introduction to georgia tech prc and its industry ... · prof. rao r. tummala joseph m. pettit...
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Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair
Professor in ECE & MSEDirector, 3D Microsystems Packaging Research Center
Georgia Institute of Technology – Atlanta, GA USArao.tummala@prc.gatech.edu
Introduction to Georgia Tech PRC and Its Industry Consortium in NAE
Greetings from Georgia Tech PRC
1 | Georgia Tech PRC Prof. Rao R. Tummala
GT Seminar in Silicon Valley: Summary
GT PRC was Funded as NSF ERC with a Paradigm in:• Research to SOP• Education to X-disciplinary individual• Industry collaborations; complete supply chain eco-system
It is Setting up a Large-scale Industry Consortium in NAE• 100-person Team with $10M budget
SV Plays the Most Critical Role in NAE GT Can Help SV Companies in 3 Ways:
• Leading-edge R&D beyond 3-5 year horizon• Supply large number of the best-educated students• Provide an accelerated path from R&D to commercialization
2 | Georgia Tech PRC Prof. Rao R. Tummala
Summary of GT Presentations
Agenda• The New Era of Automotive Electronics: The Ultimate
Electronics System – Prof. Rao Tummala • Glass Packaging and 2.5D Glass BGA Interposer for Ultra-high
Bandwidth Computing – Dr. Venky Sundaram• Power Packaging for Computer Applications – Dr. P. M. Raj• 5G Communications with Glass Embedding and Fanout –
Prof. Manos Tentzeris, Dr. Venky Sundaram• Devices and 3D Glass Fanout Package for Next Generation
Radar, Lidar and Camera – Dr. Venky Sundaram • High-power Devices, High-temperature Materials and Packaging
for Electric Cars – Dr. Vanessa Smet, Prof. Shyh-Chiang Shen
3 | Georgia Tech PRC Prof. Rao R. Tummala
Outline
Introduction to Georgia Tech PRC NAE Industry Consortium @GT
4 | Georgia Tech PRC Prof. Rao R. Tummala
Research Focus:
Georgia Tech PRC Mission & Vision
Past Focus SOC
More of Moore
Current Focus 2.5D MCM 3D ICs SIP
MEMSDNA
ImageRF
ProcessorMemory
More Than Moore
Mission:Produce Best System-level and Interdisciplinary Packaging Engineers &
Leading-edge System Technologies to Supply to the Global Industry
Next Focus SOP−SOC−3D ICs with TSV
System MooreLogic
3D Memory
Glass Substrate
5 | Georgia Tech PRC Prof. Rao R. Tummala
IC2µm
Package 80µm400µm
PWBDigitalOptical
RFPower
MEMSSensors
SOP
Why System-on-Package (SOP)?
SYSTEM-ON-PACKAGEConvergent Computing, Communication, Consumer, Automotive and Biomedical
DigitalOptical
RFPower
MEMSSensorsEmbeddedPackage
6 | Georgia Tech PRC Prof. Rao R. Tummala
Education: Inter-disciplinarity of Electronics
IC IC
Power Power Signal
Package
Power Planes
Signals
Electrical SciencesSignal IntegrityPower Integrity
Material SciencesDielectricsConductorsMagneticsEncapsulantsC,L,R, Antennas
Mechanical SciencesThermo-Mechanical
Reliability– Fatique & Creep– Warpage
Heat Transfer
Chemical Sciences Lithographic ProcessesMicrostructure vs.
