affinity 2.0 electroless nickel immersion...
TRANSCRIPT
HIGH PERFORMANCE LOW VARIATION FINAL FINISH
Affinity 2.0
Electroless Nickel – Immersion Gold
Global Final Finish Team
April 2017
A Platform Specialty Products Company. 2
MacDermid Enthone Electronics SolutionsLeading Chemical Process Supplier in Global Electronics Markets
A Platform Specialty Products Company. 3
GLOBAL PRESENCE
A Platform Specialty Products Company. 4
Our Product Offerings
ADVANCED ELECTRONICS FINAL FINISHESMETALLIZATION
ELECTRONICS MATERIALSMEMORY DISK ELECTRONICS SPECIALTIES
Direct Metallization
• Rigid PCBs
• Flex Circuitry
Electroless Copper
Electrolytic Coppers
• High Throw DC
• Periodic Pulse Reverse
• Via Fill / Through Hole Fill
Organic Solderability
Preservative
Immersion Tin
Immersion Silver
ENEPIG
ENIG
Leadframe Adhesion
Promotion
Component Termination
Solderability
Molded Interconnect Devices
Light Emitting Diodes
Solar Cell Metallization
Specialty Treatments for Copper
Dryfilm
Copper Etchant
Resist Strippers
Solder Strippers
Connector Finishing
Oxide and Oxide Alternatives
• High RF Applications
Damascene Copper
Wafer Level Packaging
• Bump Plating
• Copper Pillars
• Redistribution Layers
Preclean and Zincate
Solutions for AI substrate
High Quality EN
• High Corrosion Resistance
• Low Particle Inclusion (PDI)
• Low Pit Count
A Platform Specialty Products Company. 5
Our Product Offerings
ADVANCED ELECTRONICS FINAL FINISHESMETALLIZATION
ELECTRONICS MATERIALSMEMORY DISK ELECTRONICS SPECIALTIES
Direct Metallization
• Rigid PCBs
• Flex Circuitry
Electroless Copper
Electrolytic Coppers
• High Throw DC
• Periodic Pulse Reverse
• Via Fill / Through Hole Fill
Organic Solderability
Preservative
Immersion Tin
Immersion Silver
ENEPIG
Affinity ENIG 2.0
Leadframe Adhesion
Promotion
Component Termination
Solderability
Molded Interconnect Devices
Light Emitting Diodes
Solar Cell Metallization
Specialty Treatments for Copper
Dryfilm
Copper Etchant
Resist Strippers
Solder Strippers
Connector Finishing
Oxide and Oxide Alternatives
• High RF Applications
Damascene Copper
Wafer Level Packaging
• Bump Plating
• Copper Pillars
• Redistribution Layers
Preclean and Zincate
Solutions for AI substrate
High Quality EN
• High Corrosion Resistance
• Low Particle Inclusion (PDI)
• Low Pit Count
A Platform Specialty Products Company. 6
ENIG PopularityStrength and Weakness Analysis
Advantages……
• Long Shelf Life
• No Tarnish
• No Whiskers
• Consistent Solderability (multiple reflows).
• Aluminum Wirebondable.
• Surface Contact (Keypads)
• High Solderspread
• No Issues with Paste Misprints
Disadvantages……
• More Expensive (CEM/OEM)
• High Temperature Process (PCB Fab)
• Complex Process (PCB Fab)
• Not Re-workable (PCB Fab)
• Ni-Sn Solderjoint (Cu-Sn is preferred)
• Blackpad “Hangover” from the 90’s
HASL OSP Imm Silver Imm Tin ENIG ENEPIG
Planarity No Yes Yes Yes Yes Yes
Solderjoint Cu-Sn Cu-Sn Cu-Sn Cu-Sn Ni-Sn Ni-Sn
Relative Cost $ $ $$ $$ $$$ $$$
IPC Shelf Life No Specification No Specification 12 months 12 months 12 months 12 months
Reflows 6 4 6 2 6 6
Contact E-Test, ICT Difficult E-Test, ICT, Keypad E-Test E-Test, ICT, Keypad E-Test, ICT, Keypad
Press Fit Good Good Good Good Good Good
Au Wirebond No No No No No Yes
Al Wirebond No No Yes No Yes Yes
A Platform Specialty Products Company. 7
Affinity ENIG 2.0Reduced Variation - Higher Yield – Lower Operating Cost ENIG
Affinity ENIG 2.0 has been developed from the lead ENIG technologies
from our newly integrated companies combining new innovations from our
collective expertise.
EN Corrosion
• EN corrosion has been engineered out of the process eliminating
concern and discussion with end users and OEM’s.
Six Sigma Development
• Defects and wastes driven out during development and process variation
minimized in production– giving increased uniformity of product,
compliance to OEM and End User specifications and unrivaled reliability.
The Lowest Gold Metal Operating Cost
• Low gold thickness variation over time and between feature sizes
provides excellent control of gold consumption and significant
opportunity for operating cost reduction.
A Platform Specialty Products Company. 8
Technology Benefits – Six Sigma Development
Affinity ENIG 2.0
What is Six Sigma and why is it important to your business?
“The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety
of industries for their proficiency at reducing defects and driving process improvement.
A six sigma process produces only 3.4 defects per million opportunities!
We already have a 99% ENIG yield, why would we care about Six Sigma ?
(1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day!
• 99% take-off success would mean 11 air disasters every day!!!
