10a, 4.75 v to 14 v input, non-isolated, digital powertrain module
TRANSCRIPT
PTD08A010W
www.ti.com SLTS285E –MAY 2007–REVISED FEBRUARY 2010
10-A, 4.75-V to 14-V INPUT, NON-ISOLATED,WIDE-OUTPUT, DIGITAL POWERTRAIN™ MODULE
Check for Samples: PTD08A010W
1FEATURES APPLICATIONS• Digital Power Systems
2• Up to 10-A Output Currentusing UCD9XXX Digital Controllers• 4.75-V to 14-V Input Voltage
• Programmable Wide-Output Voltage(0.7 V to 3.6 V)
• Efficiencies up to 96%• Digital I/O
– PWM signal– INHIBIT– Current limit flag (FAULT)– Sychronous Rectifier Enable (SRE)
• Analog I/O– Temperature– Output currrent
• Safety Agency Approvals: (Pending)– UL/IEC/CSA-C22.2 60950-1
• Operating Temperature: –40°C to 85°C
DESCRIPTIONThe PTD08A010W is a high-performance 10-A rated, non-isolated digital PowerTrain module. This module is thepower conversion section of a digital power system which incorporates TI's UCD7230 MOSFET driver IC. ThePTD08A010W must be used in conjunction with a digital power controller such as the UCD9240 or UCD9110family. The PTD08A010W receives control signals from the digital controller and provides parametric and statusinformation back to the digital controller. Together, PowerTrain modules and a digital power controller form asophisticated, robust, and easily configured power management solution.
Operating from an input voltage range of 4.75 V to 14 V, the PTD08A010W provides step-down powerconversion to a wide range of output voltages from, 0.7 V to 3.6 V. The wide input voltage range makes thePTD08A010W particularly suitable for advanced computing and server applications that utilize a looselyregulated 8-V, 9.6-V or 12-V intermediate distribution bus. Additionally, the wide input voltage range increasesdesign flexibility by supporting operation with tightly regulated 5-V or 12-V intermediate bus architectures.
The module incorporates output over-current and temperature monitoring which protects against most load faults.Output current and module temperature signals are provided for the digital controller to permit user definedover-current and over-temperature warning and fault scerarios.
The module uses double-sided surface mount construction to provide a low profile and compact footprint.Package options include both through-hole and surface mount configurations that are lead (Pb) - free and RoHScompatible.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2POWERTRAIN is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2007–2010, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
CO2
330 mF
(Recommended)
VO
VO
4
3
AGND
75 6
IOUTTEMP
2
GND GND
PTD08A010W
1
8
VI
INH
12
VBIAS
CI2
22 mF
(Required)
L
O
A
D
GND
VI
GND
+
CO1
47 mF
(Required)
9
FAULT
10
SRE
11
PWM
CI1
330 mF
(Recommended)
+
Digital Lines
To/From
Digital Controller
Analog Lines To
Digital Controller
UDG-07054
[A] [A]
PTD08A010W
SLTS285E –MAY 2007–REVISED FEBRUARY 2010 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Standard PTD08A010W Application
A. CI2 and CO1 are optional when the operating frequency is greater than 500 kHz.
2 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
PTD08A010W
www.ti.com SLTS285E –MAY 2007–REVISED FEBRUARY 2010
ORDERING INFORMATIONFor the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or seethe TI website at www.ti.com.
DATASHEET TABLE OF CONTENTS
DATASHEET SECTION PAGE NUMBER
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS 3
ELECTRICAL CHARACTERISTICS TABLE 4
TERMINAL FUNCTIONS 5
TYPICAL CHARACTERISTICS (VI = 12V) 6
TYPICAL CHARACTERISTICS (VI = 5V) 8
TYPICAL APPLICATION SCHEMATIC 10
GRAPHICAL USER INTERFACE VALUES 11
TRAY DRAWINGS 12
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS(Voltages are with respect to GND)
UNIT
VI Input voltage 16 V
VB Bias voltage 16 V
TA Operating temperature range Over VI range –40 to 85
Surface temperature of module body or pinsTwave Wave soldering temperature suffix AD 260 °Cfor 5 seconds maximum
Tstg Storage temperature –55 to 125 (1)
Per Mil-STD-883D, Method 2002.3, 1 msec, suffix AD 200Mechanical shock 1/2 sine, mounted GMechanical vibration Mil-STD-883D, Method 2007.2, 20-2000 Hz 15
Weight 3.9 grams
MTBF Reliability Per Telcordia SR-332, 50% stress, TA = 40°C, ground benign 9.4 106 Hr
Flammability Meets UL94V-O
(1) The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65°C.