Properties
7 | Georgia Tech PRC Prof. Rao R. Tummala
GT PRC Started with the 1st NSF ERC in US in System Scaling and Integration to SOP
WA
CA
AZ
CO KS
TN
GASC
FL
VA
MINY
MD
MA
IL
Georgia Inst. of TechnologyPackaging Research Center
Clemson UniversityAdv. Engineering ofFibers & Films
Georgia Inst. of TechnologyCenter for the Engineeringof Living Tissue
Virginia Polytechnic InstitutePower Electronic Systems
MITBiotechnology Process Engineering Center
Johns Hopkins UniversityComputer-Integrated Surgical Systems & Technology
Vanderbilt UniversityBioengineering Educational Technology
Univ. of FloridaParticle Science & Technology
Northeastern UniversitySubsurface Sensing & Imaging Systems
Colorado State Univ.ERC for Extreme UltravioletScience & Technology
Univ. of KansasCenter for Environmentally Beneficial Catalysis
Univ. of MassachusettsCollaborative Adaptive Sensing of the Atmosphere
Univ. of MichiganReconfigurable Manufacturing Systems
Univ. of MichiganWireless Integrated MicroSystems
SUNY BuffaloMultidisciplinary Center for Earthquake Eng. Research
Univ. of IllinoisMid-America Earthquake Center
California Inst. of TechnologyNeuromorphic Systems Engineering
Univ. of Southern CaliforniaIntegrated Media Systems
Univ. of Southern CaliforniaBiomimetic MicroElectronicSystems
UC, BerkeleyPacific EarthquakeEngineering Research Center
Univ. of WashingtonEngineered Biomaterials
Univ. of ArizonaEnvironmentally Benign Semiconductor Manufacturing
8 | Georgia Tech PRC Prof. Rao R. Tummala
Georgia Tech’s Vision of Digital Convergence by 1000X Started in 1993
Digital + Analog + RF + Optical + Sensors
Computing/Internet Digital Audio Digital Imaging/Video Cellular/Wireless GPS/Satellite Sensors And, of course, timekeeping!
9 | Georgia Tech PRC Prof. Rao R. Tummala
Outcomes of Georgia Tech’s NSF ERC & Model
Research & Infrastructure
System Scaling for Smart phones 2000 ground-breaking publications 20 Faculty and 150 grad students 100 Best Paper Awards $40M SOA Laboratories
Education
Interdisciplinary Engineers Ph.D ~600,MS ~570,BS ~340
Created 20 new courses 1st undergrad & 1st Grad. book
Global IndustryCollaborations
150 US, 25 Jap., 10 Eu, 10 Korean 10 Spin-off and spin-in companies 70 Patents, and 166 IP licenses 97 Technology transfers
Funds Raised
Raised $250M for Research $350M to State of Georgia’s
Economy
DisruptiveTechnology:
SystemScaling
10 | Georgia Tech PRC Prof. Rao R. Tummala
Outline
Introduction to Georgia Tech PRC NAE Industry Consortium @GT
11 | Georgia Tech PRC Prof. Rao R. Tummala
3 Main Reasons for NAE
1. Reducing Human Fatalities 94% of 33,000 Deaths in the U.S., and 1.3M globally due to
human error2. Improving Driving – Energy Efficiency3. Improving Human ProductivityMany, many more
Mercedes-Benz F 015 Luxury in Motion Research Car
12 | Georgia Tech PRC Prof. Rao R. Tummala
Evolution and Grand Challenges in New Era of Automotive Electronics (Ford)
MP3 and ConnectivityCruise ControlTelematics Satellite
Flex FuelBattery Vehicles
Hybrid
H2 Fuel Cell
1850 1900 1925 1950 1975 2000 2006 2025
Displays analog LEDs LCDs Flex OLED ???
Software 0(1000) 0(1M) 0(10M) ???
Networks 1 2 4 6 ???
ECUs 1 80 ???
RF AM FM Cellular Sat. 4G ???
Length of wires ~50 meters ~2 kilometers ???
Power ~200 Watts ~2000 Watts ???
Autonomous Driving Collison avoidance ???
NAEGrand
Challenge
Battery lead acid NiMH Li-ion / Li-poly ???
