atlas preparations for lhc phase-i upgrade g. darbo – infn / genova atlas week, 8 july 2009 o...

ATLAS Preparations for LHC Phase-I UpgradeG. Darbo – INFN / Genova ATLAS Week, 8 July 2009o

ATLAS Preparations for LHC Phase-I

Upgrade

ATLAS Preparations for LHC Phase-I

Upgrade

ATLAS Week

CERN, July 6th

G. Darbo - INFN / Genova

Indico AGENDA page: •http://indico.cern.ch/conferenceDisplay.py?confId=47255

ATLAS Preparations for LHC Phase-I UpgradeG. Darbo – INFN / Genova ATLAS Week, 8 July 20092

IBL StatusIBL StatusProject formally started:

• Project Leader endorsed by CB (Feb 2009)

• IBL Management Board

• IBL Kick-off meeting – July 8th – Interested Institutes leaders invited

• To converge towards a MoU for the IBL project

IBL General Meeting June 25 th & 26th • 42 talks – 2 full day technical discussion

• Whole project covered including software

TDR editor• K. Einsweiller is the TDR editor, with Mar Capeans looking at the technical implementation of the document.

EB Minutes – 3 April 2009


IBL Project & OrganizationIBL Project & OrganizationThe IBL (Insertable B-Layer) is an ATLAS Upgrade project:

• It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner Detector

• When delivered, it will become a part of the Pixel Detector and of the Inner Detector and the organization will be “absorbed” into the Pixel & ID

The organization structure has:• IBL MB: Management Board to execute the project

• IBL IB: Institute Board, which starts today as an extension of the existing Pixel IB and will be chaired by C, Goessling.

Module WG

Module WG

IBL MB(Management

Board)

IBL MB(Management

Board)

StaveWG

StaveWG

I&IWGI&IWG

Off-detWG

Off-detWG

IBL IB(Institute Board)

IBL IB(Institute Board)

Pixel Institutes

in IBL

Pixel Institutes

in IBL

New Institutes

in IBL

New Institutes

in IBL

ATLASUPO

ATLASUPO

ATLAS UPGRADE

IBL

IBL PLIBL TC


Management Board (MB)Management Board (MB)

Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

Ad-interim membershipIBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling)Offline “liaison” Pixel Off-line coordinator: A. AndreazzaTDR editor (temporary): K. Einsweiler


Ref: N. Hartman:•http://indico.cern.ch/conferenceDisplay.py?confId=43496

Predominant Stave LayoutsPredominant Stave LayoutsSeveral layouts under study: 14 staves at Rmin=~3.2 cm

• Single and double staves – One or two (redundant) cooling channels

Inverted

Sensor Sensor

Biturbine

ATLAS Preparations for LHC Phase-I UpgradeG. Darbo – INFN / Genova ATLAS Week, 8 July 20096R. Vuillermet

• The support carbon tube is fixed in 2 point of PP0 and on PP1 walls on side C and A.

• The structural pipe with a support system is moved out from the support carbon tube.

. The new beam pipe (in any configuration with OD up to 82,5 mm) is inserted from A-side. It has 2 supports at PP0 area and 2 floating wall at PP1 on side A and C.

Two global support / installation scenarios: IBL support tube (1) / no tube (2):An IBL support tube would have advantage on stiffness and simplicity/safety for IBL installation, but drawback are envelope needs (~1÷1.5 mm) and increase of radiation length

Procedure studied on mock-up at bld.180 - procedure (1) animation:• The beam pipe flange on A-side is to close to the B-layer envelope - Need to be cut on the

aluminum section

• A structural pipe is inserted inside the Beam Pipe and supported at both sides.

• The support collar at PP0 A-side is disassembled and extracted with wires at PP1.

• Beam pipe is extracted from the C-side and it pulls the wire at PP1

• New cable supports are inserted inside PST at PP0.

• A support carbon tube is pushed inside the PST along the structural pipe.

Started to setup a 1:1 mock-up of Pixel/beampipe/PP1 in Bat 180

A-side C-side

Installation ScenariosInstallation Scenarios


Requirements for Sensors/ElectronicsRequirements for

Sensors/ElectronicsRequirements for IBL

• IBL design Peak Luminosity = 3x1034 cm-2s-1

• Integrated Luminosity seen by IBL = 550 fb-1

• Total NIEL dose = 2.4 x 1015 ± 30% (σpp) ± 50% (damage factor) = 4.7 x 1015 neq/cm2

• Total radiation dose > 200 Mrad

€

Φ(r) =493

r2+

25

r

⎛

⎝ ⎜

⎞

⎠ ⎟×1014

• Fit made for 2 < r < 20 cm for L=1000fb-1

• Gives for IBL @ 3.7 cm (550 fb-1):

Φ1MeV=2.4x1015 (1.2 MGy)

• Safety factors not included in the computation (pp event generator: 30%, damage factor for 1 MeV fluences: 50%)Ref. Ian Dawson - AUW


Module Layout - ConvergenceModule Layout - ConvergenceDecision between Planar and 3D sensors will be done after TDR

• Need module prototypes with FE-I4 (second half 2010)

• Diamonds could be another option

Common sensor baseline for engineering and system purposes• 3D sensors – single chip modules

• Planar sensors – 2 chip modules

• Gap between sensors: 100µm for mechanical / high voltage requirements

• Maximum operating voltage: 1000 V (need more for planar?)

