aesf/epa conference for environmental excellence
TRANSCRIPT
CONFERENCE ;"\
AESF/EPA Conference for EnvironmentalExcellenceJanuary 29-February 2, The Rosen Centre, Orlando, Fla.
W hat 's happening withMP&M? Nickel? Chromium? What's a "green
factory?" Does your shop qualifyas one? Learn how to save moneythrough E2 (energy efficiency, thenewest industry buzzword).
These topics and more will bediscussed in depth by the most informed sources at the conferencethat has been jointly sponsored bythe U.S. EPA and the AESF formore than 20 years. This conference has remained popular with industry practitioners because itchanges its focus with the times tobe responsive to finishers' needs.
For more information contactthe American Electroplaters andSurface Finishers Society, 12644Research Parkway, Orlando, FL32826; phone, 407/281-6441; fax,407/281-6446; E-mail, [email protected].
TECHNICALPROGRAMMONDAY.,JANUARY t7
9 a.m.-7 p.m,
Opening Session APlenary Session9 a.m.-Welcome & Introductions
Moderator: B.J. Mason, LombardTechnologies (Mid-Atlantic Finishing), Capitol Heights, MD
9:15 a.m., A-I-The RegulatoryFramework: Trends, Challenges& Opportunities in the NewMillennium
Presenters: Christian Richter and AlCollins, Government Relations,Washington
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9:45 a.m., A-2-Strategic GoalsAccomplishments: CollaborationWins
Presenter: Robert Benson, U.S. EPAOffice of Policy, Washington
10:30 a.m., A-3-The Crystal Ball:The Future of Innovation is inthe States
Presenters: Peter Wise, Associate Director, Illinois EPA; Terry Fabian,Deputy Director, Pennsylvania DEP;Linda Wiese, Director, Bureau of Cooperative Environmental Assistance,Wisconsin DNR
11:30 a.m., A-4-Keynote AddressChuck Fox has had to cancel.Replacement speaker to beannounced on site.
Noon-2 p.m.-Lunch on your own
Session BThe New Millennium &Environmental Policy:Challenges for IndustryModerator: John Lindstedt, ArtisticPlating, Milwaukee
2 p.m., B-I-In the Trenches ofStrategic Goals: Making it Workat the Local Level
David Jacobs, Northwestern Plating,Chicago; John Chamalian, GuildPlaters, Long Island City, N.Y.; RichSustich, Chicago Water District; PhilHeckler, New York City DEP
3 p.m., B-2-Surface FinishingEnvironmental BenchmarkingStudy: Trends & Implications
Presenters: George Cushnie, CAl,Oakton, Va.; Edie Wiarda, MichiganManufacturing Technology Center,Ann Arbor, Mich.
3:30 p.m., B-3-ISO 14000 &Environmental ManagementSystems: The Future?
4 p.m., B-4-EnvironmentalTechnology Verification forMetal FinishingAlva Daniels, U.S. EnvironmentalProtection Agency (EPA), Cincinnati;James E. Voytko and Donn Brown,Concurrent Technologies Corporation(CTC), Largo, Fla.
4:30-5:30 p.m.-Panel Discussion
Session CUnderstanding RiskSession Chairman: Matt Lorber, U.S.EPA
2 p.m., C-I-EPA's MetalFinishing Facility RiskScreening Tool (MFFRST): Part1, Status & Update
Matthew Lorber and Paul Shapiro, Office of Research & Development, U.S.EPA, Washington; Greg Schweer, Stephen Schwartz, Charles Peck, andDavid Bottimore, Versar Inc., Springfield, Va.
