2016 07-20-wp1-q2 f2 f berlin
TRANSCRIPT
WP1GatewayHWDesign&ImplementationLEADER:EUROTECH
INVOLVEDPARTNERS:ATOS, SKYWATCH,BIOASSIST, MOBISTAR,L IBELIUM
AGILEMEETING,20-21July2016,BerlinDE
WP1Objectives(recap)Mainobjective:
specification,designandimplementationofthehardwareofthemodulargateway.
Themodulargateway:• willbeavailableintwoversions:• the“makers”versionbasedonRaspberryPi;• theindustrialversionwithanewHWdesignbasedonIntelarchitecture.
• willbebasedonasetofcoreandexpansionmodules:• coremodules:carriermodule,cpu module,thestoragemoduleorthepowersupply,etc.;
• extensionmodules:thecommunicationmodules,sensingmodules,etc..
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
WP1Objectives(recap2)Addresstwolevelsofmodularity:• modularityforexistingHW:anexpansionmodule(shield)allowstheRPi tobeextendedwithnewmodules;
• intrinsicmodularity:intheindustrialgatewayanyarchitecturalelementisamodule.
Hardwaremoduleinteroperability:❓ identifytheHWtechnologiesthatsimplifyandpromoteinteroperability;❓ specifyasetofruletofollowduringmodulesdesignanddevelopment.
Hardwareprototypes development:• Implementasetofprototypesofthe“makers”gateway;• Implementasetofprototypesoftheindustrialgateway;• implementasetofexpansionmodulesthatwillbeadoptedinthepilots.
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
WP1- StatusT1.1 Definitionofthedesignanddevelopmentmethodologyconcluded.Elicitationofrequirementsandspecificationsdefinitionforbothgatewayhavebeenconcluded.
T1.2 FirstversionoftheMakersGatewaydesign concluded.Firstsetofprototypesavailable.
T1.3 DesignofindustrialGateway:ongoing.Firstsamplesofthecarriermoduleandoftheenclosureavailable.
Nextdeadlines:◦ MS1- AGILEInitialDesignMS1&DraftFrameworkRelease(M9)
◦ InitialdesignoftheAGILEplatform(SWandHW)andreleaseofadraftversionoftheAGILEframework(sw andbasichw builtonexistingprototypingplatforms).
◦ D8.1- PilotDesignandanalysisrequirementsandspecification◦ Contributiontodeliverableediting.
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
WP1- Timeline
• D1.1- AGILEGatewayarchitecturespecificationsandinitialdesign(SUBMITTED)Gatewayrequirements,designspecificationandinitialarchitecturaldesignforboththeindustrialandmakersversion.
• D1.2- AGILEGatewayhardwarefinalprototypes2ndAGILERelease– HardwarePlatformFinaldesigns,featuresandfunctionalspecificationsofthehardwareprototypes.DeliveryofthefinalAGILEGatewayprototypes.
•MS1- AGILEInitialDesignMS1&DraftFrameworkReleaseInitialdesignoftheAGILEplatform(SWandHW)andreleaseofadraftversionoftheAGILEframework(sw andbasichw builtonexistingprototypingplatforms).
•MS2- AGILEFramework(SWandHW)release&InitialIntegrationDeliveryoftheAGILEplatform(softwarecomponents,makersandindustrialgatewayprototypes)andtheinitialintegrationofthesoftwarecomponents.
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
DesignmethodologyDesignformodularity(DFM):DFMfollowstheemergingtrendinHWdesignandmanufacturingknownas“BuildtoOrder”.◦ BTOproductsarenotbuiltuntilaconfirmedorderforproductsisreceived.◦ WeextendBTOalsotothedesignphase(notonlymanufacturing).◦ Traditionally,BTOisthemostappropriateapproachusedforhighlycustomizedorlowvolumeproducts.
◦ DFMallowstomapacustomdesigninadesignbasedonstandardmodules!