A Platform Specialty Products Company. 9
Technology Benefits – Six Sigma Development
Affinity ENIG 2.0
What is Six Sigma and why is it important to your business?
“The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety
of industries for their proficiency at reducing defects and driving process improvement.
A six sigma process produces only 3.4 defects per million opportunities!
We already have a 99% ENIG yield, why would we care about Six Sigma ?
(1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day!
• 99% success would mean 11 air disasters every day!!!
(2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield !
• 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year).
A Platform Specialty Products Company. 10
Technology Benefits – Six Sigma Development
Affinity ENIG 2.0
What is Six Sigma and why is it important to your business?
“The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety
of industries for their proficiency at reducing defects and driving process improvement.
A six sigma process produces only 3.4 defects per million opportunities!
We already have a 99% ENIG yield, why would we care about Six Sigma ?
(1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day!
• 99% success would mean 11 air disasters every day!!!
(2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield !
• 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year).
Six Sigma’s vast tool kit was used throughout research, alpha and beta test phases of Affinity ENIG 2.0.
MacDermid-Enthone’s Six Sigma green and black belts will bring these benefits to your factory.
A Platform Specialty Products Company. 11
Technology Benefits – Six Sigma Development
Affinity ENIG 2.0
EN2 - 4
. 6 M
TO
EN2 - 4
MTO
EN3 - 3
MTO
EN2 -
2 M
TO
EN2 -
1 MTO
EN2 - 0
MTO
EN1 -
4.8 M
TO
EN1 -
4 M
TO
EN1 -
3 M
TO
EN1 -
2 M
TO
EN1 -
1 M
TO
EN 1
- O M
TO
9.2
9.0
8.8
Sam
ple
Mea
n
__X=8.9642
UCL=9.2270
LCL=8.7014
EN2 - 4
. 6 M
TO
EN2 - 4
MTO
EN3 - 3
MTO
EN2 - 2
MTO
EN2 -
1 MTO
EN2 - 0
MTO
EN1 -
4.8 M
TO
EN1 -
4 M
TO
EN1 -
3 M
TO
EN1 -
2 M
TO
EN1 -
1 M
TO
EN 1
- O M
TO
0.4
0.3
0.2
0.1
Sam
ple
StD
ev
_S=0.2695
UCL=0.4625
LCL=0.0764
Xbar-S Chart of Affinity 2.0 EN %PXRF %P measurement over two Electroless Nickel solution lives
ENIG Customer RequiementsIm
po
rta
nce
EN1 -
IG 1
EN1 -
IG 2
EN2 -
IG 1
EN 2
- IG
2
Notes
EN %P Control (8-10% wt/wt) 1 9 9 1 1 EDS and XRF Analysis
EN Plating Rate Control 1 9 9 3 3 IMR Charts
IG Plating Rate Control 2 9 3 1 3 IMR Charts
Functional Soldering (3 Operations) 1 9 9 9 9 LF Solderspread, Ballshear and PTH FILL
Within Panel Au Thickness Distribution 5 9 3 1 3 XRF Analysis
IG Chemistry - Low Au Concentration 2 3 9 3 9 TDS Operating Parameters
IPC 4552 EN Corrosion Spec Conformance 1 9 9 9 9 X-Section
SEM Corrosion Evaluation 5 9 9 3 3 SEM Analysis
MEES Internal X-Section Corrosion Spec 5 3 3 3 9 X-Section/ SEM Analysis
Cosmetic Appearance 1 9 9 1 1 Visual Evaluation
Process Control Simplicity 1 9 3 1 1 IMR Chart and Process Capability Analysis
Electroless Nickel Coverage 1 9 9 3 3 X-Section
Electroless Nickel Resolution 1 9 9 3 3 Visual / X-Section Evaluation
105 93 41 57
201 165 75 129
1st 2nd 4th 3rd
Absolute Weight
Releative Weight
Overall Ranking
Quality Deployment Function
• Used to compare ENIG chemistries during development process.
• Created a focus to improve EN %P control and corrosion.
• Created a focus to eliminate cost.
Measurement System Analysis
• Used to understand Au thickness and EN%P measurement errors.
• Improved measurement of gold thickness and EN %P.
• Improved control of gold thickness and cost.
Statistical Process Control
• Used to ensure “Critical to Quality” process variables are under control.
• Same product every shift and every day.
Strong Performance 9
Acceptable Performance 3
Weak Performance 1
Correlation Key
A Platform Specialty Products Company. 12
Technology Benefits – Six Sigma Development
Affinity ENIG 2.0
Design of Experiments
• Used to optimize and understand effect and Interactions of Key Process Variables.
• Issues engineered out during design stage.
• MacDermid-Enthone service team has a deep understanding of the process.
Capability Analysis
• Used to assess process performance against End User or OEM specifications.
• OEM specifications met.
Reliability Simulations
• Weibull and other reliability simulations undertaken to ensure deposit meets
Industry expectations.
• Reliability confidence when PCB’s are out in the field.
A Platform Specialty Products Company. 13
Affinity ENIG 2.0Process Cycle and Equipment
Equipment And Plating Cycle:
Affinity Clean
Affinity Etch
MicroetchPost -Dip
Affinity Activate
PDS
Affinity Activator Post -Dip
Affinity 2.0 Electroless
Nickel
Affinity 2.0 Immersion
Gold
Affinity 2.0 fits into standard ENIG process equipment, giving technical
benefits over incumbent processes.
