text book: silicon vlsi technology fundamentals, practice and modeling authors: j. d. plummer, m. d....

Text Book: Silicon VLSI Technology

Fundamentals, Practice and ModelingAuthors: J. D. Plummer, M. D. Deal,

and P. B. Griffin

Class: ECE 6466 “IC Engineering”Instructor: Dr. W. Zagozdzon-Wosik

INTRODUCTION - Chapter 1 in the Text

• This course is basically about silicon chip fabrication, the technologies used to manufacture ICs.• We will place a special emphasis on computer simulation tools to help understand these processes and as design tools. • These simulation tools are more sophisticated in some technology areas than in others, but in all areas they have made tremendous progress in recent years.

• 1960 and 1990 integrated circuits. • Progress due to: Feature size reduction - 0.7X/3 years (Moore’s Law).

Increasing chip size - ≈ 16% per year. “Creativity” in implementing functions.

Evolution of the Silicon Integrated Circuits since 1960s

Increasing: circuit complexity, packing density, chip size, speed, and reliability

Decreasing: feature size, price per bit, power (delay) product

1960s1990s

G. Marcyk

http://www.extremetech.com/computing/116561-the-death-of-cpu-scaling-from-one-core-to-many-and-why-were-still-stuck

Dennard Scaling Expanded Moore’Law

•How to scale other parameters (oxide thickness, length, doping) •To get Moore’s Law

~ 2005 collapse of scaling

Use innovations: •Materials •Designs (FinFET, FD-SOI etc.)•Architecture (multi-core) for parallelized programs end product still too slow and too high power•Multi-core is power limited

http://www.extremetech.com/computing/116561-the-death-of-cpu-scaling-from-one-core-to-many-and-why-were-still-stuck

Chip Architecture May not Solve the Problem with Scaling and Performance

Physics/chemistry/biology

come to the rescue

for transistor designs

• The era of “easy” scaling is over. We are now in a period where technology and device innovations are required. Beyond 2020, new currently unknown inventions will be required.

Cell dimensions

Atomic dimensions

Device Scaling Over Time

Era of Simple Scaling

Scaling + Innovation(ITRS)

Invention

~16% increase in complexity each year (now:6.3% for µP, 12% for DRAM)

~13% decrease in feature size each year (now: ~10%)

0.25µm in 1997

G. Marcyk, Intel

1997 1999 2001 2004 2007 2010 2013 2016

2 nodes

High K gates

Trends in ScalingSi Microeletronics and MEMS

• 1990 IBM demo of Å scale “lithography”. • Technology appears to be capable of making structures much smaller than currently known device limits.

ITRS at http://public.itrs.net/ (2003 version + 2004 update) – on class website.

• Assumes CMOS technology dominates over entire roadmap.• 2 year cycle moving to 3 years (scaling + innovation now required).

Trends in Increasing Integration Scale of CircuitsPast, Present, and Future ICs

Historical Perspective

• Invention of the bipolar transistor - 1947, Bell Labs.

• Shockley’s “creative failure” methodology

• Grown junction transistor technology of the 1950s

Building Blocks of Integrated Circuits

Bipolar Transistors(BJT) and Metal Oxide Semiconductor Field Effect Transistors (MOSFET) with n- and p-type channels.

Fabrication of Bipolar Transistors in the 1950s

Ge used as a crystal, III and V group atoms used as dopants

Al wires

Exposed junctions had degraded surface properties and no possibility of connecting multiple devices

• Alloy junction technology of the 1950s.

p-n-p transistor

3rd group

Evolution of the Fabrication Process

The Mesa Design of Bipolar Transistors

Bell Lab, 1957, Double Diffused Process

Solid state B diffusion

Solid state P diffusion

Contacts alloyed

Mesa etched

Advantage: Connection of multiple devices but no ICs

Disadvantage: Degradation by exposed junctions at the surface

Evolution of the Fabrication Process: The Planar Design of Bipolar Transistors

Implementation of a masking oxide to protect junctions at the Si surface

Boron diffusionSiO2

Mask

Oxidation possible for Si not good for Ge

Oxidation and outdiffusion

Lithography to open window in SiO2

Phosphorus diffusion through the oxide mask

Beginning of the Silicon Technology and the End of Ge devices

The planar process of Hoerni and Fairchild (1950s)

Photolithography used for Pattern Formation

Beginning of Integrated Circuits in 1959Kilby (TI) and Noyce (Fairchild Semiconductors)

• Basic lithography process which is central to today’s chip fabrication.

