110123 jstc presentation mco - final [read-only] · presentation to gams source: semiconductor...

JSTC 24 January 2011 1

MCO Applications

24th January 2011, Washington DC

JSTC 17 January 2011 2Ultra Low Power devices

Cold-chain- food control

Intelligent car key

Innovations in Lighting

PC Power Supplies

MEMS Oscillator

Semiconductors are everywhere and can be found as advanced solutions in (examples):

Semiconductor as enabling industry


New types of semiconductor products

As a result, a diverse range of high-functional super-high density packaged products - incorporating combinations of integrated circuits and discrete components - has been emerging as an ‘integrated circuit’ configuration and has been in high demand in recent years

Semiconductors are an industry of rapid technological development, enabling such societal, consumer and business needs as:• increased performance• ultra miniaturization• energy saving in cars, PCs, homeelectrical appliances and electronicequipment• cost saving


GAMS & the social contribution of MCO

Excerpt from the GAMS Chair’s Summary – September 16, 2010:

« GAMS recognizes the social contribution of semiconductors as one that serves an important role in enabling efficiency and renewable energy thereby reducing global warming and promoting energy security. […]

GAMS welcomes the report by the SIRIJ [Semiconductor Industry Research Institute Japan] which shows that increased energy consumed by ICT products can enable substantially lower consumption in the rest of the economy.

GAMS has also noted the particular role played by newly developed semiconductors such as MCO in this respect.

Based on the social contribution of semiconductors, GAMS underlined the importance of facilitating the growth of the market for such semiconductor products through zero duties on MCO with an appropriate definition that captures these new trends »


New Markets in a Symbiotic Society –presentation to GAMS

Source: Semiconductor Research Institute Japan


Market: Saving Potential by Using Power Electronics

STAND-BYPOWER

(TV)

90%Saving

potential

MOTOR CONTROL

30-40%Saving

potential

(using inverters)

TRACTION DRIVES

20-30%Saving

potential

(using power semiconductors

e.g. recuperation of braking energy)

FAN MOTOR DRIVES and AIR

CONDITIONER

30-40%Saving

potential

(usingIntelligent

Compressor Control)

POWER SUPPLY

1%Saving

potential

LIGHTING

25%Saving

potential

(using electronicballast)

INDUCTIVECOOKING

25%Saving

potential

(using inductioninstead ofelectric ovens)

Source: eupec GmbH; BVG- Berlin; Siemens / ECPE, 10/2005


The case of MCO

Source: JEITA, ESIA

Multicomponent/ Multi-chip like integrated circuits , e.g. :1) Monolithic IC/Multichip IC and Passive components2) Monolithic IC/Multichip IC and Active components3) Monolithic IC/Multichip IC and Active & Passive

Outside heading 8542!!

Multi-chip integrated circuits&

Monolithic integrated circuits are classified inside heading 8542 (under

HS2007)

Additional components in modern semiconductor products:•resistors•capacitors•sensors based on variable resistance and capacitance•inductors•passive integrated networks•piezo-electric elements•…


Semiconductor Development Impact on Packaging

More than Moore: Diversification

BiochipsSensorsActuators

HVPowerAnalog/RF Passives

Information Processing

Digital contentSystem-on-chip

(SoC)

Interacting with people and environment

Non-digital contentSystem-in-package

(SiP)

Beyond CMOS

2008

32nm

Mor

e M

oore

: M

inia

turi

zati

on

Bas

elin

e C

MO

S:

CP

U,

Mem

ory

, Lo

gic

130nm

90nm

65nm

22nm...V

45nm

Medical

A < B < C < D < E < FA = Monolithic ICs; B= Multichip (MCP); C = MCP + DiscretesD = Passive Integration and Discretes; E = D + MEMS + Optical devices; F = Solution with through Silicon via (TSV)Each group may contain all or only parts of elements specified

A

F

BC

DE


In the late 1960s, Intel co-founder Gordon Moore predicted the number of transistors on a chip would double every 18 months; an observation now referred to as ‘Moore’s law’. Referred to as ‘More Moore’ this trend continues, particularly for memories and microprocessors, which depend on size and power reduction for introduction of ever increasing complexity.

At the same time, a greater variety of semiconductor devices can be combined on the same chip in SoCs [System-on-Chips] or in the same package using SiPs [System-in-Package]. This concept, known as ‘More than Moore’, adds a lot of other devices on top of the pure CMOS process – such as analog/RF, passive, high-voltage (HV) power, sensor/actuator, biochip and MEMS components – that are processed and embedded in the chip/package instead of being added at systems level. This improves system integration by an order of magnitude and opens new application fields.

