5. tong hsing mr. ru 092112dl
TRANSCRIPT
MEMS Packaging Update –Experience Sharing
from Tong HsingPresent by: Heinz Ru
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
Company StatusCompany StatusTaipei Chung-Li Philippine Plant I Philippine Plant
II
Address 55 Lane 365, Yingtao Rd., Yingko, New Taipei City, 239
Taiwan
8F,No. 27, Ji-Lin Rd., Chung-Li Industry Park,Tao-Yuan Hsien, 320 Taiwan
Lot 15 Road 3 Cermelray Ind’l
Park Canlubang,
Calamba City,
Philippines
103 Prosperity Ave., Carmelray Ind’l
Park Canlubang,
Calamba City,
Philippines
Established August 1975 September 1994 April 2008
Area Land: 138,000 sq.ft. Land: 80,700 sq.ft. Land : 325,000 sq.ft.
Bldg: 224,455 sq.ft. Bldg: 58,982 sq.ft.
Bldg: 71,866 sq.ft. Bldg : 195,000 sq.ft.
Employees 811 425 634 859
Tel: 886-2-2679-0122 886-3-433-5998 63-49-549-2952
63-49-549-2940Fax: 886-2-2670-0122 886-3-433-5995
Web Site: www.theil.com www.tonghsing.ph
Contract Manufacturing for Microelectronic Packaging and
Ceramic Thick Film/Thin Film Substrate Fabrication.
• RF Modules for Cellular Handsets, WLAN, and WiMax
• SiP Packaging for WLAN, UWB, and PAN
• MEMS Packaging
Products and ServicesProducts and Services
• MEMS Packaging
• CMOS Image Sensor Packaging
• Reconstruction Wafer
• Chip Probing and Final Test
• PCB assembly with SMT and/or COB Processes
• Automotive Hybrids
• Thin Film on Alumina and AlN
• Thick Film on Alumina
• DBC on Alumina and AlN
1974 Tong Hsing Established
1976 Started Production of Alumina Ceramic Substrates
1977 Started Production of Thick Film Print and Fire
1979 Started Production of Hybrid Modules
1986 Shipped 500K Modules of Electronic Fuse
1989 Received IECQ Manufacturer Approval
1993 Started Large Scale Production of Thick Film Copper Process
1993 Received ISO-9002 Certification
1994 Established Tong Hsing Electronics (Philippines) Inc.
1995 Started Production of Photo-Sensitive Thick Film Circuits
1996 Established CIM System to Track the WIP through LAN
Significant AchievementsSignificant Achievements
1996 Established CIM System to Track the WIP through LAN
1997 Started Mass Production of CDMA Power Amplifier Modules
1998 Received QS-9000/ISO-9001 Certification
1999 Started Mass Production of GSM Power Amplifier Modules
2001 Started Production of Thin Film DPC Substrate Fabrication
2002 Received ISO14000 Certification
2006 Received TS16949 and OHSAS 18001 Certification
2007 IPO at Taiwan Stock Exchange on Nov.15th
2008 Won the “Excellent Enterprise Innovation Award” from MOEA (Ministry of Economic Affairs)
2009 Received AS9100 Certification.
2010 Acquired Impac to form a new Image Sensor Group
Achieved “0” ppm for All Products Shipped to Automotive Customers for two consecutive years.
2011 Sony Green Partners ~ Certification Received; Full manufacturing approval was granted by both a well-known German and Japanese Auto Parts Manufacturer for Luxury Cars
2012 2012 Acquired DBC Production, Process, Know-how, and IP from HCS
Product SegmentsProduct Segments
2008200820082008
RF
45%
Ceramic
22%
Image
0%Others
2% RFHybridCeramicImageOthers2009200920092009RF26%Ceramic40%
Image0% Others6%Hybrid
RFHybridCeramicImageOthersHybrid
31%
28%2010201020102010RF
19%
Hybrid
16%
Image
23%
Others
2%
Ceramic
40%
RFHybridCeramicImageOthers2011201120112011
RF
14%
Hybrid
13%
Ceramic
44%
Image
27%
Others
2%
RF HybridCeramicImageOthers
150,000
200,000
250,000
Sales HistorySales History
Unit: USD$/K
0
50,000
100,000
2004 2005 2006 2007 2008 2009 2010 2011
Millions US$
Capital ExpenditureCapital Expenditure
Comparison 2004 through 2011Comparison 2004 through 2011
30,000
35,000
40,000
45,000
0
5,000
10,000
15,000
20,000
25,000
2004 2005 2006 2007 2008 2009 2010 2011
Unit: USD$/K
• Flexibility
• Technical Innovation
• Continuous Improvement & Growth
• Excellent High Volume Production Capacity
• Superior Supporting Infrastructure in Northern Taiwan
Major StrengthsMajor Strengths
• Superior Supporting Infrastructure in Northern Taiwan
• Abundant Supply of Human Resources for
Semiconductor Packaging in the Philippines
• Superb Customer Satisfaction
• Strong R & D Partners
Asia: 8%Europe: 27%
Market Sales by RegionMarket Sales by Region
Taiwan: 2%N. America: 63%
• Customer Satisfaction
• Quality
• Turnaround/Delivery Time
Our FocusOur Focus
• Turnaround/Delivery Time
• Productivity
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
• Niche market
• High entry barrier
• Long development cycle
• Leverage Tong Hsing’s experience
Business ModelBusiness Model
• Leverage Tong Hsing’s experience
accumulated over the past 30 years
• Build up long term relationship with the
technology partners
• Speed – Quality - Capacity
• Leading the way in Technology
• Partnership with our customers
Business StrategyBusiness Strategy
• Partnership with our customers
Tong Hsing’s major business at present:
• RF Front Module and PA Module for Handsets & WLAN
• Base Station Modules
• SiP for WLAN, UWB, GPS and Bluetooth
• MEMS packaging
• Thin Film Substrate for power LED & next gen high end memory
• Thick Film Substrates & Hybrids for automotive industry
• CPV Solar Cell Packaging
Growth Strategies & OpportunitiesGrowth Strategies & Opportunities
• CPV Solar Cell Packaging
• Fuel Cell Technology
• Business Commercial Aircraft(compliant to DO-254)
• Image Products
• Advanced Power Semiconductor
• Military Hybrid
• 3D IC & TSV Packaging
• Bio-Medical
• QFN Technology
• Laser
• Thermoelectric Cooler
1. DLP project
2. Silicon Microphone
3. Accelerometer and Gyro
4. RF MEMS Switch
5. Micro Display
MEMS Packaging MEMS Packaging -- Potential OpportunitiesPotential Opportunities
5. Micro Display
6. Hearing Aids Modules with DPC
7. MEMS Time Units
8. MEMS Microvalve Technology
9. Fingerprint Sensor
10. TH GGI Process
11. TH MEMS Cavity Packaging
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
• Tong Hsing Company Profile
• Tong Hsing Business Strategy and Business Model
• Tong Hsing’s Involvement in MEMS packaging
– DMD
Presentation OutlinePresentation Outline
– DMD
– Printhead
– Airflow
– Microphone
– Gyro
– Medical MEMS
THE END
THANK YOU FOR YOUR LISTENING!!