.
Table 12-2 Start status indicator combination for ATN 950B
SN Status Indicator
STAT PROG ACTCACTX
1 The system control boardis not powered on.
Off Off Off
2 The BIOS is being started. Off Green Off
3 The BIOS is started, andguides and loads the boardsoftware.
Off Blinking (green) Off
4 The upper-layer softwareis being initialized.
Green Green Off
5 The upper-layer softwareinitialization is complete,but the system controlboard is not running.
Green Green Off
6 The system control boardis running.
Green Green Off/Green/Blinking (green)a
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SN Status Indicator
STAT PROG ACTCACTX
NOTEa: When the system control board is running, the ACTC and ACTX indicators may be off, in green orblinking (green). When services are normal, the indicator is green. For other statuses of the indicator, seeDescription of the CXP Switching Status Indicator (ACTX) and Description of the CXP ControlStatus Indicator (ACTC).
The STAT and PROG indicators provide the control board status indication as well as the DCN availabilityindication. By default, after the ATN is powered on and automatically goes online in DCN mode, TheSTAT and PROG indicators are both blinking green for 3s, indicating that the ATN has gone online. Thenthe STAT and PROG indicators restore the control board status indication, and the status indication lastsfor 7s. After the DCN availability indication and status indication are alternately displayed for 10 minutes,the STAT and PROG indicators no longer provide the DCN availability indication and only provide thestatus indication.
NOTE
The STAT and ALM indicators on the ATN 910I and ATN 910B provide the system status indication aswell as the DCN availability indication. By default, after the ATN is powered on and automatically goesonline in DCN mode, The STAT and ALM indicators are both blinking green for 3s, indicating that theATN has gone online. Then the STAT and ALM indicators restore the system status indication, and thestatus indication lasts for 7s. After the DCN availability indication and status indication are alternatelydisplayed for 10 minutes, the STAT and ALM indicators no longer provide the DCN availability indicationand only provide the status indication.
12.2 Dimensions and WeightThis chapter lists the dimensions and weight of each board used for an ATN device.
Table 12-3 provides the weight and dimensions of the boards for ATN 910.
Table 12-3 ATN 910 board weight and dimensions
Board Weight Dimensions (H x D x W)
ANC2CXPI 1.08kg 20.3 mm x 226.0 mm x 388.4 mm0.80 in. x 8.90 in. x 15.29 in.
ANC2CXPL 1.08kg 20.3 mm x 226.0 mm x 388.4 mm0.80 in. x 8.90 in. x 15.29 in.
AND1EF8T 0.53 Kg (1.17 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1EF8F 0.55 Kg (1.21 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
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Board Weight Dimensions (H x D x W)
AND1EG2 0.52 Kg (1.15 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1EG4F 0.50 Kg (1.10 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1ML1/AND1ML1A 0.56 Kg (1.23 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1EG4T 0.50 Kg (1.10 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND2ML1A/AND2ML1B 0.44 Kg (0.97 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1MD1A/AND1MD1B 0.49 Kg (1.08 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1MO1C 0.59 Kg (1.30 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1AVD8AAND1AVD8A
0.50 Kg (1.10 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1SHD4 0.60 Kg (1.32 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1SHD4I 0.6 Kg (1.32 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
TNC1PIU 0.12 Kg (0.26 lb) 41.4 mm x 224.8 mm x 21.0 mm1.63 in. x 8.85 in. x 0.83 in.
ANC1FAN 0.12 Kg (0.26 lb) 42.0 mm x 217.6 mm x 28.5 mm1.65 in. x 8.57 in. x 1.12 in.
Table 12-4 provides weight and dimensions of the boards for ATN 950B.
Table 12-4 ATN 950B board weight and dimensions
Board Weight Dimensions (H x D x W)
AND1CXPA/AND1CXPB 0.68 Kg (1.50 lb) 22.86 mm x 225.75 mm x 193.80 mm0.90 in. x 8.89 in. x 7.63 in.
