3d ic? 3d metrology! -...
TRANSCRIPT
![Page 1: 3D IC? 3D Metrology! - Semieuropesemieurope.omnibooksonline.com/2015/semicon_europa/TechLounge/25...3D IC? 3D Metrology! Presentation at SEMICON Europa 2015 TechLOUNGE ... Development](https://reader034.vdocuments.mx/reader034/viewer/2022051509/5ae3756a7f8b9a5b348d77c9/html5/thumbnails/1.jpg)
the art of metrologyTM
3D IC?3D Metrology !
Presentation at SEMICON Europa 2015 TechLOUNGEWednesday, 07. October 2015, 16:15
FRT, Fries Research & Technology GmbHDr. Bastian Marheinekewww.frt-gmbh.com
Visit us at booth 1241
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the art of metrologyTMvisit us at booth 1241
Distributors:approx. 20 in 18 countries
Founded 1995 by Dr. Thomas FriesPresidents: Dr. Thomas Fries, Dr. Bastian MarheinekeSubsidiaries in US and ChinaDistribution and service partners in Asia and EuropeDelivered more than 600 metrology tools world wide
Company Introduction
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the art of metrologyTMvisit us at booth 1241
Distributors:approx. 20 in 18 countries
Development of optical 3D surface metrology systems:
� Measurement of topography, film thickness etc.� Multi sensor tools� Sensor development� Development of control and analysis software� Integration and automation� Contract measurements
� Global distribution and service network� Member in professional associations� Member in committees for standardization
Company Introduction
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the art of metrologyTMvisit us at booth 1241
Multi Sensor Metrology Modular Software Set Up
Modular Hardware Set UpMeasurement Solutions Variety
Company Introduction
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the art of metrologyTMvisit us at booth 1241
Multi sensor technology for flexible metrology syst ems
� FRT offers various sensors giving 4 basic combinati on options:
FRT Multi Sensor Technology
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the art of metrologyTMvisit us at booth 1241
Fully Integrated Production Tool
Tabletop Unit
FRT ProductsFRT standard systems for various industries
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the art of metrologyTMvisit us at booth 1241
MicroProf ® 100100 mm x 150 mm
MicroProf ® 300305 mm x 415 mm
MicroProf ® 200200 mm x 250 mm
Identical technology – different sizes!
MicroProf ® Series – 3D IC ApplicationCompact Multi-Sensor Systems for R&D, Production a nd QA
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the art of metrologyTMvisit us at booth 1241
MicroProf ® Series – 3D IC ApplicationFully Automated Wafer Metrology Tool
MicroProf ® 200 MHUMulti Sensor metrology tool with 200 mm stage and material handling unit
MicroProf ® 300 TTV MHUMulti Sensor metrology tool with 300 mm stage, sensor setup for wafer thickness measurement (TTV), fully automated
SEMI CompliantTTV Measurement
FRT MFE - Metrology for FrontendFully automated Multi Sensor metrology tool with 300 mm stage, bridge tool, class 1 EFEM, SECS/GEM interface, thin wafer handling optional
Identical technology – fully automated!
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the art of metrologyTMvisit us at booth 1241
MicroProf ® Series – 3D IC ApplicationWafer Metrology Tool
Bow Warp TTV SBID Sori SFQR Sag ProfileRoughness 3D map LTV Thickness TIR
FPD Stress ROA Film Thickness Step Height …
One Metrology Tool for All Wafer Tasks !!!
GaAs / InP / Sapphire / GaN / SiC / Si / …
saw/grinding
epitaxy
pre/post polishing
device fabrication
pre/post PSS
thinning
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the art of metrologyTMvisit us at booth 1241
MicroProf ® Series – 3D IC ApplicationWafer Metrology Tool in 3D IC
Application in 3D IC
Picture courtesy:High performance interposer for network processingG. Kimmich, Jan. 2015, European 3D TSV 2015
TSV
Interposer
Backgrinding
Trenches
Bumps / µ-Bumps
Thin film measurement
Step height / width
TSV / trench depth / width
Bump analysis
Bulk thickness
Stress
T-dependent topography
Metal Contacts
Photo Resist
BGA
RDL / UBM
Reflow soldering
Multiple measurement methods in one tool
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the art of metrologyTMvisit us at booth 1241ASMC2015: Optical step height and trench depth measurement , F.Heider et al. Infineon/FRT
standard deviation for 12 weeksdynamic repeatability test = 9 nm (0.17 %)
step height = 5.2 µmstep width = 12 µm
FRT CWL point sensors
� chromatic white light sensor� optical measurement � fast and non contact� down to 6 nm vertical resolution� 2 µm lateral resolution� 4 kHz measuring frequency
also determines roughness according to international standards
MicroProf ® Series – 3D IC ApplicationAnalysis of step height / width
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the art of metrologyTMvisit us at booth 1241
standard deviation for 12 weeksdynamic repeatability test = 63 nm (0.03 %)
trench depth = 225.9 µmtrench width = 24.8 µm
ASMC2015: Optical step height and trench depth measurement , F.Heider et al. Infineon/FRT
FRT WLI PL field of view sensors
� white light interferometer� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement with
one-shot technology� deep surface measurement without shadowing
effects due to coaxial illumination� field of view 1 x 1 mm² to 85 x 85 mm²� lateral resolution 1 µm ~ 150 µm� vertical resolution 10 ~ 30 nm
MicroProf ® Series – 3D IC ApplicationAnalysis of trenches
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the art of metrologyTMvisit us at booth 1241
Via Arrays 5 µm – 100 µm
Single Via 40 µm / 250 µm
Multiple Vias 15 µm – 80 µm Multiple Vias 5 µm / 70 µm
MicroProf ® Series – 3D IC ApplicationAnalysis of TSV
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the art of metrologyTMvisit us at booth 1241
FRT WLI FL field of view sensors
� white light interferometer� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement
with one-shot technology� sub-nanometer vertical resolution,
sub-micrometer lateral resolution� field of view 0.26 x 0.35 mm²
to 1.3 x 1.74 mm²� lateral resolution 0.6 µm ~ 2.3 µm� vertical resolution 0.1 ~ 1.0 nm
Analysis of Trench and TSV structures < 1µm!
