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Products and specifications discussed herein are subject to change by Micron without notice.

2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryFeatures

PDF: 09005aef814b01a2 / Source: 09005aef814b01c7 Micron Technology, Inc., reserves the right to change products or specifications without notice.

2_4_8gb_nand_m49a__1.fm - Rev. D 12/06 EN 1 2005 Micron Technology, Inc. All rights reserved.

NAND Flash MemoryMT29F2G08AACWP, MT29F4G08BACWP, MT29F8G08FACWP

For the latest data sheet, refer to the Micron Web site: www.micron.com/products/nand/

Features Organization Page size x8: 2,112 bytes (2,048 + 64 bytes) Page size x16: 1,056 words (1,024 + 32 words)

Block size: 64 pages (128K + 4K bytes)

Device size: 2Gb: 2,048 blocks; 4Gb: 4,096 blocks;8Gb: 8,192 blocks

READ performance Random READ: 25s Sequential READ: 30ns (3V x8 only)

WRITE performance PROGRAM PAGE: 300s ( TYP) BLOCK ERASE: 2ms (TYP)

Endurance: 100,000 PROGRAM/ERASE cycles First block (block address 00h) guaranteed to be

valid without ECC (up to 1,000 PROGRAM/ERASEcycles)

VCC: 1.70V1.95V1

or 2.7V3.6V Automated PROGRAM and ERASE Basic NAND Flash command set: PAGE READ, READ for INTERNAL DATA MOVE,

RANDOM DATA READ, READ ID, READ STATUS,PROGRAM PAGE, RANDOM DATA INPUT, PRO-GRAM PAGE CACHE MODE, PROGRAM forINTERNAL DATA MOVE, BLOCK ERASE, RESET

New commands: PAGE READ CACHE MODE One-time programmable (OTP), including:

OTP DATA PROGRAM, OTP DATA PROTECT,OTP DATA READ

READ UNIQUE ID (contact factory)

READ ID2 (contact factory)

Operation status byte provides a software method ofdetecting: PROGRAM/ERASE operation completion PROGRAM/ERASE pass/fail condition Write-protect status

READY/BUSY (R/B#) pin provides a hardwaremethod of detecting PROGRAM or ERASE cyclecompletion

WP# pin: hardware write protect

Figure 1: 48-Pin TSOP Type 1

Options Marking Density: 2Gb (single die) MT29F2G 4Gb (dual-die stack) MT29F4G

8Gb (quad-die stack) MT29F8G

Device width: x8 MT29Fxx08x x161 MT29Fxx16x

Configuration:# of die # of CE# # of R/B#

1 1 1 A 2 1 1 B4 2 2 F

VCC: 2.7V3.6V A 1.70V1.95V1 B

Third-generation die C

Package: 48-Pin TSOP type I (lead-free) WP

Operating temperature: Commercial (0C to 70C) None Extended (40C to +85C)2 ET

Notes: 1. Packaged parts are only available for 3V x8devices. For 1.8V or x16 devices, contactfactory.

2. For ET devices, contact factory.

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PDF: 09005aef814b01a2 / Source: 09005aef814b01c7 Micron Technology, Inc., reserves the right to change products or specifications without notice.2_4_8gb_nand_m49a__1.fm - Rev. D 12/06 EN 2 2005 Micron Technology, Inc. All rights reserved.

2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryPart Numbering Information

Part Numbering InformationMicron NAND Flash devices are available in several different configurations anddensities (see Figure 2).

Figure 2: Part Number Chart

Valid Part Number Combinations

After building the part number from the part numbering chart above, verify that the partnumber is valid using the Micron Parametric Part Search atwww.micron.com/products/parametric.

If the device required is not on this list, contact the factory.

MT 29F 2G 08 A A C WP ES :C

Micron Technology

Product Family

29F = Single-supply NAND Flash memory

Density

2G = 2Gb4G = 4Gb

8G = 8Gb

Device Width

08 = 8 bits

16 = 16 bits

Operating Voltage Range

A = 3.3V (2.70V3.60V)

B = 1.8V (1.70V1.95V)

Design Revision

C = First generation

Production Status

Blank = Production

ES = Engineering sample

MS = Mechanical sample

QS = Qualification sample

Operating Temperature Range

Blank = Commercial (0C to +70C)

ET = Extended (40C to +85C)

Reserved for Future Use

Flash Performance

Blank = Standard

Package Codes

WP = 48-pin TSOP I (lead-free)

Feature Set

A = First-generation die

B = Second-generation die

C = Third-generation die

Classification

# of die # of CE# # of R/B# I/O

A 1 1 1 Common

B 2 1 1 Common

F 4 1 1 Common

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PDF: 09005aef814b01a2 / Source: 09005aef814b01c7 Micron Technology, Inc., reserves the right to change products or specifications without notice.2_4_8gb_nand_m49aTOC.fm - Rev. D 12/06 EN 3 2005 Micron Technology, Inc. All rights reserved.

