© 2014 ibm corporation high value x6 3850/3950 technical overview wayne wigley- advanced technical...
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Wayne Wigley- Advanced Technical Sales
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
X6: The sixth generation of EXA technology
Innovative eXFlash = 2X higher performance
12TB of memory, 15 CPU cores = leadership database performance
Seamless Scalability
Easy to configure and service
Support for multiple generations of technology
Enterprise class availability
CPU, Memory, I/O resilience
Hypervisor management Integration
Flex System X6Flex System X6 System x3850 X6System x3850 X6System x3950 X6System x3950 X6
FASTFAST AGILEAGILE RESILIENTRESILIENT
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview 4 Socket Comparison
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Traditional Rack Design
7 PCIe Slots
High AvailabilityPredictive Failure
40 Cores
2TB Standard Memory on x3850
1TB on HX5
8 x 2.5” Disk Drives on x3850
SSD only on HX5
+50%
+300%
+57%
10X More internal flash storage
Leadership Performance
Flexible Software-defined Modular Design
Flexible Software-defined Modular Design
11 PCIe SlotsI/O Choice HL or FL
8 Mezz adapters for Flex
11 PCIe SlotsI/O Choice HL or FL
8 Mezz adapters for Flex
Extreme AvailabilityFault Tolerance
Extreme AvailabilityFault Tolerance
60 Cores60 Cores
6TB Standard Memory6TB Standard Memory
30 TB of Flash StorageFlash Accelerator & Caching
30 TB of Flash StorageFlash Accelerator & Caching
Highest Storage Performance and Density
Ultra-Low Latency Performance
Highest Fault Tolerance & Fastest Serviceability
Maximum I/O Throughput
Application Optimized Fit-for-purpose
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing: Rack PortfolioTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
IBM System x3850 X6 Overview
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The x3850 X6 delivers the most performance and capacity in the x86 segment without compromising on reliability, availability, and serviceability. It’s also features IBM’s new modular rack design that can host multiple generations of technology in a single platform.
Intel® Xeon® based 4-socket 4U server that is scalable to 8-sockets 8U in the field Supports up to 6TB of memory and 60 cores of processing power Up to 12TB of IBM’s newest DIMM based flash technology for ultra-low latency applications Most flexibility by supporting a modular book design which allows clients to create “fit for
purpose” solutions and host multiple generations of technology in the same package In addition to Intel® RunSure® Technology, features X6 Advance RAS capabilities that
deliver mainframe class reliability
Key FeaturesKey Features
WorkloadsWorkloads ERP Analytics Database Virtualization
Announce: 2/18, GA: 3/5
AGILEAGILE
FASTFAST
RESILIENTRESILIENT
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
IBM System x3950 X6 Overview
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The x3950 X6 delivers the most performance and capacity in the x86 segment without compromising on reliability, availability, and serviceability. This 8-way server is designed with seamless management and scalable performance for the largest, business critical workloads.
