12.00.012.08.9 7.18 9.20 8.60 6.40 5.00 6.40 6.80 6.20 internal vacancies ifmy & iflp, september...

Internal VacanciesIFMY & IFLP, September 2010

Prepared by IFMY HR REC1 September 2010

Referees are advised to go thru the terms & conditions of the Employee Referral Programme. Please take note that all referrals must be submitted to HR.

- Thank you for your referral -

Copyright © Infineon Technologies 2008. All rights reserved. For internal use only

Position Dept/ Segment

GG/ Level Scope Requirement

Development Engineer (Trim & Form/ Plating)

AS PD 10/11/ 12

Process development owner of T&F/ plating. Planning, co-ordination, setup and establish new T&F/ plating assembly technology development and process capabilities.Monitor performance, quality & reliability of assembly process.Identify problems and implement improvement actions. Responsible for new equipment benchmark, optimization, capability roadmaps & tooling equipment.

Degree/ Master in Engineering (SemiconductorTechnology, Automation, Mechanical) Min 3 years related semiconductor assembly or development (R&D) experience.In-depth knowledge of T&F / plating technology, process and challenges.

Development Engineer (Die Attach)

AS PD 10/11

Provide technical solution for new packages/ processdevelopment for PD technology and assembly projects. Monitor, identify, evaluate and resolve technical product or process problems and perform documentation. Design and implement improvement to products, processes, materials, tooling equipment or documentation. Use analytical tools and DOE software.

Degree in Engineering (Semiconductor Technology/ Microelectronics/ Micro Technology/ Material Science) with min 3 years in package development (PD).

Development Engineer (Pre-Assembly – Back grinding, Bare Die & Wafer Sawing)

AS PD 10/11/ 12

To provide solution on a new package/process development for PD projects – pre assembly process (both back grinding-wafer thinning, bare die process and water sawing).Identify evaluate & resolve technical product pre assembly through systematical statistical/ DOE application.Design and implement improvement.

Degree in Engineering (Chemistry, Chemical, Semiconductor Technology, Microelectronics, Microtechnology, Material Science with min 3 years experience in package development/ process development.

Equipment Engineer (Molding) AS ME 9/10

To provide equipment engineering support to meet objective of ensuring machine uptime and efficiency to enable smooth production run. Manage in the area of OEE, reporting, machine maintenance and upgrading, project management, improvement programs, new machine purchase, spare parts and training.

Degree in Engineering (Mechanical/Electrical/ Electro-Mechanical) Min 1 year relevant experience in EOL semiconductor manufacturing environment.

Material Planner AS SP MP 9/10 Plan & manage material requirement to support production

needs.

Degree in Mgt, Bus. Ad. with minimum 2 - 3 years of working experience in direct materials buying/planning for a complex and high volume manufacturing environment - SAP system & Microsoft excel knowledge is an added advantage.

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Note: Complete Job Description can be obtained from the Recruitment Section

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Position Dept/ Segment GG/ Level Scope Requirement

Leadframe Co-Design Engineer AS PD 10/11

Design Lead frames as per customer and manufacturability requirements. Assess design manufacturability base on the Assembly Process Requirements. Develop/ optimize process related material and parameters to meet customer requirements.

Master/ degree in Engineering Mechanical/ Material Science/ Electronics with min 5 years experience in semiconductor industry (PD/ Assembly engineering).

Process Engineer AS ME 9/10

Multiple positions available:1.Front-Of-Line – Wirebond2.End-Of-Line – Trim & FormYield improvement activities. Identify and execute corrective action. Review and revise the process flow, control plan and FMEA as per requirement. Drive specific improvement activities in CPMO.

Degree/Diploma in Engineering (Microelectronics/Mechanical/Electrical/ Semiconductor Technology) / Physics / Chemistry/ Mathematics with min 2 years experience in related semiconductor assembly (wirebond/ trim & form process).

Production Controller AS SO 9/10

Match the weekly loading plan vs available capacity and material for demand fulfilment. Liaise with Line planner to meet weekly or daily pack out commitment. Work closely with material planningmeasurements (Clip and Range Fulfilment). Communicate with Operations team and Logistics on all Delivery issue.

Degree in Business Administration/ Economics or Diploma in Management with min 1 year experience in Semiconductor industry.

Project Leader AS PD 10/11

Multiple positions:Package definition (PAD) and Package Development (PDO) for Leadframe and Laminate packages from concept to design to implementation to volume production.