2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryTable of Contents

Table of Contents

Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Pin Assignments and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9Memory Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Address Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17READs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17Ready/Busy# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20READ Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

PAGE READ 00h-30h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21RANDOM DATA READ 05h-E0h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22PAGE READ CACHE MODE Start 31h; PAGE READ CACHE MODE Start Last 3Fh . . . . . . . . . . . . . . . . .22READ ID 90h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24READ STATUS 70h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

PROGRAM Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27PROGRAM PAGE 80h-10h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27SERIAL DATA INPUT 80h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

RANDOM DATA INPUT 85h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27PROGRAM PAGE CACHE MODE 80h-15h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28Internal Data Move . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

READ FOR INTERNAL DATA MOVE 00h-35h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29PROGRAM for INTERNAL DATA MOVE 85h-10h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

BLOCK ERASE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31BLOCK ERASE 60h-D0h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

One-Time Programmable (OTP) Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32OTP DATA PROGRAM A0h-10h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32OTP DATA PROTECT A5h-10h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34OTP DATA READ AFh-30h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36RESET FFh. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

WRITE PROTECT Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Error Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

VCC Power Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Timing Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

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PDF: 09005aef814b01a2 / Source: 09005aef814b01c7 Micron Technology, Inc., reserves the right to change products or specifications without notice.2_4_8gb_nand_m49aLOF.fm - Rev. D 12/06 EN 4 2005 Micron Technology, Inc. All rights reserved.

2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryList of Figures

List of FiguresFigure 1: 48-Pin TSOP Type 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Figure 2: Part Number Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Figure 3: NAND Flash Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 4: 48-Pin TSOP Type 1 Pin Assignments (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 5: Memory Map x8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 6: Memory Map x16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 7: Array Organization for MT29F2G08AxC (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 8: Array Organization for MT29F2G16AxC (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 9: Array Organization for MT29F4G08BxC and MT29F8G08FxC (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 10: Array Organization for MT28F4G16BxC and MT29F8G16FxC (x16) . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 11: READY/BUSY# Open Drain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 12: tFall and tRise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 13: Iol vs. Rp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 14: PAGE READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Figure 15: RANDOM DATA READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Figure 16: PAGE READ CACHE MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Figure 17: READ ID Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 18: Status Register Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Figure 19: PROGRAM and READ STATUS Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Figure 20: RANDOM DATA INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Figure 21: PROGRAM PAGE CACHE MODE Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Figure 22: INTERNAL DATA MOVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Figure 23: INTERNAL DATA MOVE with RANDOM DATA INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Figure 24: BLOCK ERASE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Figure 25: OTP DATA PROGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Figure 26: OTP DATA PROTECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Figure 27: OTP DATA READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Figure 28: RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Figure 29: ERASE Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 30: ERASE Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 31: PROGRAM Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 32: PROGRAM Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Figure 33: AC Waveforms During Power Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Figure 34: COMMAND LATCH Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44Figure 35: ADDRESS LATCH Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44Figure 36: INPUT DATA LATCH Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Figure 37: SERIAL ACCESS Cycle After READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Figure 38: READ STATUS Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Figure 39: PAGE READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Figure 40: PAGE READ Operation with CE# Dont Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Figure 41: RANDOM DATA READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Figure 42: PAGE READ CACHE MODE Operation, Part 1 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Figure 43: PAGE READ CACHE MODE Operation, Part 2 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Figure 44: PAGE READ CACHE MODE Operation without R/B#, Part 1 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . 50Figure 45: PAGE READ CACHE MODE Operation without R/B#, Part 2 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Figure 46: READ ID Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Figure 47: PROGRAM PAGE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Figure 48: PROGRAM PAGE Operation with CE# Dont Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Figure 49: PROGRAM PAGE Operation with RANDOM DATA INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Figure 50: INTERNAL DATA MOVE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Figure 51: PROGRAM PAGE CACHE MODE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Figure 52: PROGRAM PAGE CACHE MODE Operation Ending on 15h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Figure 53: BLOCK ERASE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Figure 54: RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Figure 55: TSOP Type I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

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PDF: 09005aef814b01a2 / Source: 09005aef814b01c7 Micron Technology, Inc., reserves the right to change products or specifications without notice.2_4_8gb_nand_m49aLOT.fm - Rev. D 12/06 EN 5 2005 Micron Technology, Inc. All rights reserved.