Equipment improvements available to deliver improved deposit
distribution uniformity for new build or retro fit.
Affinity Nickel 2.0 delivers 0,15-0,23 µ/min plating rate over 5 MTO
giving unrivaled productivity.
Affinity 2.0 has been engineered to be simple to use eliminating the
need for complicated auto-control / analysis systems reducing
engineering time and chance of operator error.
A Platform Specialty Products Company. 14
Affinity ENIG 2.0Process Chemistry Overview
Affinity Clean
Affinity Etch
Sulfuric Acid Pre-dip
Affinity Activate PDS
Affinity Post-dip
Affinity Nickel 2.0
Affinity Gold 2.0
Acid Cleaner• Options to take care of NPTH plating and produce chemically clean surfaces for
subsequent processing.
Microetch• Etch options to minimize variation of incoming copper surface.
Activator Pre-dip• Helps minimize occurrence of galvanic skipping.
Palladium Sulfate Based Activator• Low palladium concentration to minimize operating cost and formulated to eliminate
extraneous and skip plating.
Activator Post-dip• Helps to minimize risk of extraneous plating.
Electroless Nickel• Dummy free, stable and easy to use chemistry. Provides superior phosphorous
control, cosmetic appearance and deposit uniformity.
Immersion Gold• Optimized for low gold metal operation with excellent thickness and corrosion control.
A Platform Specialty Products Company. 15
AFFINITY ENIG 2.0Pre-Treatment
A Platform Specialty Products Company. 16
Affinity ENIG 2.0
There are many variables in the PCB manufacturing process prior to the ENIG process that can effect yield.
Affinity 2.0 has been developed with pretreatment options designed to minimize variation in incoming panel quality.
Pre-Treatment Technology Overview
• Affinity NPTH Cleaner 2.0
• Affinity Etch One
• Affinity Activate PDS
• Excellent cleaning of copper surfaces removing dirt, oils, and copper oxidation ensuring nickel
adhesion and coverage.
• Ties up residual palladium in tooling holes from electroless copper processing preventing
undesired plating.
• Produces cleaned etched surface for optimal palladium adsorption.
• Modifies copper topography to provide uniform low roughness surface for Electroless Nickel
grain formation eliminating larger EN grain boundaries which are more prone to galvanic attack
in Immersion Gold chemistry.
• Optimized to activate copper surfaces and eliminate extraneous plating on a variety of
commonly used and high performance PCB laminates.
• Mild formulation minimizes copper build up and provides long solution life giving high
performance with economical operating cost.
A Platform Specialty Products Company. 17
Affinity ENIG 2.0Cleaner Technology
• Affinity Cleaner 1.0 and Affinity NPTH Cleaner 2.0 both provide
effective removal of copper oxide, fingerprints and other soils from
previous manufacturing processes.
• Affinity NPTH Cleaner 2.0 is a two part cleaning system that provides a
solution for elimination of unwanted plating in tooling holes. Utilization of
a palladium poison renders residual palladium inactive during the
cleaning process preventing Electroless Nickel plating.
Ni 2+ Ions
Residual Pd
Pd Poison
Affinity Cleaner 1.0
Affinity NPTH Cleaner 2.0
A Platform Specialty Products Company. 18
Affinity ENIG 2.0Microetch Technology
• Excessive copper roughening prior to
soldermask application can result in irregular
grain boundary formation during Electroless
Nickel deposition. Irregular EN grain
boundaries have been cited as potential sites
for excessive corrosion during Immersion Gold
deposition.
• Affinity Etch and Affinity Etch One
microetch processes contain surface
topography modifiers which allow reduction of
surface roughness creating uniform copper
surfaces and resulting in a more uniform
Electroless Nickel surface.
Untreated Roughened Copper Following ENIG
Roughened Copper / Etch One Following ENIG
A Platform Specialty Products Company. 19
Affinity ENIG 2.0Microetch Post-Dip Technology
0.35 MTO
• Trapped microetch chemistry in partially plugged via holes can create galvanic cells will enough potential to prevent Electroless Nickel
plating along the connected trace.
• Use of a simple sulphuric acid post dip following microetch is sufficient to assist with removal of the trapped process chemistry.
• MacDermid-Enthone recommend inclusion of this process step to safeguard against galvanic skipping pads without resorting to expensive
proprietary chemistry.
Skipped Pad
Trapped Solution
Via Hole
Bulk EN Solution
A Platform Specialty Products Company. 20
Affinity ENIG 2.0Activator Technology
FR-4 Material Aluminum Nitride Ceramic
• Affinity Activate PDS is a palladium sulphate
based activator optimized for compatibility with
common and advanced substrates alike.
• Skip and extraneous free electroless nickel
deposition ensuring yield maximization.
• Operation at 25 ppm of palladium giving low
make cost and drag out losses.
• Mild corrosivity for copper ensures long
working bath.
Arlon 85NIsola P96 Rogers 3010
A Platform Specialty Products Company. 21
Affinity ENIG 2.0Activator Post-Dip Technology
0.35 MTO
• Post Dip Chemistry has the ability to removal residual palladium from tight geometries and hold in solution preventing re-deposition.
• This results in cleaner feature edges and a reduction in extraneous plating with problematic spacing and or materials.