AND2CXPA/AND2CXPB/AND2CXPE
0.68 Kg (1.50 lb) 22.86 mm x 225.75 mm x 193.80 mm0.90 in. x 8.89 in. x 7.63 in.
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Board Weight Dimensions (H x D x W)
AND1EM4T 0.44 Kg (0.97 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1EM8T 0.46 Kg (1.01 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1EX1 0.42 Kg (0.93 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1EM4F 0.44 Kg (0.97 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1EM8F 0.46 Kg (1.01 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND2CQ1BAND2PQ1 0.47 Kg (1.04 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND1ML1/AND1ML1A 0.56 Kg (1.23 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND3ML1A/AND3ML1B 0.44 Kg (0.97 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
AND2MD1A/AND2MD1B 0.49 Kg (1.08 lb) 20.32 mm x 225.75 mm x 193.80 mm0.80 in. x 8.89 in. x 7.63 in.
TND1PIU 0.12kg 41.4 mm x 229.9 mm x 21.0 mm1.63 in. x 9.05 in. x 0.83 in.
AND1FAN 0.30kg 86.2 mm x 217.6 mm x 28.5 mm3.39 in. x 8.57 in. x 1.12 in.
Table 12-5 provides the ATN 910I weight and dimensions.
Table 12-5 ATN 910I weight and dimensions
Model/Silkscreen
PowerSupply
Interface Weight Dimensions (H x D xW)
ATN 910I AC AC 4GE(O)+4GE/FE(O)+4GE/FE(E) 3 Kg (6.61lb)
1U x 220 mm x 442 mm,1U=44.45 mm (1.75 in.)1U x 8.66 in. x 17.40 in.
ATN 910I-C AC AC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
ATN 910I DC DC 4GE(O)+4GE/FE(O)+4GE/FE(E)
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Model/Silkscreen
PowerSupply
Interface Weight Dimensions (H x D xW)
DC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
ATN 910I-TC DC DC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1
NOTE
ATN 910I boards are not swappable. Table 12-5 provides the weight and dimensions of an integrated ATN910I chassis.
Table 12-6 provides the ATN 910B weight and dimensions.
Table 12-6 ATN 910B weight and dimensions
Model/Silkscreen
PowerSupply
Interface Weight Dimensions (H x D xW)
ATN 910B DC 2x10GE(O)+8GE/FE(O)+8FE/GE(E)+16E1
3 Kg (6.61lb)
1U x 220 mm x 442 mm,1U=44.45 mm (1.75 in.)1U x 8.66 in. x 17.40 in.ATN 910B DC 2x10GE(O)+16GE/FE(O)+8FE/GE
(E)
NOTE
ATN 910B boards are not swappable. Table 12-6 provides the weight and dimensions of an integratedATN 910B chassis.
12.3 Power ConsumptionThis chapter lists the power consumption of each board used for ATN devices.
Table 12-7 provides the power consumption of each board on ATN 910.
Table 12-7 ATN 910 board power consumption
Board Power Consumption
ANC2CXPI 28.0 W
ANC2CXPL 29.5 W
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Board Power Consumption
AND1EF8T 9.0 W
AND1EF8F 12.9 W
AND1EG2 6.1 W
AND1EG4F 13.2 W
AND1ML1/AND1ML1A 13.1 W
AND1EG4T 10.0 W
AND2ML1A/AND2ML1B 9.5 W
AND1MD1A/AND1MD1B 12.1 W
AND1MO1C 10.6 W
AND1AVD8A/AND1AVD8B 19.6 W
AND1SHD4 7.4 W
AND1SHD4I 7.5 W
TNC1PIU 0.5 W
ANC1FAN l Low rate: 2.3 Wl Medium rate: 6.1 Wl High rate: 17 W
Table 12-8 provides the power consumption of each board on ATN 950B.
Table 12-8 ATN 950B board power consumption
Board Power Consumption
AND1CXPA/AND1CXPB 27.3 W
AND21CXPA 23.6 W
AND21CXPB/AND21CXPE 28.5 W
AND1EM4T 10.4 W
AND1EM8T 21.1 W
AND1EX1 13.1 W
AND1EM4F 12.0 W
AND1EM8F 18.9 W
AND2CQ1BAND2PQ1 11.50 W
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Board Power Consumption
AND1ML1/AND1ML1A 13.1 W
AND3ML1A/AND3ML1B 9.5 W
AND2MD1A/AND2MD1B 12.1 W
TND1PIU 0.5 W
AND1FAN l Low rate: 4.1 Wl Medium rate: 13.6 Wl High rate: 30 W
Table 12-9 provides the power consumption of ATN 910I.
