especificações técnicas leds de potencia z7
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
www.seoulsemicon.comwww.seoulsemicon.com
Specification
Z7
SSC Customer
Drawn Approval Approval
RoHS
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
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[ Contents ]
1. Description
2. Full code of Z7 series3. Outline dimension
4. Characteristics of Z7
5. Characteristic diagrams
6. CIE Chromaticity Diagram
7. Binning Table8. Labeling
9. Reel Packing
8. Recommended solder pad
9. Soldering profile
10. Precaution for Use
11. Revision Profile
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Document number : SSC-QP-7-07-25 (Rev.00)
Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
www.seoulsemicon.comwww.seoulsemicon.com
Z7
Features
Applications
Z7
* The appearance and specifications of the product can be changedfor improvement without notice.
The Z-Power series is designed for high
current operation and high flux output
applications. It incorporates state of the
art SMD design and low thermal resistant
material.
The Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive, large LCD
backlights and high performance torches.
Super high Flux output
and high Luminance
Designed for high
current operation
SMT solderable
Lead Free product
RoHS compliant
General Torch
Architectural lighting
Task lighting
Decorative / Pathway
lighting
Remote / Solar
powered lighting
Street lighting
Description
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
www.seoulsemicon.comwww.seoulsemicon.com
Full code of Z7 series
X1 Company S SSC
X2 Package series Z Z-Power
X3Color
WPure White
X4 0
X5
Z-Power series number 7 Z7 series
X6 Lens type A Dome-Wide
X7 PCB type 0 Emitter
X8 Revision No. A Rev0
X9X10 Luminous flux - -
X11X12 Color bin - -
X13 Forward Voltage - -
1. Part Number Form : X1X2X3X4X5X6X7X8 X9X10X11X12X13
2. Sticker Diagram on Reel & Aluminum Vinyl Bag
QUANTITY : 500
SSC PART NUMBER : X1X2X3X4X5X6X7X8
Lot No : #########
Rank :
X1X2X3X4X5X6X7X8
X9X10X11X12X13
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
www.seoulsemicon.comwww.seoulsemicon.com
Outline dimensions
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none[3] Undefined tolerance is 0.2mm
[INNER CIRCIT DIAGRAM]
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
www.seoulsemicon.comwww.seoulsemicon.com
Characteristics of Z7 (SZW07A0A)
1. Pure white
1-1 Electro-Optical characteristics at 1400mA
1-2 Absolute Maximum Ratings
Parameter SymbolValue
UnitMin Typ Max
Luminous Flux [1] V[2] 390 490 530 lm
Correlated Color Temperature [3] CCT 4700 6000 8200 K
CRI Ra 65 70 75 -
Forward Voltage[4]
VF - 3.3 4 VThermal resistance (J to S) [6] RJ-S 1.6 K/W
View Angle 2 130 deg.
Parameter Symbol Value Unit
Forward Current IF 2800 (each chip 700mA) mA
Reverse Voltage V 5 V
Power Dissipation Pd 11 W
Junction Temperature Tj 135
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +100
ESD Sensitivity [5] - 3,000V HBM -
*Notes :
[1] SSC maintains a tolerance of10% on flux and power measurements.
[2] V is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tolerance.
[4] Tolerance is 0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
[6] At thermal Resistance, J to S means junction to solder point on metal PCB.
(Ta=25, RH30%)
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
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Characteristics of Z7 (SZWW7A0A)
1. Warm white
1-1 Electro-Optical characteristics at 1400mA
1-2 Absolute Maximum Ratings
Parameter SymbolValue
UnitMin Typ Max
Luminous Flux [1] V[2] 290 355 410 lm
Correlated Color Temperature [3] CCT - 3000 - K
CRI Ra - 80 - -
Forward Voltage [4] VF 3.3 4 V
Thermal resistance (J to S) [6] RJ-S 1.6 K/W
View Angle 2 130 deg.
