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Z.I. Les Joncquières 57 365 ENNERY Tél : (33) 387 73 86 73 Fax : (33) 387 73 87 13
CIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
CNES / ESA March 2009
RF / Microwave printed circuit
boards for space applications
A l’attention de :
- C. VILLETTE (European Space Agency)
- J.L. LORTAL (Centre National d’Etudes Spatiales)
Copie :
- C. DREVON (Thales Alenia Space)
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Dear Madam, dear Sir,
We would like to thank you for your interest in Cimulec know-how and manufacturing
capabilities for RF / Microwave printed circuit boards.
Since late in the 90’s, Cimulec worked in this field and is able to provide innovative solutions for
special and complex RF / Microwave bare boards :
- standard multilayer or sequential build-up up to 20 layers (more if requested),
- RF materials such as thermoset, PTFE, …
- embedded resistors,
- RF openings,
- high frequencies up to 30 GHz,
- other tools are shown in this documentation.
The goal of this presentation is to propose to the European Space community our support and
experience to develop new applications based on reliable, high quality, and tested solutions
already used for space programs with Thales Alenia Space.
Cimulec is already the long term partner for Thales Alenia Space and we are manufacturing
special RF /Microwave flying models for several programs (STENTOR, SYRACUSE,
GLOBALSTAR, …) which are described in this document. For those programs, printed circuits
boards were submitted to customer space qualification process with positive results and we
would like to extend to an ESA qualification for the benefit of all European Space Industry.
Cimulec has the will to act as a European leader of the PCB space industry, and support
customers in their actual and future needs, for high technology bare boards.
We remain fully at your disposal, with your suitability, to discuss further in details this
presentation and the advantages we can provide for European space applications.
Laurent BODIN
General Manager
Jean-Pierre LUCAS
President
François-Xavier LUCAS
Sales Manager
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CONTENTS
1 - Company profile......................................................................................................................... p. 4
1.1 Identity ............................................................................................................................. p. 4
1.2 Domain of activity............................................................................................................ p. 4
1.3 References ........................................................................................................................ p. 5
1.4 Printed circuit boards technologies .................................................................................. p. 5
1.5 Printed circuit boards for RF applications ....................................................................... p. 6
1.6 Cimul-Ohm technology (PCB with buried resistors)....................................................... p. 8
1.7 Manufacturing capabilities and productibilities............................................................... p. 9
2 - Technical Heritage ..................................................................................................................... p. 9
2.1 Materials........................................................................................................................... p. 9
2.2 RF / Microwave Technical Heritage .............................................................................. p. 10
2.3 Technical Heritage ......................................................................................................... p. 10
2.3.1 Space qualified programs .................................................................................. p. 10
2.3.2 Bare boards R&D for space applications........................................................... p. 12
2.3.3 Other RF / Microwave programs....................................................................... p. 14
3 - Quality system management .................................................................................................... p. 15
Annex 1. EUMC2005 poster ......................................................................................................... p. 16
Annex 2. List of equipments.......................................................................................................... p. 17
Annex 3. Board exhibited during IPC 2008 .................................................................................. p. 18
Annex 4. Manufacturing capabilities............................................................................................. p. 19
Annex 5. Multilayer Printed Circuit Board at 12-14 GHz with MCMs and MMICs ................... p. 23
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1 - Company profile
1.1 Identity
• Cimulec
Z.I. Les Jonquières
57365 ENNERY
Tel : +33 387738673
Fax : +33387738713
Web : www.cimulec.com
Email :
. fxlucas@cimulec.com (Sales Manager)
. lbodin@cimulec.com (General Management)
• Location : center of Europe, Ennery (Moselle)
• 4800 sqm. facility
• 71 employees
• Turnover : 8 M€ year 2008, 8 M€ forecast for 2009
• 90 % of the activity for military, avionic and space markets
• 48 % of sales for export (european zone)
• Qualification and certification : ISO 9001 V2000, EN9100, MIL-P 55110,
MIL-P 50884 (copies available upon request)
• IPC Member
1.2 Domain of activity
Since foundation in 1979, Cimulec is involved in the manufacturing of special and complex
multilayers, rigid-flex and microwaves printed circuit boards.
