photonic integrated circuit platforms for multi project ...€¦ · •hybrid combinations between...

Photonic Integrated Circuit platforms for Multi Project Wafer access

a.leinse@lionix-int.com

Technologies: InP, Si, TriPleX

TriPleX: Low loss, spot size converters

InP: Active components

Fraunhofer HHI

• Rx: 40GHz Photodiodes

• Tx: 25Gb/s Directly-Modulated Lasers

• Polarization Multiplexing: Pol.- Splitter and Converter

• Fiber-Chip Coupling with cleaved SSMF (Loss<2.0dB;

large 1dB-alignment-tolerance fiber-array coupling)

• Specific MPW offering

– Quick Turn-Around Time

(one MPW run every 3 months)

– Die size: 6 x 4 mm2

InP photonics: Tx-Rx Fraunhofer HHI

▪ 40G Rx - 25G Tx; SI substrate ▪ Polarization splitter and converter ▪ C-band wavelength range ▪ 2” MPW Wafers (soon 3”)

Passives MMIs, AWGs

3 etch depths

propagation loss = 0.5 - 2 dB/cm

PIN detectors (40GHz; Idark<10nA)

DFB lasers (25Gb DML)

DBR Lasers

SOAs EAMs Tunable DBR Gratings (4nm)

TO Phase Shifters (soon high-speed EO PMs)

SI substrate Pol.- Converter and Splitter (PER>15dB)

SSCs (MFD=10µm; 1.5-2dB Loss-to-SMF)

2” wafers (soon 3”)

Metal Interconnects (DC and RF)

InP photonics: Tx-Rx Fraunhofer HHI

▪ 40G Rx - 25G Tx; SI substrate ▪ Polarization splitter and converter ▪ C-band wavelength range

5Gb/s All-Optical Flip-Flop

Multi-Channel Transmitter

Short-Puls Generator

Optical Transmitter

InP photonics: Tx-Rx SMART Photonics

▪ Independent Pure Play III-V Foundry ▪ C-band wavelength range ▪ Sources, detectors and modulators

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▪ Extensive Building block library ▪ >150 designs fabricated ▪ MPW start every 3 months

▪ Passives, photodetectors, amplifiers,

lasers, high speed modulators ▪ Performance comparable to off-the-

shelf components!

InP photonics: Tx-Rx SMART Photonics

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Optical Gas Sensing: Mode Locked Laser

Widely tunable laser

Wavelength meter

▪ Independent Pure Play III-V Foundry ▪ C-band wavelength range ▪ Sources, detectors and modulators

TriPleX: a versatile dielectric photonic platform, Adv. Opt. Techn. 2015; 4(2): 189–207

TriPleX

• Adjustable polarization properties (sensors telecom)

• Low optical attenuation

• Small bend radii (small footprint!)

• Design by geometry

• Silicon and glass compatible

• Spot size converters for low loss fiber chip coupling

TriPleX photonics: MPW offering

✓ High Quality Passives (AWG, MZ, ring, ..) ✓ Low-loss waveguides ≤ 0.5 dB/cm ✓ Bend radii 125 µm allow real VLSI ✓ Spotsize converters for low coupling loss ✓ Thermo Optic Phase modulators

Visible light to IR transparency (405 to 2350 nm)

● Photonic ASIC prototypes in TriPleX MPW fab (typically a run every 4 months)

● Dies sized 16 x 16 mm2; 8 x 32 mm2

● Low-loss dielectric waveguides :

– silicon nitride

– silicon oxide

The PIX4LIFE project, a project funded by the EU under the H2020 programme (contract number: 688519)

Multi platform developments

• Hybrid combinations between different platforms

– Combinations between HHI-InP, SMART InP and TriPleX made.

TriPleX combines well with InP

• Hybrid Integration : combine the best of 2 worlds

TriPleX chip

InP Chip

Active devices Lasers, SOAs, fast modulators + PDs

Low-loss waveguides & spot-size converters Visible & NIR ranges

Tunable laser source

• Hybrid combination of InP gain section and TriPleX reflector chip to realize a tunable external cavity laser source with excellent specifications.