3w broucher latest

7/28/2019 3W Broucher Latest

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3W PCB DESIGN SERVICES3W PCB DESIGN SERVICES

PCBDesign

ThermalAnalysis

SI AnalysisPCBFabrication

ServicesSchematic

Development

PCB Layout

PCBAssembly


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3W PCB DESIGN SERVICES3W PCB DESIGN SERVICES

3W provides a wide range and world class PCB design services, includingschematic capture, PCB layout and board Fabrication. We have experiencewith various PCB CAD systems.

During the development of your product, our PCB designers will workclosely with the electrical engineers and mechanical engineers to ensurethat the placement of parts meets both circuit and mechanical

can provide a PCB design that supports efficient assembly and testing withhigh yields during production.

If you need assistance choosing a PCB supplier and assembly, we have astrong relationships with a large number of board manufacturers and

assemblers can find the best source of PCBs to meet your developmentschedule and prototyping needs.


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OUR PCB LAYOUT AND PCB DESIGN SERVICESOUR PCB LAYOUT AND PCB DESIGN SERVICES

AND CAPABILITIESAND CAPABILITIES

Single-sided, double-sided, and multi-layer boards

Rigid and flexible circuits

Surface mount, through-hole, mixed technology

Design for manufacturability (DFM)

Desi n for testabilit DFT

Signal Integrity Thermal Analysis.


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METHODOLOGYMETHODOLOGY

Study the customer requirements and download component datasheets.

Component symbol and footprint creation for new components as per

datasheets.

Capture/Modify Schematic as per inputs.

Import netlist from schematic to layout.

Place the critical components, connectors as per Placement guidelines.

Placement review. Layout routing.

Design rule checking

Final review as per internal checklist.

Gerber generation compatible in RS-274x format CNC drill report generation for fabrication compatible to Excellon format.


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VALUE ADDITIONVALUE ADDITION

Analog and digital areas separated.

Chasis gnd is provided at the edges

of the Board for the safety.

Our designs meet EMI/EMC

standards.

compliances with IEEE and IPC-7351

standards.

Performed signal integrity for

selected signals.

Capable to design up to 20 LayerPCBs


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SCHEMATIC AND SYMBOL CREATIONSCHEMATIC AND SYMBOL CREATION

Creating schematic Symbols.

Creating components Footprintsusing IPC - 7351PCB component

wizard.

Adding attributes to components

component.

Add components info to new

Microsoft Access Database.

Create new database library (For

Custom components if required).


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PCB ARTWORK DESIGNPCB ARTWORK DESIGNPCB Artwork Design

Designing of 2-20 layer PCBs using different CAD packages. Compliant to Design for Manufacturability and Assembly (DFMA) and

Design for Testability (DFT) methods.

We have internal checklist to verify the same.

PCB Designing following the guidelines of the client and IPC standards. PCB manufacturing files (Gerber files or odb++) generation from source.

Designing of Mechanically constrained PCBs

PTH to SMT conversion and manufacturing files generation considering

DFMS, DFT and compliance issues.


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StandardsStandards

IEC 60326, IPC 7351, IPC 2221.

Symbols compliant with IEEE

Customer Customer


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3W3W FOLLOWFOLLOW EMI/EMC GUIDELINESEMI/EMC GUIDELINES

Low effective impedance path for return.

Minimize cross talk.

Avoid ground loops and signal loops. Single traces inside the ground plane boundary.

Decoupling capacitors near to the pin, short capacitor connection length.

Se arate Analo and Di ital circuits.

Clock and oscillator circuit between two ground planes.

Direct routing for clock circuit ( With out Vias )

Use an even number of copper layers.

Consider placing voltage planes next to ground planes to form embedded

capacitors.


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3W FOLLOW DFT/DFMA GUIDELINES3W FOLLOW DFT/DFMA GUIDELINES

Ground planes (and traces) should end approx 0.010" from the edges of

the board to ensure against accidental shorting with metal chassis and

cases. Test pads provided for each net. (100% Test points coverage)

Test points should be provided on one side only, to minimize the cost of

fixture.

Components to board edge distance should be 125 mills Test pad should be 40 mills.

Test pad should be free of solder mask and ink.

Test point to test point distance should be 40mills.


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CONTACT US

[email protected]

[email protected]:www.3wtechnologies.co.in

#303, Bhavani Plaza,

ECIL X Roads

Hyderabad

Phone: 91-040-65811165

Cell: 8106000559

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