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): PTD08A010W
PTD08A010W
SLTS285E –MAY 2007–REVISED FEBRUARY 2010 www.ti.com
ELECTRICAL CHARACTERISTICSPTD08A010WTA= 25°C, FSW= 350kHz, VI= 12 V, VO= 3.3 V, VB= VI, CI1= 330 µF, CI2= 22 µF ceramic, CO1= 47 µF ceramic, CO2= 330 µF,and IO= IO(max) (unless otherwise stated)
PARAMETER TEST CONDITIONS PTD08A010W UNIT
MIN TYP MAX
IO Output current Over VO range 25°C, natural convection 0 10 A
VI Input voltage range Over IO range 4.75 14 (1) V
VOADJ Output voltage adjust range Over IO range 0.7 (1) 3.6 V
VO = 3.3 V 95%
VO = 2.5 V 92%
VI = VB = 5 V VO = 1.8 V 89%h Efficiency IO = 10 A,
VO = 1.5 V 88%fs = 350 kHz
VO = 1.2 V 86%
VO = 1.0 V 84%
VOPP VO Ripple (peak-to-peak) 20-MHz bandwidth 20 mVPP
VB Bias voltage 4.75 14 V
VB increasing 4.25 4.5 4.75VB Bias voltage under voltage VUVLO lockout VB decreasing 4.0 4.25 4.5
Inhibit (pin 8) to AGND Standby 4IB Bias current mA
Switching 34
VIH High-level input voltage 2.0 5.5SRE, INH, & PWM input levels V
VIL Low-level input voltage 0.8
Frequency range 300 1000 kHzPWM input
Pulse width limits 130 ns
Range -40 125 °C
Accuracy, -40°C ≤ TA ≤ 85°C -4 6 °CTEMP output
Slope 10 mV/°C
Offset, TA = 0°C 500 mV
VOH High-level output voltage, IFAULT = 4mA 2.7 3.3V
VOL FAULT output Low-level output voltage, IFAULT = 4mA 0 0.6
ILIM Overcurrent threshold; Reset, followed by auto-recovery 20 A
Range 0.15 3.5 V
Gain 70 100 130 mV/AIOUT output
Offset, IO = 0A, VO = 1.2V 0.44 0.6 0.76 V
Output Impedance 10 15 21 kΩ
Nonceramic 330 (2)
CI External input capacitance µFCeramic 22 (2)
Nonceramic 330 (3) 5000 (4)
Capacitance Value µFCO External output capacitance Ceramic 47 (3) (3)
Equivalent series resistance (non-ceramic) 1 (5) mΩ
(1) The maximum input voltage is duty cycle limited to (VO/(130ns × FSW)) or 14 V, whichever is less. The maximum allowable input voltageis a function of switching frequency.
(2) A 22 µF ceramic input capacitor is required for proper operation. An additional 330 µF bulk capacitor rated for a minimum of 500mA rmsof ripple current is recommended. When operating at frequencies > 500kHz the 22 µF ceramic capacitor is only recommended. Refer tothe UCD9240 controller datasheet and user interface for application specific capacitor specifications.
(3) A 47 µF ceramic output capacitor is required for basic operation. An additional 330 µF bulk capacitor is recommended for improvedtransient response. When operating at frequencies > 500kHz the 47 µF ceramic capacitor is only recommended. Refer to the UCD9240controller datasheet and user interface for application specific capacitor specifications.
(4) 5,000 µF is the calculated maximum output capacitance given a 1V/msec output voltage rise time. Additional capacitance or increasingthe output voltage rise rate may trigger the overcurrent threshold at start-up. Refer to the UCD9240 controller datasheet and userinterface for application specific capacitor specifications.
(5) This is the minimum ESR for all non-ceramic output capacitance. Refer to the UCD9240 controller datasheet and user interface forapplication specific capacitor specifications.
4 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
1
2 3 4
6
5
12
11
10
9
8
7
PTD08A010W(Top View)
Texas
Instruments
PTD08A010W
www.ti.com SLTS285E –MAY 2007–REVISED FEBRUARY 2010
TERMINAL FUNCTIONSTERMINAL
DESCRIPTIONNAME NO.