• Sensitive to light• Durable in etching

Alignment of Layers to Fabricate IC Elements

Emitter

Collector

Resistor

BaseResistor

• Lithographic process allows integration of multiple devices side by side on a wafer.

• Bipolar Transistor and resistors made in the base region

•Accuracy of placement ~1/4 to 1/3 of the linewidth being printed

Vcc

C

B

E

BJT

0V

Contact to collector

R=L/W•Rs

Schematic Cross-Section of Modern CMOS Integrated Circuit with Two Metal Levels

IC is located at the surface of a Si wafer (~500µm thick)

PMOS NMOS

Via

Interconnect

Silicide

Oxide Isolation

M1

M2

OXIDE

TiN

Modern IC with a Five Level Metallization Scheme.

Planarization

• Actual cross-section of a modern microprocessor chip. Note the multiple levels of metal and planarization. (Intel website).

Computer Simulation Tools (TCAD)

•Most of the basic technologies in silicon chip manufacturing can now be simulated.Simulation is now used for:

• Designing new processes and devices.• Exploring the limits of semiconductor devices and

technology (R&D).• “Centering” manufacturing processes.• Solving manufacturing problems (what-if?)

• Simulation of an advanced local oxidation process.

• Simulation of photoresist exposure.

Semiconductors: Si, Ge, and Compound (III-V, II-VI)

Four valence electrons

Covalent bonding: no free electrons at 0K

P-type dopants

N-type dopants

Review: materials and devices(after Streetman & Kano)

Dopants have• to be compatible with processing (ex. slow diffusion through oxide)• to have high solubility in Si

Intrinsic Semiconductor

Electron and hole generation occur at elevated temperature (above 0K). n=p

Energy Band Gap determines the intrinsic carrier concentration. ni EgGe< EgSi< EgGaAs

For devices we need concentrations: n and p>>ni

N- and p-type semiconductor

n≈ND

p≈NA

Ingot crystal

Possible dopant deactivation & defect formation

Resistivity as a Function of Dopant Concentration

=1/(qµnn+qµpp)

µ carrier mobility depends on scattering e.i. dopants, lattice imperfections (defects) andvibration (temperature)

µn>µp

Electrical Properties of Semicondutors Explained by a Band Model and Bond Model

n=pn=p=ni

Intrinsic (Undoped) Silicon

Energy Gap T>0K

Electrical Properties of Semicondutors Explained by a Band Model and Bond Model

n-type Silicon doped with As

Very small ionization energies ED and EA

n=NAs

moves

Dopant Ionization

nn>>pn ni≈pi

n-type semiconductor

intrinsic semiconductor

ni=1.45x1010cm-3 at RT (300K)

Distribution of Free Carries (electrons and holes) Obeys Pauli Exclusion Principle

Intrinsic Semiconductor n-type Semiconductor p=type Semiconductor

Conduction Band

Valence Band

Fermi level is the energy at which the probability of finding an electron F(E) is 0.5

below Ei

above Ei

p=Na

n=Nd

Fermi Dirac probability function:

Majority carriers

EF ≈Eg/2

Majority carriers

Density of states

Energy

Probability function Density of electrons and holes

Carriers’ Statistics

Effective density of states NC and NVF-D statistics becomes Boltzmann if E-EF>>kT (low doped)

n=niexp(EF-Ei/kT)

p=niexp(Ei-EF/kT)

np=ni2

Pauli exclusion principle important here

Parabolicdensity of states

Carrier Concentrations

n= Ncexp[-(EC-EF)/kT]=niexp(EF-Ei/kT)

p= Ncexp[-(EF-EV)/kT]= niexp(Ei-EF/kT)

np=ni2 =NCNVexp(-EG/kT)=KT3exp(- EG/kT)