Parameter Symbol Value Unit
Forward Current IF 2800 (each chip 700mA) mA
Reverse Voltage V 5 V
Power Dissipation Pd 11 W
Junction Temperature Tj 135
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +100
ESD Sensitivity [5] - 3,000V HBM -
*Notes :
[1] SSC maintains a tolerance of10% on flux and power measurements.
[2] V is the total luminous flux output as measured with an integrating sphere.[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tolerance.
[4] Tolerance is 0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
[6] At thermal Resistance, J to S means junction to solder point on metal PCB.
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Z7Z7
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Color Spectrum
300 400 500 600 700 800 900
0.0
0.5
1.0
1.5
2.0
2.5
RelativeSpectralPowerSpectrum
Wavelength [nm]
Pure
Warm
(IF=350mA, Ta=25 , RH 30%)
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Z7Z7
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March.March. 20122012
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0 400 800 1200 1600 2000 2400 28000.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RelativeLuminous
Flux(X100,%)
Forward Current (mA)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0-400
0
400
800
1200
1600
2000
2400
2800
ForwardCurrent[mA]
Forward Voltage [V]
Forward Current vs. Normalized Relative Luminous Flux, Ta=25
Forward Voltage vs. Forward Current, Ta=25
Forward Current Characteristics
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0 500 1000 1500 2000 2500 3000
3000
4000
5000
6000
7000
CCT
[K]
Current [mA]
Pure
Warm
Chromaticity Coordinate vs. Forward Current, Ta=25
CCT vs. Forward Current, Ta=25
0 400 800 1200 1600 2000 2400 2800
-0.006
-0.003
0.000
0.003
0.006
0.009
0.012
ChromaticityCoordinate
Current [mA]
Pure x-axis
Pure y-axis
Warm x-axis
Warm y-axis
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25 50 75 100 125 150-1.0
-0.8
-0.6
-0.4
-0.2
0.0
ForwardVo
ltageShift[V]
Junction Temperature [Celcius]
Junction Temperature Characteristics
Relative Light Output vs. Junction Temperature at IF=1400mA
VF vs. Junction Temperature at IF=350mA
25 50 75 100 125 1500
20
40
60
80
100
RelativeLum
inousOutput[%]
Junction Temperature [Celcius]
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Z7Z7
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CCT vs. Junction Temperature at IF=350mA
Chromaticity Coordinate vs. Junction Temperature at IF=350mA
25 50 75 100 125 150-0.015
-0.012
-0.009
-0.006
-0.003
0.000
0.003
0.006
0.009
0.012
0.015
Chromatic
ityCoordinate
Junction Temperature [Celcius]
Pure x-axis
Pure y-axis
Warm x-axis
Warm y-axis
25 50 75 100 125 150
3000
4000
5000
6000
7000
8000
CCT[K]
Junction Temperature [Celcius]
Pure
Warm
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March.March. 20122012
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0 20 40 60 80 1000
200
400
600
800
1000
1200
1400
1600
Fordward
Current(mA)
Ambient Temperature(C)
0 20 40 60 80 1000
500
1000
1500
2000
2500
3000
ForwardC
urrent(mA)
Ambient Temperature(C)
Ambient Temperature vs. Allowable Forward Current@1400mA
Rj-a=10 /W
Rj-a=15 /W
Rj-a=20 /W
Rj-a=8 /W
Rj-a=10 /W
Rj-a=12 /W
Ambient Temperature vs. Allowable Forward Current@2800mA
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Radiation pattern @1400mA
-90 -60 -30 0 30 60 900.0
0.2
0.4
0.6
0.8
1.0
RelativeLumin
ousIntensity
Angle [degree]
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
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CIE Chromaticity Diagram (Pure)
IF=1400mA, Ta=25
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March.March. 20122012
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CIE Chromaticity Diagram (Warm)
IF=1400mA, Ta=25
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Binning Table
Luminous Flux (lm)
@ IF= 1400mA
BinCode
Min. Max.