VI 1 The positive input voltage power node to the module, which is referenced to common GND.
2GND This is the common ground connection for the VI and VO power connections.
3
VO 4 The regulated positive power output with respect to GND.
TEMP 5 Temperature sense output. The voltage level on this pin represents the temperature of the module.
IOUT 6 Current sense output. The voltage level on this pin represents the average output current of the module.
AGND 7 Analog ground return. It is the 0 Vdc reference for the control inputs.
The inhibit pin is a negative logic input that is referenced to AGND. Applying a low-level signal to this pin disables theINH (1) 8 module and turns off the output voltage. A 10 kΩ pull-up to 3.3 V or 5 V is required if the INH signal is not used.
Current limit flag. The Fault signal is a 3.3 V digital output which is latched high after an over-current condition. TheFAULT 9 Fault is reset after two complete PWM cycles without an over-current condition (third rising edge of the PWM).
Synchronous Rectifier Enable. This pin is a high impedance digital input. A 3.3 V or 5 V logic level signals is used toSRE 10 enable the synchronous rectifier switch. When this signal is high, the module will source and sink output current. When
this signal is low, the module will only source current.
PWM 11 This is the PWM input pin. It is a high impedance digital input that accepts 3.3 V or 5 V logic level signals up to 1 MHz.
VBIAS 12 Bias voltage supply required to power internal circuitry. For optimal performance connect VBIAS to VI.
(1) Denotes negative logic: High = Normal operation, Low = Function active
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): PTD08A010W
0
50
30108642
40
70
60
90
80
100
fSW
= 350 kHz
3.3 V 2.5 V
1.8 V
1.2 V
0.8 V 3.3V
2.5V1.8V1.2V0.8V
VO
IO
– Ouput Current – A
h–
Eff
icie
ncy
–%
0 108642
IO
– Ouput Current – A
50
30
40
70
60
90
80
100
h–
Eff
icie
ncy
–%
3.3 V2.5 V
1.8 V
1.2 V
0.8 V
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 500 kHz
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 750 kHz
50
30
40
70
60
90
80
100
h–
Eff
icie
ncy
–%
0 108642
IO
– Ouput Current – A
3.3 V2.5 V
1.8 V
1.2 V
0.8 V
3.3V
2.5V1.8V1.2V0.8V
VO
3.3 V2.5 V
1.8 V
1.2 V
0.8 V
fSW
= 1 MHz
0 108642
IO
– Ouput Current – A
50
30
40
70
60
90
80
100
h–
Eff
icie
ncy
–%
0 108642
fSW
= 350 kHz
3.3V
2.5V1.8V1.2V0.8V
VO
IO
– Ouput Current – A
1
0
2
3
4
3.3 V
2.5 V
1.8 V
1.2 V
0.8 V
PD
–P
ow
er
Dis
sip
ati
on
–W
0 108642
IO
– Ouput Current – A
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 500 kHz
3.3 V
2.5 V
1.8 V
1.2 V
0.8 V1
0
2
3
4
PD
–P
ow
er
Dis
sip
ati
on
–W
1000900700600400fSW
– Switching Frequency – kHz300
20
60
90
I BIA
S–
Inp
ut
Bia
sC
urr
en
t–
mA
40
80
500 800
VI= 12 V
0 108642
IO
– Ouput Current – A
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 750 kHz
3.3 V
2.5 V
1.8 V
1.2 V
0.8 V
1
0
2
3
4
PD
–P
ow
er
Dis
sip
ati
on
–W
0 108642
IO
– Ouput Current – A
0
1
2
3
4
PD
–P
ow
er
Dis
sip
ati
on
–W
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 1 MHz
1.2 V
0.8 V
3.3 V
2.5 V
1.8 V
PTD08A010W
SLTS285E –MAY 2007–REVISED FEBRUARY 2010 www.ti.com
TYPICAL CHARACTERISTICS (VI = 12 V) (1)
EFFICIENCY vs EFFICIENCY vs EFFICIENCY vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 1. Figure 2. Figure 3.
EFFICIENCY vs POWER DISSIPATION vs POWER DISSIPATION vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 4. Figure 5. Figure 6.