Complexor
Palladium
A Platform Specialty Products Company. 22
AFFINITY ENIG 2.0Electroless Nickel
A Platform Specialty Products Company. 23
Affinity ENIG 2.0Electroless Nickel Technology Overview
Affinity 2.0 Electroless Nickel has been designed to work synergistically with the Affinity 2.0 Pre-Treatment chemistry to ensure a
uniform and consistent initiation of electroless nickel. So what does this mean to the PCB Fabricator ?
Affinity 2.0 Electroless Nickel’s enhanced chemistry delivers……
• “Right first basket” start up.
• Reduced cycle time and cost by elimination of need to dummy plate.
• Efficient even in stop/start situations. No need to worry about start up procedures
• Consistent basket to basket nickel thickness.
• Consistent productivity irrespective of Electroless Nickel solution age.
• Formulation minimizes effect of EN property changes as bath ages = consistent rack to rack deposition.
• Superior control over phosphorous content over long Electroless Nickel life.
• Improved cosmetic appearance of ENIG deposit.
• Consistent corrosion resistance of Electroless Nickel deposit.
• Consistent gold thickness basket to basket.
• Simplified operation.
• Elimination of operator intervention.
• Reduced special cause variation and potential for operator error.
A Platform Specialty Products Company. 24
Affinity ENIG 2.0Technology Benefits – Electroless Nickel Plating Rate
Having high and consistent plating rates allows the PCB fabricator high levels of productivity and increased control over EN
thickness without having to adjust Electroless Nickel pH to maintain throughput and the resultant phosphorous content sacrifices.
543210
10
8
6
4
EN MTO
mic
roin
ch
/ m
in
_X=6.833
UCL=7.418
LCL=6.248
543210
0.8
0.6
0.4
0.2
0.0
EN MTO
Mo
vin
g R
an
ge
__MR=0.22
UCL=0.7188
LCL=0
I-MR Chart of Affinity Nickel 2.0 Plating Rate
• Temperature increase from 80 to 86 OC allows consistent
electroless nickel thickness to be achieved over 5 EN MTO’s.• Consistent EN thickness with increasing EN age.
• All EN cells have same plating speed.
• No reduction in productivity.
• Temperature adjustment has no significant effect on the
electroless nickel phosphorous content, and is thus preferred to
pH adjustment.
A Platform Specialty Products Company. 25
Affinity ENIG 2.0Phosphorous Content – Measurement System Error
• Neither EDS or XRF showed good %P analysis performance (< 10 % of the tolerance).
• The XRF method showed minimal bias (error reading the standard) and if enough measurements are made the average %P is close to the actual.
• It was determined that averaging 10 XRF measurements provide a suitable measurement system of EN %P.
Reference 9.5762
Mean 9.563224
StDev 0.1054968
6 × StDev (SV) 0.6329809
Tolerance (Tol) 2
Basic Statistics
Bias -0.012976
T 0.6149740
PValue 0.544
(Test Bias = 0)
Bias
Cg 0.63
Cgk 0.59
Capability
%Var(Repeatability) 31.65%
%Var(Repeatability and Bias) 33.84%
Gage name: Waterbury SDD XRF
Date of study: Feb 2016
Reported by: Paul Romaine
Tolerance: 2
Misc:
252321191715131197531
10.5
10.0
9.5
9.0
Observation
%P
Ref
Ref + 0.10 × Tol
Ref - 0.10 × Tol
Run Chart of %P by XRF
Type 1 Gage Study for %P
Reference 9.67
Mean 9.9453
StDev 0.22753
6 × StDev (SV) 1.36518
Tolerance (Tol) 2
Basic Statistics
Bias 0.2753
T 4.68670
PValue 0.000
(Test Bias = 0)
Bias
Cg 0.29
Cgk -0.11
Capability
%Var(Repeatability) 68.26%
%Var(Repeatability and Bias) -181.22%
Gage name: Taiwan GDAC SEM-EDS
Date of study: May 2016
Reported by: Kenny Lin
Tolerance: 2
Misc:
151413121110987654321
10.50
10.25
10.00
9.75
9.50
Observation
%P E
DS
Ref
Ref + 0.10 × Tol
Ref - 0.10 × Tol
Run Chart of %P EDS
Type 1 Gage Study for %P EDS
A Platform Specialty Products Company. 26
Technology Benefits – Electroless Nickel Phosphorous Content
• Some traditional EN systems utilize pH adjustment to maintain plating rate with age, thus reducing the EN %P.
• Affinity 2.0 EN uses temperature increase to maintain plating rate and thus no effect on the deposit %P content.
• Thus Affinity 2.0 EN maintain consistent deposit properties over the working life of the chemistry.
• With high MSE associated for EN %P this reduces chance of EOL deposits being out of specification.
Affinity ENIG 2.0
5 MTO4 MTO3 MTO2 MTO1 MTO0 MTO
9
8
7
Sam
ple
Mean
__X=7.925UCL=8.094
LCL=7.756
5 MTO4 MTO3 MTO2 MTO1 MTO0 MTO
0.3
0.2
0.1
Sam
ple
StD
ev
_S=0.1731
UCL=0.2971
LCL=0.0491
1
1
1
1
1
Xbar-S Chart of Traditional EN %P
Affinity 5 MTOAffinity 4 MTOAffinity 3 MTOAffinity 2 MTOAffinity 1 MTOAffinity 0 MTO
9
8
7
Sam
ple
Mea
n
__X=8.981
UCL=9.186
LCL=8.776
Affinity 5 MTOAffinity 4 MTOAffinity 3 MTOAffinity 2 MTOAffinity 1 MTOAffinity 0 MTO
0.4
0.3
0.2
0.1
Sam
ple
StD
ev
_S=0.2102
UCL=0.3608
LCL=0.0596
Xbar-S Chart of Affinity 2.0 EN %P
A Platform Specialty Products Company. 27
Predictable EN deposit %P allows…
• High conformance to OEM and end user specifications.