Master/ Degree in Engineering (Electrical or Mechanical).Min 2 years in semiconductor or electronic industry in engineering field.

Wirebond Development Specialist

AS PD 12/13/14

Process development owner of FOL (Wirebond). Establish and setup new assembly process capabilities. Monitor performance, identify problems and execute improvement actions.

Master/ Degree in Engineering (Semiconductor Technology/ Microelectronics/ Automation/ Mechanical / Electrical) with min 8 years in related semiconductor assembly or R&D.

Equipment Manager AS ME 12/13 Support Equipment Engineering activities for FOL/EOL . Degree/Masters with at least 8 years of relevant

experience.

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Position Dept/ Segment GG Scope Requirement

Assistant Engineer (Wirebond) AS PD -

To provide support for qualification build and perform the required data collection.Technical support on pre-assembly process improvement and development projects.Maintain proper documentation on assignment and project.

Diploma in Engineering (Semiconductor Technology, Micro-technology) / Material Science with min 2 years experience in wire bond process.

Assembly Engineer (EOL) SENS 9/10/

11

Process owner for EOL process (molding, laser cutting, PMC and laser and punch). Monitor performance on yield, quality & reliability of EOL processes. Identify problem and improvement actions.Support new package/ process transfer.

Master/ Degree in Mechanical Engineering with min 1 year related semiconductor mainly molding or tooling experience.Fresh graduate will be considered.

Production Exec/Senior SENS 10/11

Sensor BE Assembly and Test Production Owner. WIP Management.Managing production staffs, productivity improvement, cost saving plans & inventory management.

Degree/ Diploma in Engineering (Electronics and Electrical is preferred or others with relevant experience).Min 5 years working experience in production environment (preferred in semiconductor field)

Manufacturing Engineer (Backend assembly) SENS 9/10/

11

Process development owner of lead frame & tooling. To manage ratio project for cost improvement. Responsible for sourcing new and alternative material. Implement the use of SPC, FMEA, DMAIC

Master/ Degree in Engineering – (Mechatronic/ Electronics)

Quality Engineer SENS 9/10/ 11

Identify, plan and drive key suppliers to implement continuous improvement. Co-ordinate effective & timely documentation. Liase with 3rd party wafer supplier / subcon on quality issues.

Degree with 2 years relevant experience in semiconductor industry .

Test Process Engineer SENS 9/10/ 11

Process owner of Test machines. In-depth knowledge of test handler and taping technology, process and challenges.Monitor performance & identify corrective improvements. Assist in new equipment set-up, machine optimization, tooling and OEE improvement.

Master/ Degree in Engineering (Mechatronic/ Electronic/ Electrical)Min 1-2 years in semiconductor mainly Testing Process experience.

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Quality Engineer DS QM 9/10

Drive and achieve QM target. Liaise with wafer supplier for quality related issues and continual improvement actions. Coordinate effective & efficient documentation (FMEA, Control Plan, process specs) review.

Degree in Engineering or Science with min 2 years semiconductor backend experience.

Manufacturing Project Manager DS 12 Support semiconductor assembly processes especially diebond,

wirebond, molding, T&F.

Degree with minimum 7 years working experience in semiconductor assembly manufacturing environment.

Molding Process Engineer DS 9/10/

11Process development owner of molding. Establish and setup of new molding assembly process capabilities for NPI and existing products.

Degree in Engineering (Mechanical/Physics) with at least 1 year of relevant experience. Fresh graduates are encouraged to apply.

Development Engineer / Senior (FOL) DS 10/11

Lead equipment purchase, material selection, process development activitiets to meet project schedule. Interface with cross functional team from various sites to meet Project/ Business needs.

Master/ Degree in Engineering (Mechanical/ Electrical)/ Physics with min 3 years working experience in FOL process engineering/ process development.

Development Engineer / Senior (EOL – Molding) DS 10/11

Lead equipment purchase, material selection, process development activities to meet project schedule. Interface with cross functional team from various sites to meet project/ business needs. Engineering/ customer sample coordination. Responsible for overall project timeline and project execution quality.

Master/ Degree in Engineering (Mechanical/ Electrical) / Physic with min 3 years working experience in End of Line process engineering/ process development.

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Assembly Process Engineer DS 9/10/

11Process development owner of assembly. Processes. Provide technical support to evaluation driven by DEV/ME Department.

Degree in Engineering (Mechanical/Physics) with at least 1 year of relevant experience. Fresh graduates are encouraged to apply.