POWER DISSIPATION vs POWER DISSIPATION vs INPUT BIAS CURRENT vsLOAD CURRENT LOAD CURRENT SWITCHING FREQUENCY
Figure 7. Figure 8. Figure 9.
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for theconverter.
6 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
0 108642
IO
– Ouput Current – A
20
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
fSW
= 350 kHz
VO
= 3.3 V
400LFM
200LFM100LFMNat conv
30
40
50
80
200 LFM100 LFM
Nat Conv
400 LFM
0 108642
IO
– Ouput Current – A
20
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
400 LFM
200 LFM
100 LFM
Nat Conv
fSW
= 500 kHz
VO
= 3.3 V
400LFM
200LFM100LFMNat conv
108642
IO
– Ouput Current – A
020
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
Nat Conv
Nat conv
fSW
= 350 kHz
VO
= 1.2 V
108642
IO
– Ouput Current – A
020
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
fSW
= 500 kHz
VO
= 1.2 V
200LFM100LFMNat conv
200 LFM
100 LFMNat Conv
108642
IO
– Ouput Current – A
020
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
fSW
= 750 kHz
VO
= 1.2 V
400LFM
200LFM100LFMNat conv
400 LFM
100 LFM200 LFM
Nat Conv
PTD08A010W
www.ti.com SLTS285E –MAY 2007–REVISED FEBRUARY 2010
TYPICAL CHARACTERISTICS (VI = 12 V)Safe Operating Area (1)
AMBIENT TEMPERATURE vs AMBIENT TEMPERATURE vs AMBIENT TEMPERATURE vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 10. Figure 11. Figure 12.
AMBIENT TEMPERATURE vs AMBIENT TEMPERATURE vsLOAD CURRENT LOAD CURRENT
Figure 13. Figure 14.
(1) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.Please refer to the mechanical specification for more information.
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): PTD08A010W
0 108642
fSW
= 350 kHz
3.3 V 2.5 V
1.8 V
1.2 V
0.8 V
3.3V
2.5V1.8V1.2V0.8V
VO
IO
– Ouput Current – A
50
40
70
60
90
80
100
h–
Eff
icie
ncy
–%
0 108642
IO
– Ouput Current – A
3.3 V 2.5 V
1.8 V
1.2 V
0.8 V
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 500 kHz
50
40
70
60
90
80
100
h–
Eff
icie
ncy
–%
0 108642
IO
– Ouput Current – A
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 750 kHz
50
40
70
60
90
80
100
h–
Eff
icie
ncy
–%
3.3 V 2.5 V
1.8 V1.2 V
0.8 V
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 1 MHz
0 108642
IO
– Ouput Current – A
50
30
40
70
60
90
80
100
h–
Eff
icie
ncy
–%
3.3 V 2.5 V
1.8 V
1.2 V
0.8 V
0 108642
fSW
= 350 kHz
3.3V
2.5V1.8V1.2V0.8V
VO
IO
– Ouput Current – A
1.0
0
2.0
3.0
0.8 V
PD
–P
ow
er
Dis
sip
ati
on
–W
Others
0.5
1.5
2.5
0 108642
IO
– Ouput Current – A
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 500 kHz
Others
1.0
0
2.0
3.0
PD
–P
ow
er
Dis
sip
ati
on
–W
0.5
1.5
2.5
1 8 V
&
2.5 V
1000900700600400fSW
– Switching Frequency – kHz300
10
30
50
I BIA
S–
Inp
ut
Bia
sC
urr
en
t–
mA
20
40
500 800
VI= 5 V
0 108642
IO
– Ouput Current – A
1.0
0
2.0
3.0
PD
–P
ow
er
Dis
sip
ati
on
–W
0.5
1.5
2.5
0.8 V
&
3.3 V
1 8 V
&
2.5 V
1.2 V
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 750 kHz
0 108642
IO
– Ouput Current – A
3.3V
2.5V1.8V1.2V0.8V
VO
fSW
= 1 MHz
All
1.0
0
2.0
3.0
PD
–P
ow
er
Dis
sip
ati
on
–W
0.5
1.5
2.5
PTD08A010W
SLTS285E –MAY 2007–REVISED FEBRUARY 2010 www.ti.com
TYPICAL CHARACTERISTICS (VI = 5 V) (1)
EFFICIENCY vs EFFICIENCY vs EFFICIENCY vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 15. Figure 16. Figure 17.
