Journal of Material Cycles and Waste Management

Resource-availability scenario analysis for formal and informal recycling of end-of-life

electrical and electronic equipment in China

Habuer a, *, Jun Nakatani b, *, and Yuichi Moriguchi b

Address correspondence to the following:

a, * Department of Global Ecology, Graduate School of Global Environmental Studies, Kyoto University

C-1-3-462 Nishikyo-ku, Kyoto 615-8540, Japan

TEL: +81-75-383-3339 / FAX: +81-75-383-3338

E-mail: ha.buer.6w@kyoto-u.ac.jp

b,* Department of Urban Engineering, Graduate School of Engineering, The University of Tokyo

7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan

TEL: +81-3-5841-6255 / FAX: +81-3-5841-6255

E-mail: nakatani@env.t.u-tokyo.ac.jp

b Department of Urban Engineering, the University of Tokyo

Supporting Information

Fig. S1 Market-share ratio of desktop and laptop PCs a

a: obtained through fitting with historical data; the desktop PC market-share ratio is underestimated believing it may retain its 10% share over the entire PC market, at least until 2030

Fig. S2 Obsolete amount of CRT, LCD monitors, and main units of desktop PCs in China

Fig.S3 Annually generated common metal contents from EoL PCs

Fig.S4 Annually generated contents of less common metals from EoL PCs

Fig.S5 Inflow and outflow per unit weight of EoL CRT TV sets in option IWith environmental contaminants

Processmd

waste CRT TV (100)

Parts (9.4)

Cables(4.2)

metallic parts (14.4)

PCBoard (8.9)

CRT (42.5)

ProcessM_shr

residue(0.6)

Iron (12.4)

process M_ecs

plastic(2.5)

copper(1.8) Process

Rc & Ru

process M_es IC chips

and substrate(7.9)

Electronic component(1.0)

plastic (20.6)

Aluminum (0.2)

Copper (1.2)

ProcessM_gs

Size-reduced plastic (20.6)

ProcessM_c

General glass (27.6)

Leaded glass(14.8)

phosphor (0.02)

Process Lf

Land filled:(residue 4.9)

land space

land space

process B

Aluminum (0.5)copper(0.5)Ferrous (0.3)silver (0.001)gold(3.E-5)

residue (4.3)

platinum(2.E-4)

ProcessRc

Recycled or reused :(iron 12.7;Aluminum 0.6;Copper 3.5;Plastic 25.5;General glass 27.6;Leaded glass 14.8;;Electronic component 1.0;Silver 0.001;Gold 3E-5;Palladium 2.E-4)Parts 9.4

plastic (2.4)

Fig.S6 Inflow and outflow per unit weight of EoL CRT TV sets in option II-bWith electricity consumption

Fig.S7 Inflow and outflow per unit weight of EoL LCD TV sets in option I With environmental contaminants

Processmd

waste LCD TV (100)

LCD panel (10.2)

Cables(0.8)

metallic parts (49.6)

PCBoard (11.2)

CCFL(0.9)

ProcessM_shr

residue(0.2)

Iron (45.3)

process M_ecs

plastic(0.5)

copper(0.4)

ProcessRc & Ru

&Er

process M_es IC chips

and substrate(10.2)

Electronic component(0.9)

plastic (27.3)

Aluminum (4.0)

ProcessM_gs Size-reduced

plastic (27.3)

ProcessPyro

Organicgas(3.1)

Copper alloy (7.2)

process Lf

Land filled:(residue 5.7)

land space

land space

process Hydro

ProcessRc

Recycled or reused :(iron 45.8;Aluminum 4.6;Copper 0.5;Plastic 27.8;LCD panel 10.2;Electronic component 0.9;Organic gas 3.1;Silver 0.0003;Gold 0.001;Platinum 0.001;Tin 0.3;zinc 0.2; etc.

process M_mr

Plastic (0.01)Glass (0.9)Aluminum (0.01)Mercury (0.0003)residue (0.01)

Aluminum (0.6)copper(0.1)Ferrous (0.5)silver (0.003)gold(0.001)

residue (5.5)

palladium(0.001)Tin (0.3)Lead (0.01)Bismuth (0.001)Antimony (0.0001)zinc (0.2)

Nickel (0.001)

