a comparison of scrub marks & contact resistance ... 12, 2003 1 “a comparison of scrub marks...

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May 12, 2003 1 A Comparison of Scrub Marks A Comparison of Scrub Marks & Contact Resistance Between & Contact Resistance Between Cantilever Type and New MEMS Cantilever Type and New MEMS Type Probe Cards Type Probe Cards Jae Jae - - Ha Lee Ha Lee Byung Byung - - Ho Jo Dr Ho Jo Dr Phicom Corporation Phicom Corporation

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May 12, 2003 1

““A Comparison of Scrub Marks A Comparison of Scrub Marks

& Contact Resistance Between & Contact Resistance Between Cantilever Type and New MEMS Cantilever Type and New MEMS

Type Probe CardsType Probe Cards””

JaeJae--Ha LeeHa LeeByungByung--Ho Jo DrHo Jo Dr

Phicom CorporationPhicom Corporation

May 12, 2003 2

Probe Card Comparison CriteriaProbe Card Comparison Criteria1. MEMS PROBE CARD1. MEMS PROBE CARD2. Pin Force2. Pin Force3. Probe Planarity3. Probe Planarity4. Scrub Mark Width/Depth4. Scrub Mark Width/Depth5. Probe X,Y Alignment5. Probe X,Y Alignment6. Path Resistance6. Path Resistance7. Life Time (Number of touchdowns)7. Life Time (Number of touchdowns)8. Bandwidth8. Bandwidth9. Specification9. Specification

May 12, 2003 3

1. MEMS PROBE CARD1. MEMS PROBE CARD

Manufactured by MEMS TechnologyManufactured by MEMS Technology

Vertical Micro ProbeVertical Micro Probe

High MultiHigh Multi--DUTDUT

Optional Tip StructureOptional Tip Structure

May 12, 2003 4

MEMS Probe Card ViewMEMS Probe Card View

Probe Head

Micro ProbesPCB

Planarization Mechanism

Decoupling Capacitor

Planarization Mechanism

Interface Pin

PCB

Micro Probe

Micro Probe Head

MEMS Probe Card- Manufactured by MEMS

technology

MEMS Probe Card side view

May 12, 2003 5

Micro Probe Tips of MEMSMicro Probe Tips of MEMS

54µm

125µm

42µm

12µm

35~45µm

MEMS PT1 Type MEMS PT2 Type

May 12, 2003 6

2. Pin Force2. Pin Force- Overdrive Vs Contact Force

- GraphNeedle P/CMEMS P/C

O.D Value

6.46.4--

2mil2mil

4.64.6--

1.5mil1.5mil

----9.79.77.47.87.87.07.06.06.05.0

4 mil4 mil3.5 mil3.5 mil3 mil3 mil2.5 mil

7.4Needle P/C5.0MEMS P/C

2.5 milO.D Value(Unit:gf/mil)

(Unit:gf/mil)

May 12, 2003 7

• The planarity after 29,600 touchdowns• T/D is real contact number on production line

3. Probe Planarity (MEMS P/C 64 DUT)3. Probe Planarity (MEMS P/C 64 DUT)

After 29600 TDS (Unit:um)

Before TDS

May 12, 2003 8

Probe Planarity (NEEDLE TYPE P/C)

• The Planarity after 29,600 Touchdowns• Touchdown Test in EG 4090 Prober System without Signal

After 29600 TDS (Unit:um)

Before TDS

May 12, 2003 9

Probe Planarity (PRVX)- Touchdowns Vs Planarity (Max.-Min.).

Measure the Pin Planarity after touchdownsTD of MEMS P/C is real contact number on production lineTD of Needle P/C is internal test data on EG 4090 Prober

25.218125.218122.242422.242420.324920.324917.221417.2214Needle P/CNeedle P/C22.146622.146620.356420.3564MEMS P/CMEMS P/C29.6K29.6K12K12K6.4K6.4K00TDS TDS

(Unit:um)

May 12, 2003 10

4. 4. Scrub Mark Width/DepthScrub Mark Width/Depth

PT1 Tip Scrub Mark Width/DepthPT1 Tip Scrub Mark Width/Depth

PT2 Tip Scrub Mark Width/DepthPT2 Tip Scrub Mark Width/Depth

Needle Scrub Mark Width/Depth Needle Scrub Mark Width/Depth

May 12, 2003 11

PT1 Tip Scrub Mark Width (SEM)PT1 Tip Scrub Mark Width (SEM)

O.D:3.0 milO.D:2.5 mil

O.D:3.5 mil O.D:4.0 mil

May 12, 2003 12

PT2 Tip Scrub Mark Width (SEM)PT2 Tip Scrub Mark Width (SEM)O.D:3.0 milO.D:2.5 mil

O.D:3.5 mil O.D:4.0 mil

May 12, 2003 13

Needle Scrub Mark Width (SEM)Needle Scrub Mark Width (SEM)O.D:3.0 milO.D:2.5 mil

O.D:3.5 mil O.D:4.0 mil

May 12, 2003 14

Scrub Length & Area (all types are compared)Scrub Length & Area (all types are compared)