DFMhasbeenappliedtothedesignoftheindustrialgateway:◦ definitionofthereferencedesign;◦ definitionandimplementationofageneralpurposeconsolidateddesign;◦ definitionandimplementationofaverticalconsolidateddesign(themonitoringstation,PilotC).
RequirementsRequirementelicitationisbasedon:◦ partnersexpertise,◦ studyofpilots.
Onpilotsside,theelicitationhasbeeninspiredmaily byPilotsA,CandD:◦ therequirementsidentifiedinPilotBandE,willbeintegratedinD8.1;◦ thefinalversionofthegateways(M18)willconsideralsotheserequirements.
Threemaincategoriesofrequirementshasbeenidentified:◦ makersgatewayspecificrequirements;◦ industrialgatewayspecificrequirements;◦ sharedrequirements.
WP1- Makersgateway
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
FIRSTDESIGN
•Architecture&Configurationdefined
•ShieldforRaspberryPiindesign• Firstprototypeavailable• 2modulestobepluggedontopofRaspPi• RaspberryPiGPIOsaccessibleforsensors
•HotSwapà Allowedbypressingbutton• Thegatewayisabletorecognizewhichmodule(amongthelistofsupportedmodules)hasbeenplugged
WP1- Makersgateway
AGILEKICK-OFFMEETING,12-14January2016,TrentoIT
FIRSTDESIGN
•CONNECTIVITY
• RaspberryPi2• 2modulestobeplugged• Wifi &3G/4Gà USBDongle
• RaspberryPi3• 2modulestobeplugged• Wifi &BluetoothLowEnergyà includedinRaspberry• 3G/4Gà USBDongle
Makersgatewayarchitecture
- Twocommunicationsockets– Xbee formfactorwithUARTandSPI.
- HotswapoftheradiosusingapushbuttonandadedicatedLED
- ExternalpowersourceselectablebetweentheRaspberryorexternalDCsource
- DebugLEDstoallowknowingthecurrentstatebyvisualinspection.
MakersgatewaymeetstheRaspberryPiHATspecificationDimensionsmeettherequirementsintheHATspecification
EEPROMmemoryaddedtostorevendorinfoandGPIOusage
- Theshieldusesa40pinfemaleconnectortoallowaphysicalconnectionwiththeRaspberryPi
- RaspberryPiGPIOSarephysicallyaccessiblefromtheuser.
Makersgatewayspecifications Feature Description RequirementReference
Power
Nominalinputpower 5VDCpinfromRaspberryPi
ID_HW_52Externalinputpower 5Vto20VDCsupplyConsumption <100mAwithoutradio
modules
RadiosocketsCommunication UARTandSPI ID_HW_1,
ID_HW_3,ID_HW_10,ID_HW_47,ID_HW_48,ID_HW_60,ID_HW_61
Power 3V3Formfactor Xbeeformfactor
I/Ointerfaces
UART TwomultiplexedUARTs ID_HW_1,ID_HW_3,ID_HW_10,ID_HW_47,ID_HW_48,ID_HW_53,ID_HW_54,ID_HW_55,ID_HW_58ID_HW_60,ID_HW_61
SPI TwoSPImodulesallowedGeneralI/O AllRaspberryGPIO
available
EnvironmentOperatingtemperature -20to+50ºC ID_HW_5Storagetemperature -40to+85ºC
Dimensions Size AccordingHATspecification
ID_HW_4,ID_HW_57
Onboardtemperaturesensor
Operationalrange -40~+85ºC
ID_HW_12,ID_HW_51
Fullaccuracyrange 0~+65ºCAccuracy ±1ºC(range0ºC~+65
ºC)Responsetime 1.65seconds(63%
responsefrom+30to+125°C).