Table 12-9 Power consumption
Model/Silkscreen PowerSupply
Interface PowerConsumption
ATN 910I AC AC 4GE(O)+4GE/FE(O)+4GE/FE(E) 28.0 W
ATN 910I-C AC AC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1 32.8 W
ATN 910I DC DC 4GE(O)+4GE/FE(O)+4GE/FE(E) 27.6 W
DC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1 32.5 W
ATN 910I-TC DC DC 4GE(O)+4GE/FE(O)+4GE/FE(E)+16E1 32.2 W
NOTE
ATN 910I boards are not swappable. Table 12-9 provides the power consumption of an integrated ATN910I chassis.
Table 12-10 provides the power consumption of ATN 910B.
Table 12-10 ATN 910B power consumption
Model/Silkscreen PowerSupply
Interface PowerConsumption
ATN 910B-A DC 2x10GE(O)+8GE/FE(O)+8FE/GE(E)+16E1 52.1 W
ATN 910B-B DC 2x10GE(O)+16GE/FE(O)+8FE/GE(E) 49.8 W
NOTE
ATN 910B boards are not swappable. Table 12-10 provides the power consumption of an integrated ATN910B chassis.
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12.4 Interface SpecificationsThis chapter presents the list of Interface Specifications.
NOTE
An ATN device does not directly provide optical interfaces. Instead, it provides optical modules, whichsupport optical interfaces. Therefore, the optical interface specifications actually refer to the specificationsof interfaces on optical modules on an ATN device.
12.4.1 Specifications of STM-1 Optical Interfaces
FE Optical Module (commercial)
Table 12-11 Technical specifications of the FE optical interface (two-fiber bidirectional)
Item Specification
Optical interfacetype
Two-fiber bidirectional interface
100BASE-FX(15 km)
100BASE-FX(40 km)
100BASE-FX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
Working wavelengthrange (nm)
1261 to 1360 1263 to 1360 1480 to 1580
Mean launchedoptical power (dBm)
-15 to -8 -5 to 0 -5 to 0
Receiving sensitivity(dBm)
-28 -34 -34
Minimum overload(dBm)
-8 -10 -10
Minimum extinctionratio (dB)
8.2 10 10
Optical module code S4015755 S4015715 34060282
Table 12-12 Technical specifications of the GE optical interface (single-fiber bidirectional)
Item Specification
Optical interface type LC, single-fiber bidirectional interface
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Item Specification
100BASE-FXSTM-1(15 km)
100BASE-FXSTM-1(10 km)
Encapsulation type eSFP eSFP
Fiber type Single-mode Single-mode
Working wavelength range(nm)
Tx: 1260 to 1360Rx: 1480 to 1500
Tx: 1480 to 1500Rx: 1260 to 1360
Mean launched optical power(dBm)
-15 to -8 -15 to -8
Receiving sensitivity (dBm) -32 -32
Minimum overload (dBm) -8 -8
Minimum extinction ratio(dB)
8.5 8.5
Optical module code 34060363 34060364
Usage description Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 12-12, 34060363 and34060364 are used together.
