XIS Meeting 2004Mar16XIS Meeting 2004Mar16FMS0 Door Open FailureFMS0 Door Open Failure

& AE/TCE0 TCE Card Problem& AE/TCE0 TCE Card Problem

K. Hayashida, Osaka UniversityK. Hayashida, Osaka University

FMS0 Door Open Failure on Feb27FMS0 Door Open Failure on Feb27

Nominal Door Open SequenceNominal Door Open Sequence Actuator current Actuator current StartStart

Current =0.35-0.37A/+29VCurrent =0.35-0.37A/+29V Door openDoor open M-SW Off / Current stop / M-SW Off / Current stop / LED onLED on Actuator shrinkActuator shrink M-SW on / LED offM-SW on / LED off

2004/2/27 FMS0 2004/2/27 FMS0 Installed in Vacuum Chamber / LN2 Cooling started Installed in Vacuum Chamber / LN2 Cooling started

Accutuator 18degC / BNT Pressure Sensor 0degCAccutuator 18degC / BNT Pressure Sensor 0degC 175sec after the Actuator current start, LED on for 2-3sec175sec after the Actuator current start, LED on for 2-3sec At the time of LED on, the chamber pressure increased by one At the time of LED on, the chamber pressure increased by one

order of magnitude, indicating the Door at least partly opened. order of magnitude, indicating the Door at least partly opened. No X-rays detected even when CCD= -60degC !No X-rays detected even when CCD= -60degC ! Warm up/Leak … Door was closed !! Warm up/Leak … Door was closed !!

Door Open Time2min-3min at RT4min at -20degC6min at -40degC9min at -70degC

FMS0 Installed in the chamberFMS0 Installed in the chamber

FMS0 Door Closed!FMS0 Door Closed! Upward

XIS-BNT GSEXIS-BNT GSE

FMS0 Door Opened FMS0 Door Opened

Door Open MechanismDoor Open Mechanism

Door CompletelyClose (O-ring compressed)

Door Half Close (O-ring not compressed)

Door Open !

M-SW off /current off/LED on

LatchActuator Lod

M-SW

Ball-baring on the Door

Side View (View from the inside BNT) Top View

Post Failure TestPost Failure Test De-installed from the Chamber De-installed from the Chamber Manually move the latch to open the Door Manually move the latch to open the Door Door Open test in the Air at RT using GSE + actuator; no Door Open test in the Air at RT using GSE + actuator; no

problem Door Open Time 165sec problem Door Open Time 165sec Various Inspections and Measurements Various Inspections and Measurements

Scratch on the Latch surface to which M-SW contactsScratch on the Latch surface to which M-SW contacts Stroke between the Door Open Position to M-SW off position ~0.Stroke between the Door Open Position to M-SW off position ~0.

58mm58mm Margin of the Latch part to the Bonnet Housing; That should not Margin of the Latch part to the Bonnet Housing; That should not

make inversion of Door Open and M-SW offmake inversion of Door Open and M-SW off M-SW strokeM-SW stroke

Free(off) position to On position :0.32mmFree(off) position to On position :0.32mm On position to the most compressed position: 0.06mm On position to the most compressed position: 0.06mm On position to off position: 0.14mmOn position to off position: 0.14mm By touching the M-SW lever, the M-SW was easily on/off. By touching the M-SW lever, the M-SW was easily on/off.

NOT YET RESOLVED

FMS0 Door OpenedFMS0 Door Opened

Scratch on FMS0 LatchScratch on FMS0 Latch

M-SW (FMS1)M-SW (FMS1)

Scratch on FMS1 LatchScratch on FMS1 Latch

PossibilitiesPossibilities Actuator and/or GSE problemActuator and/or GSE problem Actuator worked properly but door did not open (O-ring sActuator worked properly but door did not open (O-ring s

tick to the body; The springs are too weak etc)tick to the body; The springs are too weak etc) Latch part problemLatch part problem

Various margins of the Latch/Door are short to reproduce the invVarious margins of the Latch/Door are short to reproduce the inversion Door Open and M-SW off timing. ersion Door Open and M-SW off timing.

M-SW problemM-SW problem Strokes of M-SW of FMS0 BNT is systematically different from otStrokes of M-SW of FMS0 BNT is systematically different from ot

her BNTs. her BNTs. *) FMS0 failure occurred at cooling down phase BNT te*) FMS0 failure occurred at cooling down phase BNT te

mperature of 0degC 19degC. Test at such low temperatumperature of 0degC 19degC. Test at such low temperature has not yet been done. re has not yet been done.