Fig.S8 Inflow and outflow per unit weight of EoL LCD TV sets in option II-aWith electricity consumption

Processmd

waste LCD TV (100)

LCD panel (10.2)

Cables(0.84)

metallic parts (49.6)

PCBoard (11.2)

ProcessM_shr

residue(0.2)

Iron (45.3)

process M_ecs

plastic(0.49)

copper(0.35) Process

Rc & Ru

process M_es IC chips and substrate

(10.2)

Electronic component(0.9)

plastic (27.3)

Aluminum (4.0)

ProcessM_gs Size-reduced

plastic (27.3)

process Lf

Land filled:(residue 6.2)

land space

land space

process B

Aluminum (0.6)copper(0.1)Ferrous (0.5)silver (0.0003)

gold(0.002)

residue (6.0)

platinum(0.001)

ProcessRc

Recycled or reused :(iron 45.8;Aluminum 4.6;Copper 0.5;Plastic 30.9;LCD panel 10.2;Electronic component 0.9;Silver 0.0003;Gold 0.002;Platinum 0.001)

plastic (3.1)

CCFL (0.9)

process M_mr

Glass (0.9)Aluminum (0.01)Mercury (0.0003)residue (0.01)

Plastic (0.01)

Fig.S9 Inflow and outflow per unit weight of EoL LCD TV sets in option II-b With electricity consumption

The abbreviations of processes are listed below:

md: Manual dismantling and separation

pM: Primitive (outdated) physical mechanical process

pM_hs: Hammer smashing

pM_hb: Heating board

M: Physical mechanical process (including shredding, packaging, axed cutting, eddy current separation, magnetic and

gravity separation)

M_shr: Shredding and packaging

M_gs: Shredding and gravity separation

M_es: Electronic component separation

M_c: Cutting and shredding

M_ecs: Shredding and eddy current separation

M_mr: Mechanical separation and mercury recovery

pC: Primitive chemical process

pPyro: Open burning

pHydro: Primitive hydrometallurgical process (such as acid leaching)

C: Chemical process

Pyro: Pyro metallurgical process

Hydro: Hydro metallurgical process

Od: Open dumping

Lf: Landfill disposal

Rd: Resale to downstream manufacture

Rc: Recycled

Ru: Reused

Er: Energy recovery

B: Physical process

Table.S1. Module composition and average PCs weight

Type of PCs e

Weight (%) of module b Total (%)

Weight (kg)

Metallic material (metallic housing

etc.)

Plastic material

Printed circuit board (PCB

oard)

CRT glass d LCD panel Drives (C

PU, FD

D,H

DD

)

Battery

Cold

Cathode Fluorescent Lam

ps (C

CFLs)

Copper cable (w

ire)

Electronic component c

Ferrous metal

Alum

inum m

etal

Copper m

etal

Other non-ferrous m

etal

Total

Panel glass

Funnel glass

Outer panel

Inner panel

Desktop

PC Main unit 63.0 _ 0.2 _ 　63.2 2.8 19.0 _ _ _ _ 13.7 _ _ 0.9 0.4 100 10.1

LCD monitor n.a n.a n.a n.a 　54.8 21.6 7.4 _ _ 16.1 n.a 0.0 _ 0.1 _ _ 100 14.0

CRT monitor 4.0 _ _ 0.0 　4.0 18.0 12.0 40.3 21.7 _ _ _ _ _ 4.0 _ 100 24.3

Laptop PC 16.0 2.4 _ _ 　18.4 27.7 14.7 _ _ 13.3 _ 10.0 13.9 0.05 1.0 0.9 100 2.9

b: The median values of collected data from published literature and technical reports [17, 19, 25–29]; c: capacitors, solder, resistance and diode etc. contained in PC Boards; d: by assuming the percentages of panel and funnel glass 65% and 35% respectively according to [17, 18]; e: The numbers of individual data sets collected are 1 for Main unit, 7 for LCD monitor, 10 for CRT monitor and 15 for Laptop PC. n.a: nonavailable; CRT: cathode ray tube, LCD: liquid crystal display.