Cimulec produces printed circuit boards dedicated to military, avionics and space applications,
from prototype to series.
Quality and reliability of our printed circuits boards reach the confidence of the main European
customers for more than 25 years.
In 1996 began the first business and technical connections with Alcatel Espace within the
framework of the project Stentor. Cimulec produced then its first embedded resistors using
OhmegaPly thin film.
In 2008, Cimulec carried out the radiating panels for the active antenna Globalstar 2 (24
antennas with more than 300 RF boards).
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1.3 References
The main customers of Cimulec are the major actors in the military, aeronautics and space
industry all over Europe. Among them:
• France : Dassault Equipements, Thales Airborn System, Thales Avionic, Safran, MBDA
France, Thales Alenia Space, …
• Germany : EADS, Rockwell Collins, Dornier, Thales ATM, …
• England : BAE Sytems Avionics, Cinch,
• Italy : Galileo Avionica Difesa, Northrop Grumman, Elettronica, …
• Spain : Indra, Elcan, …
• Denmark : Terma
• Turkey : Aselsan, Havelsan
• India : Bahrat Electronic Limited
1.4 Printed circuit board technologies
Cimulec offers to its customers printed circuit board products using all technologies available for
their applications, in accordance with the specific requirements, constraints and environmental of
each system application.
• Multilayer PCBs
• Rigid-flex PCBs
• Multilayer with heat sink (inner or outer, C.I.C)
• Multilayer with buried and/or blind via holes
• Microwave PCB’s (high frequency)
• HDI PCBs, microvias PCBs
• Multilayer with embedded resistors
• Sequential build-up PCBs
• Combination of one or more elementary technology
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1.5 Microwave boards for RF applications
Cimulec has produced high frequency and microwave printed circuit boards for many years and
has gained substantial experience in using most materials including PTFE or thermoset resin
system. The high level of quality and reliability is achieved through our skilled and experienced
engineers or operators who are using the most advanced manufacturing equipments available.
Technical capabilities :
- standard multilayer or sequential build-up up to 20 layers (more if requested),
- RF materials such as thermoset, PTFE, …
- embedded resistors,
- RF openings,
- high frequencies up to 30 GHz,
With the knowledge and our long expertise in this field, our technicians can achieved an efficient
communication with our customers, for all the aspects of the design of the printed circuits. We
believe that this know-how gives the opportunity to define a cost effective, reliable and high
quality product.
A long term partnership has been established with Thales Alenia Space (formerly Alcatel Space),
in microwave printed circuits for space applications. STENTOR, SYRACUSE, MARCOS, LNA
FAFR, embedded resistors are some examples of achievements or developments carried out with
Cimulec. In 2007, after a design to cost development phase between the engineering teams of
Thales Alenia Space and Cimulec, we began to produce and deliver the Globalstar2 radiating
panels antenna. Up to now, more than 300 boards were produced by Cimulec.
There are several reasons which give us the feeling that RF printed circuits is a technology for
the future:
- the needs for improved performances require higher signal speeds as well as better signal
integrity: the control of specific technical steps during the manufacturing process of the printed
circuits, and the use of dedicated materials with improved electrical properties, allows us to
match these targets.
- laminates with improved electrical properties provide better thermomechanical properties
compared to the standard epoxy or polyimide resin materials.
- the future developments will design printed circuits with embedded components
(resistors, capacitors, filters for example).
Our will to develop RF application field results in an increase of turnover from 8 to 21% of the
total Cimulec’s turnover during the last 24 months, for these technologies. Cimulec was present
as an exhibitor during the three last European microwave exhibitions (EUMW).
In 2005, a poster (Multilayer RF PCB for Space Applications) co-written by Alcatel Alenia
Space/Cimulec was exhibited at EUMW Paris (Appendix 1).
At Cimulec, the improvements implemented on the flex-rigid products (historical technology of
the company) are applied to microwave board products. Our people are thus able to answer all
the mechanical requirements (cavities free of resin flow, RF openings, depth drilling with Z axis
control, backdrilling,…) for RF boards.