Credits: M.Garcia-Sciveres – F. Hügging


3D Sensors3D SensorsLarge collaboration

• 15 Laboratories and 3 processing facilities

Thickness 230±15 mModule type single FE-I4 assembly#electrode 2 per 250mEdge active 5m Edges guard 200m Signal (5x1015) ~12500 e-

Bias (5x1015) ~150VWcm-2( 5x1015) 33mW at -10oCLorentz angle before irr. freeEfficiency (3200 e-) 96% (0o) 99% (15o)Wafer dim. 4”Expected yield ~50%Bias bump-b and pad

FBK & CNM

SINTEF/Stanford

Credits: C. Da Via on behalh of ATLAS 3D Sensor R&D


Planar SensorPlanar SensorPlanar sensor R&D approved by sLHC USG

• 16 Institutions

• High dose (also for IBL)

• Low cost – large area @ sLHC

• N-on-n & n-on-p

For IBL:• improve radiation

hardening

• Slim edge (no overlap in Z)

• Optimize guard-ring vs. Vbias


Planar Sensors – Slim EdgePlanar Sensors – Slim Edge


3D & Planar – Test Beam (June ‘09)

3D & Planar – Test Beam (June ‘09)

Comparison of 3D and Planar• Test beam with magnetic field

• Planar sensors are sensitive to Lorentz angle: maximize charge at incidence angle = Lorentz angle

• 3D (electric field parallel to sensor surface) are not.

• Active edge: ~5 to ~10 µm from edge (see picture at the right)

3D FBK ToT at 15o 3200e-

planar


Frontend Chip - FE-I4Frontend Chip - FE-I4

7.6mm

8mm active

2.8mm

FE-I374%

active 16.8mm

20.2mm

~2mm

~200μm

FE-I4~89%

Ch

art

ere

d r

eti

cu

le (

24 x

32)

IBM

reti

cu

le

~19 mm

New FE-I4

Pixel size = 250 x 50 µm2

Pixels = 80 x 336Technology = 0.13µmPower = 0.5 W/cm2

FE-I3

Largest Chip in HEP


FE-I4 StatusFE-I4 StatusFE-I4 Status

• Prototype blocks in MPW (MOSIS) submitted 3/2008, measurements, irradiation

• Design review (3/2009): “Design Technical Issues” on full scale design

FE-I4 Design Collaboration Meeting - Bonn July 1st and 2nd 2009

• Very successful to finalize technical details needed for full design integration

• Target date for having complete chip layout done is still September 09

• The technical schedule for each circuit block delivery is being updated

• Many interfaces have been finalized and documentation of the details is under way

• Internal communication between circuit blocks

• data output format headers, configuration read-back, etc.

• Partitioning of power "planes" and power-up sequence

• Pinout (being updated)


FE-I4 Pixel Cell LayoutFE-I4 Pixel Cell Layout


Cooling: CO2 or C3F8Cooling: CO2 or C3F8

IBL cooling Ptotal =1.5kW

Prototyping CO2 and C3F8 cooling system in cooperation with ATLAS CERN cooling groups and NIKHEF

Prototype staves and cooling pipes/heater assemblies ready to start measurements on heat transfer coefficient and thermal performance of stave

• Pipe material plays important role in thermal gradient: figure of merit is between 16.5 C.cm2/W (CF) and 2.4 C.cm2/W (Ti), Ti therefore allows for higher sensor power before thermal run-away

• Choice of coolant influences pipe diameter (CO2: ~1.6mm, C3F8 ~3mm) and minimal evaporation temperature (C3F8 min Tevap=-30C, CO2 min Tevap= -45C)

• Want redundancy (2 pipes) to avoid this significant “single point failure” in case of leak/blockage of one pipe

Very preliminary & conservative material breakdown for different options:

Credits: D. Giugni, P. Schwemling, H. Pernegger


When is IBL Ready to Install?When is IBL Ready to Install?Difficult answer…:

• In February (AUW) we have been told that the installation date was delayed by one year

• End of 2012 -> end to 2013

• Today we feel that the 2013 is optimistic

• Earliest starting date for Phase I is the 2013/2014 shutdown.

• The availability of LINAC4 (around 2014) will define the shutdown for Phase I, upgrade, when the IBL would be installed.

• The Upgrade Project Office (May 12th) suggests to use 2014/2015 as a guideline for the IBL installation date.

• We are now working with a schedule that foresee an installation date in 2014/2015

• Need to agree with LHC machine on Phase I date -> LHCC

• The FE-I4 and Sensor/Module are on the critical path, and installing earlier than 2014/2015 would require some compromises in the performance.


