6/8/03j. lajoie - phenix silicon workshop1 pixel ladder, pilot issues physical structure of first...
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6/8/03 J. Lajoie - PHENIX Silicon Workshop 1
Pixel Ladder, PILOT Issues
• Physical structure of first pixel layer– FPGA-based PILOT chip readout
• Show some results from simulation model
– Kapton cable bus for parallel pixel chip readout
• Is a parallel readout structure possible?
J. Crandall, J. Hill, J. Lajoie, C. Ogilvie, G.Tuttle, S. Skutnik
6/8/03 J. Lajoie - PHENIX Silicon Workshop 2
Implementation in PHENIX
Laser + 2 pin diodes
Dig
PILOTGOL
Ana
PILOT
Flash
ADC
Pilot/control board, one per ladder• supplies voltage to readout• reads data from each readout• sends data out on fiber-optic• sets thresholds, masks etc.
start with ALICE design, modify to meet PHENIX needs
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FPGA-based PILOT Module:Problem Statement and Goal
• Read 8 ALICE1 Pixel Chips in Parallel– Keep readout time within PHENIX specification– Minimize readout electronics
• Transmit Zero-Word Suppressed Data to Optical Chip (GOL)
• First look at design– Basic functionality only– Does it match to possible rad-hard FPGA?
6/8/03 J. Lajoie - PHENIX Silicon Workshop 4
PILOT Module Block Diagram
8 ALICE1 PIXEL CHIPS
32-bit Pixel Output @ 10MHz
8 chips in parallel
PILOT Module
GOL
16-bit PILOT Output @ 40MHz
LVL1 Strobe
. . . . .
. . . . .
. . . . . NEVR (Next Event Read) CE (Chip Enable)
6/8/03 J. Lajoie - PHENIX Silicon Workshop 5
PILOT Module Functional Operations
• READ– Read 32bit-word ALICE1 Pixel Data x 256 cycles @10 MHz– Reject zero words– Append word/cycle Address to 32-bit data word
• (0-255)– Store into FIFO
• WRITE– Append Pixel Chip Address (0-7)– Write to GOL 16-bit bus @ 40MHz
Full PHENIX functionality would require these two operations to be asynchronous!
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Readout Timing
• ALICE1 Read Time:
• Store 32b Pixel data + 32b Address (overkill!) in FIFO
• Total Estimated Pixel-Chip Readout w/10% (word) Occupancy & Zero-word Suppression
(Note: design occupancy is <1% per channel)
t TMHz
sread pixel * * .2561
10256 25 6
t t t sMHz
sTOTAL read write 25 6256 8 4
4010% 461.
* ** .
6/8/03 J. Lajoie - PHENIX Silicon Workshop 7
FPGA Coding
• Written in VHDL for basic functionality– Read, Zero-suppress, Write to GOL
• Implement in FPGA Logic– Synthesize VHDL to FPGA architecture (Xilinx)– Implement Triple Modular Redundancy (TMR)
• TMR for state and critical logic • Check match for size, gates, timing etc. of FPGA
6/8/03 J. Lajoie - PHENIX Silicon Workshop 8
Xilinx FPGA SynthesisExceeded (BRAM capacity) of XCV600E (~23mm X 23mm, ~660k system gates)
Easily fit XCV2000E (~40mm X 40mm, ~2M system gates)
Does not currently meet ladder-physical size constraint, BUT
Use a smaller die and put FIFOs in system logic.
• Device Xilinx v2000efg680-6 (~40mm X 40mm)
• Number of Slices: 576 out of 19200 3%
• Number of Slice Flip Flops: 633 out of 38400 1%
• Number of 4 input LUTs: 1001 out of 38400 2%
• Number of bonded IOBs: 276 out of 516 53%
• Number of TBUFs: 512 out of 19200 2%
• Number of BRAMs: 32 out of 160 20%
• Number of GCLKs: 2 out of 4 50%
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Functionality and Timing Tests
Simulation of read cycle and zero suppression:
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Radiation Tolerance of FPGA’s• Development driven by satellite applications
• Xilinx QPro Series– Guaranteed for 100kRad operation (~9.0 rad/s rate)– SEL Immunity up to LET ~ 125 MeV cm2/mg– SEFI Immunity up to LET ~6 MeV cm2/mg (with TMR!)– Configuration data can be “scrubbed”– >100kRad possible with “self-annealing”
• ACTEL Rad-Hard Antifuse (RTSX-S)– Extensive use in industry – SEFI LET Immunity up to ~37 MeV cm2/mg (TMR in hardware!)– Antifuse (program once!)– ProASCI (Flash) not fully tested for rad-hard applications
• Need to more fully absorb test data and match PHENIX requirements
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FPGA-based PILOT Chip Future Work
• Continue with software simulation• Multi-event readout cycle (async. READ/WRITE)• Bit-level zero suppression, smaller headers• Include ALICE1 and GOL behavioral models into
simulation• Move on to FPGA hardware, late summer/fall ‘03• Implement Triple Modular Redundancy for state machine
logic• Radiation Dose Estimates, FPGA evaluation for rad-hard
performance• Evaluate failure modes, rates.
6/8/03 J. Lajoie - PHENIX Silicon Workshop 12
Pixel Readout Bus
• 8 readout chips per ladder, 2 ladders laid end-to-end
ladder
control
pixel chip
READOUT CHIP
PIXELS DETECTOR 150 to 200µm
290µm
150 to 200µm
carbon fiber support cooling
passive components
Multi-layered kaptonALICE bus 32 signal lineseach chip read-out sequentially 8*25.6 s = 200 s
6/8/03 J. Lajoie - PHENIX Silicon Workshop 13
Line Density• Bus width is ~ 15mm• Line pitch= 15mm/(8*32) = 58m
– each output is single-ended• Existing busses
– D0 (2001) pitch 50m “fanned” out to 100m,• trace width 7-8m
– D0 (2002) two // cables each with pitch 91m• avoided “fan”
– Both made by Dyconex (Swiss), other manufacturers identified
• Manufacturing problems scale with bus length!• Requirements are close to state-of-the-art for production
– Our length (~50cm), requirements not unreasonable
6/8/03 J. Lajoie - PHENIX Silicon Workshop 14
Bonding Chip to Bus
READOUT CHIP
PIXELS DETECTOR 150 to 200µm
290µm
150 to 200µm
carbon fiber support cooling
passive components
wire bond densitysame as ALICE ~ 12mm/32 ~ 375 m
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Parallel Bus Summary
• Worthwhile considering what limits going to an 8*32 signal bus – allows us to read all eight chips in parallel– time = (15 s + time to write) ~ 40 s
• Structure of readout bus must match requirements and manufacturing capabilities– Power and ground planes or traces?– Two or four layer bus?
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Backups
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Pilot Internal Structure
READ Module
WRITE Module
8b-Counter
L1a
addr
NEVRCE
coutCount_ enable
From ALICE1
To
GOL
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Read Module + FIFO (Parallel Operation, Replicated 8x)
Read Control LogicX
64b X 256 deep FIFOX
(Synchronous)
L1a
From ALICE1
NEVRCE
64b Data_in
addr
Rd_enable
coutCount_enable
64b Data_out
Wr_enable
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FIFO + Write Module (Daisy-Chain Operation, Replicated 8x)
64b X 256 deep FIFOX
(Synchronous)
64b Data_out
Write Control LogicX
Donex
Wr_enable
L1a
Startx
Done x-1
Start x+1
16b to MUXempty
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Write Daisy Chain
MUX
FIFO x-1
FIFO x
FIFO x+1
WRITE x-1
WRITE x
WRITE x+1
GOL
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