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Tools for microwave applications :
Over the years Cimulec is developing and proposing tools dedicated to high frequencies
applications:
- embedded resistors (cf. § 1.6).
- improved etching tolerances (depending on design and product configuration).
- improved face to face registration on double sided laminates : coplanar tracks.
- backdrilling with « contact drill » option and flat drill bit : cutting of the barrel to avoid
antenna phenomenon. In some cases, this solution allows the use of a standard plated through
hole build-up instead of a sequential one to gives costs advantages.
- RF openings : signal access on the same RF layer is giving a better signal adaptation
while minimizing the losses. For this purpose, Cimulec has developed a special process in order
to minimize the risks of finish surface contamination (especially in the case of pure electrolytic
gold used for wire bonding)
RF opening sample
Backdrilling with flat drill bit
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1.6 Cimul-Ohm Technology (PCB with buried resistors)
For more than 10 years, Cimulec has proposed to its customers printed circuit boards with
embedded resistors manufactured by using thin film resistive materials from Ohmega
Technologies.
Resistors sample in a distribution board
The Ohmega-Ply material used (available in a range of 25 to 100 Ohms/square) allows Cimulec
to produce resistor values from a few units to several hundred Ohms.
This technology, mainly used for microwave applications, gives the following advantages:
• signal division and/or distribution, • in addition, RF openings minimize signal adaptation and losses,
• load resistors, • assembly times reduction,
• dimensions, space and weight reduction…
Resistive material
The material used to produce embeddded resistors is Ohmega-ply supplied by Ohmega
Technologies. It is provided as a 17.5 µm copper foil including a thin nickel-phosphorous
film of about 0.1 to 0.4 µm. Its characteristic resistivity is 25 Ω/ ±5% (other resistivity
values are available upon request).
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Supported material
Any type of dielectric can be used to support embedded resistors with Ohmega-Ply. The resistive
material is laminated on the board material by using prepreg (such as speedboard C from Gore or
prepreg associated with the laminates) depending on customer specifications and electrical
characteristics.
1.7 Manufacturing capabilities and productibilities
The list of equipments available in Cimulec is shown in Annex 2 while Annex 4 describes the
technical capabilities.
2 - Technical Heritage
2.1 Materials
Over the years, Cimulec has used most of the material with RF properties available on the
market. Cimulec is in relation with all RF laminates manufacturers and is able to discuss about
the future needs and developments.
List of RF materials used on a daily basis at Cimulec :
Manufacturer Material
Rogers RT 6002
RT 5870 / 5880
RT 6010
Ultralam 2000
RO 4003 / 4350
TMM10i
Arlon CLTE-XT
AD 600
Cuclad 250
Diclad 527
AR1000
Taconic TLY
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2.2 RF / Microwave Technical Heritage
2.3.1 Programs with space qualification:
Period Program Type of board Quantity Description
1998 STENTOR BFN 11 layers SBU board. RT6002
/ Speedboard C and OhmegaPly
10 layers BFN board 10 layers SBU board. RT6002 / Speedboard and OhmegaPly
BFN repartitor board
interco BFN board Double sided on RT 6002 2002
SYRACUSE III / SICRAL 2
Antennas Double sided on RT 6002 and
QP 35N
2004 DOMINO 2 Carrier for LNA FAFR (Chip on Board technology). Up to 30
GHz
50 active modules boards. 47 passive modules boards
RO 4003 double sided 0.3 mm thick. Surface finish
electrolytic NiAu
2007 2009
GLOBALSTAR 2 Radiating panels more than 300
boards FM + EQM / EBB / HC
4 layers standard PTH RO4003 / Speedboard and OhmegaPly, backdrilling.
5 mm thick.
2008 2009
FLIP Test vehicle similar to Syr III
BFN 1 board
10 layers SBU board RO4000 with embedded resistors
STENTOR, year 1998(see Annex 5)
STENTOR build-up
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SYRACUSE III / SICRAL 2 : year 2002 (see Annex 1)
BFN Syracuse with embedded resistors
Summary :
- 10 layers 4 drilling séq.