EFFICIENCY vs POWER DISSIPATION vs POWER DISSIPATION vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 18. Figure 19. Figure 20.
POWER DISSIPATION vs POWER DISSIPATION vs INPUT BIAS CURRENT vsLOAD CURRENT LOAD CURRENT SWITCHING FREQUENCY
Figure 21. Figure 22. Figure 23.
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for theconverter.
8 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
108642
IO
– Ouput Current – A
020
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
Nat Conv
Nat conv
fSW
= 350 kHz
VO
= 3.3 V
108642
IO
– Ouput Current – A
020
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
Nat Conv
fSW
= 500 kHz
VO
= 3.3 V
Nat conv
108642
IO
– Ouput Current – A
020
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
Nat Conv
Nat conv
fSW
= 500 kHz
VO
= 1.2 V
108642
IO
– Ouput Current – A
020
60
70
90
TA
–A
mb
ien
tT
em
pera
ture
–°C
30
40
50
80
Nat Conv
fSW
= 750 kHz
VO
= 1.2 V
200LFM100LFMNat conv
200 LFM
100 LFM
PTD08A010W
www.ti.com SLTS285E –MAY 2007–REVISED FEBRUARY 2010
TYPICAL CHARACTERISTICS (VI = 5 V)Safe Operating Area (1)
AMBIENT TEMPERATURE vs AMBIENT TEMPERATURE vs AMBIENT TEMPERATURE vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 24. Figure 25. Figure 26.
AMBIENT TEMPERATURE vsLOAD CURRENT
Figure 27.
(1) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.Please refer to the mechanical specification for more information.
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): PTD08A010W
–Vsens-rail3
10 kW
0.1 mF
FCX491A+3.3 V
UCD9240RGC
53
52
51
50
57
56
55
54
47
44745
3
59
60
61
62
63
1
2
EAp1
EAn2
EAp2
EAn1
EAn4
EAp4
EAn3
EAp3
AddrSens1
AddrSens0
CS-1A(COMP1)
CS-2A(COMP2)
CS-2B
CS-1B
CS-4A(COMP4)
CS-3A(COMP3)
+Vsens-rail1
–Vsens-rail2
+Vsens-rail2
–Vsens-rail1
–Vsens-rail4
+Vsens-rail4
+Vsens-rail3
CS-rail2B
CS-rail1A
CS-rail4A
CS-rail3A
CS-rail2A
CS-rail1B
6
5
4
Temp
Vtrack
Vin/Iin
16
15
PMBus-Data
PMBus-Clk
39
28
27
PowerGood (TMS)
PMBus-Ctrl
PMBus-Alert
+3.3 V
46
52
V33F
B
V33A
V33D
V33D
IO-1
V33D
IO-2
BP
Cap
4.7 mF
20
19
18
17
12
11
23
21
DPWM-1A
15 kW
0.1 mF
34
25
14
13
24
22
35
33
30
29
32
31
42
FAN-Tach36
41FAN-PWM
SyncOut37
38SyncIn
10
40
DPWM-2B
DPWM-2A
DPWM-1B
FAULT-1B
FAULT-1A
DPWM-4A
DPWM-3A
FAULT-2A
FAULT-4A
FAULT-3A
FAULT-2B
SRE-1B
SRE-1A
SRE-2B
SRE-2A
SRE-4A
SRE-3A
TMUX-1
TMUX-0
TMUX-2
FAN-TACH
FAN-PWM
SYNC-OUT
SYNC-IN
RCR
TRST9RESET
10 kW
10 kW
VIN
49
48
64 8 26
Dgnd-2
Dgnd-1
Agnd-3
Agnd-2
Agnd-1
43
Dgnd-3
10 kW
14
13
A1
A0
1
12
15
A4
A3
A2
4
2
A7
A6
A55
8
11
10
6
S2
Com
S0
S1
EN
3
Temp-rail1B
Temp-rail1A
Temp-rail2B
Temp-rail2A
Temp-rail4A
Temp-rail3A
CD74HC4051
+3.3 V
16
PTD08A010W
FAULT
PWM
SRE
INH IOUT
PTD08A010W
FAULT
PWM
SRE
INH IOUT
Commutation
UCD7230 Driver
Logic
FAULT
PWM
SRE
INH
IOUT
Temp Sensor
PTD08A020W
Temp-rail1A
INH
+3.3 V
VIN
VO
PTD08A020W
FAULT
PWM
SRE
INH IOUT
Temp-rail1B
CS-rail1A
+Vsens-rail1–Vsens-rail1
Temp-rail2A
Temp-rail2B
+Vsens-rail2–Vsens-rail2
CS-rail1B
CS-rail2A
CS-rail2B
PTD08A010W
FAULT
PWM
SRE
INH IOUT
PTD08A010W
FAULT
PWM
SRE
INH IOUT
Temp-rail3A
Temp-rail4A
+Vsens-rail4–Vsens-rail4
CS-rail3A
CS-rail4A
+Vsens-rail3–Vsens-rail3
82.5 kW
TEMP
VOUT
GND
VBIAS
TEMP
GND
TEMP
VOUT
GND
TEMP
VOUT
GND
TEMP
VOUT
GND
TEMP