13 | Georgia Tech PRC Prof. Rao R. Tummala
New Era of Automotive Electronicsthe Most Complex Heterogeneous Electronic System
Sensing Electronics Radar LiDAR
Cameras Integrated Radar &
Camera
High-speed & High-power
Electronics with SiGe, SiC and GaN Devices
High-temp Electronics Healthcare
ElectronicsIOTs
Computing & Communications Electronics Wireless Electronics Sensor Electronics Camera Electronics
4G LTE Digital Electronics Power Electronics
NAE: Most Complex Heterogeneous Electronics System
14 | Georgia Tech PRC Prof. Rao R. Tummala
Move to Autonomy is Happening
Adapted from: Dave McNamara, Magna
Auto
mat
ion
/ Ass
ista
nt L
evel
Year1920 1930 1940 1950 1960 1970 1980 1990 2000 2010 2020
Auto timingAutomatic Transmission
Automatic Choke
Cruise Control
Auto-on Lamps
Traction ControlSensing Wipers
Navigation
Break Assist
Lane departure prevention
Park assist Rear traffic alert Drowsiness detection Collison mitigation Blind spot mirror Rear cameras Traffic Jam Assist
15 | Georgia Tech PRC Prof. Rao R. Tummala
ADAS is Highly Heterogeneous System Requiring SOP Concept
Technologies ECU Collision Mitigation ADAS Domain ControlACC
RADAR Brake AssistLIDAR Blind Spot
Ultrasonic Park Assist
Lane AssistCamera Pedestrian Det.- Mono Traffic Sign Rec.- Stereo Auto High Beam- ToF Dynamic Lighting- IR Surround View
Night Vision
Map Data Navigation Source: Strategy AnalyticsV2V/V2X etc. Telematics
2010 2015 2020
Multifunction Camera
Highly Automated Driving Assistance based on fusion of
comprehensive environment information
Sensor Fusion
Courtesy: Dave McNamara, Magna
Highly automated driving by sensor
fusion
16 | Georgia Tech PRC Prof. Rao R. Tummala
SE USA Becoming a Global Automotive Alley
ALMS
TN NC
SC
FL
GA
KY
17 | Georgia Tech PRC Prof. Rao R. Tummala
Georgia Tech's Program in NAE
New Technologies Educated Workforce Global Manufacturing Supply Chain Heterogeneous Integration Roadmaps Standards
Georgia Tech Forming Partnerships with SEMI, IEEE CPMT, IMAPS and iNEMI
~ 50 Global Tier 1, Tier 2 and OEM Companies
&
18 | Georgia Tech PRC Prof. Rao R. Tummala
Progress in Transistor Scaling vs. Package Scaling in the Last 5 Decades
Courtesy: S.S. Iyer, IBM
Nod
e di
men
sion
(nm
)
100
10,000
1,000
0
bump pitch(um
)
100
1,000
10
• High Power>100KW• HPC: Cognitive,
Networking,5G and Beyond
• Self-driving Electronics
Package Scaling (I/O Pitch)
Transistor Scaling (Node)
Year1970 20001980 1990 20101960 2020
19 | Georgia Tech PRC Prof. Rao R. Tummala
Packaging Evolution to Next Paradigm
1970s
Leadframe
1980s
Ceramics
1990s
Build-up Laminate & WLP
Large Panel & High Throughput Packaging Glass Laminate
Wafer Packaging Si Interposer Pkg. Wafer Fan-out
20 | Georgia Tech PRC Prof. Rao R. Tummala
Why Inorganics Such as Glass?
Good Fair Poor
Ideal PropertiesMaterials
Glass SC Si Organic Metal CeramicPoly SiCharacteristic
Electrical
Physical
Thermal
Mechanical
Chemical
TPV and RDL CostReliability
Cost/mm2
High resistivity Low loss and low k Smooth surface finish Large area availability Ultra thin High Conductivity
High strength & modulus Low warpage Resistance to process
chemicals Low cost Via formation
and metallization CTE matched to Si and
PWB At 25µm I/O pitch
21 | Georgia Tech PRC Prof. Rao R. Tummala
Why Inorganic Such as Glass?