- PTFE material RT 6002
- 265 x 165 mm
- 3 sequences with resistors
- Finishing ENIG
- Space application
DOMINO 2 : year 2004
Double sided board RO 4003
Thickness : 0.3 mm
LNA FAFR module
GLOBALSTAR 2 : 2007-2009
Multilayer (4 layers) RO4003 with embedded resistors and backdrilling
Thickness : 5 mm
Surface finish : ENIG + coverlay
Radiating panel GLOBALSTAR 2
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SAPHIR : year 2007 - 2008
Multilayer (6 layers) mix materials (RO 4003 and polyimid) and depth control
drilling
Thickness : 1.6 mm
Mix surface finishes : ENIG and electrolytic gold
Saphir - Depth drilling sample
2.3.2 Bare boards R&D for space applications
Bread boards R&D for space applications : in partnership with Thales Alenia Space, Cimulec has
worked and is still working on RF / Microwave boards development.
Period Program Type of board Quantity Description
2003 PEA MARCOS
65 boards with 15 different designs
3 layers board RT 6002 / Speedboard with RF openings
2003 2004
DOMINO 2 OL distribution board 1 prototype and 2 EQM boards
3 layers board RT 6002 / Speedboard with RF openings
2003 2004
MARCHE CNES PCB HYPER
Test vehicle with with basic BFN patches
2 boards 6 layers standard PTH board. RO 4000 + MPass resistors +
RF openings
2006 E-CUBES Elementary bricks 26 boards RO 4003 double sided 0.8
mm thick.
2006 AGORA Elementary bricks for technological trials
30 boards RO 4003 double sided 0.3 mm thick. Surface finish
electrolytic NiAu
2007 EAF PRODUITS FI Test vehicle similar to
Syr III BFN 1 board
10 layers SBU board RO4003 / GPY
2007 ADAPTATION FILTRE SAW
Filters 20 boards Single side boards. RO 4003
0.8 mm thick
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Period Program Type of board Quantity Description
2007 GLOB-TOP DE PUISSANCE
Elementary bricks for technological trials
RO 4003 0.3 mm thick. 32 x
27 mm. Surface finish electrolytic NiAu
2007 TETE INTEGREE
KA/FI Filters
Single side boards. RO 4003 0.3 mm thick
2008 ACE 2 / ARASCOM Antennas with MEMS
components 20 boards in 2 different design
RO 4003 0.3 mm and 0.6 mm thick with tight tolerances for
lines and spaces
2008 TETE INTEGREE
KA/FI Filters 84 boards
Single side boards. RO 4003 0.3 mm thick
2008 E-CUBES Elementary bricks 15 boards + 2 test
vehicules 3 layers SBU RO4000 with
complex routing
2008 FLIP 720MHz FI Filters 32 boards RO 4003 double sided 0.8
mm thick.
2008 2009
MARCHE CNES PCB HYPER SUITE
Test vehicle similar to Syr III BFN
1 board 10 layers SBU board RO4000 with embedded resistors
2008 2009
Material study Resonating rings + coplanar lines
4 rings and lines per material
Study on 13 different material
2009 SMARTIS Elementary bricks for
switch matrix demonstrator
4 different boards type with RO 4000 (single side, 4
layers, 6 layers and 5 layers SBU)
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2.3.3 Other RF / Microwave programs
Cimulec is also working in the field of RF / Microwave applications for many customers
either in the military, avionics or others industrial segments. The boards produced there can be
SBU with mix materials, striplines boards including embedded resistors (RO 4003 or RT6002),
mix RF / BF including internal copper heat sink.
Multilayer RF/BF SBU with internal heat sink
Summary :
- 12 layers / 3 drilling seq.
- RO 4003 material
- Copper sink thickness : 0.8 mm
- Total thickness : 3.2 mm
Finishing :
- RF openings : pure gold (bonding)
- nickel on sink level
- Selective refused SnPb elsewhere
Mix RF /BF RAFALE board microsection
During year 2007, Cimulec produced for an INFINEON subsidiary a new concept of test
board for SDRAM:
- mix material RO 4003 and FR4 High Tg,
- 17 layers sequantial build-up
- 3 resistive layers (OhmegaPly 100 Ω/) with resistors implemented in the BGA area,
- impedance controlled,
- 3 backdrilling depth
- pad-on-hole technology,
- surface finish : ENIG and electrolytic gold cobalt.
