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TRANSCRIPT
• About Us
• Milestones
• Global Footprint
• Our Leading Customers
• Semiconductors
o Wire Bonders
o Consumables
• Customized Fine Machining
• Thin Film Coating
• Quality Assurance
• Why Choose MPP ?
• Young, dynamic company with YOY growth of 15 – 20%
• Formerly a division of K&S “Micro Swiss”
• The foundation of MPP is the know-how, technology and experienced engineering and
sales teams acquired from K&S “Micro Swiss”
• A leading provider of wire bonding machinery and consumable tools for the semiconductor
and microelectronic device assembly industry
• Providing uniquely designed and standard tools and parts for the Medical, Aerospace and
Military Industries
• Headquarters and manufacturing sites are located in northern Israel
• 120 employees
• Sales and distribution networks support more than 500 customers in over 20 countries
around the globe.
• Ongoing research and development in collaboration with leading establishments in Israel:
o The Israeli Chief Scientist
o The Israeli Investment Center
o Technion – The Israel Institute of Technology
2010 - MPP is founded. Multiple production lines were purchased from KNS
2013 - USP Patent filed
2014 - Acquisition of Thin Films
2015 - Cornerstone laid for MPP’s new facility is Israel
2016 - Acquisition of MWB
Experienced technical and sales teams support customers worldwide
NA Sales Office
Headquarters Yokneam, Israel
Application support China
Manual Wire Bonders
• Offering top-of-the-line bench top wire bonding systems
The advanced IBOND 5000 series includes four models:
• Ball
• Wedge
• Dual
• HWW
The 4500 Series includes two models:
• Ball
• Wedge
• High yield and excellent repeatability for a wide variety of
• Easy implementation and low operating costs
• Designed for a wide range of wire diameters
Heavy Wire Wedge
• Suitable for all wedge bonder models
• Innovative, customized and unique designs that optimize bonding performance
• Competitive pricing
• Flexible production and short lead time
• Wire diameters ranging from 75 um to 300 um
• Applications : power devices, automotive, solar, home appliances
Wedge Bonding Tools
• For standard and customized applications: fine pitch, deep access, COB, Ribbon
• For accurate and consistent bonding
• Suitable for all types of bonders
• For gold or aluminum wire applications
• Patented wedge bonding tool (UFP) for ultra fine pitch applications
Consumable Tooling for All Your Packaging and Wire Bonding
Requirements
Die Collets
• For high accuracy in die positioning
• Closed or open collet designs are available (4 or 2 side walls)
• Minimum contact with die surface
• Strong grip
Pick up Tools
• For use with all pick and place equipment
• Wide variety of materials are available (plastics, ceramics, carbides and metals)
as per customers’ requirements
• Can achieve accurate die positioning
• Designed for use in environments with a range of temperatures
• Suitable for variety of die attach processes
Push up needles
• For automatic die bonding machines
• Designed as per customer’s specifications
Die Bonding Tools for Die Attach and Flip Chip Processes
Four-Point Probe Heads
• For measuring resistivity during the wafer incoming procedure
• A wide range of needle tip radii, spacing and arrays are available
• Independently adjusted pressure of each needle eliminates tolerance variables
• High breakdown voltage with low leakage
SJB Tools
• Leading designer and manufacturer of dispensing tools for Solder Jet Bonding
• For use with highly accurate “capillary” manufactured from WC
• Minimum ID is 40µ
• Applications include HGA & HSA assembly in the HDD industry, Bumping
processes in Flip Chip applications
High Precision Solutions
• Cutting edge precision technologies provide customized, complex machined
components and tooling to aerospace, medical, automotive and military
industries.
• Skilled and creative engineering facilitates optimization of design and process
while meeting stringent tolerances and quality requirements
• Machine line-up includes 5 axis CNC, lathing and turning machines, EDM
• Variety of material options are available as per customers’ requirements
• From prototype volumes to serial production
• Short lead times
Unique Patented Process
• Thin protective glasslike coatings using HVCS technology (high voltage cold
sputtering)
• HVCS Technology operates at low temperatures of 30˚-150˚C and creates an
amorphous thin film
• Variety of ceramic and metal coatings available
• Successful application in microelectronics, optics, medical, aerospace, machining
tools and precision mechanics
Advantages
• Increases wear resistance and therefore prolongs life span of bonding tools,
cutting/machining tools, gears, bearings and plastic molds
• Increases resistivity to contamination on die handling tools, bonding tools and
vacuum tip tools
• Provides anti-corrosive coating and increases surface protection in aggressive
environmental conditions.
• Coating thickness ranges from 0.2 – 3 µ
• Operates as an optical reflector
Commitment to deliver best-in-class quality
Customized control features throughout the entire production process
State-of-the-art measuring equipment
Continuous improvements for environmental protection and minimization of waste.
International Standards:
Certified:
ISO 9001:2008
ISO 14001:2004
In process:
ISO 18001
AS9100
ISO 13485
RoHS Compliance
Outstanding Quality:
• High Quality products
• Consistent results
• Conformance with the highest international standards
Advanced Engineering:
• Experts in our field
• Continuous development of new products and processes
• State-of-the-art machinery
Service excellence:
• Competitive pricing
• Short lead times
• Localized sales and technical support
• Customized solutions