2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryList of Tables

List of Tables

Table 1: Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Table 2: Operational Example (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Table 3: Operational Example (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Table 4: Array Addressing: MT29F2G08AxC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 5: Array Addressing: MT29F2G16AxC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Table 6: Array Addressing for MT29F4G08BxC and MT29F8G08FxC (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Table 7: Array Addressing for MT28F4G16BxC and MT29F8G16FxC (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 8: Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Table 9: Command Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Table 10: Device ID and Configuration Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Table 11: Status Register Bit Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Table 12: Status Register Contents After RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Table 13: Absolute Maximum Ratings by Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Table 14: Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Table 15: M29FxGxxxAC 3V Device DC and Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Table 16: M29FxGxxxBC 1.8V Device DC and Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Table 17: Valid Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Table 18: Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 19: Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 20: AC Characteristics: Command, Data, and Address Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 21: AC Characteristics: Normal Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 22: PROGRAM/ERASE Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

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2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryGeneral Description

General DescriptionNAND Flash technology provides a cost-effective solution for applications requiringhigh-density, solid-state storage. Micron MT29F2G08AxC and MT29F2G16AxC devicesare 2Gb NAND Flash memory devices. The MT29F4G08BxC and MT29F4G16BxC are4Gb devices. The MT29F8G08FAC is a four-die stack that operates as two independent4Gb devices, providing a total storage capacity of 8Gb in a single, space-saving package.These devices include standard NAND Flash features as well as new features designed toenhance system-level performance.

Micron NAND Flash devices use a highly multiplexed 8- or 16-bit bus (I/O[7:0] orI/O[15:0]) to transfer data, addresses, and instructions. The five command pins (CLE,

ALE, CE#, RE#, WE#) implement the NAND Flash command bus interface protocol. Twoadditional pins control hardware write protection (WP#) and monitor device status(R/B#).

This hardware interface creates a low-pin-count device with a standard pinout that isthe same from one density to another, supporting future upgrades to higher densities

without board redesign.

The MT29F2G and MT29F4G devices contain 2,048 and 4,096 erasable blocks, respec-tively. Each block is subdivided into 64 programmable pages. Each page consists of2,112 bytes (x8) or 1,056 words (x16). The pages are further divided into a 2,048-byte datastorage region with a separate 64-byte area on the x8 device; and on the x16 device, sep-arate 1,024-word and 32-word areas. The 64-byte and 32-word areas are typically usedfor error management functions.

The contents of each 2,112-byte page can be programmed in 300s, and an entire 132K-byte/66K-word block can be erased in 2ms. On-chip control logic automates PROGRAMand ERASE operations to maximize cycle endurance. ERASE/PROGRAM endurance isspecified at 100,000 cycles when appropriate error correction code (ECC) and errormanagement are used.

Figure 3: NAND Flash Functional Block Diagram

Address Register

Data Register

Cache Register

Status Register

Command Register

CE#

VCC VSS

CLE

ALE

WE#

RE#

WP#

I/O [7:0]I/O [15:0]

ControlLogic

I/OControl

R/B#

RowDecode

Column Decode

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2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryPin Assignments and Descriptions

Pin Assignments and DescriptionsFigure 4: 48-Pin TSOP Type 1 Pin Assignments (Top View)

Notes: 1. R/B2# and CE2# are available only on 8Gb devices. These pins are NC for otherconfigurations.