Typicalconsumption 1μAmeasuring
OnboardHumidity
sensor
Measurementrange 0~100%ofRelativeHumidity(fortemperatures<0°Cand>60°Cseefigurebelow)
ID_HW_12,
ID_HW_51
Accuracy <±3%RH(at25ºC,range20~80%)
Hysteresis ±1%RHOperatingtemperature -40~+85ºCResponsetime (63%ofstep90%to0%
or0%to90%):1secondTypicalconsumption 1.8μAmeasuringMaximumconsumption 2.8μAmeasuring
OnboardPressure
sensor
Measurementrange 30~110kPa
ID_HW_12,
ID_HW_51
Operationaltemperaturerange
-40~+85ºC
Fullaccuracytemperaturerange
0~+65ºC
Absoluteaccuracy ±0.1kPa(0~65ºC)Typicalconsumption 2.8μAmeasuringMaximumconsumption 4.2μAmeasuring
OnboardADC
Accuracy 18-Bit
ID_HW_51
Channels Upto4channels
Onboardvoltage
reference
2.048V
I/Ointerface I2C
Power 3V3
Programmabledatarate From3.75to240SPS
• OnboardADC• OnboardTemperature,Humidity
andPressuresensor
Industrialmodulargateway:requirementsStatus:◦ industrialgatewayreferencedesigndefined;◦ generalpurposeindustrialgatewayconsolidatedesign:
◦ designdefined;◦ implementationongoing;◦ firstsamplesofthecarrierandofthemodularenclosureavailableexpectedforthe27/7;◦ firstprototypesshouldbeavailablebytheendof2016.
◦ verticalconsolidateddesign(monitoringstation,PilotC):◦ averypreliminaryversiondefined;◦ thefinaldesignandtheprototypeswillbeavailableforM18.
IndustrialGatewayModulesCPUModule:◦ IntelAtomBayTrail orApolloLakefamilies◦ 10WTDPClassCPU◦ COMExpressType10
BoardManagementModuleBMM:◦ 32BitMicrocontroller◦ Managessystemandmodulesstatusandrelatedtransitions(coldboot,warmboot,lowpowerstatessuchassuspendorhybernate).
◦ Managessystemmaintenance,e.g.:◦ secureupdate,◦ autotest,◦ extendedinputwakeup&suspend,◦ specialfeatureslikeinjectionsensing,timedprocedure,etc.
IndustrialGatewayModules(2)Storagemodule:
1. storageintegratedintheCPUmodule,e.g.eMMC Flash,SATASSD(e.g.itisusedinhighruggedandreliablesystemtoavoidvibrationissue).
2. Internalexpansion,e.g.mSATA SSDDriveorSDMemoryCard.
3. Externalstoragemodule,e.g.HDD/SDDDiskwithoptionalDriveBay.
AUXI/OModule(e.g.PoE orpaneldisplaybacklight):thesemoduleshaveapowerabsorptionthatisnotsupportedbythecarrierandmustbeconnecteddirectlytothepowersupplymodule.TheI/Omodulesarepoweredbythecarrier.
IndustrialGatewayModules(3)I/OExpansionmodules:◦ theygeneratethesignalthatmustbeavailableontheexternalpanel;◦ implementI/Ofunctionalitiesforaspecificvertical;◦ provideconnectorsforaspecificvertical;◦ allowstocustomizetheexternalconnections.◦ Examples:
◦ BUSconverter◦ Expander,e.g.I2C->10GPIO◦ IsolatedandprotectedI/O◦ SpecialfunctionslikeaparticularfieldbusforaScada application.
I/OExpansionModule
USB
EXTERNALPAN
EL
3xRS485
Ethernet RJ45ML2MIL
IndustrialGatewayModules(3)UserI/OModules:itcanbeanexternalmoduleorasetoffunctionalitiesimplementedinthecarrier.It’scheaperthanI/Oexpansionandsatisfiesmechanicalrequirements.◦ SDMemoryCard.◦ Test,debuganddevelopmentinterfaces.◦ Maintenanceinterfaces.◦ Legacyinterfaces,likemouseandkeyboard.