Staff Engineer - Test Equipment DS 12

Test equipment and maintenance support. Establish and setup new test capabilities. Monitor performance, identify problems & execute improvement actions.

Master/ Degree in Engineering (Semiconductor Technology/ Microelectronics/ Automation/ Mechanical/Electrical) with min 7 years relevant working experience.

Senior/ Test Process Engineer DS SO 9/10/

11

Process owner of Testing area. Establish and set-up new testing process capabilities. Identify problem and execute improvement actions. Responsible for process yield, quality, cost and delivery improvement. Implement the use of SPC/FMEA/DMAIC, DOE, 8D and FA techniques & related documentation filing.

Master/ Degree in Engineering (Semiconductor Technology/ Equipment Engineering)/ Physics with min 3 – 5 years experience in semiconductor (Test and Process)

Automation Engineer PO 10/11

Develop and realized process automation concepts. Support process automation system in mass volume production environment. Project management on new automation projects. Actively support, participate and embrace empowered team culture including significant interaction with manufacturing

Degree/Technical Diploma/ Advance in Engineering (Mechanical/ Electrical/ Electronic or in any equivalent engineering) with min 2 year relevant working experience.

Development Engineer PO 9/10 11

Package development owner for SO power package. Lead new package concepts and ramp up for new platform & extensions, planning and co-ordination and execution of new assembly technology development projects.

Degree in Engineering with minimum 2 years of related semiconductor assembly or development .

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Process Engineer (Wirebond) PO 10/11

Plan process yield target. Monitor, execute and improve process performance. Support team to address customer complaints and audits. Update and issue relevant specs/documents.

Degree in Engineering (Mechanical/ Electrical/ Mechatronics or other relevant disciplines) with min 1 year experience.Diploma in Engineering with min 5 years experience.

Process & Equipment Engineer PO 9/10/

11

Manage equipment utilization, performance efficiency and reliability. Oversees the installation, modification, upgrade and maintenance of manufacturing equipment.

Degree in Engineering (Mechanical/ Electrical/ Electronic Engineering)/ Applied Science or any equivalent engineering discipline with min 2 years relevant semiconductor working experience.

Assistant Engineer PO G1To provide engineering support for all development project engineering activities. Monitor performance, identify problem & execute improvement actions.

Diploma/ Certificate in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical) with min 3 years in related semiconductor assembly or R&D experience.

Senior ManagerDB soft solder PO GG14

Process and material expert to drive, identify and implement robust manufacturing die bond processes (eg. solder solder, epoxy and solder paste) in PO.

Bachelor’s/ Master’s Degree in Mechanical/Material or any equivalent engineering discipline. Minumum of 8 years semiconduction working experiences (development or manufacturing) in soft solder bonding or soft solder material characteristic/interfaces.

Manager Wire-Bonding Cu PO GG13

Process and material expert to drive, identify and implement robust wire bond in manufacturing environment. Major competency in Cu wire bonding required.

Bachelor’s/ Master’s Degree in Mechanical/Material or any equivalent engineering discipline. Minumum of 8 years semiconduction working experiences (development or manufacturing) in Au/Cu/Al wire bonding or wire bonding material characteristic/interfaces. Candidate with Black Belt would be an advantage.

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ManagerProcess Control & Statistics

PO GG13

Manages large production data-sets and provides data analysis using a variety of statistical tools in order to improve manufacturing success rates (yield, quality) in real-time, providing retrospective data analysis for process improvements, and providing input for complex manufacturing investigations.

Bachelor Degree in Applied Statistics or equivalent, minimum second class upper. Minimum 12 years manufacturing experiences and knowledge in databases, mathematical and statistical software packages (Oracle, Matlab, Design Expert, SAS Jump).

Senior ManagerQuality PO GG14

Black Belt Expert in Quality Management.Training of Engineering/Quality team on 6-Sigma method. Ensure the proper DOE is planned and executed for new equipment/process/product/material introduction.

Bachelor’s/ Master’s Degree in any engineering discipline. Minimum of 8 years semiconductor working experiences (development or manufacturing) and Master Black Belt.

Senior ManagerMolding PO GG14

Process, equipment and material expert to drive, identify and implement robust molding process in PO.Identify, evaluate & define robust molding process (eg. flashes free, void free) for manufacturing

Bachelor’s/ Master’s/PhD in Mechanical/Material or any equivalent engineering discipline.Minumum of 8 years semiconduction working experiences (development or manufacturing) in molding or End of Line with solid knowhow in material characteristic/interfaces.