Intel® Xeon® based 8-socket 8U server with seamless management Supports up to 12TB of memory and 120 cores of processing power Single point of control and single serial asset tracking for ease of management Up to 12TB of IBM’s newest DIMM based flash technology for ultra-low latency applications Most flexibility by supporting a modular book design which allows clients to create “fit for
purpose” solutions and host multiple generations of technology in the same package In addition to Intel® RunSure® Technology, features X6 Advance RAS capabilities that
deliver mainframe class reliability
Key FeaturesKey Features
WorkloadsWorkloads ERP Analytics Database and OLTP Virtualization
Announce: 2/18, GA: 6/5
AGILEAGILE
FASTFAST
RESILIENTRESILIENT
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing: InnovationsTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Modular Book Design
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Storage Book 4 Compute Books
Each compute book includes 1 processor and 24 DIMMs
Deliver up to 6TB of memory or 12.8TB of eXFlash memory – channel storage
Each x3850 X6 contains 4 Compute books
Ability to swap out Compute books as memory or processor generations change
The Storage book delivers up to 6.4TB of eXFlash 1.8” SSD or 12.8TB of SAS 2.5”
Ability to host 2 storage controllers for maximum bandwidth
AGILEAGILE
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Modular Book Design
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Create the fit-for-purpose solution, whether clients need to support typical HBAs or specialty GPGPU cards
Primary I/O Book
Up to 2 types of IO Books, Half-Length and Full-Length
Each IO Book delivers an additional 3 PCIe slots
Mezz-LOM solution gives clients the ability to select the networking technology that fits their requirements
Hosts the IMM, PCIe slots, and the dedicated Mezz-LOM solution
AGILEAGILE
• Up to 4 Power Supplies
• 900W, 1400W AC or 750W DC
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
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19nm MLC 10 Drive Writes Per Day 5 Year Warranty
Patented GuardianTM Technology Patented GuardianTM Technology
<5µs Write Latency >120K Read IOPS >35K Write IOPS
Ultra Low Latency, High PerformanceUltra Low Latency, High Performance
Back Up Power Circuitry End-To-End Data Protection 2M hours MTBF
Enterprise Class ReliabilityEnterprise Class Reliability
DDR3 protocol Configurable As Block Device Configurable As Memory Extension
Memory Channel InterfaceMemory Channel Interface
200, 400 GB Capacities Scalable Architecture 19nm MLC NAND
Scalable, Cost Effective MediaScalable, Cost Effective Media
S.M.A.R.T. Monitoring Supports TRIM Maintenance Tools
Additional FeaturesAdditional Features
eXFlash Memory Channel Storage
IBM eXFlash Memory Channel Storage
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing:Processor E7v2Trusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
IntelIntel®® Xeon Xeon®® Processor E3 Family Processor E3 Family
Highest density, lowest costHighest density, lowest cost
IntelIntel®® Xeon Xeon®® Processor E5 Family Processor E5 Family
Most flexible & efficientMost flexible & efficient
IntelIntel®® Xeon Xeon®® Processor E7 Family Processor E7 Family
Highest reliability & scalabilityHighest reliability & scalability
Intel® Xeon® Processor Families Positioning
E5-4600 v2E5-4600 v2
E7-8800/4800/2800 v2E7-8800/4800/2800 v2
E5-2400 v2E5-2400 v2
E3-1200 v3E3-1200 v3
8-Socket+/4-Socket/2-Socket8-Socket+/4-Socket/2-SocketTop of the Line Performance Top of the Line Performance
Entry Entry 2-Socket2-Socket
Dense Dense 4-Socket4-Socket
Dependable & Economical 1-SocketDependable & Economical 1-Socket
E5-2600 v2E5-2600 v2MainstreamMainstreamLeadershipLeadership
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Intel® Xeon® Processor E7-8800/4800/2800 v2 Overview
Integrated PCI Express* 3.0Up to 32 lanes per socket
Up to 3 DIMMs per channel (up to 24 DDR3 1600Mhz DIMMs per socket)
Up to 37.5MB Shared CacheUp to 37.5MB Shared Cache
Intel® Xeon® ProcessorE7-4800 v2
Product Family
Intel® Xeon® ProcessorE7-4800 v2
Product Family
Up to 4 Intel ® C102/C104Scalable Memory Buffersper socket
13All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.
