akb2007 gondro statistical simulation methodology for smart … · 2007. 10. 26. · source: /ep/...
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Page 1Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Statistical Simulation Methodologyfor a Smart Power Technology
I nfi
neo
nAutomotive Power CAD
Dr. Elmar Gondro
2007, Oct 19th
AK Bipolar 2007 / Munich
Page 2Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Outline
�Motivation�Modeling Flow�Model Quality�Conclusion
Page 3Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Motivation / Wake-Up
Zero DefectZero Defect
Design 4 Manufacturability
Design 4 Manufacturability Automotive
Excellence
Automotive Excellence
CAD PDTD
Model Quality
Flow Quality
YieldEnhancemen
t
YieldEnhancemen
t
Nominal & statisticalRepresentation of allfuture Fab Outputs
Page 4Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Five Steps Extraction Process of Electrical Parameters
NominalParameters
StatisticalParameters
PCM Targets
„Golden Wafer“
PCM Spec Limits
PCM Samples
Extraction
Centering µ
Deviations σ
Correlations
Mismatch Testchip Matching Consts
Page 5Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 1: Nominal Parameters
0.6 0.8 1 1.2
I[µ
A]
simu
VBE [V]
IC meassimu
IB meas
100
0.40.2
1e6
10000
1
0.01
0.0001
1e−6
1e−8
source: /EP/-Docu (Bipolar / Tempsense)
PCM parameters:Vbe � Ic
β � IbVbd � none
Page 6Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 1: Nominal Parameters
source: /PCM/-Docu (Bipolar)
Re-Simulation SchematicsSMART5 PCM: • 41 of 75 device types covered• 143 of 194 PCM setups can
be re-simulated simultaneously
Page 7Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 2: Parameter Centering
µ
pro
pability
densi
ty
past (T7)
Page 8Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 2: Parameter Centering
µ=Target
Definition!!!
pro
pability
densi
ty
Definition!!!
Page 9Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 2: Parameter Centering
Nom
µ=Target
pro
pability
densi
ty
Page 10Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 2: Parameter Centering
µ=Target=Nom
pro
pability
densi
ty
Page 11Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
Definition!!!
6 σ 6 σ
USLLSL µ=Target=Nom
pro
pability
densi
tyCentering and ±6σ
� cpk=2
Definition!!!
Page 12Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
µ=Target=NomLSL USL
pro
pability
densi
ty
past (T7)today
Page 13Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
µ=Target=NomLSL USL
pro
pability
densi
ty
past (T7) futuretoday
Page 14Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
µ=Target=NomLSL USL
pro
pability
densi
ty
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
Page 15Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
µ=Target=NomLSL USL
pro
pability
densi
ty
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
Page 16Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
3 σ
µ=Target=NomLSL USL
Definition!!!
3 σ
pro
pability
densi
ty
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
Centering and ±3σ� cpk=1
Definition!!!
Page 17Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
source: /MQ/-Docu (Low Volt NMOS)
Normalized PCM Window with 3 σ Process Variations
simu
YYIsat MNLE2
MMRon MNLE2
MMG MNLE2
YYVt MNLE2
ClassificationParameter
USLTargetLSL
MOSFET
Page 18Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
source: /MQ/-Docu (qnbh Bipolar)
Normalized PCM Window with 3 σ Process Variations
Bipolar
MM
VBE QNBH 50u MM
VCEO QNBH RMno simulation possible
no simulation possibleVCB QNBH RM
VEB QNBH RMno simulation possible
simu
Parameter
VBE QNBH 1m
MMB QNBH 200u
YMB QNBH 20u
MMB QNBH 200n
Classification
USLTargetLSL
Page 19Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 3: Process Deviations
source: /EP/-Docu (qnbh Bipolar)
Gummel Poon and beta Plot
Bipolar
0.8 1 1.2
I[µ
A]
simu
VBE [V]
IC meas
IB meassimu
1
0.60.40.2
10000
100
0.01
0.0001
1e−6
1e−8
1e−6 0.0001 0.01 1 100IC [µA]
10000
β[−
]
meassimu
40
90
80
70
60
50
30
20