International Technology Roadmap for Semiconductors (ITRS) Semiconductor technology trends


Evolution of semiconductor integration configurations

Monolithic ICs, Included in HS2002

MCO ICs in production, not covered in HS2007

Multi Chip ICs, Included in HS2007

MCO ICs in development, not covered in HS2007

D E

E

D

B

A

C

F

Note: B to D typically use BGA or similar packages. Packages with MEMS may differ

ABCDEF

A B C D E


Packaging History Single chip from 1950, WB in single Package

PDIP = Plastic DualInline Package

PGA = Pin Grid ArrayQFP = Quad Flat

PackageSOJ = Small Outline

J-LeadedBGA = Ball Grid ArrayCSP = Chip Size

PackageFC = Flip Chip

(Package)VIC = Vertical inte-

grated Circuit(TSV-Package)

HF= High Frequency

Molding

A

Power HF Chip Memory ASIC Mikroprozessor Opto

Wire Bond Bumping Umhüllen

IC

Montage 1

Package PDIP PGA QFP SOJ BGA CSP FC VIC

19851970

Tech

nolo

gy P

erfo

rman

ce

PDIP

QFP

BGA

2000

Such standard ICpackages are used to assemble different monolithic semiconductor technologies


Examples of Semiconductor product evolution shown in following slides

Slide 13: Monolithic IC (type A) Slide 14 + 15: Multi-chip IC (type B) Slide 16: Multi-chip plus discrete elements integrated into

single package (type C) Slides 17, 18: Solution with passive integration and

discrete elements (type D) Slides 19, 20, 21: Solutions with passive

integration/semiconductor technology based MEMS/optical and discrete elements (type E)

Slide 22: 3D integration with multiple types of elements (type F)


Standard Telecom PCB Board (ADSL):Single Chip mounted on a PCB together with passives

ADSLDigitalProcessor

ADSLLineDriver Transformer

A

A

A

A A

A

A A


DECT MCP / since 1995 in volume

BExamples for leadframeMCPs, chip to chip wire bonding

P-TQFP-144-38 interconnections,1997 onwards

P-MQFP-64-865 interconnections,1998 onwards

TV Megatext


TV Text MCP / since 1999 in volume

B

thin film on silicon substrate

Logic + FlashP-SDIP-52-3, ~14x46x4.8mm,

2 layer thin film on silicon substrate

~ 260 wires

std. LF die pad

production, 1999-2003

Flash

Examples for leadframe with substrate, wire bonding. Used in TV set for video-text


Bluetooth Module C

Schematic diagram of the module. Note the capacitors and resisters around the logic dies, U1 and U2 (Source: National Semiconductor)

Top and bottom views of module,


Standard ADSL system line cardsSiP plus integrated passives, 2005

Integration of four channels per

package inclusive passive components

2 x PassivesIntegrated Filter Caps

History

D


IC Package with TV reception functionality

Monolithic IC die16mm2

Substrate

Monolithic IC die3.5mm2

Passive integration

Monolithic IC die2.25mm2

D

Pictures show components withseveral lC dies, discrete and integrated passive circuit elementsbefore plastic molding into standard IC package


Silicon Microphone Device, 2007

ApplicationConsumer application with special focus on

mobile phones.NotebooksCamerasAlso suitable for automotive, industrial or medical

applications, where microphones are directly assembled onto the PCB and where size as well as temperature immunity matter

TechnologyThe Silicon Microphone Device consists of two

chips combined in a single package.The MEMS chip is capacitor made up of a stiff and perforated backplate and a flexible membrane on silicon substrate. It transfers the sound waves into capacity variations. The ASIC chip converts the capacity variations into an electrical signal.

E


Tire Pressure Monitoring Sensor, 2008

Mainly used in cars

Helps reduce road fatalities by monitoring tyres inflation and warning the driver in case of under-inflation

Contributes to lower fuel energy

The IC contains 2 chips inside a standard plastic semiconductor package.

A MEMS sensor die capable of measuring pressure and acceleration

A signal conditioning ASIC.

The IC will provide output data:

Pressure (from the MEMS sensor)

Acceleration From the MEMS sensor)

Temperature (from the ASIC)

Battery voltage (from the ASIC)

MEMS Sensor

ASIC

E

June 2008 21AF85 VCM Module Design

Isometric View of Final Module

Exploded ViewActuator Assembly

IR Holder Assembly

Substrate & Die Assembly

Actuator

Sub-components

- Assembled by supplier

IR Glass

Top View of Final Module

Cross-section of Final Module

Optical Modules E


Solution with 3D Integration (Future oriented)

22

F

Source:SINTEF Source: IZM MunichBulk Acoustic Wave filterand Tire Pressure Sensor in Through Silicon Via (TSV) realization.