This board was exhibited during the annual IPC convention in 2008 (see Annex 3).
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3 - Quality System Management
Quality policy, organisation :
Our Manual Quality, conforms to the requirements ISO 9001 Version 2000 and EN9100,
described the Quality policy of Cimulec and the organization in place to satisfy the requirements
with our customers. Since many years, Cimulec has developped a permanent improvement
process.
Products quality :
Our procedures and manufacturing instructions all the controls necessary to ensure the quality
required by our customers and conformity taking into consideration related specification.
Cimulec records all the manufacturing traceability : material lots, operations logging, …
The key control points :
• automatic optical inspection for inner layers,
• panel registration after lamination (X-Ray),
• microsections (build-up, registration, metallisation, final product),
• electrical tests, • visual inspection, • mechanical controls,
Control report :
A control report is written for each delivery. This document gives following information:
- the description of the controls carried out by CIMULEC: visual, mechanical, surface
finishes thicknesses,
- control on microsections : thickness of basic copper, plated through holes copper
thickness, …
- laminates references used in production (lot number, references, …).
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Multilayer RF PCB for Space Applications :
technological and interconnections trade-off
M. Paillard 1, F. Bodereau 1, C. Drevon 1, P. Monfraix 1, J.L. Cazaux 1, L.Bodin 2, P. Guyon 2
1Alcatel Alenia Space France , 26 Avenue Champollion, BP1187, F-31037 Toulouse, France - mathieu.paillard@alcatelaleniaspace.com2 Cimulec, Z.I "les Jonquières", F-57365 Ennery, France - lbodin@cimulec.com
Multilayer RF Printed Circuits Boards with embedded passives are complex structures to manufacture and to package while keeping good
RF performances. Here, technological solutions aimed at simplifying these issues are proposed : the use of thermoset materials instead of
thermoplastic laminates and an original interconnection technique based on "RF openings" machined in the edges of the boards. Two
breadboards based on these solutions have been developed and demonstrate very good RF performances between 5 and 15 GHz.
Return losses
-50
-40
-30
-20
-10
0
5 6 7 8 9 10 11 12 13 14 15
Frequency (GHz)
S11 (dB)
Insertion Losses
-3
-2
-1
0
5 6 7 8 9 10 11 12 13 14 15
Frequency (GHz)
S12 (dB)
Return losses
-50
-40
-30
-20
-10
0
5 6 7 8 9 10 11 12 13 14 15
Frequency (GHz)
S11 (dB)
Insertion Losses
-3
-2
-1
0
5 6 7 8 9 10 11 12 13 14 15
Frequency (GHz)
S12 (dB)
Insertion losses
-10
-8
-6
-4
-2
0
5 6 7 8 9 10
Fréquency (GHz)
S12 (dB)
Return losses
-60
-50
-40
-30
-20
-10
0
5 6 7 8 9 10
Fréquency (GHz)
S11 (dB)
Isolation
-50
-40
-30
-20
-10
0
5 6 7 8 9 10
Fréquency (GHz)
S23 (dB)
Insertion losses
-10
-8
-6
-4
-2
0
5 6 7 8 9 10
Fréquency (GHz)
S12 (dB)
Return losses
-60
-50
-40
-30
-20
-10
0
5 6 7 8 9 10
Fréquency (GHz)
S11 (dB)
Isolation
-50
-40
-30
-20
-10
0
5 6 7 8 9 10
Fréquency (GHz)
S23 (dB)
Conclusion
Complex multilayer RF Printed Circuit Boards with embedded
resistors have been designed, manufactured and tested to benchmark
PTFE and thermoset based substrates and prepregs. Advantages and
drawbacks of both technologies are discussed and thermoset laminates
are demonstrated to offer similar RF performances to their PTFE-
based counterparts but with easier and more accurate manufacturing
processes. In parallel, an original and very reproducible
interconnection technique based on "RF openings" machined in the
edges of the circuit has also been demonstrated. This method offer
new solutions for interconnections of multilayer boards to their
environment without any degradations of the RF signal. By combining
all these technological solutions, very good RF performances have
been demonstrated on different test structures up to 15 GHz.