Si-Like BEOL to Close Interconnect Gap
Ultra-miniaturized High-temp. Stability Hermetic Reliability Ultra-low loss and Ultra-
high Resistivity Minimum Warpage Excellent Surface
Smoothness High Moisture Resistance Large Panel
Via over Line
Glass(Via and Line Same)
22 | Georgia Tech PRC Prof. Rao R. Tummala
Homogenous Integration Multi-Die SOC
xPU
xPU
xPU
xPU
Interposer
2.5D
Interposer
xPU
DR
AM
Challenges with SOC
32nm 14nm20nm28nm
Yield
Mask CountDefect Density 1/(x^2)
Large SOC
Heterogenous by 3D IC Stack
MEMSDNA
ImageRF
ProcessorMemory
3D SOP Architecture with SOC and 3D ICs
30µm
Logic
3D Memory
Glass Substrate
1µm Cu at 2µm pitch Thermal vias
Optical viasPower vias
IC-Package Strategy from SOC to 2.5D MCM & 3DICs to 3D SOP
23 | Georgia Tech PRC Prof. Rao R. Tummala
GT Paradigm; 3D SOP Architecture
Applications Digital: Cognitive, Cloud, Networking, THz RF 5G and Beyond Power Optical Sensors IOTs Etc.
24 | Georgia Tech PRC Prof. Rao R. Tummala
Georgia Tech Programs in NAE
5G &mm-Wave
RF (WLAN & LTE)
Integrated Voltage
Regulator
2.5DGlass
Interposer
Radar, Camera
with GFO
High-power &
Reliability
High-tempMaterial &Reliability
25 | Georgia Tech PRC Prof. Rao R. Tummala
Georgia Tech Faculty in the Industry Consortium
System Integration
Prof. TummalaTechnology Integration
I&A
Prof. AntoniouSintered Cu
Dr. SmetNon-solder
Passives
Dr. RajRF & Power
Dr. SharmaPassives
Devices: SiGe, GaN, MEMS and Sensors
Prof. ShenGaN
Prof. CresslerSiGe
Prof. DupuisGaN
Prof. HeskethSensors
Materials
Prof. LosegoDielectrics
Prof. WongEncapsulants
Substrates
Dr. SundaramGlass
Dr. LiuRDL
Design
Prof. ChangOptical
Prof. SitaramanMechanical
Prof. SwaminathanPower
Prof. JoshiThermal
Prof. GrahamThermal
Prof. TentzerisRF 5G
26 | Georgia Tech PRC Prof. Rao R. Tummala
Industry Consortia Members from US, Europe, Japan, Korea and Taiwan
27 | Georgia Tech PRC Prof. Rao R. Tummala
Environmental Testing Shared User Labs
Plating Facility Substrate Cleanroom Assembly Facility
300mm Cleanroom Pilot Facility and Labs
28 | Georgia Tech PRC Prof. Rao R. Tummala
Package Foundry
GT Strategy: Close Interconnect Gap With Glass Panel
Lith
ogra
phy
Gap
Pitc
h (µ
m)
50
200
100
020
WaferFoundry
Lithography350 10 1 .1.3
PWB
HDI PWB
BEOL
HDIInterposer
29 | Georgia Tech PRC Prof. Rao R. Tummala
Digital - HPCDigital - MobileRFPower/Analog
Ultimate Promise of Embedding & Fan-outR
elat
ive
Waf
er, P
anel
, PW
B a
nd L
CD
Siz
e (m
m)
Wafer(300mm)
LCD(1000mm)
PWB(600mm)
Panel(400-
500mm)
Lithographic Ground Rule (µm)
120 51050
LargePanel
PWB
SmallPanel
Wafer
Fraunhofer ePFO
AT&S ePFO
Schweizer ePFO
eWFO – OSATs
TDK ePFO
eWFO –TSMC
eWFO –SWIFT
ePFO –OSATs Panel
Samsung ePFO
GT GFO
eWFO –BEOL
EMIB -Intel
Ultra-low
Low
Medium
Relative C
ost
High
30 | Georgia Tech PRC Prof. Rao R. Tummala
GT Seminar in Silicon Valley: Summary
GT PRC was Funded as NSF ERC with a Paradigm in:• Research to SOP• Education to X-disciplinary Individual• Industry collaborations; Complete Supply Chain Eco-system
It is Setting up a Large-scale Industry Consortium in NAE• 100-person Team with $10M budget
SV Plays the Most Critical Role in NAE GT Can Help SV Companies in 3 Ways:
• Leading-edge R&D beyond 3-5 year horizon• Supply large number of the best-educated students• Provide an accelerated path from R&D to commercialization
rao.tummala@ece.gatech.edu
Thank you
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