2:30 p.m., C·2-EPA's MetalFinishing Facility RiskScreening Tool (MFFRST): Part2, Updates to Source EmissionCharacterization
Stephen Schwartz, Versar Inc.,Springfield, Va.; Matthew Lorber, Office of Research & Development, U.S.EPA, Washington
3 p.m., C-3-Risk Screening ofChemicals in the Absence ofData
Ihab H. Farag and MelissaWaleryszak, Chemical EngineeringDepartment, University of NewHampshire, Durham, N.H.; WilliamT. Waugh and Maggie Wilson, U.S.EPA, Office of Pollution Prevention &Toxics (OPPT), Washington
Metal Finishing
3:30 p.m., C-4-Integrated PlantModel for Maximum WasteReduction in Cleaning & RinsingOperations
H,H. Lou and Yinlun Huang, Chemical Engineering & Materials Science, Wayne State University, Detroit
EXHIBIT RECEPTION
TUESDAY• .JANUARY
9 a.m.-5 p.m,
Session DRegulatory & ComplianceUpdate
9 a.m., D-I-Surface FinishingGovernment Relations Update &Regulatory Overview
Christian Richter and AI Collins,Government Relations, Washington
9:30 a.m., D-2-ResourceConservation & Recovery Act:F006 Regulatory Update
Presenter: Kristina Meson, U.S.EPA Office of Solid Waste, Arlington, Va.
10:30 a.m., D-3-Clean Water Act:Metal Products & MachineryRule
Presenter: Shari Zuskin, U.S. EPAOffice of Water, Washington
11 a.m., D-4-Clean Water Act:Industrial PretreatmentStreamlining Rule
Presenter: Pat Bradley, U.S. EPA Office of Water, Washington
11:30 a.m., D-5-Clean Air Act:Regulatory Update
Presenter: Laura McKelvey, U.S.EPA Office of Air & Radiation, Raleigh-Durham, N.C.
ExhibitLunch in Exhibit HallReception (3:30-5 p.m.)
January 2001
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Session EWater & RinsewaterWorkshopSession Chairman: Fred Reinhard,CH2M Hill, Eagan, Minn.
Session FAlternative Processes I
9 a.m., F-I-Non-line-of-sightHard Chromium Alternatives
M. Hull, M. Klingenberg, M. Pavlik,D. Trunick, and D. Schario, Concurrent Technologies Corp., Johnstown,Pa.
9:30 a.m., F-2-A New Ni-Fe-CoAlloy Substitute for ChromiumPlating
Wenhua Hui, Shining Surface Systems Inc., Ewing, N.J.
10 a.m., F-3-A New Alternativefor Decorative HexavalentChromium Plating
Michael Flanigan and Blair Vandivier, Benchmark Products Inc., Indianapolis
10:30 a.m., F-4-Hard ChromeAlternatives Team UpdateImproving Performance WhileReducing Cost
Keith Legg, Rowan TechnologyGroup, Chicago; Bruce Sartwell,Naval Research Laboratory, Washington
11 a.m., F-5-MFASC-SCAQMDNickel Electroplating Emissions& Control Technology Study
M. Dean High, Pacific EnvironmentalServices Inc., Baldwin Park, Calif.
Session GFundamentalsSession Chairman: Derek Vachon,Canadian Finishing Systems Ltd.,Burlington, Ont.
9 a.m., G-I-Critical Options inAqueous Cleaning Systems
Harish A. Bhatt, Visteon, Ypsilanti,Mich.
9:30 a.m., G-2-Case Study:Integrated Water RecyclingSystem for SemiconductorManufacturer ReducesConsumption by 15.8 MillionGallonslYr
George Sendrey, Kinetico EngineeredSystems Div., Newbury, Ohio
10 a.m., G-3-EstimatingChemical Air Emissions fromProcess Tanks at a PlatingJobshop Using a Timely &Inexpensive Method
James Tobin, DAV-TECH PlatingInc., Marlboro, Mass.
10:30 a.m., G-4-IPC's Health &Safety Audit Form
Joan Girard, Electrotek Corp., OakCreek, Wis.