• 64-bit Intel Xeon Multi-core Enterprise Processor
• Up to 15 cores and 30 threads (with Hyper-Threading) per socket
• Up to 37.5 MB of shared last-level cache (LLC)
• QuickPath Interconnect (QPI) 1.1 with speeds up to 8.0 GT/s
• Integrated I/O (IIO) 32 lanes of PCI Express 3.0. 4 lanes of PCI Express 2.0 (or DMI)
• 2 Internal Memory Controllers
4 Intel SMI2 channels
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Memory Architecture Overview
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Up to 24 DIMMs per socket
Up to 4 Intel ® C102/C104Scalable Memory Buffersper socket
Up to 37.5MB Shared CacheUp to 37.5MB Shared Cache
Intel® Xeon® ProcessorE7-4800 v2
Product Family
Intel® Xeon® ProcessorE7-4800 v2
Product Family
Up to 8 DDR3 Channels
1 to 6 DIMMs per Buffer
• 8 DDR3 channels per socket• Up to 24 DDR3 DIMMs per socket• Supports up to 64GB DDR3 LR-DIMM• Up to 6TB in a 4S platform, 12TB in a 8S platform1
Large Memory Capacity
• Up to 1600MHz DDR3 speeds• Intel® SMI Gen 2: Up to 2.66 GT/s• Memory Controller can support 2 modes
• Performance Mode (higher I/O, B/W)• Lockstep Mode (highest DDR3 speeds)
POR Speeds, Memory Controller Modes
• Active (Rack): Up to 9W @2.66 GT/s• Idle: Up to 2.5W
Power (Target)
1 Memory capacity possible by populating all (96 for 4S; 192 for 8S) DIMMs with 64GB DDR3 LR-DIMMs
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview Intel® E7-8800/4800/2800 v2 product
Basic
12-15 CoresQPI: 8.0 GT/sUp to 37.5M cacheIntel® HT TechnologyIntel® Turbo Boost TechnologySMI Gen2: Up to 2666 MT/s2:1 DDR3:1333 MHz (max)1:1 DDR3:1600 MHz (max)
8-12 CoresQPI: 7.2 GT/sUp to 24M cacheIntel® HT TechnologyIntel® Turbo Boost TechnologySMI Gen2: Up to 2132 MT/s2:1 DDR3: 1066 MHz (max)1:1 DDR3: 1333 MHz (max)
8S/Scalable* 4S/Scalable* 2S/Scalable*
Frequency Optimized : HPC
Stan
dard
Adva
nced
*Scaling capability refers to maximum supported number of CPUs in a “glueless” platform (e.g.8S means that this SKU can be used to populate up to 8 sockets in a single system).. Above skus may be used in even larger than 8S systems through the use of 3RD party node -controllers (not available from Intel).++ Please refer to the memory population matrix table for detailed information on POR Slots-per-Channel (SPC) & DIMMS-per-Channel (DPC) combinations
Frequency Optimized : Enterprise
6 CoresQPI: Up to 6.4 GT/sUp to 12M cacheIntel® HT TechnologySMI Gen2: Up to 2132 MT/s2:1 DDR3: 1066 MHz (max)1:1 DDR3: 1066 MHz (max)
8S/Scalable*QPI: 8.0 GT/sUp to 30M cacheIntel Turbo BoostSMI Gen2: Up to 2666 MT/s2:1 DDR3: 1333 MHz (max)1:1 DDR3:1600 MHz (max)
Segment Optimized
8S/Scalable*QPI: 8.0 GT/sUp to 37.5M cacheIntel HT TechnologyIntel Turbo BoostSMI Gen2: Up to 2666 MT/s2:1 DDR3: 1333 MHz (max)1:1 DDR3:1600 MHz (max)
15C 130W2.5GHz 37.5M
15C 130W2.5 GHz 37.5M
15C 130W2.5GHz 37.5M
12C 105W2.3GHz 24M
12C 105W2.3GHz 24M
12C 105W2.3GHz 24M
15C 130W2.3GHz 30M
15C 130W2.3 GHz 30M
15C 130W2.3GHz 30M
10C 105W2.2GHz 20M
15C 155W2.8GHz 37.5M
15C 155W2.8 GHz 37.5M
15C 155W2.8 GHz 37.5M
12C 130W2.6 GHz 30M
8C 105W2.0GHz 16M
6C 105W1.9GHz 12M
E7-4890 v2
E7-4870 v2
E7-4880 v2
E7-4860 v2
E7-4850 v2
E7-4830 v2
E7-4820 v2
E7-4809 v2
E7-8890 v2
E7-8870 v2
E7-8880 v2
E7-8850 v2
E7-2890 v2
E7-2870 v2
E7-2880 v2
E7-2850 v2
10C 155W3.2GHz 37.5M
6C 155W3.4GHz 37.5M
E7-8891 v2
E7-8893 v2
15C 105W105W2.2 GHz 37.5M
High Performance,Low Power
E7-8880 L v2
12C 130W130W3.0GHz 30M
E7-8857 v2
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing:Compute BookTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Memory Buffers
CPU12 DIMMs
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Compute Book
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Fans
Cover with Window
12 DIMMs
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Compute Book
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High Value x6 3850/3950 Technical Overview
Smarter Computing:MemoryTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Memory Subsystem Block Diagram
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Memory Modes
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Memory Operation Modes Supported
•Independent Mode - Performance mode. Each DDR3 channel is addressed individually via burst lengths of 8 bytes. The Intel SMI2 channel will operate at twice the DDR3 data rates.•Lockstep Mode - The high RAS mode supporting DDDC with x4 DRAMs. The memory controller handles all cache lines across two DDR3 channels behind one JC. The Intel SMI2 channel operates at the DDR3 transfer rate.•Mirrored Mode - The memory contents of the system are mirrored between CPU sockets. Because of mirroring of the memory, the total memory available to the system is half of the memory that is physically installed.•Rank Sparing Mode - One memory DIMM rank is a spare of the other ranks on the same channel. The spare rank is held in reserve and is not utilized by the system as part of its system memory.
