advanced rf integration for lte smartphones - en.tdk.eu · pdf fileadvanced rf integration for...

Christian Block CEO and CTO of the Systems, Acoustics, Waves Business Group

CTO and Member of the Management Board of EPCOS AG November 12, 2014

Technologies & Products Press Conference 2014

Advanced RF integration for LTE smartphones

Technologies & Products Press Conference 2014 • Advanced RF integration for LTE smartphones

© EPCOS AG A TDK Company

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LTE is the driver of future RF architectures

Miniaturization • Multiband / multimode architectures

in compact handsets • Low insertion height + small footprint Superior performance • High thermal and frequency stability • High power durability • Excellent electrical performance

(e.g. lowest losses, highest linearity) • Low costs Advanced architectures • Carrier aggregation • Envelope tracking • MIMO concepts

Challenges for RF modules

RF integration is the key enabler of next-generation smartphones.



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Building blocks of the module integration architecture

High band (2300 – 2690 MHz)

e.g. bands 7, 40, 41, 30

Mid band (1710 – 2170 MHz)

e.g. bands 1, 2, 3, 4, 25, 34, 39

Low band (699 – 960 MHz)

e.g. bands 5, 8, 12, 13, 20,

26, 28, 29

Antenna(s) Antenna switches Duplexers

Power Amplifiers RF IC



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Today’s RF module integration is mainly based on combining similar building blocks into one package

Evolving RF module integration strategy (1)

Example • Antenna switch modules • Duplexer banks

EPCOS duplexer bank module

High Band

Mid Band

Low Band





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New features like carrier aggregation, envelope tracking and multimode/multiband power amplifiers are driving new integration schemes.




High Band

Mid Band

Low Band



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The combination of different functions such as duplexers and antenna switches into multifunctional front-end modules increases the degree of integration and saves space.


EPCOS B5208 FEMiD module

Example • EPCOS front-end modules

with 6 integrated duplexers (FEMiD)



High Band

Mid Band

Low Band



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Frequency separation is driving future integration

The next integration step is one fully integrated RF module for each frequency range, including multimode/multiband power amplifiers, duplexers, RF switches and RF matching.

Requirements of high-density integration of PAs with duplexers into PA based modules • Excellent RF performance

covering 0.5 to 3.5 GHz • High power capability /

thermal management • Smallest footprint in

combination with 0.80 mm height

• Highest cost efficiency



High Band

Mid Band

Low Band



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Key technologies for RF modules

Advanced RF modules

• Wafer-based front-end technologies for PAs, switches and duplexers

• SAW and BAW filter technologies with low TCF

Micro-acoustic

technology

• Chip-sized SAW package (CSSP, CSSPlus, CSSP Cu)

• Die-sized SAW package (DSSP) • Thin-film acoustic package (TFAP)

Packaging technology

• Low-temperature co-fired ceramic (LTCC) • Semiconductor embedded in substrate

(SESUB) • Multilayer laminate

Module integration technology



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Advanced micro-acoustic technologies improve RF filter performance

Reduction of losses to improve overall resonator Q • Lower insertion attenuation • Higher skirt steepness Improved piezoelectric coupling • Realization of filters for larger filter bandwidth • Prerequisite for efficient temperature compensation

technology

Temperature compensation technology • Reduced center frequency drift over temperature • Zero temperature drift for critical skirts

Standard performance without temperature compensation

Improved performance with temperature compensation



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Compared to standard SAW • Lower |TCF| of ≈ 20 ppm/K • Lower losses • No spurious modes

Compared to standard SAW • Lower |TCF| of ≈ 20 ppm/K • Lowest losses @ 2 GHz • Hybrid BAW / SAW solutions possible

SAW and BAW filters with low |TCF| of ≈ 20 ppm/K

TCF = temperature coefficient of frequency

Two micro-acoustic technologies already available with temperature compensation

Temperature-compensated SAW duplexer for band 20

Hybrid BAW / SAW duplexer



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Advanced TDK packaging technology platforms

• Designed for both discrete components and module integration • Support additional functionality (e.g. integrated or embedded passives) • Drive miniaturization and cost reduction • Offer improve thermal management and interconnect technology • Achieve low insertion of < 250 µm (DSSP and TFAP)

Flip-chip package Wafer-level package Bare die package

CSSP3 Glob-Top CSSP3 Cu frame DSSP TFAP

CSSP chip-sized SAW package DSSP die-sized SAW package TFAP thin-film acoustic package



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• Die size = package size

• Low insertion height of less than 200 µm, including bumps

• Hermetic package withstands overmolding processes up to 80 bar

• Compatible with all micro-acoustic RF technology platforms

TFAP – ultra-thin package for all RF platforms WLAN module with TFAP BAW filter

TFAP BAW filter



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TFAP process enables optimal RF performance

Frequency [MHz]

Atte

nuat

ion

[dB]

Before packaging After packaging

0

-10

-20

-30

-40

-50

-60

-70 1750 1800 1850 1900 1950 2000

TFAP package has no negative impact on RF or electromagnetic performance.



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Integrated module development

• Integration of passive components

• Embedding of active components

• Multiple interconnect technologies (wire bond, SMD, solder balls, Cu pillars)

• Own high-volume LTCC production

• 3D electromagnetic simulation and co-design with duplexers

Buried inductor

Buried capacitor

Embedded ICs

With flip-chip and SMD components

LTCC

SESUB

Multilayer laminate

The combination of module integration technologies

enables perfect-fit solutions.



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Roadmap

Module integration technology

Today Tomorrow

Multilayer substrates with passive integration

High-density 3D integration of active and

passive components

Micro-acoustic

technology |TCF| ≈ 20 ppm/K

700 to 2700 MHz

|TCF| < 10 ppm/K

400 to 4000 MHz

Temperature compensation and bandwidth

Packaging technology < 0.3 mm < 0.2 mm

Insertion height of filters and duplexers

Degree of integration

www.global.tdk.com • www.epcos.com

advanced rf integration for lte smartphones - en.tdk.eu · pdf fileadvanced rf integration for...

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