• Consistent corrosion resistance.
• Excellent gold thickness control.
• Consistent low level of observed corrosion anomalies.
• Consistently reliable functional performance.
Technology Benefits – Electroless Nickel Phosphorous Content
Several OEM’s already specify an EN phosphorous content of 7 – 10%, but PC Fabricators prefer 8 – 10 % due to improved
corrosion resistance. Out of specification (low) phosphorous content is often cited in failure analysis as root cause of excessive
corrosion. Affinity 2.0 Electroless Nickel demonstrates consistent EN %P allowing consistent corrosion resistance over the
working life contributing to reduced variation in gold thickness as well as minimizing observed corrosion anomalies.
Affinity ENIG 2.0
EN2 - 4
. 6 M
TO
EN2 - 4
MTO
EN3 - 3
MTO
EN2 -
2 M
TO
EN2 -
1 MTO
EN2 - 0
MTO
EN1 -
4.8 M
TO
EN1 -
4 M
TO
EN1 -
3 M
TO
EN1 -
2 M
TO
EN1 -
1 M
TO
EN 1
- O M
TO
9.2
9.0
8.8
Sam
ple
Mea
n
__X=8.9642
UCL=9.2270
LCL=8.7014
EN2 - 4
. 6 M
TO
EN2 - 4
MTO
EN3 - 3
MTO
EN2 - 2
MTO
EN2 -
1 MTO
EN2 - 0
MTO
EN1 -
4.8 M
TO
EN1 -
4 M
TO
EN1 -
3 M
TO
EN1 -
2 M
TO
EN1 -
1 M
TO
EN 1
- O M
TO
0.4
0.3
0.2
0.1Sa
mp
le S
tDev
_S=0.2695
UCL=0.4625
LCL=0.0764
Xbar-S Chart of Affinity 2.0 EN %PXRF %P measurement over two Electroless Nickel solution lives
A Platform Specialty Products Company. 28
Affinity ENIG 2.0Technology Benefits – Consistent EN and ENIG Structure
EN
Only
ENIG
• Affinity 2.0 provides a consistent and uniform EN deposit structure over 5 MTO’s. This allows not only consistent gold deposit
but improved cosmetic appearance.
0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO
A Platform Specialty Products Company. 29
Affinity ENIG 2.0Technology Benefits – Consistent Cosmetic Appearance
• Affinity 2.0 Electroless Nickel’s highly uniform
structure allows improvement in ENIG cosmetic
appearance.
• Improved “haloing” of PTH-in-ground features.
• Reduced pad-pad color differences between
adjacent pads connected to trace or ground area.
A Platform Specialty Products Company. 30
AFFINITY ENIG 2.0Immersion Gold
A Platform Specialty Products Company. 32
Affinity ENIG 2.0Technology Benefits- Corrosion Control
Anodic Reaction
Ni → Ni2+ + 2e-
Cathodic Reaction
2[Au(CN)2]- → 2Au+ + 4CN-
2Au+ + 2 e- → 2 Au
Overall Reaction
Ni + 2[Au(CN)2]- → 2Au + [Ni(CN)4]
2-
Immersion gold mechanism involves galvanic
displacement of nickel ions from the EN surface
The point at which EN corrosion leads to reliability
concerns is debated, but this concern is reduced
significantly with Affinity 2.0
PCB fabricators and end users continue to become
more critical of ENIG corrosion, this is reflected in the
recent revision A of IPC4552
Affinity ENIG 2.0 has been developed with these
concerns in mind, delivering low and consistent
corrosion occurrence.
Affinity 2.0
Traditional ENIG
A Platform Specialty Products Company. 33
IPC4552 Revision ACorrosion Control
IPC4552A section ”3.6 Nickel Hyper-Corrosion” discusses and tries to add some sense and uniformity to
the ongoing ENIG corrosion acceptability and reliability argument.
Key Points….
• Some occurrences of hyper-corrosion will always be found if enough samples are taken from a printed board or if excessive
magnification is used for evaluation. A single occurrence of hyper-corrosion is NOT rejectable.
• The defect associated with hyper-corrosion is non-wetting (although the gold has been consumed) as defined by a lack of
Intermetallic Compound (IMC) formation.
• Hyper-corrosion may be evident but if it does not interfere with the formation of a reliable solder joint as defined by contiguous
IMC formation, it is NOT considered to be rejectable.
• Severe hyper-corrosion whereby the soldering is impacted negatively is a rejectable condition. Inspection of hyper-corrosion for
acceptance criteria shall use optical microscopy at a maximum of 1000X magnification.
A Platform Specialty Products Company. 34
IPC4552 Revision ACorrosion Control
IPC4552A section ”3.6 Nickel Hyper-Corrosion” discusses and tries to add some sense and uniformity to
the ongoing ENIG corrosion acceptability and reliability argument.
Key Points….
• Some occurrences of hyper-corrosion will always be found if enough samples are taken from a printed board or if excessive
magnification is used for evaluation. A single occurrence of hyper-corrosion is NOT rejectable.