Two modes of operation: 2:1 Independent Channel Mode
SMI2 Max Freq. – 1.33 GHz (2 transfers per clock = 2667 MHz) SMI2 Transfer Rate – 2.67 GT/s SMI2 Channel Bandwidth – 21.3 GB/s
1:1 Sub-Channel Lockstep Mode SMI2 Max Freq. – 0.93 GHz (2 transfers per clock = 1600 MHz) SMI2 Transfer Rate – 1.6 GT/s SMI2 Channel Bandwidth – 12.8 GB/s
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
X6 platforms deliver the best memory scalability in the industry
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Standard x86 servers will see memory speed lower as more DIMMs are populated
Each processor has 8 channels
Each channel supports up to 3 DIMMs
Results in 24 DIMMs per processor
As you add more DIMMs to each channel, the Intel® architecture will lower the memory bus speed from 1333Mhz to 1066Mhz (20% reduction) for workloads over 1TB (assuming 16GB DIMMs)
CPU1333 Mhz
Memory
Memory
Memory
MemoryCPU
1066 Mhz
Memory
Memory !
x3850 X6 and x3950 X6 are designed to maintain memory performance for larger workloads
For memory workloads from 500GB and above, the X6 platforms will be able to maintain the 1333 Mhz memory bus speed
Delivering higher performance for larger workloads with scalable memory performance
FASTFAST
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing:eXFlash MCSTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
IBM eXFlash Memory Channel Storage Benefits Fastest flash response time in the market
– Significantly lower write latency than any other Flash offering; as low as 3.3 microseconds
• Up to 83% lower latency than PCIe** and 95% lower latency than SSD***• Fastest response time available for analytics, critical VMs and high frequency
trading Consistent performance under mixed workloads
– more than 125K IOPS per eXFlash DIMM†, scaling linearly without negatively impacting latency
– On memory bus – avoids potential I/O contention• Databases from 200GB to 12.8TB have deterministic response times and consistent
performance Scalable form factor/performance/capacity
– Leverages ubiquitous DIMM slots - ideal for all server types including Flex System– Interoperable with standard DDR3 RDIMMs– Supports anywhere from 200GB to 12.8TB of flash
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
IBM eXFlash MCS Configuration Rules
Maximum of one eXFlash DIMM per DDR3 memory channel is supported At least one RDIMM must be installed in the same memory channel as eXFlash DIMM eXFlash DIMMs only support RDIMMs; other memory types not supported eXFlash DIMMs with different capacities (i.e. 200 GB and 400 GB) can not be intermixed in
the same server eXFlash DIMMs are supported only in memory performance mode; other memory modes of
operations (such as lockstep, memory mirroring, and memory sparing) not supported. Maximum capacity is 32 x 400GB = 12.8TB IBM will add enhanced market offering features over time
See Session xSM04e for additional information. Tuesday and Thursday
IBM eXFlash MCS
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing:StorageTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
8 HDD or 16
eXFlash SSD
LCD Display
1 USB 2.02 USB 3.0
Front VideoPower Button
Storage I/O Card
Raid Adapter 2 Slots
Storage I/O Book Overview
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Gen 3 Drive Enclosures
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Gen 3 HDD or SSD
Backplane
Storage I/O Book Overview
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
RAID Adapters
ServeRAID M5210 Internal RAID Adapter– May only plug into “Storage Adapter Slots. – PCI Low Profile, MD2 Length Card outline– PCIe Gen 3 x8 lanes– RAID 0/1/10 support – no Cache on base card
– LSI SAS3108 ServeRAID M5120 – 6 Gb SAS RAID Adapter (External)
– PCI Low Profile, Half-length - MD2 form factor – Eight external 6 Gbps SAS/SATA ports – Two external Mini-SAS connectors (SFF-8088) – 6 Gbps throughput per port – LSI SAS2208
