iade 1400 lecture notes 2013 - university of colorado...
Post on 30-Mar-2018
224 Views
Preview:
TRANSCRIPT
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado
• Materials: doping and metals • Growing silicon crystals • Optical lithography • Moore’s Law
197
Lecture 25 Fabrication of silicon chips
• Lecture 25: Silicon chip fab
http://www-03.ibm.com/press/us/en/pressrelease/39641.wss
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado 198
Doping and wiring
http://tymkrs.tumblr.com/post/3525431464/thirteenth-ham-lesson-o-de-day
http://pcplus.techradar.com/files/pcp_images/sand_to_silicon_step_8.jpg`
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado 199
Silicon boules and wafers
http://www.quora.com/Semiconductors/How-do-silicon-boules-not-break-off-during-semiconductor-fabrication
http://www.peekreview.net/the-many-processes-of-silicon-wafer-processing/
http://www.ami.ac.uk/courses/ami4202_mdesign/u02/
http://www.ami.ac.uk/courses/ami4202_mdesign/u02/
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado 200
Optical pattern transfer
http://www.hitequest.com/Kiss/VLSI.htm
http://britneyspears.ac/physics/fabrication/photolithography.htm
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado 201
Optical Lithography
ArF laser
Illumination Shaping
Mask
Projection Camera
Si Wafer Water
l=193 nm
Resist
193 nm light illuminates a mask The mask puts a pattern on the light The light is reduced 4X in size on the resist The resist hardens where illuminated A solvent washes away the soft resist An acid could then etch the Si Or a metal could be deposted on the Si
Slide adapted from Tom Milster, “Application of ODS Technology to Lithography” ODS 2008.
http://www.opticalres.com/cv/gallery.swf
http://www.nature.com/nphoton/journal/v1/n11/covers/tech_focus_index.html
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado 202
From wafer to package
http://www.sunnyray.org/Solar-pv-jargon.htm
aspentechnologies.com
http://www.chemistryexplained.com/Ru-Sp/Semiconductors.html
Structured wafer
Wafer dicing
Wire bond
Bonded and encapsualted chip
http://forsoft.pl/grommet/transponder-wirebond.html http://www.wireandtubenews.com/2012/07/09/bonding-wire-is-scalability-the-wave-of-the-future/
Wire bonder
• Lecture 25: Silicon chip fab
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado 203
Moore’s Law
http://asia.stanford.edu/events/spring06/ee402s/slides/041306-Kamins.pdf
• Lecture 25: Silicon chip fab
http://en.wikipedia.org/wiki/Moore%27s_law
ECEN 1400 Introduction to Analog and Digital Electronics
Robert R. McLeod, University of Colorado 204
Moore’s “second law”
Illumination
Projection lens
Laser
Mask
Wafer
• Resolution 40 nm • Transfer rate ~100 THz • Cost 41 M$
ASML TWINSCAN 1900Gi
http://asia.stanford.edu/events/spring06/ee402s/slides/041306-Kamins.pdf
• Lecture 25: Silicon chip fab
top related