Y2 290 340
Z1 340 390
Z2 390 440
A1 440 490
A2 490 540
Bin Code
Luminous Flux (lm)
@ IF= 1400mA
Color Chromaticity Coordinate
@ IF= 1400mA
Forward Voltage (V)
@ IF= 1400mA
V2 C2 H
Available ranks
Forward Voltage(V)
@ IF= 1400mA
BinCode
Min. Max.
G 2.75 3.00
H 3.0 3.25
I 3.25 3.5
J 3.5 3.75
K 3.6 3.8
Color Chromaticity Coordinate
@ IF= 1400mA
Bin
CodeMin. Max.
Ref. 15, 16 pages
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Z7Z7
(Rev.(Rev. 03)03)
March.March. 20122012
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Label
X9X10X11X12X13
- X9X10 : Luminous Flux : LF [lm]
- X11X12 : Color Coordinates : x, y
- X13 : Forward Voltage : VF [V]
Rank
X1X2X3X4X5X6X7X8
- X1 : Company
- X2 : Z-Power LED series number
- X3X4 : Color
- X5 : Series number
- X6 : Lens type
- X7 : PCB type
- X8 : Revision number
Full code form :
QUANTITY : 500
SSC PART NUMBER : SZDW7A0A
Lot No : #########
Rank :
SZDW7A0A
X9X10X11X12X13
: SZW07A0A
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Emitter Carrier & Reel Packaging
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Recommended solder pad
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none[3] This drawing without tolerances are for reference only[4] Recommended solder paste height : 30um
Solder Pad
Isolation
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Reflow Soldering Conditions / Profile
* Caution1. Reflow soldering should not be done more than one time.2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.3. Die slug is to be soldered.4. When soldering, do not put stress on the LEDs during heating.5. After soldering, do not warp the circuit board.6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
IPC/JEDEC J-STD-020C
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3 C/second max. 3 C/second max.
Preheat
- Temperature Min (Tsmin)- Temperature Max (Tsmax)- Time (Tsmin to Tsmax) (ts)
100C150 C
60-120 seconds
150C200 C
60-180 seconds
Time maintained above:- Temperature (TL)- Time (tL)
183 C60-150 seconds
217 C60-150 seconds
Peak Temperature (Tp) 215 260
Time within 5C of actual PeakTemperature (tp)2
10-30 seconds 20-40 seconds
Ramp-down Rate 6 C/second max. 6 C/second max.
Time 25C to Peak Temperature 6 minutes max. 8 minutes max.
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Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximumhumidity of 50%.
Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Soldering should be done immediately after opening the package (within 24Hrs).
b. Required conditions after opening the package
- Sealing
- Temperature : 5 ~ 40 Humidity : less than 30%
c. If the package has been opened more than 1 week or the color of the desiccant changes,
components should be dried for 10-12hr at 605
Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
Do not rapidly cool device after soldering.
Components should not be mounted on warped (non coplanar) portion of PCB.
Radioactive exposure is not considered for the products listed here in.
Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
The appearance and specifications of the product may be modified for improvement without
notice.
Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
The slug is isolated from anode electrically.
Therefore, we recommend that you dont isolate the heat sink.
Attaching LEDs, do not use adhesives that outgas organic vapor.
Precaution for use
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The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.
Notes for handling:
Avoid touching silicone resin parts especially with sharp tools such as Pincette
(Tweezers)
Avoid leaving fingerprints on silicone resin parts.
Silicone resin will attract dust so use covered containers for storage.
When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that excessive mechanical
pressure on the surface of the resin must be prevented. It is not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
Especially, if a reverse voltage is continuously applied to the product, such operation can
cause the electro-migration resulting in LED damage.
Handling of Silicone resin LEDs
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Revision Profile
No Change Date Change Issue Version
00 The institution of datasheet
01 Add flux rank
02 February.2012 Revision of data
03 March. 2012Datasheet merge between pure and warm
white
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