Table S2. Substances’ contents in a desktop PC f

Substance concentration in a desktop PC

Major fraction

PC Board(mg/kg)

Drives(mg/kg)

Common metals Al: aluminum 18000 178342Cu: copper 200000 34630Fe: iron 13000 281492Sn: tin 23000 2344Zn: zinc 2600 20725Ni: nickel 2563 21396Pb: lead 19000 1561

Less common metals Ba: barium 1900 n.a

Bi: bismuth 50 n.aCo: cobalt 48 n.aSb: antinomy 15861 5Hg: mercury n.a n.aSr: strontium 380 n.a

Precious metals Ag: silver 570 134

Au: gold 220 18Pd: palladium 145 29

f:data from [17–19].　　n.a: nonavailable

Table S3. Substances’ contents in laptop PC g

Substance concentration in a laptop PC

Major modulesPC Board(mg/Kg)

LCD panel(mg/Kg)

Battery(mg/Kg)

CCFL(mg/Kg)

Common metal Al: aluminum 17700 n.a 53000 n.aCu: copper 50825 175 87500 n.aFe: iron 37000 n.a 207500 n.aSn: tin 16500 n.a n.a n.aZn: zinc 15500 3 n.a n.aNi: nickel 991 2 n.a n.aPb: lead 1848 13 n.a n.a

Less common metal

Ba: barium 773 60 n.a n.aBi: bismuth 115 n.a n.a n.aCo: cobalt 80 n.d 167000 n.aSb: antinomy 210 n.d n.a n.aHg: mercury n.a n.a 300Sr: strontium 380 n.a n.a n.a

Precious metal Ag: silver 99 12 n.a n.aAu: gold 625 n.a n.a n.aPd: palladium 204 n.a n.a n.a

g: data from [18, 25, 30–33] n.a: nonavailable, n.d: nondetected.

Table S4.Characteristics of each group by cumulative metal contents and damage factors

Group(G)

Cumulative metal content (C)

Damage factor(D)

Potential negative maximum impact (C×D)

1 large high high2 middle high Middle-high

large middle Middle-high

3small high middlelarge low middle

middle middle middle4 middle low middle-low

small middle middle-low5 small low low

Table S5. Summary of categorization of metals in EoL TV sets and PCs discarded in 2010-2030

Group Metals included in Description

G1

Co in EoL TV sets low positive incentive for resource availability (RA)- low positive incentive for resource recovery (MV)- high negative potential environmental impact (ED)Ba in EoL TV sets high negative potential environmental impact (HH)

G2

- middle-low positive incentive for resource availability (RA)Zn, Sb, Co in EoL TV sets; Zn, Sb in EoL PCs middle-low positive incentive for resource recovery (MV)Cu in EoL PCs middle- high negative potential environmental impact (ED)Sb, Pb in EoL TV sets; Ba, Sb, Pb in EoL PCs middle- high negative potential environmental impact (HH)

G3

Fe, Zn, Ni, Ag, Sn, Pd, Au in in EoL TV sets;Fe, Co, Zn, Ni, Ag, Sn in EoL PCs middle positive incentive for resource availability (RA)

Fe, Cu, Pb, Al, Sn, Ni, Ag, Bi, Pd, Au in EoL TV sets;Fe, Cu, Pb, Al, Sn, Co, Ni, Ag, Bi in EoL PCs middle positive incentive for resource recovery (MV)

Pb, Ba, Ni, Zn, Ag in EoL TV sets;Pb, Co, Ni, Zn, Ag in EoL PCs middle negative potential environmental impact (ED)

Cu, Ni, Zn, Hg in EoL TV sets;Cu, Ni, Zn, Ag, Co in EoL PCs middle negative potential environmental impact (HH)

G4

Pb, Cu in EoL TV sets; Pb, Cu, Pd, Au in EoL PCs middle-high positive incentive for resource availability (RA)Pd, Au in EoL PCs middle-high positive incentive for resource recovery (MV)Sn, Sb, Hg, Co in EoL TV sets; Ba, Sn, Sb in EoL PCs middle-low negative potential environmental impact (ED)Sn in EoL TV sets; Sn in EoL PCs middle-low negative potential environmental impact (HH)

G5

- high positive incentive for resource availability (RA)- high positive incentive for resource recovery (MV)- low negative potential environmental impacts (ED)Co in EoL TV sets low negative potential environmental impact (HH)