FE Optical Module (industry)
Table 12-13 Technical specifications of the FE optical interface
Item Specification
Optical interfacetype
Two-fiber bidirectional interface
100BASE-FX(15 km)
100BASE-FX(40 km)
100BASE-FX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
Working wavelengthrange (nm)
1261 to 1360 1263 to 1360 1480 to 1580
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Item Specification
Mean launchedoptical power (dBm)
-15 to -8 -5 to 0 -5 to 0
Receiving sensitivity(dBm)
-28 -34 -34
Minimum overload(dBm)
-8 -10 -10
Minimum extinctionratio (dB)
8.2 10 10
Optical module code S4015755 S4015715 34060282
12.4.2 Specifications of FE Optical Interfaces
FE Optical Module (commercial)
Table 12-14 Technical specifications of the FE optical interface (two-fiber bidirectional)
Item Specification
Optical interfacetype
Two-fiber bidirectional interface
100BASE-FX(15 km)
100BASE-FX(40 km)
100BASE-FX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
Working wavelengthrange (nm)
1261 to 1360 1263 to 1360 1480 to 1580
Mean launchedoptical power (dBm)
-15 to -8 -5 to 0 -5 to 0
Receiving sensitivity(dBm)
-28 -34 -34
Minimum overload(dBm)
-8 -10 -10
Minimum extinctionratio (dB)
8.2 10 10
Optical module code S4015755 S4015715 34060282
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Table 12-15 Technical specifications of the GE optical interface (single-fiber bidirectional)
Item Specification
Optical interface type LC, single-fiber bidirectional interface
100BASE-FXSTM-1(15 km)
100BASE-FXSTM-1(10 km)
Encapsulation type eSFP eSFP
Fiber type Single-mode Single-mode
Working wavelength range(nm)
Tx: 1260 to 1360Rx: 1480 to 1500
Tx: 1480 to 1500Rx: 1260 to 1360
Mean launched optical power(dBm)
-15 to -8 -15 to -8
Receiving sensitivity (dBm) -32 -32
Minimum overload (dBm) -8 -8
Minimum extinction ratio(dB)
8.5 8.5
Optical module code 34060363 34060364
Usage description Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 12-15, 34060363 and34060364 are used together.
FE Optical Module (industry)
Table 12-16 Technical specifications of the FE optical interface
Item Specification
Optical interfacetype
Two-fiber bidirectional interface
100BASE-FX(15 km)
100BASE-FX(40 km)
100BASE-FX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
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Item Specification
Working wavelengthrange (nm)
1261 to 1360 1263 to 1360 1480 to 1580
Mean launchedoptical power (dBm)
-15 to -8 -5 to 0 -5 to 0
Receiving sensitivity(dBm)
-28 -34 -34
Minimum overload(dBm)
-8 -10 -10
Minimum extinctionratio (dB)
8.2 10 10
Optical module code S4015755 S4015715 34060282
12.4.3 Specifications of GE Optical Interfaces
FE/GE Optical Module (commercial)
Table 12-17 Technical specifications of the FE/GE optical interface (single-fiber bidirectional)
Item Specification
Optical interface type LC, single-fiber bidirectional interface
1000BASE-BX40-U(40 km)
1000BASE-BX40-D(40 km)
Encapsulation type eSFP eSFP
Fiber type Single-mode Single-mode
Working wavelength range(nm)
Tx: 1260 to 1360Rx: 1480 to 1580
Tx: 1480 to 1580Rx: 1260 to 1360
Mean launched optical power(dBm)
-3 to 2 -3 to 2
Receiving sensitivity (dBm) -24 -24
Minimum overload (dBm) -3 -3
Minimum extinction ratio(dB)
8 8
Optical module code 34060638 34060639
Usage description Used together.
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NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 12-17, 34060638 and34060639 are used together.
GE Optical Module (commercial)
Table 12-18 Technical specifications of the GE optical interface (two-fiber bidirectional)
Item Specification
Opticalinterface type
LC, two-fiber bidirectional interface
1000BASE-SX(0.5 km)
1000BASE-LX(10 km)
1000BASE-VX(40 km)
1000BASE-ZX(80 km)
1000BASE-CWDM(80 km)
Encapsulation type
eSFP eSFP eSFP eSFP eSFP
Fiber type Multi-mode Single-mode Single-mode Single-mode Single-mode
Workingwavelengthrange (nm)
770 to 860 1270 to 1360 1260 to 1360 1500 to 1580 For details,seewavelengthallocation of1000BASE-CWDMopticalinterfacesand relatedopticalmodule code.
Meanlaunchedoptical power(dBm)
-9.5 to 0 -11 to -3 -5 to 0 -2 to 5 0 to 5
Receivingsensitivity(dBm)
-17 -19 -23 -23 -28
Minimumoverload(dBm)
0 -3 -3 -3 -9
Minimumextinctionratio (dB)
9 9 9 9 8.2
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Item Specification
Opticalmodule code
34060286 34060473 S4016954 34060360 For details,seewavelengthallocation of1000BASE-CWDMopticalinterfacesand relatedopticalmodule code.