10
0
beta @ Ic=200n, 20u, 200u
Vbe @ Ic=50u, 1m
Page 20Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 4: Correlation Table
Page 21Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 4: Correlations
source: /PCM/-Docu
0.95
0.75 0.8 0.85
Sim: c = 0.751
Vt
MN
NE2
[V]
PCM: c = 0.818
Nom=0.863
Nom=0.838
0.9
Vt MNLE2 [V]
0.9
0.85
0.8
0.75
USL=0.943
Target=0.852
LSL=0.761
USL=0.93Target=0.834LSL=0.738
Page 22Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
PCM Targets
„Golden Wafer“
PCM Limits
PCM Samples
Mismatch
Step 5: Mismatch Parameters
Area
constmismatchmismatch
2=σ
Special Device Pair Measurements on Testchiprequired
• Threshold voltages of MOS transistors• Current gains of bipolar• Sheet resistances of poly resistors
Page 23Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Monte Carlo Sections
uniform distribution of samplesµ = Target = (USL+LSL)/2σ = (USL-µ)/sqrt(3)
= σ[nom]*sqrt(3)
unif
Gaussian distribution of samplesµ = Target = (USL+LSL)/2σ = (USL-µ)/3= (USL-LSL)/6
nom
DistributionComment
LSL USL
LSL USL
Page 24Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Monte Carlo Sections
parameters shifted to their Spec Limits (USL or LSL)µ = Target = (USL+LSL)/2
σ = USL-µ= σ[nom]*3
specLimits
uniform distribution of samples within 2σ and 3σµ = Target = (USL+LSL)/2
σ ≈ (USL-µ)*0.84= σ[nom]*2.5
unif2s3s
uniform distribution of samplesµ = Target = (USL+LSL)/2
σ = (USL-µ)/sqrt(3)= σ[nom]*sqrt(3)
unif
Gaussian distribution of samplesµ = Target = (USL+LSL)/2
σ = (USL-µ)/3= (USL-LSL)/6
nom
DistributionComment
LSL USL
LSL USL
LSL USL
LSL USL
Page 25Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Monte Carlo Sections
parameters shifted to their Spec Limits (USL or LSL)µ = Target = (USL+LSL)/2
σ = USL-µ= σ[nom]*3
specLimits_noParspecLimits
uniform distribution of samples within 2σ and 3σµ = Target = (USL+LSL)/2
σ ≈ (USL-µ)*0.84= σ[nom]*2.5
unif2s3s_noParunif2s3s
uniform distribution of samplesµ = Target = (USL+LSL)/2
σ = (USL-µ)/sqrt(3)= σ[nom]*sqrt(3)
unif_noParunif
Gaussian distribution of samplesµ = Target = (USL+LSL)/2
σ = (USL-µ)/3= (USL-LSL)/6
nom_noParnom
DistributionCommentw/o Parasiticsw/ Parasitics
LSL USL
LSL USL
LSL USL
LSL USL
Page 26Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Example 1: PCM Par Vt_MNLE2 — MC Section nom
LSL USL
source: /PCM/-Docu
0.85 0.9
pro
pability
density
[%]
Vth [V]
LSL=0.738 Target=0.834 USL=0.93
Nom=0.838
PCM µ=0.836 σ=0.0121 N =1677Sim µ=0.84 σ=0.032 N =1000Spec µ=0.834 σ=0.032
00.80.75
4000
3500
3000
2500
2000
1500
1000
500
Page 27Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Example 2: PCM Par Vt_MNLE2 — MC Section unif
LSL USL
0.85 0.9
pro
pability
density
[%]
Vth [V]
LSL=0.738 Target=0.834 USL=0.93
Nom=0.838
PCM µ=0.836 σ=0.0121 N =1677Sim µ=0.838 σ=0.0551 N =1000Spec µ=0.834 σ=0.055
00.80.75
4000
3500
3000
2500
2000
1500
1000
500
Page 28Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Example 3: PCM Par Vt_MNLE2 — MC Section unif2s3s
LSL USL
0.85 0.9
pro
pability
density
[%]
Vth [V]
LSL=0.738 Target=0.834 USL=0.93
Nom=0.838
PCM µ=0.836 σ=0.0121 N =1677Sim µ=0.838 σ=0.0807 N =1000Spec µ=0.834 σ=0.081
00.80.75
4000
3500
3000
2500
2000
1500
1000
500
Page 29Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Example 4: PCM Par Vt_MNLE2 — MC Section specLimits
LSL USL
0.85 0.9
pro
pability
density
[%]
Vth [V]
LSL=0.738 Target=0.834 USL=0.93
Nom=0.838
PCM µ=0.836 σ=0.0121 N =1677Sim µ=0.838 σ=0.0962 N =1000Spec µ=0.834 σ=0.096
00.80.75
8000
7000
6000
5000
4000
3000
2000
1000
Page 30Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Corner Sections
δVth(MNND, MNND2)=0.243V
δlcap(MNTE, MNSE2)=0.32µm
δVth(MNND)=-0.139VδVth(MNND2)=-0.154Vδlcap(MNTE, MNSE2)=-0.25µm
depSlow:
dmosSlow:
depFast:
dmosFast:
Comment
depSlow_dmosSlowdepFast_dmosSlow
depSlow_dmosFastdepFast_dmosFast
There are no universally valid “worst cases” in BCD Technologies�Corners have to be defined by Device Team according to the needs of Product Development!