FEI4 drives the schedule for modules-getting the next FEI4 asap is crucial for module qualification

Stave 0 plays a crucial to qualify the IBL system (mechanics, staves and off detector electronics)

Service installation happens in shutdowns- need definition & procurement of services (USA15->PP2) early on to use shutdown time efficiently

Commissioning as part of Pixel system

Credits: H. Pernegger


IBL Software - Migration to Athena/G4

IBL Software - Migration to Athena/G4

Attilio Andreazza coordinating the activities - mailing list for IBL software development•[email protected]

Implement IBL in the existing ATLAS software framework• Detector simulation based on Geant 4

• Keep up with material updates in the ID and surroundings

• Use existing ATLAS track reconstruction algorithms

• Use existing b‐tagging algorithms

Meeting end of July to discuss progress:• G4 geometry implementation (Dmitri Tsybychev)

• Implementation of different digitizations (Vadim Kostyukhin)

• Simulation of radiation damage (from current pixel community)

• Define benchmarks for TDR


TDAQ @ sLHC Phase ITDAQ @ sLHC Phase IWork has started within Level-1 to

• revisit the performance of current L1 algorithms at 1034 and extend to 3x1034

• Understand the benefits of topological information

• Hardware changes necessary to propagate/use the topological info L1Calo and L1Muon to understand together how

• L1Calo info can be propagated to L1Muon for muon isolation purposes

• the max latency available to work within

FTK is a hardware track reconstruction system • It would work on L1A events and produce tracks in the whole InDet (not RoIs) within

10s of µs to be used by L2 (tracking performance similar to L2)

• Work has been hampered by difficulty in producing sizable simulation datasets at 1034

• Asked to explore

• How FTK deals with 3x1034 (needs simulation)

• How FTK can incorporate the IBL

• How the FTK compares with expanding the L2 farm

• Planning to submit a TDR by end 2009


Muon @ sLHC Phase IMuon @ sLHC Phase IMuon detector has large uncertainty (factor 5) on cavern background:

• Possible performance degradation in the very forward region 2.0< <2.7 (CSC region)

• Original Muon Spectrometer Design with 2 layers of CSC (8 precision measurements) but currently only one layer installed.

• Study the possibility to reinforce the CSC region by inserting a thin (50 mm) detectors to provide more measuring points and possibly pad read-out

• Current Options:• TGC• MicroMegas• ThinTubes MDT


BACKUP SLIDESBACKUP SLIDES


New Beam PipeNew Beam PipeFrom Ray’s presentation to PO 10/6

• http://indico.cern.ch/conferenceDisplay.py?confId=60437

Need beam pipe ready for integration in SR1 1 year before IBL installation• Beam pipe production ARO long (2 years at manufacturer + 8mo for preparation at

Cern ??? - To be verified)

2009:Aim to have full technical drawing of beam pipe by end of this year (flanges,..)

Important: Need to make official request to Beam Pipe group now

Start market survey

25mm radius compatible with aperture and mechanics

Open question to validate this number• larger TAS, smaller VI• Machine induced background• Impedance requirement & Vacuum


IBL kick-off Meeting – Draft Agenda

IBL kick-off Meeting – Draft Agenda

9:00 – Introduction – G.Darbo (20 min)• What is IBL project – first project in the upgrade phase I – deliver a 4th layer for the pixel detector –

model of resources

• Scope of the meeting

9:30 – Technical Presentation of IBL project - H. Pernegger (30 min)• Where exists a technical baseline

• Where are open technical options and what are the planned steps for a convergence

• Where technical solutions have not discussed or are very little developed

• Manpower figure

10:15 Coffee Break

10:45 Project Cost – G. Darbo (20 min)

11:15 Round table – “Wishes and Interest of Institutes” – Chair C. Gößling

12:45 Lunch

14:15 Sharing of Work – “Interactive Session” G.Darbo, C. Gößling• Fill online a table with work sharing – “the big picture”

• Keep note of inputs from round table

16:45 Coffee Break

17:15 Memorandum of Understanding – M.Nordberg• What should be inside – look at ATLAS construction MoU

• How to map “the big picture” into the MoU

18:00 End of the meeting


MB & WG OperationMB & WG OperationIBL organization is starting up:

Management Board (IBL MB) • Weekly meeting on Monday – closed meeting – issues tracking

The 4 Working groups (WG) cover the whole project:• WG1 – Module

• WG2 – Stave

• WG3 – Integration & Installation

• WG4 – Off-detector

Mailing lists – open subscription to ATLAS active members• IBL General: [email protected]

• WG1: [email protected] (alias [email protected])

• WG2: [email protected] (alias [email protected]) (it was the [email protected])



• To subscribe: https://e-groups.cern.ch/


Collaborative WorkspaceCollaborative Workspacehttps://espace.cern.ch/atlas-ibl/default.aspx


IBL CostIBL CostTotal cost 9.6 MCH:

• Use this cost to “shape the project” – revise when better understanding of the design (TDR)

• Funding Model: M&O-A, M&O-B, New project money

atlas preparations for lhc phase-i upgrade g. darbo – infn / genova atlas week, 8 july 2009 o...

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