Scrub Mark X trend

Scrub Mark X*Y trend

May 12, 2003 15

Scrub Mark Depth Measurement EquipmentScrub Mark Depth Measurement Equipment

Model: SIS-1200

Interscan System

Z-Resolution : EPSI 1nm

PSI 0.1nm

Lateral Resolution :MAX0.64um

Lens : 50X

L/R:0.64um

Field of View : 0.14 x 0.10mm

May 12, 2003 16

O.D:2.5 milPT1 Tip Scrub DepthPT1 Tip Scrub Depth

O.D:3.0 mil

May 12, 2003 17

PT1 TIP Scrub DepthPT1 TIP Scrub Depth O.D:3.5 mil

O.D:4.0 mil

May 12, 2003 18

O.D:4.5 milPT1 Tip Scrub DepthPT1 Tip Scrub Depth

PT1 Tip Scrub Depth TrendPT1 Tip Scrub Depth TrendPT1 Tip

2000

2500

3000

3500

4000

2 2.5 3 3.5 4 4.5 5

Over Drive(mil)

Scru

b Dep

th(Å

)

May 12, 2003 19

O.D:2.5 milPT2 Tip Scrub DepthPT2 Tip Scrub Depth

O.D:3.0 mil

May 12, 2003 20

PT2 Tip Scrub DepthPT2 Tip Scrub DepthO.D:3.5 mil

O.D:4.0 mil

May 12, 2003 21

PT2 Tip Scrub DepthPT2 Tip Scrub Depth O.D:4.5 mil

PT2 Tip Scrub Depth TrendPT2 Tip Scrub Depth TrendPT2 Tip

2000

2500

3000

3500

4000

4500

5000

5500

2 2.5 3 3.5 4 4.5 5

Over Drive(mil)

Scrub

Dep

th(Å

)

May 12, 2003 22

Needle Scrub DepthNeedle Scrub DepthO.D:2.5 mil

O.D:3.0 mil

May 12, 2003 23

O.D:3.5 milNeedle Scrub DepthNeedle Scrub Depth

O.D:4.0 mil

May 12, 2003 24

Needle Scrub DepthNeedle Scrub Depth

Needle Tip Scrub Depth TrendNeedle Tip Scrub Depth Trend

O.D:4.5 mil(Å

)

Needle

0

1000

2000

3000

4000

5000

6000

2 2.5 3 3.5 4 4.5 5

Over Drive(mil)

Scrub

Dep

th(Å

)

May 12, 2003 25

Scrub Depth (all types are compared)Scrub Depth (all types are compared)

Scrub Depth (All type)

0

1000

2000

3000

4000

5000

6000

2 2.5 3 3.5 4 4.5 5

Over Drive

Dep

th PT1PT2Needle

(Å)

May 12, 2003 26

5. Probe X,Y Alignment (MEMS)5. Probe X,Y Alignment (MEMS)

Before TDS After 29600 TDS

Real contact number on production line

May 12, 2003 27

6. Path Resistance- Touchdown Vs Path Resistance (Average)

- Graph

1.61211.61211.60121.60121.69811.69811.14371.1437Needle P/CNeedle P/C

1.051.051.041.04MEMS MEMS P/CP/C

29.6K29.6K12K12K6.4K6.4K00TDSTDS

(Unit:Ohm)

May 12, 2003 28

MEMS P/C Path Resistance Trend

Before TDS After 29600 TDS without Cleaning

Real contact number on production line

May 12, 2003 29

Needle P/C Path Resistance Trend

Before TDS After 29600 TDS without Cleaning

Phicom Test Data

May 12, 2003 30

7. Probe Life Time- Life Time (Number of Touchdowns)

32,000TDS

120,000TDS64,000TDS

May 12, 2003 31

- Cleaning Period

30000TDS CleaningMean Time Between Cleaning (April 03')

0

5

10

15

20

25

30

35

M01 M02 M03 M04 M05 M06 M07 M08 M09 M10

MEMS P/C (64 DUT) Serial number

Days

Initial

May 12, 2003 32

8. MEMS Probe Card Bandwidth

Insertion Loss (S21)

-3

-2.5

-2

-1.5

-1

-0.5

0

0 0.5 1 1.5 2

GHz

dB

May 12, 2003 33

Sys te m Value Unit3D 15 ~ 20 um

25 ~ 30 umLe akage <5 nA

<5 OhmVxe rr 80 ove rlay %Vye rr 80 ove rlay %S crub 10 umTscrub 25 umDiame te r <18 um

S EM < 13 umS crub Are a <13x24 um2

Normal 75 umMaximum 110 um

Impe dance Polar 50 (±10%) Ohm600 mA

Pin Force 2.5(±20%) gf/mil8.8 mm

> 15,000 TDsLife Time Probe r 1 Million TDs

Me asure me nt Ite msSpe cification

Planarity

PRVX

Contact Re sistance

Probe De pthCle aning Pe riod

Max Curre nt

Tip Diame te r (Change able )(Base d on O.D 75um)

O.D.

9. MEMS Probe Card Specification

May 12, 2003 34

Summary

- Enough Pin Force to penetrate Al2O3- Stable Planarity- Stable X.Y Alignment Status- Low Pad Damage With Enough Scrub Mark- Constant Path Resistance- Long Cleaning Period- Long Life Time- Uniform Probe Tip Shape