good thermo-mechanical stability
"FR4-like" manufacturing
processes
homogeneous associated prepreg
with low bonding temperature
low cost
higher losses than thermoplastics
low losses
poor thermo-mechanical
stability
prepreg with high bonding
temperature
require specific
manufacturing processes
ThermosetsThermoplastics (PTFE)
good thermo-mechanical stability
"FR4-like" manufacturing
processes
homogeneous associated prepreg
with low bonding temperature
low cost
higher losses than thermoplastics
low losses
poor thermo-mechanical
stability
prepreg with high bonding
temperature
require specific
manufacturing processes
ThermosetsThermoplastics (PTFE)
6 layers thermoset-based breadboard manufactured by Cimulec
Complex multilayer boards at Alcatel Alenia Space
operating frequency : 5-15 GHz
large dimensions (up to 265 x 165 mm)
up to 12 layers
with embedded resistors
sequential construction (up to 5 sequences)
high reliability for space harsh environment
Applications : Beam Forming Network (BFN)
Local Oscillator frequency distribution BFN with 4 stacked multilayers PCB
RF interconnections in Multilayer PCB
Plated Through Holes and Laser microvias
• for inner interconnections
• limited positioning accuracy
and reproducibility
RF openings
• for external interconnections
• good ground plane continuity
• good reproducibility
• mechanically and laser machined
with tight tolerances at the PCB shop
• compatible with different substrates and surface metallization
Thermoset vs Thermoplastics substrates
S parameters measurements of a 50 ΩΩΩΩ
line in stripline configuration (top)
and a Wilkinson power divider (right)
on a 3 layers PTFE-based (blue line)
and a 6 layers thermoset-based (pink
line) RF PCB.
External view of a 12 layers RF PCB
with embedded resistors manufactured by Cimulec
⇒Manufacturing issues limit the overall RF performances of complex
multilayer PCB based on thermoplastic materials.
RF opening
c imulec c imulec
Annex 1
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Annex 2
Main equipements available in Cimulec
• 2 AOI equipments (Automatic Optical Inspection)
• 2 clean rooms class 100000 with 4 laminar air flux benches class 100
• 2 dry film laminators
• 5 exposure stations including one LDI (Laser Direct Imaging)
• 1 automatic exposure line
• 2 development lines
• 2 etching machines (acid and alkaline)
• 1 post-etch punch
• 4 multilayer assembly benches
• 2 automatic vacuum laminating presses
• 9 drilling and routing machines (25 spindles)
• 1 X-ray inspection equipment
• 1 plasma for hole preparation and cleaning
• 1 low build copper metallization line (thin copper)
• 1 electrolytic copper, tin, lead plating line (with reverse pulse plating)
• 1 pilot line for copper µvias filling
• 2 flying probes electrical testing machines (ATG A2 and A5 including embedded passives option)
• 1 line for soldermask
• 1 YAG laser ESI 5300
• 1 automatic line for ENIG and chemical tin
• 1 Hot Air Leveling
• 1 photoplotter
ANALYSE & CONTROL
• 1 VRT chamber (thermal shock)
• 1 ionograph (ionic contamination measurement)
• 1 microsection equipment
• 1 fischerscope (surface finish measurement) and 1 CPVS analyzer (chemistry concentrations)
• 1 differential scanning calorimeter for Tg analyses (DSC)
• 1 laboratory for chemistry analyses
• 1 Polar CITS 500 for impedance control
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Annex 3 (IPC convention 2008)
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Manufacturing CapabilitiesCIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
Product Class
Standard products
• Double sided PCB
• Multilayer PCB from standard plated
through holes to sequential multilayer
(buried and/or blind via holes)
• Multilayer PCB with microvias
• Rigid-Flex PCB
Special products
• Multilayer PCB with metal core
• Multilayer with external heat sink
• Impedance controlled PCB
• Mixed material PCB
• Microwave PCB
• PCB with embedded resistors
Note for Microvias : Type I, II, or III according to IPC / JPCA - 2315.