VOUT
GND
VBIAS VIN
VIN
VBIAS VIN
VIN
VBIAS VIN
VIN
VBIAS VIN
VIN
VBIAS VIN
VIN
[A]
UDG-08035
PTD08A010W
SLTS285E –MAY 2007–REVISED FEBRUARY 2010 www.ti.com
APPLICATION INFORMATION
DIgital Power
Figure 28. Typical Application Schematic
B. This discrete bias power circuit may be substituted with a low dropout regulator (LDO). For example, TPS715A33 canprovide bias power to the UCD9240.
Figure 28 shows the UCD9240 power supply controller working in a system which requires the regulation of fourindependent power supplies. The loop for each power supply is created by the respective voltage outputs feedinginto the Error ADC differential inputs, and completed by DPWM outputs feeding into the UCD7230 drivers whichare shown on the PTD08A0x0W modules.
10 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
PTD08A010W
www.ti.com SLTS285E –MAY 2007–REVISED FEBRUARY 2010
UCD9240 Graphical User Interface (GUI)
When using the UCD9240 digital controller along with digital PowerTrain modules to design a digital powersystem, several internal parameters of the modules are required to run the Fusion Digital Power Designer GUI.See the plant parameters below for the PTD08A010W and PTD08A020W digital PowerTrain modules.
Table 1. PTD08A010W Plant Parameters
PTD08A010W Plant Parameters
L (µH) DCR (mΩ) Rds-on-hi (mΩ) Rds-on-lo (mΩ)
0.90 2.2 3.6 3.6
Table 2. PTD08A020W Plant Parameters
PTD08A020W Plant Parameters
L (µH) DCR (mΩ) Rds-on-hi (mΩ) Rds-on-lo (mΩ)
1.0 1.5 5.0 2.5
Internal output capacitance is present on the digital PowerTrain modules themselves. When using the GUIinterface this capacitance information must be included along with any additional external capacitance. See thecapacitor parameters below for the PTD08A010W and PTD08A020W digital PowerTrain modules.
Table 3. PTD08A010W Capacitor Parameters
PTD08A010W Capacitor Parameters
C (µF) ESR (mΩ) ESL (nH) Quantity
47 1.5 2.5 1
Table 4. PTD08A020W Capacitor Parameters
PTD08A020W Capacitor Parameters
C (µF) ESR (mΩ) ESL (nH) Quantity
47 1.5 2.5 2
Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): PTD08A010W
PTD08A010W
SLTS285E –MAY 2007–REVISED FEBRUARY 2010 www.ti.com
TRAY
12 Submit Documentation Feedback Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): PTD08A010W
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type PackageDrawing
Pins Package Qty Eco Plan (2) Lead/Ball Finish
MSL Peak Temp (3) Samples
(Requires Login)
PTD08A010WAD ACTIVE Through-Hole Module
EGS 12 36 Pb-Free (RoHS) SN Level-1-235C-UNLIM/Level-3-260C-168HRS
Request Free Samples
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DLP® Products www.dlp.com Communications and www.ti.com/communicationsTelecom
DSP dsp.ti.com Computers and www.ti.com/computersPeripherals
Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps
Interface interface.ti.com Energy www.ti.com/energy
Logic logic.ti.com Industrial www.ti.com/industrial
Power Mgmt power.ti.com Medical www.ti.com/medical
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defenseDefense
RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video
Wireless www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2010, Texas Instruments Incorporated