EG=

EC

EV

EC-EV Band gap

EF

For small dopant concentrations or close to the intrinsic conditions (ex. at processing temperatures) charge neutrality should be used:

ND++p=NA

-+n then

n=1/2[N+D- N-

A)+√(N+D - N-

A)2+4ni2]

p=1/2[N-A -N+

D)+√(N-A - N+

D)2+4ni2]

Heavy doping moves EF to EC

Energy Band Dependence on Temperature

Larger temperature weakens the bonding between atoms causing the band gap energy EG (energy needed to free e-h pairs) to decrease

EG(eV)=1.17-4 -4. 73x10-4T2/(T+636)≈1.16 - (3x10-4)T

EG shrinks with T

EF

Example: doping by As and B results in p-type Si at RT

Energy levels for shallow dopants are close to the majority carrier bands

and in intrinsic Si at 1000°C

RT 1000°C

n≈p≈ni at 1000°C

p>>n

Recombination of Carriers

Si is an indirect semiconductor so indirect recombination (Shockley-Read-Hall) occurs through traps located in the mid-gap

intrinsic Si n-type Si; a trap (below EF) is always filled with electron=majority carrier and waits for a minority hole.

R=1/vthNt

lifetime capture cross sectionthermal velocity, and traps

Carier Recombination and Generation

Traps (defects,metal impurities) present in silicon act either to annihilate carriers (recombination) or produce (generation) them.

SRH recombination/generation rate

lifetime r≠g

Umax for ET=Ei

np>ni2 U>0 recombination

np<ni2 U<0 generation

s=vthNit

Surface of Si with traps lead to the surface recombination velocity, which affects carrier lifetime

Semiconductor Devices

Reverse biased diode Forward biased diode

p-n Diodes

after Kano, Sem. Dev.

n+ for low resistance

p-n Diodes at Thermal Equilibrium

Dopants’ positions are fixed

Carriers move and create depletion layers

after Kano, Sem. Dev.

Majority holes

Minority holes

Majority electronsMinority

electrons

p-n Diodes at Thermal Equilibrium

Uncompensated acceptors and donors

At thermal equilibrium charge neutrality qN+

dxn=qN-Axp leads to asymmetrical depletion layers

Electric field only in the depletion layer

p-n Diodes at Thermal Equilibrium

Build-in voltage determined by doping on both sides of the p-n junction

No current flows at thermal equilibrium

after Kano, Sem. Dev.

n0n≈ND

p0n≈ni2/ND

p-n Diodes Under Bias

Reverse biased diode

Forward biased diode

Majority electrons (and holes) diffuse, become minority carriers and produce large current

holes

(- +)

(+ -)

Minority electrons and holes drift (small current)

after Kano, Sem. Dev.

I~exp(qV/kT)I

V

I

V

p-n Diodes Under Forward Bias

Depletion layer shrinks

Electric field decreases

Junction potential decreases by Va

Energy barrier decreases by qVa

after Kano, Sem. Dev.

J

J~exp(qVa/kT)

p-n Diodes Under Reverse Bias

Depletion layer spreads mainly to the low doped side

Electric field increases

Junction potential increases by Va

Energy barrier increases by qVa

after Kano, Sem. Dev.

J0A

p-n Diodes Under Bias

Carrier Injection and Extraction

Current distribution in a p-n diodeFor the forward biasing condition

after Neudeck

No recombination assumed in the SCR

Breakdown of a p-n Diode

Zener effect Avalanche effect

after Kano and Streetman

Breakdown Voltage of a p-n Diode

after Kano and Streetman

Eg

5-7V

• Ebr field increases with ND but not very much• Wdepl~1/√ND

Vbr=Ebr•Wdepl so Vbr decreases with ND

Transistors for digital and analg applications

MOSFET and Bipolar Junction Transistors

Bipolar Transistors

E-B junction is forward biased=injects minority carriers to the baseBase (electrically neutral) is responsible for electron transport via diffusion (or drift also if the build in electric field exist) to collectorC-B diode is reverse biased and collects transported carries