Page 31Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Corner Sections
δVth(PMOS)=-3σ
δ wint =-3σ
δVth(PMOS)=-3σ
δVth(PMOS)=3σ
δwint =+3σ
δVth(PMOS)=3σ
δVth(NMOS)=3σδtox =+3σδlint =+3σδCj =+3σδVth(NMOS)=-3σ
SlowSlow:
FastSlow:
SlowSlowFastSlow
δVth(NMOS)=-3σδtox =-3σδlint =-3σδCj =-3σδVth(NMOS)=3σ
FastFast:
SlowFast:
SlowFastFastFast
δVth(MNND, MNND2)=0.243V
δlcap(MNTE, MNSE2)=0.32µm
δVth(MNND)=-0.139VδVth(MNND2)=-0.154Vδlcap(MNTE, MNSE2)=-0.25µm
depSlow:
dmosSlow:
depFast:
dmosFast:
Comment
depSlow_dmosSlowdepFast_dmosSlow
depSlow_dmosFastdepFast_dmosFast
Page 32Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Model Sections
� 8 Monte Carlo Sections
� 4 sections with different distributions� 4 “no Parasitics” sections (noPar) with neglect of:
- (substrate) parasitic devices- voltage/current/power warnings- paramTests (geometry checks)
� Corresponding noPar sections speed up simulation by ≥ 25%.� No section toggle required for nominal and Gaussian MC
simulation� 8 Corner Sections
� 4 corners for NMOS/PMOS speed� 4 corners for leakage current of depletion MOS and slew rate
of DMOS� Performing Monte Carlo analysis issues an error.
Page 33Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Model Quality
� The SMART5 PCM comprises 194 measurements (ASM52).� 143 of them can be re-simulated.� PCM evaluations may serve as a testbench to quantify the
model quality (w/o correlation and mismatch).
1. Does the nominal simulation reproduce the PCM Target?nom = Target
2. Does the mean value of the Monte Carlo simulation reproduce the nominal value?
µ = nom3. Does the standard deviation of the Monte Carlo simulation
reproduce one third of the distance between the PCM Upper Spec Limit and the PCM Target (cpk=1)?
3 σ = USL-Target
Page 34Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Model Quality
source: /MQ/-Docu
Page 35Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Model Quality
source: /MQ/-Docu
meas
simu
YYIsat MNLE2
MMRon MNLE2
MMG MNLE2
Vt MNLE2 YY
ClassificationParameter
USLTargetLSL
Page 36Copyright © Infineon Technologies 2007. All rights reserved. 19.10.2007
Conclusion
� PCM: not only Process Monitoring (TD), but also Device Monitoring (CAD)
� Recommended Usage of
� Monte Carlo Section nom with ≥100 runs for small circuits� Monte Carlo Section unif2s3s_noPar with ≤100 runs for
large circuits� Corner Sections only if you know what you are doing
(worst-worst case)� Reproduction of Correlations
� Monte Carlo Section nom� Monte Carlo Section unif, unif2s3s, specLimits� Corner Sections
� To be discussed
� Benefits of Quarterly Monitoring?� Device type coverage (SMART5 PCM: 41 of 75 types)?� PCM measuring regions?� PCM AC and Temp measurements needed?