11 a.m., G-5-Rinsewater RecycleDesign & Operations
Gregory R Allan, Advanced ChemicalTechnologies, Redmond, Wash.;Charles M. Babb, Hytek Finishes Co.,Kent, Wash.
11:30 a.m., G-6-A Review ofNickel Plating Bath LifeExtension, Nickel Recovery &Copper Recovery from NickelBaths
Diana R Bless, U.S. EPA, Cincinnati
Session HAlternative Processes II
1:30 p.m., H-I-Elimination ofChromates in Paint Preparation
Richard H. Buchi, TIELM. Hill AFB,Utah
2 p.m., H-2-Validation of aFunctional Trivalent ChromiumPlating Process
RP. Renz, P.O. Miller, E.J. Taylor,C.D. Zhou, Faraday Technology Inc.,Clayton, Ohio; RA. Richardson,Techmetals Inc., Dayton, Ohio
2:30 p.m., H-3-Machine CuttingFluids-Environmental Problemor Improvement Opportunity?
Thomas Schoonover, The Boeing Co.,Portland, Ore.
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3 p.m., H-4-CorrosionPerformance of EnvironmentallyAcceptable Alternatives toChromium Coatings
E.W. Brooman, D.A. Schario, M.L.Klingenberg, E.J. Onesto, Concurrent Technologies Corp., Johnstown,Pa.
3:30 p.m., H-5-VacuumDeposition of Chromium as anAlternative to Hexavalent orTrivalent Chromium Plating
Brent Lee, Stephen M. Koelzer, Technic Inc., Sunnyvale, Calif.
Session IWastewater Treatment &Recycling PanelSession Chairman: Thomas H. Martin, Delta Chemicals & EquipmentInc., Indianapolis
Session JEnvironmental Management 1Session Chairman: John Lott, DuPont Electronics, Research TrianglePark, N.C.
1:30 p.m., J.1-Using InformationTechnology to BenchmarkEnvironmental Performance
Glenna Ford, GreenWare Environmental Systems Inc., Toronto
2 p.m., J-2-The Application ofMembrane Technology as anElement of Business CompetitiveAdvantage
James A. Bilgo, Eric D. Fessler, Kenneth E. Kaszubowski, Robert F. Peschel, Sigma Environmental ServicesInc., Oak Creek, Wis.
2:30 p.m., J-3-The Ion ExchangeResource Recovery Business
Peter Meyers, Larry Gottlieb, ResinTech Inc., Cherry Hill, N.J.
3 p.m., J-4-Economics of Health& Safety
Philip A. Platcow, Secor InternationalInc., Chestnut Hill, Mass.
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3:30 p.m., J-5-Development &Implementation of an ISO 14001Environmental ManagementSystem: The Advantages ofBecoming ISO 14001 Certified
Jeffrey A. Hedges, World ResourcesCompany (WRC), Pottsville, Pa.
3:30-5 p.m., Exhibit ReceptionExhibit Open
WEDNESDAY• .JANUARY 1.
9:30 a.m.-4 p.m,
Session KDump, Bleed or Maintain?Session Chairman: Kevin Klink,CH2M Hillfralisman Partners, Corvallis, Ore.
9 a.m., K-1-Aqueous CleanerRecycling at Raytheon SystemsCompany
Paul Fecsik, Raytheon Systems Co.,Tucson, Ariz.
9:30 a.m., K-2-Purification ofSulfuric Anodizing Bath UsingPatented Ion ExchangeTechnology
Mohamed Abid, Eco-Tec Inc., Pickering,Ont.
10 a.m., K-3-Treatment &Disposal of Spent ElectrolessNickel Plating Solutions
David Crotty, MacDermid Inc., NewHudson, Mich.; Don Baudrand, consultant, Poulsbo, Wash.
10:30 a.m., K-4-A SulfamateNickel Ammonium RemovalSystem
Anthony D'Amato, Zero DischargeTechnologies Inc., Chicopee, Mass.