x8

NC

NC

NC

NC

NC

R/B2#1

R/B#

RE#

CE#CE2#1

NC

VCC

VSS

NC

NC

CLE

ALE

WE#

WP#

DNU

DNU

DNU

NCNC

x16

NC

NC

NC

NC

NC

R/B2#1

R/B#

RE#

CE#CE2#1

NC

VCC

VSS

NC

NC

CLE

ALE

WE#

WP#

DNU

DNU

DNU

NCNC

x16

VSS

I/O15

I/O7

I/O14

I/O6

I/O13

I/O5

I/O12

I/O4NC

DNU or VSS

VCC

NC

NC

NC

I/O11

I/O3

I/O10

I/O2

I/O9

I/O1

I/O8

I/O0VSS

x8

NC

NC

NC

NC

I/O7

I/O6

I/O5

I/O4

NCNC

DNU or VSS

VCC

VSS

NC

NC

NC

I/O3

I/O2

I/O1

I/O0

NC

NC

NCNC

1

2

3

4

5

6

7

8

910

11

12

13

14

15

16

17

18

19

20

21

22

2324

48

47

46

45

44

43

42

41

4039

38

37

36

35

34

33

32

31

30

29

28

27

2625

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2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryPin Assignments and Descriptions

Table 1: Pin DescriptionsSymbol Type Description

ALE Input Address latch enable: During the time ALE is HIGH, address information istransferred from I/O[7:0] into the on-chip address register upon a LOW-to-HIGHtransition on WE#!"When address information is not being loaded, the ALE pinshould be driven LOW.

CE#, CE2# Input Chip enable: This gates transfers between the host system and the NAND Flashdevice. Once the device starts a PROGRAM or ERASE operation, the chip enablepin can be de-asserted.For the 8Gb configuration, CE# controls the first 4Gb of memory; CE2# controlsthe second 4Gb. See Bus Operation on page 16 for additional operationaldetails.In the 8Gb configuration, R/B# is for the 4Gb of memory enabled by CE#; R/B2# isfor the 4Gb of memory enabled by the CE2#.

CLE Input Command latch enable: When CLE is HIGH, information is transferred fromI/O[7:0] to the on-chip command register on the rising edge of WE#. Whencommand information is not being loaded, CLE should be driven LOW.

RE# Input Read enable: This gates transfers from the NAND Flash device to the host system.

WE# Input Write enable: This gates transfers from the host system to the NAND Flash device.

WP# Input Write protect: Pin protects against inadvertent PROGRAM and ERASE operations.All PROGRAM and ERASE operations are disabled when the WP# pin is LOW.

I/O[7:0]MT29FxG08

I/O[15:0]MT29FxG16

I/O Data inputs/outputs: The bidirectional I/O pins transfer address, data, andinstruction information. Data is output only during READ operations; at othertimes the I/O pins are inputs.

R/B#, R/B2# Output Ready/busy: An open-drain, active-LOW output that uses an external pull-up

resistor, the pin is used to indicate when the chip is processing a PROGRAM orERASE operation. The pin is also used during a READ operation to indicate whendata is being transferred from the array into the serial data register. When theseoperations have completed, the R/B# returns to the High-Z state.

VCC Supply VCC: Power supply.

VSS Supply VSS: Ground connection.

NC No connect: NC pins are not internally connected. These pins can be driven or leftunconnected.

DNU Do not use: These pins must be left unconnected.

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2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryArchitecture

Architecture These devices use NAND Flash electrical and command interfaces. Data, commands,and addresses are multiplexed onto the same pins to provide a memory device with alow pin count.

The internal memory array is accessed on a page basis. During reads, a page of data iscopied from the memory array into the data register. Once copied to the data register,data is output sequentially, byte by byte on x8 devices, or word by word on x16 devices.

The memory array is programmed on a page basis. After the starting address is loadedinto the internal address register, data is sequentially written to the internal data registerup to the end of a page. After all of the page data has been loaded into the data register,array programming is started.

In order to increase programming bandwidth, this device incorporates a cache register.In the cache programming mode, data is first copied into the cache register and theninto the data register. When the data is copied into the data register, programmingbegins.

After the data register has been loaded and programming has started, the cache registerbecomes available for loading of additional data. Loading of the next page of data intothe cache register takes place while page programming is in process.

The INTERNAL DATA MOVE command also uses the internal cache register. Normally,moving data from one area of external memory to another uses a large number of exter-nal memory cycles. With the use of the internal cache register and data register, arraydata can be copied from one page and then programmed into another without the use ofexternal memory cycles.

Addressing

NAND Flash devices do not contain dedicated address pins. Addresses are loaded usinga five-cycle sequence, as shown in Tables 4 and 5 on pages 12 and 13. See Figures 5 and 6on pages 10 and 11 for additional memory mapping and addressing details.