ScheduleSchedule

FMS0 bonnet was disconnected from the FMS0 bonnet was disconnected from the FMS0 base on Mar1. FMspare Bonnet wa FMS0 base on Mar1. FMspare Bonnet wa s connected to FMS0 base on Mar6.s connected to FMS0 base on Mar6.

FMS0 bonnet is now inspected in detail at FMS0 bonnet is now inspected in detail at NTS.NTS.

Other bonnets in Osaka/Kyoto were inspeOther bonnets in Osaka/Kyoto were inspected by NTS people (Mar12-13).cted by NTS people (Mar12-13).

Re-adujstement and/or replacement of M-Re-adujstement and/or replacement of M-SW is considered. SW is considered.

AE/TCE0 TCE Card TroubleAE/TCE0 TCE Card Trouble 　　 (Mar10) (Mar10)

FMS0 Test with AE/TCE0FMS0 Test with AE/TCE0 EGSE-software on Sun-WS and QL started 11:57EGSE-software on Sun-WS and QL started 11:57 PSU-on 12:11 PSU-on 12:11 PSU voltage/currents were nominalPSU voltage/currents were nominal AE/TCE Reset (pulse) 12:18AE/TCE Reset (pulse) 12:18 Hk_all 12:18Hk_all 12:18 Hk_routine 12:19Hk_routine 12:19

Strange HK from TCE card / Timeout for CR read to TCE cardStrange HK from TCE card / Timeout for CR read to TCE card. . CR / HK values from other cards were nominal.CR / HK values from other cards were nominal.

Temp Set=30.76degC/SCL=0.0% … Temp Set=30.76degC/SCL=0.0% … could not set into TCE CRcould not set into TCE CR AE/TCE Reset (pulse) 12:21 AE/TCE Reset (pulse) 12:21

The situation did not changeThe situation did not change.. AE/TCE Reset (pulse) 12:34AE/TCE Reset (pulse) 12:34 PSU-off 12:36PSU-off 12:36 *)No problems in Mar9 experiment with the same configuration. No *)No problems in Mar9 experiment with the same configuration. No

problems in Mar11 test of AE/TCE0 with dummy CCD and dummy Tproblems in Mar11 test of AE/TCE0 with dummy CCD and dummy TEC EC

Strange HK / Timeout CRStrange HK / Timeout CRin capture login capture log

The strange HK values of the TCE card is likeThe strange HK values of the TCE card is like T_READ_HK T_HK_CHAN0 (0x310000) => 0xc8fc (SC Bus Voltage=56.056 Volts)T_READ_HK T_HK_CHAN0 (0x310000) => 0xc8fc (SC Bus Voltage=56.056 Volts) T_READ_HK T_HK_CHAN1 (0x310100) => 0xcd4f (SC GND=9.900 Volts) T_READ_HK T_HK_CHAN1 (0x310100) => 0xcd4f (SC GND=9.900 Volts) T_READ_HK T_HK_CHAN2 (0x310200) => 0xd182 (TCE +12 Volts=31.301 Volts) T_READ_HK T_HK_CHAN2 (0x310200) => 0xd182 (TCE +12 Volts=31.301 Volts) T_READ_HK T_HK_CHAN3 (0x310300) => 0xd590 (TCE +5 Volts=10.956 Volts) T_READ_HK T_HK_CHAN3 (0x310300) => 0xd590 (TCE +5 Volts=10.956 Volts) T_READ_HK T_HK_CHAN4 (0x310400) => 0xd98b (TCE TEC Voltage=11.466 Volts)T_READ_HK T_HK_CHAN4 (0x310400) => 0xd98b (TCE TEC Voltage=11.466 Volts) T_READ_HK T_HK_CHAN5 (0x310500) => 0xdd5e (TCE +24 Volts=35.855 Volts) T_READ_HK T_HK_CHAN5 (0x310500) => 0xdd5e (TCE +24 Volts=35.855 Volts) T_READ_HK T_HK_CHAN6 (0x310600) => 0xe11a (TCE GND=12.433 Volts) T_READ_HK T_HK_CHAN6 (0x310600) => 0xe11a (TCE GND=12.433 Volts) T_READ_HK T_HK_CHAN7 (0x310700) => 0xe4b8 (TCE Temp=6173.000 Deg(C))T_READ_HK T_HK_CHAN7 (0x310700) => 0xe4b8 (TCE Temp=6173.000 Deg(C))