MicroProf ® Series – 3D IC ApplicationAnalysis of Trenches and TSV
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the art of metrologyTMvisit us at booth 1241
FRT CFM field of view sensors
� confocal microscope� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement
with one-shot technology� nanometer vertical resolution,
sub-micrometer lateral resolution� field of view 0.14 x 0.19 mm²
to 0.72 x 0.96 mm²� lateral resolution 0.37 ~ 1.23 µm� vertical resolution 1 ~ 3 nm
Fully automated bump field analysis:Statistics on bump height, diameter, co-planarity, etc.
MicroProf ® Series – 3D IC ApplicationAnalysis of Bumps / Micro Bumps
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the art of metrologyTMvisit us at booth 1241
No. T[nm] (n,k)
1 3079 SiO2.nk2 456 Si3N4$.nk3 750000 Si.nk
Fit results from centre measurement
FRT FTR film thickness sensor
� UV/VIS/NIR interferometric sensor� optical measurement – non contact� fit algorithm (up to 10 layers)� iterative FFT / fit analysis� 20 nm ~ 230 µm range� better 1% (1 nm) thickness resolution � 100 ~ 400 µm lateral resolution� ~ 5 µm high resolution with optics
SiO2 / Si3N4 on Si substrate
MicroProf ® Series – 3D IC ApplicationAnalysis of single and multilayer film thickness
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the art of metrologyTMvisit us at booth 1241
FRT IRT film thickness sensor
� IR interferometric sensor� optical measurement – non contact� FFT analysis� 4 ~ 4,700 µm range (n = 1)� 15 ~ 105 nm thickness resolution� 6 ~ 25 µm lateral resolution� 4 kHz measuring frequency
Controlled thinning process from full wafer thickness (~ 724 µm) to < 5 µm
MicroProf ® Series – 3D IC ApplicationAnalysis of wafer thickness / back grinding
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the art of metrologyTMvisit us at booth 1241
Total thicknessmeasurementin TTV set-up
(2x CWL)Film ThicknessSi-Waferwith FRT IRT
Film ThicknessResistwith FRT IRT
+ 2 x
MicroProf ® Series – 3D IC ApplicationAnalysis of back grinding: wafer and resist thickne ss
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the art of metrologyTMvisit us at booth 1241
2 x
Fully automated analysis of global and local wafer parameters
- also for glass wafers -
MicroProf ® Series – 3D IC ApplicationAnalysis of wafer parameters: TTV, bow, warp, …
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the art of metrologyTMvisit us at booth 1241
Topographypre treatment
Topography post treatment
MicroProf ® Series – 3D IC ApplicationAnalysis of bow of Si IC stack
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the art of metrologyTMvisit us at booth 1241
Stress: σ = -7,65 MPa
Topography priorto film deposition
Topography afterfilm deposition
Thickness mapping
+
Stoney equation
MicroProf ® Series – 3D IC ApplicationAnalysis of wafer stress
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the art of metrologyTMvisit us at booth 1241
T = 25°C T = 175°C
Fully automated topography measurement at different temperatures
MicroProf ® Series – 3D IC ApplicationThermo Unit
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the art of metrologyTMvisit us at booth 1241
3D IC? – 3 D Metrology!
MicroProf ® Series:• Combination of multiple sensors
• Semi automated to fully automated wafer metrology
• Top- / backside topography
• Multiple parameter analysis
• TSV and Trench measurement
• Bump and µ-bump analysis
• Global and local wafer parameter analysis
• Film thickness measurement
• Stress analysis
• Measurement under thermal load
One Metrology Tool for All Wafer Tasks !!!
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the art of metrologyTMvisit us at booth 1241
HeadquartersFRT, Fries Research & Technology GmbHFriedrich-Ebert-StrasseD-51429 Bergisch GladbachTel.: +49 (0) 2204 - 84 2430Fax: +49 (0) 2204 - 84 2431
Internetwww.frt-gmbh.com
FRT, Fries Research & Technology GmbH
Thank you for your attention!
Visit us at booth 1241!