ManagerManufacturing Concept PO GG13

Source, characterize, develop and implement new technologies and advanced packages.

Re-engineer processes and packages to meet new industrial / legislative requirements.

Working in global teams / environment to deliver committed project targets.

Bachelor / Master Degree in Chemical Engineering / Mechanical Engineering / Material Science / Physics / Chemistry / Electronics. Minimum 8 years working experience in semiconductor industry preferably in Power Packages. Must possess detailed knowledge in assembly and test processes, and selectively, in equipment design. Practicing fact-based techniques in problem solving ( e.g. Analytical Trouble Shooting, Design of Experiments, SPC ). Good inter-personal skills and able to work well under pressure.

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ManagerIndustrial Engineering

PO GG 12/ 13

Drive shopfloor / production to enhance productivity and profitability, eg reduction of conversion time (SMED), simplified process flow, optimization of resources thru IE methodology. Layout optimization and productive.Improvement in operation supports thru automation / IT integration, eg visible production KPI, production planning, machine performance. Cost productivity – reduce headcount / waste / material etc & increase capacity. Simulation tools for analysis & decision making.Strategy planning & provide scenarios for management decision making.

Degree / Master in Industrial Engineering, or equivalent from recognized universities.At least 8 years of relevant working experience.Possess excellent degree of know-how in all Industrial Engineering related disciplines and PC knowledge.

ManagerAutomation PO GG13

Support the objective of Power Segment manufacturing automation. Develop and realize process automation concepts; focus in vision automation and optic application.Support process automation systems in mass volume production environment, with the focus in the vision integration. Project Management on new Automation Projects. Support New manufacturing line qualification and ramp-up. Actively support, participate and embrace an empowered team culture including significant interaction with manufacturing, quality and engineering groups.

Degree in Mechanical/ Electrical/ Electronic Engineering or any equivalent engineering discipline. Minimum of 8 years working experiences in semiconductor assembly manufacturing environment.Advance knowledge in vision & lighting application.Strong electrical/mechanical/programming troubleshooting skills. Strong & systematic problem solving skills. Excellent interface skills to interact with internal and external tool vendors. Good coaching skills & leadership. Analytical skills & good knowledge of basic statistics

Senior managerPackage Definition PO GG14

Source, characterize, develop and implement new technologies and advanced packages. Re-engineer processes and packages to meet new industrial / legislative requirements. Working in global teams / environment to deliver committed project targets.

Bachelor / Master Degree in Chemical Engineering / Mechanical Engineering / Material Science / Physics / Chemistry / Electronics. Minimum 10 years working experience in semiconductor industry preferably in Power Package R&D. Possess detailed knowledge of Package Development characterization and proven track record with own patent portfolio. Good knowledge of market trends with established network of information sources. Familiar with Package Development tools e.g. thermal / mechanical modeling.

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Specialist – Test Engineering

PO 12

Develop an effective testing method to detect intermittent assembly defects such as chip die, lifted wire, etc. Define test programming rules & procedure which fulfills manufacturing requirement especially in the areas of test detection on assembly related defects. Work closely with Division Test development to enhance existing or implement new developed test detection method. Support customer FAR on test escapee root cause finding and implement improvement action.Initiate collaboration program with customer/professional bodies for in-house test detectability enhancement.

Honors / Basic degree in electrical, electronic engineering / applied physics or sciences with minimum 8 years test programming related experience. Basic knowledge in Analog/Digital device circuitry is necessary.Minimum of 8 years experience in semiconductor test development or test engineering. Knowledge in Teradyne IG-XL, IMAGE based platform and automotive product will be an added advantage. Possess strong analytical, problem solving and leadership skill. Independent, mature, result oriented and a team player.

Quality Director PO 15

Possible tasks are listed below and depend on the specific role and organisational unit: Defines Q-methodology & Defines and establishes Q-organisation / network within organisational unit. Enforces awareness building for quality and risk management. Represent ultimate authority for all quality and risk related matters. Quality KPI reporting. People Management / Encouragement.Ensures the fulfilment of time and cost according agreed qualification plans / schedules. Defines quality targets (corporate targets) out of requirements from customer and market. Initiates and drives continuous improvement activities / programmes. Owner for quality meetings and project meetings with customers worldwide. Risk assessments and decision competence on risk releases. Data management and documentation. Overall QM support activities (customer audits, request, problem solving). Installation and definition of effective process flow for complaint management. Monitor quality criteria and the adherence to quality assurance risk management procedures within the function. Define and run quality and risk reporting systems. Contribute to the development of adequate quality measurement criteria and establishing and harmonising quality assurance objectives, policies and operating procedures including risk management.Call upon Q-measures / Q-audits.