• The defect associated with hyper-corrosion is non-wetting (although the gold has been consumed) as defined by a lack of
Intermetallic Compound (IMC) formation.
• Hyper-corrosion may be evident but if it does not interfere with the formation of a reliable solder joint as defined by contiguous
IMC formation, it is NOT considered to be rejectable.
• Severe hyper-corrosion whereby the soldering is impacted negatively is a rejectable condition. Inspection of hyper-corrosion for
acceptance criteria shall use optical microscopy at a maximum of 1000X magnification.
Non-wetting soldering defects can occur for many reasons. For this reason a consistent and low level of EN corrosion is
advisable to avoid any solderability failure being diagnosed as “Hyper Corrosion”.
A Platform Specialty Products Company. 35
Affinity ENIG 2.0Optimization of Galvanic Displacement Reaction
Traditional ENIG
Traditional ENIG - Galvanic Displacement Reaction
1a. Replacement of Ni from EN surface with Au ion (electron transfer) proceeds. 2. Gold deposit forms with spikes of corrosion.
1b. Oxidation of the EN surface can occur simultaneously.
Gold Deposit
Corrosion Spikes
Electroless Nickel
Copper
Affinity 2.0 ENIG - Controlled Galvanic Displacement Reaction
1. Surface Active Agent adsorbs on EN surface 2. Surface Active Agent desorbtion allows 3. Controled replacement of nickel with gold
preventing nickel oxidation / corrosion. controlled replacement of Nickel with Gold. proceeds by repeating stages 1 and 2.
Gold Deposit
Surface Active Agent
Electroless Nickel
Copper
O2 O2
Au+ Ni2+
Ni2+
Ni2+ Ni2+
O2
Au+ Ni2+
Ni2+Ni2+
Ni2+
O2O2
A Platform Specialty Products Company. 36
Affinity ENIG 2.0Optimization of Galvanic Displacement Reaction
Traditional ENIG
Affinity ENIG 2.0
Traditional ENIG - Galvanic Displacement Reaction
1a. Replacement of Ni from EN surface with Au ion (electron transfer) proceeds. 2. Gold deposit forms with spikes of corrosion.
1b. Oxidation of the EN surface can occur simultaneously.
Gold Deposit
Corrosion Spikes
Electroless Nickel
Copper
Affinity 2.0 ENIG - Controlled Galvanic Displacement Reaction
1. Surface Active Agent adsorbs on EN surface 2. Surface Active Agent desorbtion allows 3. Controled replacement of nickel with gold
preventing nickel oxidation / corrosion. controlled replacement of Nickel with Gold. proceeds by repeating stages 1 and 2.
Gold Deposit
Surface Active Agent
Electroless Nickel
Copper
O2 O2
Au+ Ni2+
Ni2+
Ni2+ Ni2+
O2
Au+ Ni2+
Ni2+Ni2+
Ni2+
O2O2
A Platform Specialty Products Company. 37
Affinity ENIG 2.0Technology Benefits – Corrosion Control
0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO
Affinity ENIG 2.0 provides excellent corrosion observations by X-Section and SEM following gold stripping.
PCB Fabricator and End Users will observe consistent and low occurrence of corrosion.
Eliminate concern and discussion over reliability associated with traditional ENIG systems.
A Platform Specialty Products Company. 38
Affinity ENIG 2.0Gold Thickness Control: Ability to meet Specification
Revision A to IPC4552.
X̄ - 3s ≥ 0.04 µm [≥1.58 µIn]
X̄ + 3s ≤ 0.1 µm [≤3.94 µIn]
• IPC has added an upper specification limit for gold thickness
• Addition of upper boundary increases need for Gold
thickness control to maintain a capable process.
• IPC allows a lower average Gold thickness is good deposit
distributions can be achieved.
• This offers potential savings in gold metal consumption.
A Platform Specialty Products Company. 39
Affinity ENIG 2.0Gold Thickness – IPC4552 Rev A Specification
• Gold thickness specification statistical constraints adds more pressure to maintain a consistent gold thickness .
• Affinity ENIG 2.0 shows consistent basket to basket gold thickness control - no thickness variation due to EN age.
• High level of conformance to the IPC4552 (Revision A) specification - 0 DMPO (no out of specification parts produced).
5.0 MTO4.5 MTO4.0 MTO3.5 MTO3.0 MTO2.5 MTO2.0 MTO1.5 MTO1.0 MTO0.5 MTO0 MTO
2.40
2.25
2.10
Sam
ple
Mea
n
__X=2.2704
UCL=2.3376
LCL=2.2033
5.0 MTO4.5 MTO4.0 MTO3.5 MTO3.0 MTO2.5 MTO2.0 MTO1.5 MTO1.0 MTO0.5 MTO0 MTO
0.10
0.05
0.00
Sam
ple
StD
ev
_S=0.0471
UCL=0.0983
LCL=0
Xbar-S Chart of Affinity 2.0 ENIG Gold ThicknessAs per IPC4552 Revision A
A Platform Specialty Products Company. 40
Affinity ENIG 2.0Gold Thickness – IPC4552 Rev A Specification
• Gold thickness specification statistical constraints adds more pressure to maintain a consistent gold thickness .
• Affinity ENIG 2.0 shows consistent basket to basket gold thickness control - no thickness variation due to EN age.
• High level of conformance to the IPC4552 (Revision A) specification - 0 DMPO (no out of specification parts produced).