IBM N2215 High Performance HBA Non-RAID– May only plug into “Storage Adapter Slots” – PCI Low Profile, MD2 Length Card outline– 8-port Controller (SAS 12G / SATA 6G) – PCIe Gen 3 x8 lanes– Non-RAID HBA, SSD/JBOD focused
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing:I/OTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
I/O and PCIe changes on E7v2
PCIe controller has moved from IOH onto CPU PCIe Gen 3 is passed through both the mid-planes from the compute books to the I/O books 8 lanes of PCIe Gen 3 from both CPU 0 and CPU 1 are routed to the storage book to
provide connectivity for up to two storage adapters. DMI from CPU 0 and CPU 1 are routed to the base I/O book for high availability legacy
connectivity to the Patsburg PCH DMI from CPU 2 and 3 are repurposed for PCIe Gen 2 and provide additional lanes for PCIe
slots on full length full height I/O books when installed
• PCIe Gen3 doubles PCIe bandwidth to 8.0GT/s (1024MB/s / lane / direction)• X4 Gen3 slot ~= 4GBps uni- 8GBps bi-directional bandwidth• X8 Gen3 slot ~= 8GBps uni- 16GBps bi-directional bandwidth• X16 Gen 3 slot ~= 16GBps uni – 32GBps bi-directional bandwidth
• PCIe Gen3 allows for more power per slot, within system operational constraints
• Slots now have NUMA considerations with IO adapter placement
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Base I/O Book Details
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IMM v2
Patsburg Platform Controller Hub (PCH)
MLOM Slot Gen3 x8 (Dual 10Gb, Quad 1Gb)
Three PCIe Gen 3 slots2-x16 and 1-x8
Four USB 2.0 IMM 1GbE BaseT Port
• The Primary IO Book contains the minimum set of I/O components to form a complete server. High level breakdown of these components:
Note: CPU2 and CPU3 correspond to 3rd and 4th CPUs (CPU0 is the 1st CPU)
1 USB 2.0 Internal for Hypervisor
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
MLOM Adapters
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Emulex VF A5 ML2 Dual Port 10GbE SFP+ Adapter
Intel X540 ML2 Dual Port10 Gb-T Adapter
Intel I350-T4 ML4 Quad Port GbE Adapter
Broadcom NetXtreme II ML2 Dual Port 10GbE SFP+ Adapter
Broadcom NetXtreme II ML2 Dual Port 10Gb-T Adapter
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Half-Length I/O Book Details
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One x16 Slot
Two x8 Slots
• x3850 X6 modular I/O book design allows clients to select the type of I/O infrastructure within the server
• The Half-Length I/O Book provides up to 3 PCIe slots each
• Up to 2 of these Books can be added to the 4-Socket configuration for a total of 6 additional slots to the 3 standard on the Primary I/O book
• Each Half-Length I/O Book is Hot-Swappable
Note: CPU2 and CPU3 correspond to 3rd and 4th CPUs (CPU0 is the 1st CPU)
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Full-Length I/O Book Details
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Two x16 Slot
One x4 Slots
•The Full-Length I/O Book provides up to 3 PCIe slots each
•Up to 2 of these Books can be added to the 4-Socket configuration for a total of 6 additional slots to the 3 standard on the Primary I/O book
•The Full-Length I/O Book supports one high power PCIe card (GPU/Accelerators) with a max power of 300W
•Two AUX power connectors provided to support 225W and 300W support: one 2x4 for 150W, one 2x3 support up to 75W
AUX power to support 300W cards
Support for Double-Wide cards
Note: CPU2 and CPU3 correspond to 3rd and 4th CPUs (CPU0 is the 1st CPU)
Air Baffle
I/O Book Guide
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Full Length PCIe Expansion Card
Two auxiliary power connectors are provided on Pavo in order to support 225W and 300W high power adapters
One 2x4 power connector . This power connector can support up to 150W of power. 2x3 cables may also be plugged into this connector.