Degree in relevant field with at least 15+ years experience in development and / or marketing or quality management in semiconductor branchesProject management skills.Basic knowledge of:Market, competitors, technologies and productsCustomer requirementsExternal standards in use.Training need / effort analysisContinuous improvement Programme (moderation)Skills in customer / supplier negotiationsQS 9000 / QM processes.

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Leadframe, Molding & Tooling Design Specialist

MCS 12+

Perform LF & Mold tooling manufacturability and is interaction to process and material and co-ordinate implementation of new LF design, new molding technology, process and equipment.Support needs from segment ad requests from other global sites from process freeze to ramp up of technology (ItT and ItP), innovation and change management projects, productivity and process robustness.

Degree/Masters with extensive hands on experience in molding process is semiconductor backend fab. Mobile and prepared to undertake short to medium term delegation to other global sites.

Inorganic Material Specialist MCS

12+Render technical support & expertise on in-organic materials including chemicals, epoxy, metals, etc. Support needs from segment ad requests from other global sites from process freeze to ramp up of technology (ItT and ItP), innovation and change management projects, productivity and process robustness.

Degree/Masters with extensive hands on experience in materials engineering with detailed knowhow in metal /chemical used in semiconductor industry. Mobile and prepared to undertake short to medium term delegation to other global sites.

Pre-Assembly (Singulation) Specialist

MCS12+

Render technical support & expertise on pre-assembly processes & equipment including wafer mounting and singulation. Support needs from segment ad requests from other global sites from process freeze to ramp up of technology (ItT and ItP), innovation and change management projects, productivity and process robustness.

Degree/Masters with extensive hands on experience in pre-assembly technology/processes and equipment with detailed knowhow in thin wafer and 300 mm singulation. Mobile and prepared to undertake short to medium term delegation to other global sites.

Front-Of-Line Specialist MCS 12+

Render technical support & expertise on front-of-line processes including wafer diebond and wirebond. Support needs from segment ad requests from other global sites from process freeze to ramp up of technology (ItT and ItP), innovation and change management projects, productivity and process robustness.

Degree/Masters with extensive hands on experience in front-of-line technology/processes and equipment on Cu wirebond and relevant areas. Mobile and prepared to undertake short to medium term delegation to other global sites.

Statistical Design & Data Analysis Specialist

MCS 12+

Render technical support & expertise on design of data collection, synthesis, analysis and interpretation Perform statistical design ad analysis of experiments to drive decision making and direction finding without subjective human judgement. Support needs from segment ad requests from other global sites from process freeze to ramp up of technology (ItT and ItP), innovation and change management projects, productivity and process robustness.

Degree/Masters in Statistics with solid working experience in statistical design and analysis of experiments/ manafacturing/production datas. Mobile and prepared to undertake short to medium term delegation to other global sites.

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System Engineer (Unix, Open VMS & Backup Infrastructure)

IT OS 9/10/11

Unix, OpenVMS and backup infrastructure administration. Liaise with application groups on various projects and other system support requirements. Document system processes and procedures.

Degree in Information Technology with min 2-3 years experience in Unix, OpenVMS servers and backup infrastructure.

System Engineer (Network ) IT OS 9/10

/11

Provide networking support on various platforms. Design solution for customer/ project change request. Respond to faults call/ service call. Maintenance of documentation. To provide 24 hrs x 7 days standby support.

Degree in Information Technology, Computer Sciences, Computer Engineering or relevant discipline with min 2 years. Experience in Cisco, LAN and TCP/IP technologies.

System Engineer IT CBS MD 9/10/11

Responsible for programming tasks including asset management, iShare application, sourcing tool, SLCM, Master Data routine & ad hoc small development activities. Oracle based application with Centura and C# User interfaces to SAP.

Degree in Computer Studies with min 2-3 years relevant working experience.

System Engineer IT CBS GOC ILM

9/10/11

Second level support for Documentum and e-Archive Application. Manage incident & service order tickets, prepare test cases and perform test for systems and applications as part of quality assurance. Train and provide demonstration to users on application usage.