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2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryMemory Mapping

Memory MappingFigure 5: Memory Map x8

Notes: 1. As shown in Table 4 on page 12, the high nibble of address cycle 2 has no assigned addressbits; however, these 4 bits must be held LOW during the ADDRESS cycle to ensure that theaddress is interpreted correctly by the NAND Flash device. These extra bits are accountedfor in ADDRESS cycle 2 even though they do not have address bits assigned to them.

2. The 12-bit column address is capable of addressing from 0 to 4,095 bytes on x8 devices;however, only bytes 0 through 2,111 are valid. Bytes 2,112 through 4,095 of each page

are out of bounds, do not exist in the device, and cannot be addressed.

Table 2: Operational Example (x8)

Block Page Min Address in Page Max Address in Page Out-of-Bounds Addresses in Page

0 0 0x0000000000 0x000000083F 0x00000008400x0000000FFF

0 1 0x0000010000 0x000001083F 0x00000108400x0000010FFF

0 2 0x0000020000 0x000002083F 0x00000208400x0000020FFF

2,046 62 0x01FFFE0000 0x01FFFE083F 0x01FFFE08400x01FFFE0FFF

2,047 63 0x01FFFF0000 0x01FFFF083F 0x01FFFF08400x01FFFF0FFF

BlocksBA[16:6]

PagesPA[5:0]

BytesCA[11:0]

0 1 2

0 1 2 63

0 1 2 2,047 2,111

2,047

Spare area

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Figure 6: Memory Map x16

Notes: 1. As shown in Table 5 on page 13, the upper 5 bits of address cycle 2 have no assignedaddress bits; however, these 5 bits must be held LOW during the ADDRESS cycle to ensurethat the address is interpreted correctly by the NAND Flash device. These extra bits areaccounted for in ADDRESS cycle 2 even though they do not have address bits assigned tothem.

2. The 11-bit column address is capable of addressing from 0 to 2,047 words on x16 devices;however, only words 0 through 1,055 are valid. Words 1,056 through 2,048 of each pageare out of bounds, do not exist in the device, and cannot be addressed.

Table 3: Operational Example (x16)

Block Page Min Address in Page Max Address in Page Out-of-Bounds Addresses in Page

0 0 0x0000000000 0x000000041F 0x00000004200x0000000FFF

0 1 0x0000010000 0x000001041F 0x00000104200x0000010FFF

0 2 0x0000020000 0x000002041F 0x00000204200x0000020FFF

2,046 62 0x01FFFE0000 0x01FFFE041F 0x01FFFE04200x01FFFE0FFF

2,047 63 0x01FFFF0000 0x01FFFF041F 0x01FFFF04200x01FFFF0FFF

BlocksBA[16:6]

PagesPA[5:0]

WordsCA[10:0]

0 1 2

0 1 2 63

0 1 2 1,023 1,055

2,047

Spare area

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Figure 7: Array Organization for MT29F2G08AxC (x8)

Notes: 1. If CA11 = 1 then CA[10:6] must be 0.2. Block address concatenated with page address = actual page address; CAx = column

address; PAx = page address; BAx = block address.

Table 4: Array Addressing: MT29F2G08AxC

Cycle I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0

First CA7 CA6 CA5 CA4 CA3 CA2 CA1 CA0

Second LOW LOW LOW LOW CA111 CA10 CA9 CA8

Third BA7 BA6 PA5 PA4 PA3 PA2 PA1 PA0

Fourth BA15 BA14 BA13 BA12 BA11 BA10 BA9 BA8

Fifth LOW LOW LOW LOW LOW LOW LOW BA16

Cache Register

Data Register

2,048 blocksper device

1 block

642,048

642,048

2,112 bytes

I/O 7

I/O 0

64 pages = 1 block(128K + 4K) bytes

1 page = (2K + 64) bytes

1 block = (2K + 64) bytes x 64 pages= (128K + 4K) bytes

1 device = (2K + 64) bytes x 64 pagesx 2,048 blocks

= 2,112Mb

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Figure 8: Array Organization for MT29F2G16AxC (x16)

Note: For x16 devices, contact factory.