Table 12-19 Wavelength allocation of 1000BASE-CWDM optical interfaces and related optical module code
SN Opticalmodule code
Wavelength (nm) SN Opticalmodule code
Wavelength (nm)
1 34060483 1464.5 to 1477.5 5 34060478 1544.5 to 1557.5
2 34060481 1484.5 to 1497.5 6 34060476 1564.5 to 1577.5
3 34060479 1504.5 to 1517.5 7 34060477 1584.5 to 1597.5
4 34060482 1524.5 to 1537.5 8 34060480 1604.5 to 1617.5
Table 12-20 Technical specifications of the GE optical interface (single-fiber bidirectional)
Item Specification
Opticalinterface type
LC, single-fiber bidirectional interface
1000BASE-BX10-U(10 km)
1000BASE-BX10-D(10 km)
1000BASE-BX40-U(40 km)
1000BASE-BX40-D(40 km)
1000BASE-BX(80 km)
1000BASE-BX(80 km)
Encapsulationtype
eSFP eSFP eSFP eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode Single-mode Single-mode Single-mode
Workingwavelengthrange (nm)
Tx: 1260 to1360Rx: 1480 to1500
Tx: 1480 to1500Rx: 1260 to1360
Tx: 1260 to1360Rx: 1480 to1500
Tx: 1480 to1500Rx: 1260 to1360
Tx: 1260 to1360Rx: 1480 to1500
Tx: 1480 to1500Rx: 1260 to1360
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Item Specification
Meanlaunchedoptical power(dBm)
-9 to -3 -9 to -3 -3 to 5 -3 to 5 -2 to 4 -2 to 4
Receivingsensitivity(dBm)
-19.5 -19.5 -23 -23 -26 -26
Minimumoverload(dBm)
-3 -3 -3 -3 -3 -3
Minimumextinctionratio (dB)
6 6 6 6 9 9
Opticalmodule code
34060470 34060475 34060539 34060540 34060595 34060596
Usagedescription
Used together. Used together. Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 12-20, 34060470 and34060475 are used together, 34060595 and 34060596 are used together, and 34060539 and 34060540 areused together.
GE Optical Module (industry)
Table 12-21 Technical specifications of the GE optical interface (two-fiber bidirectional)
Item Specification
Optical interface type LC, two-fiber bidirectional interface
1000BASE-LX(10 km)
1000BASE-VX(40 km)
1000BASE-ZX(80 km)
Encapsulation type eSFP eSFP eSFP
Fiber type Single-mode Single-mode Single-mode
Working wavelengthrange (nm)
1280 to 1350 1260 to 1360 1500 to 1580
Mean launched opticalpower (dBm)
-11 to -3 -5 to 3 -2 to 5
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Item Specification
Receiving sensitivity(dBm)
–19 –23 –23
Minimum overload(dBm)
-3 -3 -3
Minimum extinctionratio (dB)
9 9 9
Optical module code 34060290 34060320 34060324
Table 12-22 Technical specifications of the GE optical interface (single-fiber bidirectional)
Item Specification
Optical interface type LC, single-fiber bidirectional interface
1000BASE-BX10-U(10 km)
1000BASE-BX10-D(10 km)
Encapsulation type eSFP eSFP
Fiber type Single-mode Single-mode
Working wavelength range(nm)
Tx: 1260 to 1360Rx: 1480 to 1500
Tx: 1480 to 1500Rx: 1260 to 1360
Mean launched optical power(dBm)
-9 to -3 -9 to -3
Receiving sensitivity (dBm) -19.5 -19.5
Minimum overload (dBm) -3 -3
Minimum extinction ratio(dB)
6 6
Optical module code 34060644 34060676
Usage description Used together.
NOTE
A single-fiber bidirectional module receives and transmits optical signals using different workingwavelength ranges over a single optical fiber. The receiving and transmitting working wavelength rangesof single-fiber bidirectional modules at both ends must match. As shown in Table 12-22, 34060644 and34060676 are used together.