Source: SINTEF, e-Cubes Project

TSV


Semiconductor (and MCOs) are not PCBs or end use systems

Semiconductor products are clearly distinguished from PCB (Printed Circuit Board) products and end use systems, for:

• Different connection techniques: all examples showndemonstrated that by connection techniques typicalof semiconductor industry at package level the resultis a clear semiconductor product

• Interconnection Wire bonding Flip chip Die attach

• Packaging (Molding)

• Element relative density


MCO definition background

Consecutive definition proposals for MCOs:• November 2007: Japanese Gov definition proposal

based on the World Semiconductor Council proposal• October 2008: US Gov definition proposal

more restrictive in scope• February 2010: European Commission non-paper, built on• the definition proposals by Japan and US• WSC proposal of 2007 (scope)• JSTC list of MCO products

November 2010 – WCO does not take up MCO definition issue. December 2010 – USITC sends invitation per the GAMS

summary of the Kobe meeting; GAMS invited its members “to consult their customs experts without delay to start to develop and finalize preferably before April 2001 a definition of what constitutes multicomponent (MCO) products. . .GAMS envisages to reach a consensus on duty free treatment in its GAMS 2011 meeting.”


What are MCOs? A summary

MCOs are products manufactured in semiconductor technology*

They perform multiple functions thanks to the variety of components integrated in a single unit

MCOs are combinations of one or more monolithic, hybrid and/or multi-chip

integrated circuits with one or more other elements and are formed into a

single body, for connection to a printed circuit board (PCB) or other

carrier and which are formed to all intents and purposes indivisibly

Even if they have become functionally very powerful, they are not end-

devices or finished products. They remain semiconductors.

As MCOs currently have to be classified according to their function, they can be found in a broad variety of headings (e.g. as parts of refrigerators or washing machines)

* please see Note 8b to HS Chapter 85


Back up


Definition proposals (1)

November 2007

Proposed industry (WSC) definition for a multi-component IC(forwarded by the Japanese Government to WCO on November 9, 2007)

“A multi-component IC is an electronic microcircuit consisting of one or more monolithic, hybrid and/or multi-chip ICs combined with one or more discrete active and/or passive elements and/or other components - including but not limited to “MEMS”, optoelectronic components, sensor components and/or optical elements - interconnected to all intents and purposes indivisibly, whether or not on one or more flexible or inflexible substrates, with or without leadframes”.

[April 2008: Revised World Semiconductor Council (WSC) text drafted to meet Authorities’ concerns, approved by 5 Semiconductor Industry Associations:“Multi-component integrated circuits which are combinations of one or more monolithic, hybrid and/or multi-chip integrated circuits with one or more discrete active and/or passive elements, integrated passive dies, micro-electromechanical systems (MEMS), sensors, actuators, piezoelectric, optoelectronic*, and/or optical elements that are formed into a single body**, for connection to a printed circuit board (PCB) or other carrier and which, after manufacturing, would not be susceptible to cost effective removal or replacement of individual elements or the inclusion of elements that were not integrated into the multi-component integrated circuit at the time of original manufacture”.*e.g. LED]



September 2008

Draft definition circulated by the United States Government"Multi-component integrated circuits are combinations of one or more monolithic, hybrid or multi-chip integrated circuits with one or more components classifiable under heading 85.32, 85.33 or 85.41 and formed to all intents and purposes indivisibly with or without a substrate into a single body as a component of a kind used for assembly onto [mounting on?] a printed circuit board (PCB) or other carrier [platform?].“



February 2010 (confirmed in August 2010)

European Commission definition of MCOs:

Draft proposal for a definition of multi-component integrated circuits(MCOs) for the purposes of an agreement on duty free tariff treatment

"This agreement covers so-called "multi-component integrated circuits", other than those of HS heading 8542 by virtue of Note 8 to Chapter 85 of the HS nomenclature, falling under HS headings [8473, 8504, 8517, 8518, 8522, 8523, 8525, 8528, 8529, 8535, 8536, 8537, 8543, 8548, 9026, 9030, 9031, 9032 and 9504].

In this context a "multi-component integrated circuit" is defined as a combination of one or more monolithic, hybrid and/or multichip integrated circuits with one or more components of HS headings [8504, 8505, 8517, 8518, 8522, 8529, 8532, 8533, 8534, 8541, 8543, 8548, 9001,9002, 9026 and 9031] [or other semiconductor-based devices], interconnected and combined to all intents and purposes indivisibly into a single package for assembly onto a printed circuit board or other carrier."

110123 jstc presentation mco - final [read-only] · presentation to gams source: semiconductor...

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