11 a.m., K-5-Use of MembraneTechnologies for SourceReduction & Waste Minimizationin the Metal Finishing Process
Ken Martins, CH2M Hill EngineeredSystems, Santa Ana, Calif.
Session LEnvironmental Management 2Session Chairman: John Sharp, Teradyne Inc., Nashua, N.H.
9 a.m., L-1-A Practical Guide forScoring Environmental Aspectsto Determine Their Impact onthe Environment
Robert L. Iuliucci, Sequa Corp., Hackensack, N.J.
9:30 a.m., L-2-How to Use a LifeCycle Assessment to Its Fullest:The Fundamentals
Wayne E. Bates, Rizzo Associates,Natick, Mass.
10 a.m., L-3-ISO 14001Implementation Tips
Andrea L. Clemencio, Patrick R. Curran, Dana-Long Mfg., Oakville, Onto
10:30 a.m., L-4-EnvironmentalPreparedness
Terry Begnoche, consultant, Farmington Hills, Mich.; John S. Vargo,consultant, Wixom, Mich.
11 a.m., L-5-EMS Template forMetal Finishers: EMSImplementation at SeveralSouthern California Facilities
Laura Bloch, D. Env., U.S. Environmental Protection Agency, Region 9,San Francisco; Michael Keefe,Patrick Wooliever, Tetra Tech EMInc., San Francisco
11:30 a.m., L-6-SegregatedWastewater Treatment forEnvironmental Excellence &Cost Effectiveness
Paul Eckerson, Molex Inc., Lincoln,Neb.
Session MWastewater Treatment &RecyclingSession Chairman: Lyle Kirman, Kinetico Engineered Systems, Newbury, Ohio
1:30 p.m., M-1-WastewaterTreatment of CombinedElectroplating, Powder Coating& E-coat Process OperationsThat Are All Routed Through aConventional Flow-throughTreatment System
Mark E. Andrus, Taskem, Inc.,Brooklyn Heights, Ohio
Metal Finishing
2 p.m; M-2-0rganoclays ReduceP&T Costs
George R. Alther, Biomin Inc., Ferndale, Mich.
2:30 p.m., M-S-The Use ofBromine Chemistry for SandFilter Disinfection
Frederick W. Lehmann, TASKEMInc., Brooklyn, Ohio
3 p.m., M-4-CeramicMicrofiltration for MetalFinishing Wastewater Treatment
David R. Stewart, BASX SystemsLLC, Fort Collins, Colo.
3:30 p.m., M-5-ln-processPurification of Plating Baths
R.P. Renz, P.O. Miller, E.J. Taylor,C.D. Zhou, Faraday Technology Inc.,Clayton, Ohio
Session NEmerging Technologies
Session Chairman: Dr. Fred Reinhard, CH2M Hill, Eagan, Minn.
1:30 p.m., N-l-3-D ElectrolyticCell Provides New Option forWastewater Recycle & WasteMinimization
B. George Kniazewycz, Charles E.Lemon, Renovare International Inc.,Walnut Creek, Calif.
2 p.m., N-2-Removal of Chrome& Creation of a Zero DischargeSystem Using Electronic WaterPurification
Robert Atlas, Sabrex of Texas Inc.,San Antonio
2:30 p.m., N-S-An Environmental& Economic Comparison of IonExchange & RecentlyCommercialized ElectrochemicalTechnologies for the Recovery ofRinsewater in a Bright NickelPlating Facility
Dave Szlag, Chris Dillhoff, U.S. EPA,National Risk Management ResearchLaboratory (NRMRLl, Cincinnati
3 p.m., N-4-The Effectiveness ofElectrocoagulation as an Aid inWastewater Treatment
Jerry C. Brown, Illinois Waste Management & Research Center (lWMRC), Oak Brook, Ill.
3:30 p.m., N-5-Bioremediation inMetal Cleaning Applications
Barry Williams Atotech USA Inc.,Rock Hill, S.C. MF
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