• Potential for reduction in gold consumption - Average gold thickness reduction.
5.0 MTO4.5 MTO4.0 MTO3.5 MTO3.0 MTO2.5 MTO2.0 MTO1.5 MTO1.0 MTO0.5 MTO0 MTO
2.40
2.25
2.10
Sam
ple
Mea
n
__X=2.2704
UCL=2.3376
LCL=2.2033
5.0 MTO4.5 MTO4.0 MTO3.5 MTO3.0 MTO2.5 MTO2.0 MTO1.5 MTO1.0 MTO0.5 MTO0 MTO
0.10
0.05
0.00
Sam
ple
StD
ev
_S=0.0471
UCL=0.0983
LCL=0
Xbar-S Chart of Affinity 2.0 ENIG Gold ThicknessAs per IPC4552 Revision A
A Platform Specialty Products Company. 41
Affinity ENIG 2.0Understanding Variation: What Does Gold Distribution Mean For Quality and Savings?
• A normal distribution will have 99.7% of all data evenly distributed ± 3 standard deviations from the population mean (µ).
• Therefore 99.85% of all gold thickness measurements will be + 6 standard deviations from the minimum thickness measured.
A Platform Specialty Products Company. 42
Affinity ENIG 2.0Understanding Variation: What Does Gold Distribution Mean For Savings?
• Some PCB fabricators only care about not
exceeding the minimum specification gold
thickness.
• With poorly distributed Immersion Gold thickness
this can lead to significant waste.
Affinity 2.0
Competing ENIG
A Platform Specialty Products Company. 43
Affinity ENIG 2.0Understanding Variation: What Does Gold Distribution Mean For Savings?
• Some PCB fabricators only care about not
exceeding the minimum specification gold
thickness.
• With poorly distributed Immersion Gold thickness
this can lead to significant waste.
• Affinity ENIG 2.0 has been demonstrated to
deliver significantly improved gold thickness
distribution over competitive ENIG systems.
Affinity 2.0
Competing ENIG
Waste $
A Platform Specialty Products Company. 44
Affinity ENIG 2.0
Affinity 2.0
Competing ENIG
Cost
Down
Ave Au = 2.0 µIn
Ave Au = 2.8 µIn
Understanding Variation: IPC4552A - What Does Gold Distribution Mean For Savings?
• Some PCB fabricators only care about not
exceeding a minimum specification gold
thickness.
• Poor gold thickness distribution = significant
waste
• Affinity ENIG 2.0 delivers significantly improved
gold thickness distribution compared to
competitive ENIG systems.
• IPC4552 Rev. A allows minimum gold
thickness of 1.58 microinches at three
standard deviations below the average
thickness.
A Platform Specialty Products Company. 45
Affinity ENIG 2.0
Affinity 2.0
Competing ENIG
Cost
Down
Ave Au = 2.0 µIn
Ave Au = 2.8 µIn
Understanding Variation: IPC4552A - What Does Gold Distribution Mean For Savings?
• Some PCB fabricators only care about not
exceeding a minimum specification gold
thickness.
• Poor gold thickness distribution = significant
waste
• Affinity ENIG 2.0 delivers significantly improved
gold thickness distribution compared to
competitive ENIG systems.
• IPC4552 Rev. A allows minimum gold thickness
of 1.58 microinches at three standard deviations
below the average thickness.
• This translates directly to cost savings for
processes with tighter gold thickness
distributions.
A Platform Specialty Products Company. 46
Affinity ENIG 2.0Technology Benefits – Basket to Basket and Within Panel Gold Thickness Comparison
• .Affinity 2.0 – Shows a consistent average thickness over time (5 EN MTO’s) due to minimized basket-
basket gold variation. Affinity 2.0 also shows superior gold thickness dispersion around the average gold
thickness due to the superior within panel distribution. These two features provide excellent control over
gold thickness and therefore cost.
1
24
3
• Affinity 2.0 and three competitive
ENIG systems were analyzed for
basket to basket gold thickness as
well as within panel gold thickness.
• 4 different pad sizes
• 5 Panel locations
• Over 5 EN MTO’s
A Platform Specialty Products Company. 47
Technology Benefits – Proving Cost Savings
Affinity ENIG 2.0
• Affinity ENIG 2.0 deposits have shown consistent low gold distribution vs competitive products in benchmarking exercises.
• Affinity ENIG 2.0 has potential to realize large reductions in gold metal consumption.