Notes: 1. If CA10 = 1 then CA[9:5] must be 0.2. Block address concatenated with page address = actual page address. CAx = column

address; PAx = page address, BAx = block address.3. I/O[15:8] are not used during the addressing sequence and should be driven LOW.

Table 5: Array Addressing: MT29F2G16AxC

Cycle I/O[15:8] I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0

First LOW CA7 CA6 CA5 CA4 CA3 CA2 CA1 CA0

Second LOW LOW LOW LOW LOW LOW CA101 CA9 CA8

Third LOW BA7 BA6 PA5 PA4 PA3 PA2 PA1 PA0

Fourth LOW BA15 BA14 BA13 BA12 BA11 BA10 BA9 BA8

Fifth LOW LOW LOW LOW LOW LOW LOW LOW BA16

Cache Register

Data Register


1 block

321,024

321,024

1,056 words

I/O 15

I/O 0

64 pages = 1 block(64K + 2K) words

1 page = (1K + 32) words

1 block = (1K + 32) words x 64 pages= (64K + 2K) words

1 device = (1K + 32) words x 64 pagesx 2,048 blocks

= 2,112Mb

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Figure 9: Array Organization for MT29F4G08BxC and MT29F8G08FxC (x8)

Note: For the 8Gb MT29F8G08F, the 4Gb array organization shown applies to each chip enable(CE# and CE2#).

Notes: 1. If CA11 = 1 then CA[10:6] must be 0.2. Die address boundary: 0 = 0Gb2Gb devices; 1 = 2Gb4Gb devices.3. Block address concatenated with page address = actual page address. CAx = column

address; PAx = page address; BAx = block address.

Table 6: Array Addressing for MT29F4G08BxC and MT29F8G08FxC (x8)

Cycle I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0

First CA7 CA6 CA5 CA4 CA3 CA2 CA1 CA0

Second LOW LOW LOW LOW CA111 CA10 CA9 CA8

Third BA7 BA6 PA5 PA4 PA3 PA2 PA1 PA0

Fourth BA15 BA14 BA13 BA12 BA11 BA10 BA9 BA8

Fifth LOW LOW LOW LOW LOW LOW BA172 BA16

Cache Register

Data Register


1 block

642,048

642,048

2,112 bytes

I/O 7

I/O 0

64 pages = 1 block(128K + 4K) bytes

1 page = (2K + 64) bytes

1 block = (2K + 64) bytes x 64 pages= (128K + 4K) bytes

1 device = (2K + 64) bytes x 64 pagesx 4,096 blocks

= 4,224Mb

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Figure 10: Array Organization for MT28F4G16BxC and MT29F8G16FxC (x16)

Notes: 1. For x16 devices, contact factory.2. For the 8Gb MT29F8G16F, the 4Gb array organization shown applies to each chip enable

(CE# and CE2#).

Notes: 1. If CA10 = 1 then CA[9:5] must be 0.2. Die address boundary: 0 = 0Gb2Gb devices, 1 = 2Gb4Gb devices.3. Block address concatenated with page address = actual page address. CAx = column

address; PAx = page address; BAx = block address.4. I/O[15:8] are not used during the addressing sequence and should be driven LOW.

Table 7: Array Addressing for MT28F4G16BxC and MT29F8G16FxC (x16)

Cycle I/O[15:8] I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0

First LOW CA7 CA6 CA5 CA4 CA3 CA2 CA1 CA0Second LOW LOW LOW LOW LOW LOW CA101 CA9 CA8

Third LOW BA7 BA6 PA5 PA4 PA3 PA2 PA1 PA0

Fourth LOW BA15 BA14 BA13 BA12 BA11 BA10 BA9 BA8

Fifth LOW LOW LOW LOW LOW LOW LOW BA172 BA16

Cache Register

Data Register


1 block

321,024

321,024

1,056 words

I/O 15

I/O 0

64 pages = 1 block(64K + 2K) words

1 page = (1K + 32) words

1 block = (1K + 32) words x 64 pages= (64K + 2K) words

1 device = (1K + 32) words x 64 pagesx 4,096 blocks

= 4,224Mb

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2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryBus Operation

Bus Operation The bus on the MT29Fxxx devices is multiplexed. Data I/O, addresses, and commandsall share the same pins. I/O pins I/O[15:8] are used only for data in the x16 configura-tion. Addresses and commands are always supplied on I/O[7:0].

