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Pr = 501.4 (b m) 19:45:38 Wed 13 Jan 1999he Y;1999/01/13 18:04:07,00;00:54 E35TI

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Panasonic I iUltrahigh Accurate 13-D Profilometer 98

Catalogue

Ultrahigh Accurate 3-D Profilometer

Nanometer PrecisionPanasonic’s thee-dimensional profilometev enables ultra high precision measurement

down to an accuracy of 10 nm.Easy Windows-based operation and rapid feedback to processing contnbutes to

your product’s improved quality.

Listening to You, Building Tomorrow

Aspherical lenses, semiconductor wafers, hard disks: all t3high precision measurements dun’ng their development anThe premiere ultra high-precision three-dimensional profirmicro-measurements for a wide range of applications.

I Non-destructive measurement with extremely high Measurement usinglevel of 0.01 pm accuracy accommodating up to 60”slope angle and 400 mm operating range. On-axis measurement

An atomic force probe scans and measures the curved surface withoutleaving any trace.

/ Scratch-free Measurement using Lasers &nd Atomic ForcesZ-axis measurement laser

r- I

Micro displacement detector/

Semiconductor laser for focus servo

Measurement Force: 50 mg

A Wide Variety of Measuring ObjectsAspherical Lens

n linear scanning measurement of onaspherical lens

1

I

Probe radius: 500 pmXY = 6 mm dia.. Pitch = X: 0.05 mm. Y. 0.08 mmDesign equabon type:[S] Rms: 0 0310 pm, P-V: 0.2899 pmAl!gnment values: X= t 3.774, Yz7.754. Z= -0.024 [pm]

a= -2.149. b= -1.252. c= 0.000 [mln ]

0 Built-in design equations :[S] Rotation-symmetry aspherical surface,[A] Cylindrical surface,[B] Donut-shaped surface,[C] Barrel-shaped surface,[D] X-axis aspherical, Y-axis circular arc,[P] Flat plane.0 Other types of shape can be handled by[U] user-defined equations (optional).

n Circular scanning measurement of onaspherical Lens

Probe radws 500 pmXY = 6 mm dia.. Pitch = A Fi: 0.5 mm, & L: 0 08 mmDesign equabon type:[S] Rms: 0 0386 pm. P-V 0 1983 pm

0 The newly-developed optional circularscanning measurement scans in concentriccircles. This type of measurement ensures0.1 pm accuracy up to a slope of 60’.0 The auto-centering feature automaticallyfinds the imaginary center of even acenterless condenser mirror formeasurements.l lock of planarity measurement of amagnetic disk or optical disk is alsopossible.

linear measurement

Circular measurement

n On-axis measurement of an aspherical lens

n Measurement of a fresnel lens by usinga diamond stylus (DVD dual focus lens)

e pvodugts, and mung others, could not exist withoutnanufactuve.tetev delivers superb performance using a variety of

Now available as a Windows-

Icompatible systemEasy operation - Rapidmeasurement

0 Our software corrects setup errors of themeasured object, eliminating the need for thespecial skills normally required for this operation.0 Ultra high-accuracy measurement can becompleted in an average of just 3 minutes.

H Alignment program

Surface to be

The opbmum alfgnment IS obtained by three-dfmenslonalrotation and shtftlng

W Setting menu for alignment moving axis- NC program automatic generation- Automatic elimination of dust dato

FllhXlS

P Automatic C Manual

WX r-urn I- a vmin

I7 Y (Out71 r b (Omin

rz r-urn F c 17min

Semiconductors Hard diskn Flatness measurement of asemiconductor wafer

w Measurement of a wafer pin-chuck byusing a flat probe

XY = 160 mm da& P-V = 6 0566 vrn

H Measurement of a polishing sheet farCMP of semiconductor wafer

- Extensive library of optional software

n Circular measurement of a hard disk

XY = 190 mm dla (8’ PI” chuck) P-V = 4.1236 pm XY = 90 mm dia. P-V = 3 1966 pm

n Measurement of CSS zone on a hard disk

Flat probe (optional)

Pin-chuck

XY = 5 mm square P-V = 176 6262 pm XY = 200 pm square P-V = 0.1038 pm

n Ui3P SpecificationsModel UABPA UA3P-5 UA3P-6

Part Number 1 PEP-16109304 1 PED-16109305 1 PED-16109306Measurement RangeIX. Y. Z-axis1

100x1 OOx35mm 20Ox200x45mm 40Ox400x90mm

ScaleProbe

Maxmwm Measurable Angle

He-Ne oscillation-frequency-stablllzed laserAtomic force probe

Ruby: Tip radius 0.5 mm, measunng force: 50 mg.Diamond: Tip radius 2 pm, measuring force: 50 mg.