I/OModulesforfieldbus:◦ integrated,providedbytheCPUmoduleorbytheBMM,e.g.CANBus;◦ internalexpansionmodule,providingpotentiallyanykindoffieldbus.
Powermodule:itcanbeintegratedorexternalandprovideawiderangepowerformultipledomainapplication(24V-110V).◦ Insulatedand/orprotectedversionavailable.◦ Supportfortensionslowerthanthenominalrange(e.g.forautomotive).◦ DesignedforEN50155,MIL-STD,FCC,CE.
Industrialgatewaypreliminaryspecifications
Feature DescriptionRef.
Requirements
PROCESSOR CPU Intel Atom BayTrail (E3845, 1.91GHz, 4 cores)
GW_6, GW_22, GW_38
MEMORY RAM Up to 4GB 1333 MHz DDR3L GW_7, GW23
STORAGE
Embeddedstorage Up to 8GB eMMC GW_8, GW_24, GW_38 SATA 1x mSATA
1x SATA II
Removable storage
Micro SD slot (service panel) optional Removable Drive Bay
GW_25
I/OINTERFACES
Wired networking
2x Indipendent Gb Ethernet (10/100/1000) auto-sensing
GW_1, GW_26, GW_19
USB 1x USB 2.0, 1x USB3.0
1x USB 2.0 (service panel) Noise and surge protected
GW_27, GW_19, GW_20, GW_34
Serial
1x RS-232 (5 wires) optoisolated, up to 3x RS-485/RS-422 configurable
optoisolated, 1x console (service panel)
Fieldbus Integrated 1x CANBus 2.0B;
other fieldbus standard supported by miniPCIe cards
Generic programmable I/O
Up to 8 digital optoisolated and protected lines: 3x In, 3x Out
1x system on remote ctrl
GW_28, GW_19
Video
Default: 1x mini Display Port (service panel)
custom option for 2nd video LVDS,VGA or HDMI
GW_29, GW_19, GW_20, GW_34
Audio 1x Line IN stereo, 1x Line OUT stereo
or optional integrated MIC and Speaker (2W)
GW_31, GW_19
OTHER
RTC Ultra low power RTC GW_32
RTC backup > 1 month
Watchdog Yes, CPU module independent GW_33
Non volatile User Memory Serial EEPROM GW_34
TPM Optional GW_21
Programmable button Yes (service panel) GW_34
SIM support 1x micro SIM slot (service panel) GW_35
INTEGRATEDSENSORS
GPS
Yes. Options: integrated high sensitivity receiver; up
to 3 concurrent GNSS (GPS, Galileo, GLONASS, BeiDou)
with external antenna; external module;
GW_18
System temperature
Operating temperature range temperature sensor
GW_14
Accelerometer Two or three axes GW_14
INTERNALEXPANSIONS
High speed Expansion Interface
Rugged Board to Board connector PCI express Gen 2.0 1x 1-lane SATAII port, USB2, Ctrl, Pwr
GW_10, GW_11, GW_12, GW_27, GW_37, GW_38, GW_19
miniPCIe Slots 3x independent miniPCIe slots one slot mSATA compatible
POWER
Nominal power Input
110-220 V AC or 12-24 V DC protected not isolated
GW_40, GW_16 Power
Consumption <50W Max
Industrialgatewaypreliminaryspecifications(2)
ENVIRONMENT
Operating Temperature -20 to +50 °C
GW_4, GW_5,
GW_39, GW_41, GW_42
Storage Temperature -40 to +85 °C
Humidity 0 to 95% non-condensing
Dimensionsreferencedesign
Form factor Rugged BOX PC
Width x Depth x Height < 140x260x70 mm
Weight < 3.0 Kg
Thermal solution Fanless, conductive cooling
DESIGNEDFORCERTIFICATIONS
Regulatory CE, FCC, EN45545 (fire&smoke)
GW_13, GW_43
Safety UL 60950
Environmental RoHS2 REACH
Radio RED
Cellular Carrier Specific, External antenna design
Ingres Protection IP 65