3d plus technology and offer - semi.org 3d plus.pdf · p.couderc 3d plus technology and offer 15...

P.COUDERC 3D PLUS technology and offer 1

All Rights Reserved © 3D PLUS 2012

3D PLUS technology and offer

By Dr Pascal Couderc,

3D PLUS

408, Rue Hélène Boucher 78532 BUC – France

Phone: + 33 1 30 83 26 50

Email : www.3d-plus.com

TM

http://www.3d-plus.com/



Outline

- Introduction

- 3D PLUS technology

- Product examples

- Conclusions



- Spin off from Thales (1996)

- Located in Buc (France ) , South of Paris

- From September 2011, 3D PLUS is a 100% subsidiary of

HEICO company

- Strong R&D from the 3D PLUS launching

- Active patenting policy

- Space certifications from CNES, ESA, NASA, JPL,JAXA,

CAST etc… ( more than 70 000 modules in space

including ROSETTA mission cameras )

- Exportation: 90%

- Workforce : 150

- R&D : 11 including 5 PhD

Introduction



3D PLUS technology

FLOW 2 process1 ) - Flex Design

2 ) – Components attachment

3 ) - Circuit Test & Screening

4 ) – Layers Stacking

6 ) – Cube Sawing

5 ) – Cube Molding

7 ) – Cube Plating ( Ni + Au )

8 ) – Circuit interconnection by

laser grooving

9 ) – Cube Test & Screening



WDoD ™(1) initial criteria

Use of multi sourcing wafers

Stacking of 5 to 10 levels per mm

Size: 200µm around the larger Die

Stacking of Known Good Rebuilt Wafer (KGRW)

Possibility of several dice of different dimensions of the same level

Parallel processing/Panelization from A to Z

Possibility to stack PCB levels ( flow 2) and rebuiltwafers in order to optimize performances and costs

(1) Wirefree Die on Die – Trade Mark from 3D PLUS

WDoDTM technology



WDoDTM technology



WDoDTM technology

Molding resinSi

2D routing:

RDL

Metal trackDielectric passivation layer

Al Pads



WDoDTM technology

300 mm wafer

Single unit

RDL cross section

Via interconnect at Al pad level2 layers RDL with ground plane



WDoDTM technology



WDoDTM technology

Laser patterning



WDoDTM technology

PoP and WDoD package relative sizes



Product example 1 : Leadless pacemaker

Dimensions :

2.3 x 5.2 x 7.3 mm

(courtesy of SORIN CRM)

•The module has 5 layers

stacked using 3D PLUS

WDoDTM process.

•The layers are stacked at

wafer level. 2 layers have

known good passive (30) and

active components (3) and

are reconstituted wafers

using fan out WLP

technology eWLB.

• RDL pitch is 50µm. The 3

other layers are PCB

based(mixed flow2 and

WDoD)



Product Example 2 :Embedded programmable

module

8Mx16 166MHz mDDR

64Mb 104MHz

NOR

Spartan 6FPGA

Ban

k4

8Mx16 166MHz mDDR B

ank5

Ban

k3B

ank1

Ban

k0SPI

Ban

k2

JTAG

167 caps

4 GTPs

6 CMT

64

60

36

• Same footprint as a single SPARTAN 6

CSG484

• The two dimensional area gain on a

board is about 58 %

• Embedded decoupling capacitors



Product Example 2 : Embedded programmable

module

• MODULE DIMENSIONS : 19 x19 x 3 mm

• BALLING : 484 SAC305 balls

• SAME BALL OUT THAN FPGA COMPONENT



Conclusions-Offer

• With 3D PLUS technologies patented portfio , we can design,

manufacture and performed electrical tests on 3D modules

• We have a large portfolio of standard 3D modules

• We can also develop and manufacture 3D modules for

specific customers applications

• Our technologies are good alternatives to flex-folded, TSV,

PoP , Chip-On-Chip technologies.



Questions?

Ultra Dense 3-D Micro system with WDoD

Thank you for your attention

www.3d-plus.com

3d plus technology and offer - semi.org 3d plus.pdf · p.couderc 3d plus technology and offer 15...

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