alox for diffusion barriers oled displayslampx.tugraz.at/~hadley/memm/lectures15/may7.pdf · 2015....
TRANSCRIPT
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Atomic Layer Deposition(ALD)
http://en.wikipedia.org/wiki/Atomic_layer_deposition#/media/File:ALD_schematics.jpg
AlOx for diffusion barriers OLED displays
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http://www.lamresearch.com/products/deposition-products
Lam’s market-leading ALTUS systems combine CVD and ALD technologies to deposit the highly conformal films needed for advanced tungsten metallization applications. Nucleation layer formed using Lam’s Pulsed Nucleation Layer (PNL) ALD process and in-situ bulk CVD fill.
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Electrochemical Deposition (ECD)
Copper
A seed layer is deposited by CVD or PVD
The wafer is immersed in a liquid electrolyte at room temperature.
Cu
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http://www.tf.uni-kiel.de/matwis/amat/def_en/articles/damascene_and_si/damascene_process_si.html
Copper wiring
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http://www.kinetics.net/index.php/products/electro-chemical-deposition-ecd-products.html
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http://www.lamresearch.com/products/deposition-products
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Lithographie, Galvanoformung, Abformung (LIGA)
Fransila
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Lithographie, Galvanoformung, Abformung (LIGA)
http://timetapestry.blogspot.co.at/2012_12_01_archive.html
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Etching
Wet chemical etchingIon millingReactive ion etchingChemical-Mechanical Polishing
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Wet etching
Etchant Etch stop (DI water)
etching rate, anisotropy, selectivity
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Wet Etching
Fransila
Spray etching
http://www.slideshare.net/gkdelhi8/slide-25-36278815
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http://www.cleanroom.byu.edu/wet_etch.phtml
Etch rate depends on deposited m
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http://www.cleanroom.byu.edu/acid_safety.phtml
Acid safety
Read the MSDSKnow which precautions to takeDispose of acids properly
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Solvent safety
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Isotropic and anisotropic etching
http://mmadou.eng.uci.edu/Book/Q_Chap4.htm
Isotropic
Anisotropic
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KOH etches Si {110} > {100} > {111}, producing a characteristic anisotropic V-etch, with sidewalls that form a 54.7° angle with the surface (35.3° from the normal).
http://www.ece.uncc.edu/research/clean_room/fabprocesses/KOH-EtchingAndDecon.pdf
KOH etching of silicon
Self limiting depth:2
Wd =
W
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https://cmi.epfl.ch/etch/PladeKOH.php
Etching through a wafer can take hours
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https://cmi.epfl.ch/etch/PladeKOH.php
KOH etching of silicon
The <111> planes are etched 200 times slower than <100> planes.
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Other anisotropic etchants for silicon
EDP (an aqueous solution of ethylene diamine and pyrocatechol), displays a <100>/<111> selectivity of 17X, does not etch silicon dioxide as KOH does, and also displays high selectivity between lightly doped and heavily boron-doped (p-type) silicon.
Tetramethylammonium hydroxide (TMAH) presents a safer alternative than EDP, with a 37X selectivity between {100} and {111} planes in silicon.
http://en.wikipedia.org/wiki/Etching_%28microfabrication%29
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HF etching of SiO2
Stops at the silicon surface and leaves the surface hydrogen passivated.
HF is dangerous and you require special training before using it. Larger labs have a dedicated HF station.
HF reacts with glass, concrete, metals, water, oxidizers, reducers, alkalis, combustibles, organics and ceramics. It must be kept in special polyethylene or fluorocarbon plastic containers and special tools are used.
SiO2 + 6 HF = 2H+ SiF62- + 2H2O
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http://memslibrary.com/guest-articles/47-silicon-etching/4-etch-stop-techniques-for-etching-of-silicon-in-alkaline-solutions.html
Etch-stop techniques
p+ etch stopsilicon highly doped (>1019 cm-3) with boron etches very slowly
Etch stop with buried masking layersimplant O, N, or C to make SiO2, SiC, or SiNx
Electrochemically controlled pn etch stopThe voltage drops across the reverse biased junction until the n region is exposed and then the potential at the surface oxidizes the silicon
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Plasma etching
The plasma activates the etching gas which reacts at the surface to form a gaseous product.
(In PECVD a solid product is formed.)
Plasma
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The same equipment can be used for
plasma etchingplasma cleaningsurface modification
Leaves less residue than wet etching. The products are volatile.
Plasma etching
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Ion Milling
Ions (typically Ar) are accelerated at the substrate.No chemical reactionSelectivity ~ 1:1High vacuumWill etch anything
http://hitachi-hta.com/products/electron-ion-and-probe-microscopy/ion-beam-milling/im4000-ion-milling-system
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Reactive Ion Etching (RIE)
Combines physical ion milling with chemical etching.Is faster and more selective than ion milling.
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Isotropic and Anisotropic Plasma Etching
Fransila
You can use plasma etching to etch isotropically and anistotropically.
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Isotropic and Anisotropic Plasma Etching
Channels used for microneedles.Fransila
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Microbolometer
Fransila
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Bosch process
http://en.wikipedia.org/wiki/Deep_reactive-ion_etching
Repeat 2 processes over and over
1. Etch Si with SF6 (nearly isotropic)
2. Deposit passivation layer C4F8
Directional etching at the bottom breaks through the passivation layer.
Short cycles: smooth walls
Long cycles: fast etching
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Through-Silicon Via (TSV)
A vertical electrical connection (via) passing completely through a silicon wafer.
Used in 3D integration.
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Chemical Mechanical Polishing (CMP)
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Woodpile photonic crystal
http://www.sandia.gov/media/photonic.htm
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http://en.wikipedia.org/wiki/Damascening#/media/File:Damascening.jpg
Damascene process
Inlaying of one metal in another
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http://www.tomshardware.com/reviews/intel-14nm-broadwell-y-core-m,3904.html
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Cleaning
Wafer cleaning is a critical function that must be repeated many times during semiconductor manufacturing.
Villach/Austria is the global centre for the development and production of all single-wafer spin technology products for back- and front- end-of-line (BEOL/FEOL) cleaning, etching and stripping applications.