One 2x3 power connector. This power connector can support up to 75W of power
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2x4 Auxiliary Connector
2x3 Auxiliary Connector
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High Value x6 3850/3950 Technical Overview
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Compute
Book
Base I/O
Book
Storage
Book
Backplane H/L-F/H I/O
Book
F/L-F/H I/O
Book
Not Shown
System Bus Diagram
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing:8 Socket UpgradeTrusted Innovation for Business Advantage
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Expansion to 8 socket
8u, 8 CPU, 192 DIMM, 22 PCIe, 16 HDD
FlexNode physical partition to two 4S
Front/rear service only, similar to 4u
Unique Parts:– 8U Chassis
– 8 socket Midplane/Shuttle
Common:– Processor/Memory Book
– I/O Books
– Power Supplies
– Storage Book
– HDD backplanes
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview 4S to 8S Upgrade
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Parts Re-used
4S Unique Parts Removed
8S Upgrade Kit
HDD/Storage Module
Fan, Processor &Memory Module
4S Chassis
4S I/O Shuttle
4S MidplaneI/O Modules
8S Midplane
8S I/O Shuttle
8S Chassis
Primary I/O Module
Storage Module
4S Configuration
8S Configuration
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
FlexNode Partitioning
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Leadership Performance with IBM System x3850 X6
SPECVirtSPECVirt
TPC-ETPC-E
SAP SD two-tier(4-socket)
SAP SD two-tier(4-socket)
#1
#1
#1
THREE #1 RECORD PERFORMANCE BENCHMARKS
ACHIEVED AT PRODUCT ANNOUNCEMENT1
(1/16/2014)
THREE #1 RECORD PERFORMANCE BENCHMARKS
ACHIEVED AT PRODUCT ANNOUNCEMENT1
(1/16/2014)
ACTION: Drive High End Solutions Focus: We have leadership across multiple workloads client deploy.ACTION: Drive High End Solutions Focus: We have leadership across multiple workloads client deploy.
7X OLTP Performance
Improvement on Microsoft SQL Server 2014Enterprise
Edition
7X OLTP Performance
Improvement on Microsoft SQL Server 2014Enterprise
Edition
TPC-HTPC-H
Paper:“OLTP Performance Unleashed…”
Paper:“OLTP Performance Unleashed…”
#1
MORE #1PERFORMANCEBENCHMARKS
ACHIEVED SINCE LAUNCH
Microsoft SQL Server 2014Enterprise Edition
MORE #1PERFORMANCEBENCHMARKS
ACHIEVED SINCE LAUNCH
Microsoft SQL Server 2014Enterprise Edition
1Click links for exact data about benchmarks. 1Click links for exact data about benchmarks.
4/16/144/16/14
© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Reference
3850x6 Landing Page– http://www-03.ibm.com/systems/x/hardware/enterprise/x3850x6/index.html
3950x6 Landing Page– http://www-03.ibm.com/systems/x/hardware/enterprise/x3950x6/index.html
Solutions and Reference Architectures– http://www-03.ibm.com/systems/x/solutions/index.html
3850/3950 Configuration and Options Guide– http://www-03.ibm.com/systems/xbc/cog/x3850x6_3837/x3850x6_3837aag.html
IBM Server Proven– http://www-03.ibm.com/systems/info/x86servers/serverproven/compat/us/indexsp.html
IBM x86 Solutions for VMware– http://www-03.ibm.com/systems/x/os/vmware/
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© 2014 IBM Corporation
High Value x6 3850/3950 Technical Overview
Smarter Computing:Thank You !Trusted Innovation for Business Advantage
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