Manufacturing CapabilitiesCIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
Base materials
Epoxy Tg ≥ 130° CEpoxy Tg ≥ 150° CEpoxy Tg ≥ 170° CLow CTE Epoxy
Polyimid
Adhesiveless flexible material
Heat sink : copper / aluminium
Metal core : copper invar copper
PTFE (Microwave PCB)
Other materials (on request)
Material manufacturers Cimulec is working with : Isola, Hitachi, Arlon, Neltec,
DuPont , Rogers, Taconic ...
Annex 4
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Manufacturing CapabilitiesCIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
Surface finishes
Electrolytic Ni/Au (subcontracted)
Electroless Ni / Immersion Gold (ENIG)
Immersion Tin
Tin Lead reflow
Organic Surface Passivation (MecSeal)
Hot Air Levelling (SnPb)
Chemical silver (subcontracted)
Mixed Surfaces on request
5 µm / from 0.5 to 3 µm
Ni 4-7 µm ; Au 0.05-0.12 µm
> 1µm
7 - 12 µm
0.2 µm
0.15 µm
Typical thickness
Manufacturing CapabilitiesCIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
Design rules
F
GADC E
H
IB
Standard
(µm)
Special
(µm)
Line Space A 90 75
Line Width B 90 75
Micro Via Pad Diameter C 300 250
Micro Via Drill Diameter D 120 90
Line to Pad Space E 100 80
Mechanical Drill Diameter F 250 200
Board Edge to Route Clearance F 350 200
Unplated Hole to Route Clearance I 350 200
Pad Diameter for Mechanical Drills G 550 400
Notes : - values given in this table are minimum that can achieved
- Design Rules Check is performed according to the board size and copper thicknesses
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Manufacturing CapabilitiesCIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
Vias Types and
Plated Through Hole
E A G
C F
Standard
(µm)
Special
(µm)
Diameter of Blind Via (Depth Controlled) A 250 200
Diameter of Buried Via (Resin Filled) C 250 200
Diameter of Micro Via (Laser Drilled) E 120 90
Diameter of Blind Via (Resin Filled) F 250 200
Diameter of Through Via (Mechanical Drilled) G 250 200
Aspect Ratio of Blind Via (Depth Controlled) A <= 1 <= 1
Aspect Ratio of Buried Via (Resin Filled) C <= 8 <= 8
Aspect Ratio of Micro Via (Laser Drilled) E <= 1 <= 1
Aspect Ratio of Blind Via (Resin Filled) F <= 8 <= 8
Aspect Ratio of Through Via (Mechanical Drilled) G <= 8 <= 8
Limits
Manufacturing CapabilitiesCIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
Solder Mask (Probimer 77 9000 HF )
Standard
(µm)
Special
(µm)
Solder Mask Line Width 150 100
Solder Mask Clearance Diameter 100 60
Solder Mask Coating Thickness 20 N.A.
Routing Tolerances• Standard : ± 150 µm
• Special : ± 100 µm
• Laser routing : ± 40 µm Board Size• Standard : up to 580 x 417 mm• Special : greater on request
• Overall Thickness : up to 4.8 mm
Miscellaneous
EtchingTolerances• Standard : according to copper thickness• Special : down to ± 10 µm on agreement
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Manufacturing CapabilitiesCIRCUITS IMPRIMES MULTICOUCHES ET SPECIAUX
Inspection report
- Qualification and conformance inspection according to MIL-PRF-55110
- Qualification and conformance inspection according to MIL-P-50884
- IPC-6011, 6012, 6013, 6016 class I, II or III
- According to your requirements
- Acceptability of printed boards according to IPC-600 class I, II or III
- Acceptability of printed boards according to ECSS-Q-70-11A
- Electrical Test :
flying probes ; test voltage : up to 500 V DC (> 10 MΩ)
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Annex 5
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