The timeout of the CR values of TCE card is as followsThe timeout of the CR values of TCE card is as follows T_READ_CR T_CR_CHAN0 (0x210000) => 0x0000 (Operating Mode=0) (READ GENERATET_READ_CR T_CR_CHAN0 (0x210000) => 0x0000 (Operating Mode=0) (READ GENERATE

D NO RESPONSE) D NO RESPONSE) T_READ_CR T_CR_CHAN1 (0x210100) => 0x0000 (CCD Temp=-257.790 deg(C)) (READ GET_READ_CR T_CR_CHAN1 (0x210100) => 0x0000 (CCD Temp=-257.790 deg(C)) (READ GE

NERATED NO RESPONSE) NERATED NO RESPONSE) T_READ_CR T_CR_CHAN2 (0x210200) => 0x0000 (HeatSink Temp=-255.770 deg(C)) (READ T_READ_CR T_CR_CHAN2 (0x210200) => 0x0000 (HeatSink Temp=-255.770 deg(C)) (READ

GENERATED NO RESPONSE)GENERATED NO RESPONSE) T_READ_CR T_CR_CHAN4 (0x210400) => 0x0000 (CCD Temp Set Point 1.714T + 177.26 T_READ_CR T_CR_CHAN4 (0x210400) => 0x0000 (CCD Temp Set Point 1.714T + 177.26

(T is desired setpoint in degrees C)=0) (READ GENERATED NO RESPONSE)(T is desired setpoint in degrees C)=0) (READ GENERATED NO RESPONSE) T_READ_CR T_CR_CHAN5 (0x210500) => 0x0000 (Current Soft Limit 1.27P (P is desired peT_READ_CR T_CR_CHAN5 (0x210500) => 0x0000 (Current Soft Limit 1.27P (P is desired pe

rcentage of max current=0)(READ GENERATED NO RESPONSE)rcentage of max current=0)(READ GENERATED NO RESPONSE)

Points to be consideredPoints to be considered What is the cause of this “rare” failure ? PSU-on proceduWhat is the cause of this “rare” failure ? PSU-on procedu

re problem? TCE card trouble ? Command decoder troure problem? TCE card trouble ? Command decoder trouble in Control Card ? ble in Control Card ?

Shouldn’t “AE/TCE reset” initialize the AE/TCE status to iShouldn’t “AE/TCE reset” initialize the AE/TCE status to its “reset” state? There might be two or more states for tts “reset” state? There might be two or more states for the reset ? he reset ? 　　 Cf. High/Low states in +5V current reporteCf. High/Low states in +5V current reported by Tsuru-san. d by Tsuru-san.

In the SC operationIn the SC operation The XIS PSU is almost always on. We have to turn off all the XIS The XIS PSU is almost always on. We have to turn off all the XIS

system, if this event occur ?system, if this event occur ? *) The DE forces the AE/TCE reset line assert when the *) The DE forces the AE/TCE reset line assert when the

DE is off or in initializing state. We can assert the reset liDE is off or in initializing state. We can assert the reset line when we turn on the PSU in the ground operation.ne when we turn on the PSU in the ground operation.

TCE Card Replacement ScheduleTCE Card Replacement Schedule

Mar 20 Current (Old) TCE Card testMar 20 Current (Old) TCE Card test AE/TCE01 with dummy CCD + dummy TEC test (1.5hr / one AE/AE/TCE01 with dummy CCD + dummy TEC test (1.5hr / one AE/

TCE ? ) @OsakaTCE ? ) @Osaka AE/TCE23 (+BNT GSE?) Kyoto-> Osaka, the same test for AE/TAE/TCE23 (+BNT GSE?) Kyoto-> Osaka, the same test for AE/T

CE23CE23 Mar21 AE/TCE01 Card replacement and Test ?Mar21 AE/TCE01 Card replacement and Test ? Mar22 AE/TCE23 Card replacement and Test ?Mar22 AE/TCE23 Card replacement and Test ? Mar23 Sumo; Setup XIS-EU sensor to the chamberMar23 Sumo; Setup XIS-EU sensor to the chamber Mar24 XIS-EU cooling down/TEC performance Test/55FMar24 XIS-EU cooling down/TEC performance Test/55F

e Data at -90degC e Data at -90degC Heatsink Temp <-45degCHeatsink Temp <-45degC Mar25 Spare Mar25 Spare Mar26 MIT members leave JapanMar26 MIT members leave Japan Mar29 – FM-Sensors cooling test @Osaka/Kyoto Mar29 – FM-Sensors cooling test @Osaka/Kyoto