60’

Probe MeasurementAccuracy

Ruby: Tilt angle of a measurement plane:30’ or smaller: 0.01 - 0.05 pm45’ or smaller: - 0.1 pm60’ or smaller: - 0.3 pm’

‘For circular scanning (optional):6O’or smaller: - 0.1 pmDiamond: Tilt angle of a measurement plane: 30~ or smaller: - 0.1 pm”

** Measured value (not a guaranteed value)Resolution of 2 axls : 3 nm.

Measurement errors 100 mm or smaller range: 0.05 pm or less (Repeatability 0.05 urn or less)by coordmate axis 200 mm or smaller range: 0.1 pm or less (Repeatability 0.05 pm or less)(within the range of X- and Y-ax@ 400 mm or smaller range: 0.2 pm or less (Repeatability 0.05 urn or less)Measunng speed

I0.01-10 mm/s Vanable m multiple steps 0.02-20 mm/s Vanable m

multiple steps

Software (Windows 95) NC program generation, Auto-alignment

(including probe radws correction), Data editing, Auto-centering, Auto-tiltcorrection, In-operation monitoring, 3-D color graphics

Computer Panacom V24 (IBM compatible)Printer Color inkJet pnnterMain frame external dtmenslons 1000x1100x1400 1200x1350x1550 1600x1600x1 650Mass (Weight) Main unit: 1200kg Mam unit: 1500kg Main unit: 4000kg

Other equipment: 250kg Other equipment: 250kg Other equipment: 250kgPower and pneumatic supply Two lines of 1OOV. 20A. Dry air 5kg/cmz or more, 150 Nllmin.Operating Temperature Constant temperature room 20-23 + 1 ~Cenwronment Humidity 20-60%

VibrationCleanliness

Recommended: 0.5 cm/s2 Allowable: 2.0 cm/s2 (=2.0 gal)Recommended: Class 15,000 or better

(15,000 pcs of dust larger than 0.5 pm per cubic foot)

W User-defined equations [U]Design equations other than the built-in standard equations can beused.Covers all ISO-defined shapes.n Circular scanning measurementScanning measurement along concentric circles. A center-free objectcan be measured and centered.W Roughness measurementRa, Ry and Rz (JIS specification) can be measured.W Base alignmentAlignment operation using the prewously computed alignment values.W 45” on-axis measurementExpands effective X-Y measurement range up to 1.4 times.W Measurement origin operationAllows measuring operations of multiple objects (up to 30) by storingand accessmg the measurement origin of each position.

W IS0 - UA3P Desion Eouations Comoarison

1

Aspherical lens, Toric lens, Polygon0 Aspherical lens and its mold(Optical disk, Camera, Glasses, Printer, Projector,Stepper)0 Semiconductor wafer0 Hard diskl Aspherical surface mirror for X-rays0 Other precision components and micro

components(Magnetic heads, video drums for digital VCRs, etc.)

Wlndows 95 IS a reglstered trademark of Mtcrosofl Corporation.

In no event shall MEI be bound by any terms and conditions that contravene any export laws, regulations or other restraints of any relevant countries including but not lImItedto Japan. All orders are subject to the obtatnlng of any reqwed licenses under the said relevant laws.

PanasonicSales & Service OfficeU.S.A. JapanPanasonic Factory Automation company Overseas FA SalesMain office Twin 21 National Tower 1-61 Shiromi 2 chome. Chuo-ku

9377 W. Grand Avenue, Franklin Park, IL 60131 Osaka 540-0001, Japan

Production Engineering LaboratoryCorporate Production Enginnering DivisionManufacturing Equipment Division

(647) 266-4400 Tel. +61-6949-6727 Matsushita Electric Industrial Co., Ltd.2-7 Matsuba-cho, Kadoma-shi, Osaka 571-6502, Japan

Tel. +61-6905-4611v 01

Speclfvzatvxs and descr$pl,ons I” ihls catalog are sub@ to change w,tho”t not,ce

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AMSYS 5.4DEC 8 199816:11:34NODAL SOLUTIONSTEP=1SUB =lTIME=1USUM ( AI/q :IRSYS=l]PowerGraphicsEFACET=lAVRES=MatDMS =. 438E-03SMX =,43:$E--03m -3423-05 : mlrr

. 75,&14

. 991E-04

. 123E-03

. 1473-03

. 171E-03

. 195E--0.3

. 219E--03243E-03:2673-03.291E-03" 314E-03'?38E-03. YL

.362E--03

.386;E--03

. 4 1 II E - 0 3

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1

ANSYS 5 . 4DEC 8 199818:23:04NODAL SOLUTIONSTEP=1SUB =ITIME=1USUM (AVG)RS'fS=[lPowerGraphicsEFACET=lAVRES=MatDMX =. 3533-03SMX =.353E-03 s@= mm

m .276E-05 -I.221E-04

.414E-04607E-04:800E-04.993E-04. 119E-03. 1383-03.157E-03. 177E-03.19GE-032153-032353-032543-03273E-032923-03312E--03

I .331E-173. 35 3E-03

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HOW TO MEASURE ACTUAL DIAMOND TOOL RADIUS

Method

R : design radiusRa : Actual radius6r = R-Ra , AB = 42 * 8rdG = 6r ( 2/2 - 1) = 0.424 8r at 45 degree

1. Fabrication of a hemisphere or more.2. Roundness measurement using a roundness tester.

Proberesolution 0.05 pm

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75 - Exilude

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