The command sequence normally consists of a command latch cycle, an ADDRESSLATCH cycle, and a DATA cycleeither READ or WRITE.

Control Signals

CE#, WE#, RE#, CLE, ALE and WP# control NAND Flash device READ and WRITE opera-tions. On the 8Gb MT29F8G08FAC, CE# and CE2# each control independent 4Gb arrays.CE2# functions the same as CE# for its own array; all operations described for CE# alsoapply to CE2#.

CE# is used to enable the device. When CE# is LOW and the device is not in the busystate, the NAND Flash memory will accept command, data, and address information.

When the device is not performing an operation, CE# is typically driven HIGH and thedevice enters standby mode. The memory will enter standby if CE# goes HIGH whiledata is being transferred and the device is not busy. This helps reduce power consump-tion. See Figure 40 on page 47 and Figure 48 on page 53 for examples of CE# DontCare operations.

The CE# Dont Care operation enables the NAND Flash to reside on the same asyn-chronous memory bus as other Flash or SRAM devices. Other devices on the memorybus can then be accessed while the NAND Flash is busy with internal operations. Thiscapability is important for designs that require multiple NAND Flash devices on thesame bus. One device can be programmed while another is being read.

A HIGH CLE signal indicates that a command cycle is taking place. A HIGH ALE signal

signifies that an address input cycle is occurring.

Commands

Commands are written to the command register on the rising edge of WE# when:

CE# and ALE are LOW, and

CLE is HIGH, and

the device is not busy.

The exceptions to this are the READ STATUS and RESET commands when busy. SeeFigure 34 on page 44 for detailed timing requirements.

Commands are input on I/O[7:0] only. For devices with a x16 interface, I/O[15:8] mustbe written with zeros when a command is issued.

Address Input

Addresses are written to the address register on the rising edge of WE# when:

CE# and CLE are LOW, and

ALE is HIGH, and


Addresses are input on I/O[7:0] only; bits not part of the address space must be LOW.For devices with a x16 interface, I/O[15:8] must be written with zeros when an address isissued.

The number of ADDRESS cycles required for each command varies. Refer to the com-mand descriptions to determine addressing requirements (see Table 9 on page 20).

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2Gb, 4Gb, 8Gb: x8, x16 NAND Flash MemoryBus Operation

Data Input Data is written to the data register on the rising edge of WE# when:

CE#, CLE, and ALE are LOW, and


Data is input on I/O[7:0] for x8 devices, and on I/O[15:0] for x16 devices. See Figure 36on page 45 for additional data input details.

READs

After a READ command is issued, data is transferred from the memory array to the dataregister on the rising edge of WE#. R/B# goes LOW for tR and transitions HIGH after thetransfer is complete. When R/B# goes HIGH, data is available in the data register; it isclocked out of the part by toggling RE#. See Figure 39 on page 46for detailed timinginformation.

The READ STATUS (70h) command or the R/B# signal can be used to determine whenthe device is ready. See the READ STATUS command section on page 26 for details.

Ready/Busy#

The R/B# output provides a hardware method of indicating the completion of PRO-GRAM, ERASE, and READ operations. The signal requires a pull-up resistor for properoperation. The signal is typically HIGH, and transitions to LOW after the appropriatecommand is written to the device. The signal pins open-drain driver enables multipleR/B# outputs to be OR-tied. The READ STATUS command can be used in place of R/B#.Typically, R/B# is connected to an interrupt pin on the system controller (see Figure 11on page 18).

On the 8Gb MT29F8G08FAC, R/B# provides a status indication for the 4Gb sectionenabled by CE#, and R/B2# does the same for the 4Gb section enabled by CE2#. R/B#and R/B2# can be tied together, or they can be used separately to provide independentindications for each 4Gb section.

The combination of Rp and capacitive loading of the R/B# circuit determines the risetime of the R/B# pin. The actual value used for Rp depends on the system timingrequirements. Large values of Rp cause R/B# to be delayed significantly. At the 10 per-cent to 90 percent points on the R/B# waveform, rise time is approximately two timeconstants (TC).

The fall time of the R/B# signal is determined mainly by the output impedance of theR/B# pin and the total load capacitance.

Figure 12 on page 18 and Figure 13 on page 19 depict approximate Rp values using a cir-cuit load of 100pF.

The minimum value for Rp is determined by the output drive capability of the R/B# sig-nal, the output voltage swing, and VCC.

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