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12.4.4 Specifications of 10GE Optical Interfaces
10GE Optical Module (commercial)
Table 12-23 Technical specifications of the 10GE optical interface
Item Specification
Opticalinterfacetype
LC, two-fiber bidirectional interface
10GE(10 km)
10GE(40 km)
10GE(80 km)
10GE(CWDM)(70 km)
10GE(DWDM)(40 km)
10GE(DWDM)(80 km)
Encapsulation type
XFP XFP XFP XFP TXFP XFP
Fiber type Single-mode
Single-mode
Single-mode
Single-mode
Single-mode
Single-mode
Workingwavelength range(nm)
1310 1550 1550 For details,seewavelengthallocationof 10GE(CWDM)opticalinterfacesand relatedopticalmodulecode.
1529.163to1560.606(wavelength tunable)
For details,seewavelengthallocationof 10GE(DWDM)opticalinterfacesand relatedopticalmodulecode.
Meanlaunchedopticalpower(dBm)
-6 to -1 -1 to 2 0 to 4 0 to 4 -1 to 2 -1 to 3
Receivingsensitivity(dBm)
-14.4 -15 -24 -24 -16 -24
Minimumoverload(dBm)
0.5 -1 -7 -9 0 -9
Minimumextinctionratio (dB)
6 8.2 9 8 10.5 8.2
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Item Specification
Opticalmodulecode
S4015772 S4015776 S4015794 For details,seewavelengthallocationof 10GE(CWDM)opticalinterfacesand relatedopticalmodulecode.
34060568 For details,seewavelengthallocationof 10GE(DWDM)opticalinterfacesand relatedopticalmodulecode.
Table 12-24 Wavelength allocation of 1000BASE-CWDM optical interfaces and related opticalmodule code
SN Opticalmodule code
Wavelength(nm)
SN Opticalmodulecode
Wavelength (nm)
1 34060547 1471 5 34060551 1551
2 34060548 1491 6 34060552 1571
3 34060549 1511 7 34060553 1591
4 34060550 1531 8 34060554 1611
Table 12-25 Wavelength allocation of 1000BASE-DWDM optical interfaces and related opticalmodule code
SN Opticalmodule code
Wavelength(nm)
SN Opticalmodulecode
Wavelength (nm)
1 34060532 1529.55 9 34060531 1548.51
2 34060515 1530.33 10 34060514 1549.32
3 34060504 1531.12 11 34060502 1550.12
4 34060503 1531.90 12 34060501 1550.92
5 34060534 1532.68 13 34060533 1551.72
6 34060628 1533.47 14 34060625 1552.52
7 34060627 1534.25 15 34060624 1553.33
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SN Opticalmodule code
Wavelength(nm)
SN Opticalmodulecode
Wavelength (nm)
8 34060626 1535.04 16 34060623 1554.13
12.4.5 Specifications of GE and FE Electrical InterfacesAn ATN device supports GE and FE electrical interfaces. This section provides specificationsof GE and FE electrical interfaces for quick reference.
Table 12-26 and Table 12-27 list specifications of GE and FE electrical interfaces, respectively.
Table 12-26 Specifications of the GE electrical interface
Item Specifications
Interface rate 10 Mbit/s, 100 Mbit/s and 1000 Mbit/s.
RJ-45 electrical interface Complies with IEEE 802.3.
Table 12-27 Specifications of the FE electrical interface
Item Specifications
Interface rate 10 Mbit/s and 100 Mbit/s.
RJ-45 electrical interface Complies with IEEE 802.3.
