advanced packaging assembly solution

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✦Advanced Packaging Assembly Solution

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Solutions for Advanced Packaging Assembly

Flip Chip die

PCB

Flux

High Accuracy Placement: Embedded Device WLCSP Power QFN

Flip Chip Die Attach

SIP/MCM Assembly: Die Attach Flip Chip & Component Placement

Chip

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Growth In Advanced Packaging

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The closest Package format to a Flip Chip or WLCSP Package

What’s new?QFN (Quad Flatpack No Lead)

Flip Chip die

PCB

Flux

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QFN Market AssessmentAPAS Opportunity

Tota

l QFN

& P

QFN

Pac

kage

s

0

12.5

25

37.5

50

Year2009 2010 2011 2012 2013 2014 2015

12.410.3

8.67.2

5.443.6

41.4

34.5

28.7

24

21.819.8

18

QFN Units PQFN Units

Market in Transition Price of Gold Thermal Performance Electrical Performance

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PQFN Market AssessmentPackaging Units, Lines and Capacity Needs

Incr

emen

tal

Cap

acity

(m/c

's &

$M

)

0

32.5

65

97.5

130

Tota

l PQ

FN P

acka

ges

(B)

0

3.25

6.5

9.75

13

Year2009 2010 2011 2012 2013 2014 2015

PQFN Units Incremental PQFN m/c's Incr CAPEX $ M

90.97

75.81

63.17

129.96

108.3

90.25

12.4

10.3

8.6

7.2

5.4

43.6

63.17

75.81

90.9790.25

108.3

129.96

Incremental CAPEX $

Incremental Lines needed

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Annual Savings from no Taping = $300,000 / Year PER COMPONENT!

Wafer Re-constitution - WLCSP

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OSAT’s Strategic Value

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