3.002.752.502.252.001.751.50
0.35
0.30
0.25
0.20
0.15
0.10
Average Au Thickness
Std
Dev
Traditional MacDermid Enthone 2
Traditional MacDermid Enthone 1
Competition B
Competition C
Competition A-1
Competition E
Competition D
Competition A-2
Affinity 2.0Affinity 2.0Affinity 2.0Affinity 2.0Affinity 2.0
Affinity 2.0
Affinity 2.0
Affinity 2.0Affinity 2.0
Affinity 2.0Affinity 2.0Affinity 2.0
Affinity 2.0
Affinity 2.0 Affinity 2.0
Scatterplot of Std Dev vs Average Au ThicknessAnalysis of Affinity 2.0 ENIG vs Competitive Systems
A Platform Specialty Products Company. 48
Affinity ENIG 2.0Technology Benefits – Average Gold Thickness Reduction / Cost Saving Calculation
Au Metal $/g 37.85 Metal Area 15.00%
Incumbent Affinity 2.0
Minimum Gold Thickness microinches
Gold Thickness Standard Deviation 0.2500 0.1500 microinches
Average Au Thickness 2.35 2.05 microinches
Gold Metal Consumed 0.0316 0.0276 gram /panel sq ft
Gold Metal Cost $1.20 $1.044 $ /panel sq ft
Gold Consumption Reduction
Product Estimate Month
Monthly Saving
Annual Saving
1.60
125,000
$19,106.50
$229,278.06
Net Benefit in Gold Consumption Calculation
12.77%
0
0.5
1
1.5
2
2.5
3
0.5 1 1.5 2 2.5 3 3.5
Den
sit
y
Au (microinches)
Gold Thickness DistributionAffinity 2.0 ENIG vs. Competitive System
A Platform Specialty Products Company. 50
AFFINITY ENIG 2.0Reliability and Performance Testing
A Platform Specialty Products Company. 51
Affinity ENIG 2.0Lead Free Soldering – Introduction
• Affinity ENIG 2.0 Supercoupons TV’s processed at every EN MTO.
•All samples for Lead Free solderability testing were pre-conditioned
by processing X3 as per the attached lead free profile.
•Following Pre-Conditioning these TV’s were assessed for
solderspread and ballshear using as well as PTH fill by lead free
wave soldering.
• Peak Temp of Panel = 255 OC
A Platform Specialty Products Company. 52
Affinity ENIG 2.0Technology Benefits – Soldering
Using Alpha CVP-390 SAC305 solderpaste, Affinity 2.0
shows excellent solder wetting properties following X3
lead free reflow.
Solderspread analysis shows high and consistent %
spread measurements from 0 – 5 EN MTO’s.
5 MTO4 MTO3 MTO2 MTO1 MTO0 MTO
350
300
250
200
150
100
50
0
Affinity Nickel 2.0 MTO
% S
old
ers
pre
ad
Boxplot of Affinity 2.0 Solderspread vs EN MTO
0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO
A Platform Specialty Products Company. 53
Affinity ENIG 2.0Technology Benefits – Soldering
Affinity 2.0 shows excellent high and consistent ball shear performance.
All failures observed are the preferred ductile failure mode (within solderball).
5 MTO4 MTO3 MTO2 MTO1 MTO0 MTO
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Affinity Nickel 2.0 MTO
Kg
Fo
rce
Boxplot of Affinity 2.0 Ball-Shear vs EN MTO
Solder Ball
Laminate
1. Pad/Substrate
2. Intermetallic(IMC)
3. Solder Joint
4. Bulk Solder
0 MTO 1 MTO 2 MTO 5 MTO4 MTO3 MTO
A Platform Specialty Products Company. 54
Affinity ENIG 2.0Technology Benefits – Soldering
• Supercoupons TV’s were evaluated for PTH filling by passing through
Novastar solderwave equipment under standard conditions for SAC alloy
using Alpha EF6000 Flux.
• % of PTH’s filled to Target conditions of IPC J-Std 003 was calculated.
A Platform Specialty Products Company. 55
Affinity ENIG 2.0Technology Benefits – Soldering
Affinity 2.0 shows excellent high and consistent PTH filling following X3 lead free reflow - easily
conforming to IPC J-Std 003.
75%
80%
85%
90%
95%
100%
0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO
PTH
% F
ill
Affinity 2.0 PTH Filling vs EN MTO
Affinity 2.0 IPC J-Std 003
A Platform Specialty Products Company. 56
Affinity ENIG 2.0Value Proposition Statement
$86,000
less
kW*hrsReduction
In Gold Use
Reduction
in Out-of-
Spec Parts
Elimination
of OEM
returns
Benefits
Reduced
Labor costs
Significant operational savings from superior within panel gold
thickness distribution and basket to basket thickness control versus
competitive processes.
Low and consistent corrosion eliminating discussion and concern over
reliability.
Six Sigma approach to R&D and process control provide robust
manufacturing, increased yieild and conformance to end user
specifications.
Process simplicity results in reductions in labor costs, engineering
input, defects and production strain.
A Platform Specialty Products Company. 57
Affinity ENIG 2.0Proposal
MacDermid-Enthone propose to process standard test
vehicles through incumbent ENIG process over the
course of the EN life (beginning, middle and end as a
minimum).
MacDermid-Enthone will analyze the gold thickness
distribution, examine the corrosion as well as other key
attributes of the ENIG process and provide a report
detailing the operating cost reduction and technical
benefits in switching to Affinity 2.0.
MacDermid-Enthone will process any additional test
vehicles required by the customer through Affinity ENIG
2.0 and return them for evaluation.
A Platform Specialty Products Company. 58
For more information…
John Swanson
Director Surface Finishes
Global
MacDermid Enthone Electronics Solutions
245 Freight St
Waterbury
CT 06702
O +1 203 575 7909
M +1 203 228 0762
Martin Bunce
Global Applications Manager
Lean Six Sigma Black Belt
MacDermid Enthone Electronics Solutions
245 Freight St
Waterbury
CT 06702
O +1 203 575 5772
M +1 203 706 8539
Ryan Tam
Final Finish Product Manager
Asia
MacDermid Enthone Electronics Solutions
4/F, #9 Tongfuyu Industrial Town,
Tanglang, Xili, Nanshan Dist.
Shenzhen, Guangdong
O +8675536905271
M +8613501597927