ASML Special Applications EuropeDe Run 65015504 DR VeldhovenThe NetherlandsPhone: +31 40 268 4000

ASML Special Applications North America6580 Via Del OroSan Jose, CA 95119U.S.A.Phone: +1 408 719 6375

ASML Special Applications Asia#372 Chung-Ri Dongtan-MyunHwasung-Si, Gyunggi-Do445-813, KoreaPhone: +82 31 379 1500

www.asml.com/applications

Applications Development

Applications Development

Customized imaging solutionsASML Special Applications has a proven track record for innovative imaging solutions. We have an

experienced team of lithography experts, each skilled in translating our technology into customized

imaging solutions in an array of challenging markets.

Our tailor-made solutions help semiconductor manufacturers improve yields, cost efficiency and overall

value of ownership. We are committed to making our customers’ lithography systems the most

productive in the world.

Applications supportThough application markets are characterized by small to medium-size companies with limited resources

for introducing new equipment to their production lines, our customers continuously expand their installed

base performance by leveraging our expert support. We join forces with them to achieve their most

demanding objectives.

Examples of our support include reticle layout and test, job definition, alignment mark definition, imaging,

and alignment strategies for your specific processes. We also develop new processes for the Compound

Semiconductors industry and for other application markets such as microsystems. Start-up process

integration support is tailored to each application, and we work onsite with new installed equipment

at your facility so you can begin your production as quickly as possible for a faster time to market.

Applications Development: Test drive your productOur Applications Development Lab brings an exciting new dimension to product development.

This unique facility permits different device manufacturers to develop new processes and products

using proven ASML equipment. Cooperative customer product development has helped prove

the viability and value of a number of approaches, and manufacturers have made significant

improvements in silicon devices, MEMS, image sensing devices, Thin Film Heads, SAW devices

and small displays.

Our Applications Development Lab takes all of the guesswork out of

development. Customers gain confidence that the tools they are

purchasing are capable of building their products. By eliminating

delay for engineering development, customers start volume

production as soon as their tool has been installed. In fact, customers

can meet their development milestones before their tool is even

delivered. For start-up companies, our services can contribute to

success. Moreover, every customer can explore new lithographic

applications and utilize enabling technologies for new markets.

Applications DevelopmentProcess Examples

Thick Film Imaging

ASML demonstrated that, contrary to initial belief, thick film

imaging and high-aspect ratio images are capable of being

printed on a high-NA reduction wafer stepper. This gives the

MEMS manufacturers and other industries the performance

of reduction tooling without losing their printing capabilities.

3DAlign™

3DAlign, an optical front-to-back alignment technology,

allows ASML’s production-proven lithography steppers to

provide fully automated, high-throughput, double-sided

processing of MEMS devices. The 3DAlign option also

enables high-accuracy, backside-only alignment, which

de-couples alignment from process.

Nanotubes

ASML Special Applications recognized early on the tremendous

potential of commercializing nanoelectromechanical switch

technology using carbon nanotubes. In collaboration with its

partners and customers, ASML SA has played an instrumental

role in fostering so-called NRAM memory chip technology that

could lead to a fundamental shift in the semiconductor

industry from silicon to carbon and from volatile DRAM chips

to non-volatile NRAM memory.

Small Piece Handling

In the emerging photonics and III-V device markets, substrate

materials are expensive. These new technologies require

advanced imaging on tools that typically handle only 200-300

mm wafers. Especially in R&D, the ability to keep costs down

by using small pieces is essential. Advanced exotic materials

are normally available only in small wafer sizes but we have

solutions for both PAS 5000™ and PAS 5500™ platforms.

Flexible Material Processing

Emerging markets require out-of-the-ordinary processing

solutions. We have experience with a variety of challenging

substrate materials such as InP, GaAs, AlTic, ceramic, quartz

and glass, and we have special methods to handle a full

range of wafer sizes.

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