12.4.6 Specifications of E1 Electrical InterfacesTable 12-28 lists the specifications of the E1 interfaces.
Table 12-28 Specifications of E1 interfaces
Item Specification
Nominal bit rate (kbit/s) 2048
Interface impedance 75 ohms120 ohms
Interface code HDB3
Pulse waveform at the output interface Complies with ITU-T G.703
Attenuation tolerance of the input interface atthe point with a frequency of 1024 kHz (dB)
0 to 6
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Item Specification
Anti-interference capability of the inputinterface
Complies with ITU-T G.703
Input jitter tolerance Complies with ITU-T G.823
Output jitter Complies with ITU-T G.823
12.4.7 Specifications of T1 Electrical InterfacesTable 12-29 lists the interface specifications of the T1.
Table 12-29 Interface specifications of the T1
Item Specification
Nominal bit rate 1544 kbit/s
Interface impedance 100 ohm
Code B8ZS
Pulse shape at output port Compliant with ITU-T G.703
Anti-interference capability ofinput port
Compliant with ITU-T G.703
Input jitter tolerance Compliant with ITU-T G.824
Output jitter Compliant with ITU-T G.824
12.4.8 Specifications of the ADSL2+ InterfaceTable 12-30 lists the specifications of the ADSL2+ interface.
Table 12-30 Specifications of the ADSL2+ interfaces
Interface Max. Uplink Rate Max. Downlink Rate Max.TransmissionDistance
ADSL2+ 2.5 Mbit/s 24 Mbit/s 6.5 km
12.4.9 Specifications of the VDSL2 InterfaceTable 12-31 lists the specifications of the ADSL2+ interface.
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Table 12-31 Specifications of the VDSL2 interfaces
Interface Max. Uplink Rate Max. Downlink Rate Max.TransmissionDistance
VDSL2 50 Mbit/s 100 Mbit/s 3.5 km
12.4.10 Specifications of the G.SHDSL InterfaceTable 12-32 and Table 12-33 list the specifications of the G.SHDSL interface.
Table 12-32 Specifications of the interfaces on the AND1SHD4
Interface Max.UpstreamRate
Max.DownstreamRate
Max. Four-LineBundling Rate
Max.TransmissionDistance
G.SHDSL 5.7 Mbit/s 5.7 Mbit/s 23 Mbit/s 5.25 km
Table 12-33 Specifications of the interfaces on the AND1SHD4I
Interface Max.Upstream Rate(Mbit/s)
Max.DownstreamRate (Mbit/s)
Max. Rate ofFour BundledInterfaces(Mbit/s)
Max.TransmissionDistance (km)
G.SHDSL 2.3 2.3 9.2 5.25
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A Acronyms and Abbreviations
A
AC Alternating Current
ADSL Asymmetric Digital Subscriber Line
ADSL2+ Asymmetric Digital Subscriber Line 2 Plus
APS Automatic Protection Switching
ATM Asynchronous Transfer Mode
B
BFD Bidirectional Forwarding Detection
BITS Building Integrated Timing Supply
C
CAR Committed Access Rate
CBR Constant Bit Rate
CC Continuity Check
CES Circuit Emulation Service
D
DC Direct Current
DCN Data Communication Network
DDF Digital Distribution Frame
DIP Dual In-line Package
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E
EFM Ethernet in the First Mile
ESD ElectroStatic Discharge
eSFP Enhanced Small Form-factor Pluggable
ETSI European Telecommunications Standards Institute
F
FE Fast Ethernet
G
GE Gigabit Ethernet
GND Ground
GRE Generic Routing Encapsulation
H
HDB3 High Density Bipolar of order 3 code
I
IEEE Institute of Electrical and Electronics Engineers
IMA Inverse Multiplexing over ATM
IMB Indoor Mini Box
IP Internet Protocol
ITU-T International Telecommunication Union-Telecommunicationstandardization sector
L
L3VPN Layer 3 Virtual Private Network
M
MLPPP Multi-Link Point-to-Point Protocol
MPLS MultiProtocol Label Switching
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N
NCP Network Control Protocol
NNI Network Node Interface
NQA Network Quality Analysis
NTP Network Time Protocol
O
OAM Operation, Administration and Maintenance
ODF Optical Distribution Frame
P
PW Pseudo Wire
PWE3 Pseudo Wire Emulation Edge-to-Edge
R
rt-VBR real-time Variable Bit Rate
S
SDH Synchronous Digital Hierarchy
SFP Small Form-factor Pluggable
SHDSL Single-pair High-speed Digital Subscriber Line
STM-1 Synchronous Transport Module level 1
U
UBR Unspecified Bit Rate
UBR+ Unspecified Bit Rate plus
UNI User Network Interface
X
xDSL x Digital Subscriber Line
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