Degree in IT related field with 2-3 years relevant experience.Basic SAP knowledge, scripting & codes (Java, SQL, DQL etc)

System Engineer IT SHP 9/10/11

Provide SHP systems and application supports (ADA, Assist4, HLTrans, MIC, NISTAS and Sikit). Support daily operation, incident management, documentation, global service model.

Degree in Computer Science or Information Technology with min 2 years IT system and application support experience.

System Engineer (MIT Application Support)

OP CSC MIT ASY

9/10/11

To maintain, design and implement Manufacturing IT solutions. Administrate application, internal system support and troubleshooting.

Master/ Degree in Computer Science, Software Engineering or IT related discipline or equivalent.Skill: Java, C+, Script, NET, PL/SQL, XML)

System Engineer

(Application Programming Dev. & Support)

OP CSC MIT PRE

AME

9/10/ 11

Demand management, designer, quality management, software development & documentation, 3rd level support and operational support of existing application. Global operational support of existing EBS applications (EBS XE, EBS Loader, STEPP, PAT, Converters. Etc) .

Degree in Computer Science/ Information Technology or equivalent.2-3 years programming experience in semiconductor

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System Engineer (Manufacturing Middleware)

OP CSC MIT ATS

9/10/ 11

Provide 2nd level operational support for Tibco Rendezvous & Tibco Business Works operations tasks. Standby support on 24 x 7.

Degree in Computer Science. Knowledge and experience with Tibco Rendezvus and Tibco BusinessWorks

System Engineer

(Global Operations Support for EBS Applications)

OP CSC MIT PRE

AME

9/10/ 11

Provide global operations support for existing EBS applications (EBS XE, EBS Loader, STEPP, PAT, Converters, etc) analysis of problems, rollout of new versions, contact to 4rd level support.

Degree in Computer Science /IT with experience in wide variety of systems and technology (Systems – Windows /UNIX) database – Oracle, Programming languages C++, C, C#). Able to work additional hours as needed and regional travelling on a regular basis. Willing to be on-call support.

Cost Analyst Finance 9/10

Responsible in Financial Management in the area of inventory controlling, investment controlling and return of material, engineering samples, assets transfer and scraps.

Degree in Business Administration/ Accounting with min 3 years experience in Financial Management/ Accounting with Manufacturing environment. Posses professional qualifications ACCA/CIMA will be added advantage.

Security Executive Security 9/10 To perform security task with high integrity in the area of Logistic Security & Crisis Management.

Degree/ Diploma/ STPM/SPM. Experience in any uniformed organization. Fluent in written/ spoken BM & English Computer literacy

Reliability Engineer QM 9/10/ 11

Responsible for the reliability testing of power semiconductor devices for product monitoring, qualification/ evaluation and product qualification. Liaise with vendor on fabrication of burn-in board, test fixtures and buy-off of new reliability equipments.

Degree in Engineering (Electrical/ Electronics), Applied Science with major in Physics/ Solid State Physics.

Ramp-up, Changeand Sample Manager

RSM 12/13

Responsible in ramp-up and sample manager that acts as interface between Development, Marketing, Quality Management, Finance, Logistics and production sites. Administrative manager and managing local team members and RSM representative.

Degree in Engineering or Science with 6 years experience in logistics/ supply chain management and project management.

ESH Supervisor ESH G1 To assist in enforcing ESH compliance requirements and related to OSH Act 1994 (Safety And Health Officer)

Cerificate or Diploma related to Occupational Safety & Health or Registered SHO or attended SHO course.

Assistant Storekeeper LOG G3 Assist in store activities SPM with at least 2-3 years of relevant experience. 19.04.23


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Copyright © Infineon Technologies 2008. All rights reserved. For internal use only19.04.23

Staffing Personnel E-Mail Contact Number

Arulkumar

Kho Sue Ying Shennie

[email protected]

[email protected]

06-2325266, Ext 8404

06-2325266, Ext 8428

Contact Person/s

Note for Employee Referral Programme

1 All referrals MUST be submitted to HR.

2 Referrals must be submitted together with the ERP form which can be obtained from HR Online forms.

3Submission made directly to hiring managers will not be entitled for ERP. Referrals must be locked in/approved by HR before the candidate is shortlisted for interview.

4 Referees are advised to read the terms & conditions of the Employee Referral Programme. All submissions made to HR will be acknowledged.

12.00.012.08.9 7.18 9.20 8.60 6.40 5.00 6.40 6.80 6.20 internal vacancies ifmy & iflp, september...

Documents

new packageprocess development

pd technology

process problems

development rd experience

process capabilities

bare die process

assembly projects

years experience