VBE>0 VBC<0

IE=IEn+IEp IC=IE<1

IB=IEp+Irec

IE IC

IB

Bipolar Junction Transistors

n-p-nIntegrated circuit BJT

p-n-p Individual device

Bipolar Junction Transistors

minority carriers

Injectedelectrons

Extracted electronsholes

Forwards bias Reverse bias

Bipolar Junction Transistors

Currents’ Components

small

Bipolar Junction Transistors

Forward Operation Mode

Early Effect

Early Voltage

Bipolar Junction Transistors

Breakdown Voltages

Common BaseCommon Emitter

Collector-Base junction

Bipolar Junction Transistors

Current Gain =

Gummel Plot

Kirk Effect

Recombination in the E-B SCR

IC/IB

Bipolar Junction Transistors and a Switch

SchottkyDiode used in n-p-n BJTs forfaster speed

MOS Field Effect Transistors (MOSFET)

NMOS and PMOS (used in CMOS circuits)

VG>VT to create strong inversion

depletion

Oxide

Operation of NMOS-FET

Linear Region, Low VD

Saturation Region, Channel Starts to Pinch-Off

Saturation Region, channel shortens beyond pinch-off, L’<L

Operation of MOS-FET

ID(VD)

Channel-Length-Modulation(Shorten by L)

ID=kp[(VG-VT)VD-VD2/2

Device transconductancekp=µnCoxW/L larger for NMOS than PMOSIn CMOS for compensation use Wp>Wn

Scaled Down NMOS

DIBL

Proximity of the drain depletion layer charge sharing DIBL

Modern MOS Transistors Gate

LDDLDD used to reduce the electric field in the drain depletion region and hot carrier effects

Self aligned contacts decrease the resistance

isolation

DrainSource

Semiconductor Technology Families

First circuits were based on BJT as a switch because MOS circuits limitations related to large oxide charges

isolation

BL

n-p-n

NMOS and CMOS Technologies

Enhancement NMOS Depletion NMOS

1970s

NMOS PMOS1980s and beyond

Smaller power consumption

Challenges For The Future• Having a “roadmap” suggests that the future is well defined and there are few challenges to making it happen.

• The truth is that there are enormous technical hurdles to actually achieving the forecasts of the roadmap. Scaling is no longer enough.

• 3 stages for future development:

Materials/process innovationsNOW

Device innovationsIN 5-15 YEARS

Beyond Si CMOSIN 15 YEARS??

“Technology Performance Boosters” Invention

???

Gate

Source Drain• Spin-based devices • Molecular devices• Rapid single flux quantum• Quantum cellular automata• Resonant tunneling devices• Single electron devices

Plummer et al.

Broader Impact of Silicon Technology

Tip on Stage Individual Actuator Part of 12 x 12 arrayCornell University

-0.75V

-2.5V

-2.25V

-2V

-1.75V

-1.5V

-1.25V

-1V

-0.5V

Stanford, Cornell

• Many other applications e.g. MEMs and many new device structures e.g. carbon nanotube devices, all use basic silicon technology for fabrication.

Source

Gate

Drain

SiO2

Plummer et al.

Summary of Key Ideas• ICs are widely regarded as one of the key components of the information age.

• Basic inventions between 1945 and 1970 laid the foundation for today's silicon industry.

• For more than 40 years, "Moore's Law" (a doubling of chip complexity every 2-3 years) has held true.

• CMOS has become the dominant circuit technology because of its low DC power consumption, high performance and flexible design options. Future projections suggest these trends will continue at least 15 more years.

• Silicon technology has become a basic “toolset” for many areas of science and engineering.

• Computer simulation tools have been widely used for device, circuit and system design for many years. CAD tools are now being used for technology design.

• Chapter 1 also contains some review information on semiconductor materials semiconductor devices. These topics will be useful in later chapters of the text.

Plummer et al.