wafer foundry offerings for smart mobility solutions · 2018-11-16 · automotive quality system -...
TRANSCRIPT
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Wafer Foundry Offerings for Smart Mobility Solutions
Alexander Muffler
Field Application Engineering Manager EMEA
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Outline
• Introduction
• Holistic Wafer Foundry Approach Semiconductor process
Design support
Wafer fab / operations
Quality systems
• Summary
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What Is Smart Mobility?
• Smart mobility is a new and revolutionary way of transportation Cleaner
Safer
More efficient.
• Implication to semiconductors Increased focus on safety, robustness and reliability
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Introduction
Overview of typical Semiconductor applications in modern cars, especially in high-temperature environments
High temperature spots in different zones of a car
(source: www.eetimes.com)
Hall sensor Pressure sensor Inertial/gyro sensor Temperature sensor Optical sensor Touch panel sensor
Battery Fuel Gauges Battery Monitors Battery Protectors
LIN & CAN bus transceiver
Voltage regulator IC BLDC motor controller Full Bridge MOSFET Pre-Driver Mid.-Power 3 Phase BLDC Pre-Driver
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X-FAB Semiconductor Foundries – Who We Are
• The More than Moore Foundry.
• 25 years proven track record of
experience in pure-play foundry
services for analog/mixed-signal
semiconductor applications
• Specialty foundry with a
comprehensive set of robust
technologies serving automotive
needs such as high temperature,
high voltage and non volatile
memories
• Manufacturing excellence
• 6 wafer fab facilities in Germany,
France, Malaysia and US
• Capacity: 98,000 wafer starts per
month (200mm equiv.)
• IATF 16949 certification for all sites
• Audited and approved by major
OEMs
• More than 4,000 employees
worldwide
• Technologies interfacing the real world
• Expertise in analog/mixed-signal IC
production, MEMS and SiC with a focus
on high-growth automotive, medical and
industrial end markets with long
lifecycles
• Strong design support to drive customer
engagement over the long-term with
successful technology leaders
• Technologies qualified according to
AEC-Q100
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Automotive Semiconductor Requirements
Function - Technologies interfacing the real world
Robustness - Temperature, vibration, humidity, acceleration
Reliability - Zero ppm
Cost - Best cost per function, best die cost
Quality Systems - ISO TS / IATF 16949 certification
Automotive Quality: Degree to which the primary characteristics like function, robustness, reliability and cost are fulfilling the customer requirements Robustness
Cost
Reliability
Function
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Function – Automotive SOC
• Increases complexity – more digital content • Wide range of sensing capabilities
Pressure, Temperature, Inertial, Light, Magnetic Field, …
• High voltage and power handling capabilities • Intelligence
Signal conditioning ADC / DAC conversion Configuration according to environmental
conditions Short loop control function
• Networking capabilities Wire line, RF or optical connectivity
Automotive SOC require monolithic integration of digital, analog,
high voltage and NVM (non volatile memory) options
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How X-FAB Supports Customers to Achieve “0 ppm“ Automotive Requirements
To fulfill your need to do Design for Reliability X-FAB is providing (selection):
• Spice models with 6-sigma limits
• Reliability specifications
• Monte-Carlo models
• Safe operating area check (SOAC)
• Design for test to achieve high test coverage Particular applicable for the provided IP & NVM blocks
Customer contribution requires:
Post wafer processing tasks to achieve 0-ppm goal:
• High test coverage
• Test at high or low temperature
• Provide test results to X-FAB
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Automotive Quality Approach
• Infrastructure is in place at X-FAB to be part of the supply chain in order to support Automotive requirements
Wafer manufacturing
Raw material
Component manufacturing
Module manufacturing
OEM / Car manufacturing
End Customer Field
Yield Quality
Yield Quality
Yield, RMA Quality
Lifetime / RMA Yield, RMA Quality
Yield Quality
S u p p l y C h a i n
X-FAB Customer Supplier
Yield EOL 0miles Field Return
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Qualification Methods
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AEC-Q100, Rev. H
Level 2a
Level 1
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Level 1 reliability assessment Focus on intrinsic failure mechanisms (e.g. JESD122, internal
knowledge)
Wear out tests
Test methods following JEP001A standard or internal procedure
Level 2a reliability assessment Focus on intrinsic failure mechanisms (e.g. JESD122, internal
knowledge)
Stress tests
Test methods following AEC-Q100-005 and JESD47 standards
NVM qualification methodology
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AEC-Q100, Rev. H
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Holistic Automotive Foundry Approach
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Fab / Operations Process /
Technology
Design
Quality
X-FAB
Implication of Automotive Requirements
Design for test Design for manufacturing
Design for reliability
Characterization Safe operating area 6-Sigma modeling
Advanced manufacturing, inline inspection
and PCM test
Zero defect mindset Safe launch
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Design Support
• 3- to 6-Sigma models
• Ready for high temperature design (Tj = 175°C)
• Operating condition check (extended simulation models)
• DFM: a built-in feature to the digital libraries
Increased dimensions where applicable, design tools to enable multiple via placement
• NVM IP blocks
Qualified for high temperature (+175°C) usage
Failure redundant solutions available – e.g. NVM ECC, Internal IP ownership
Embedded test features including wafer level test capability
• ESD
Extended ESD support with HV IO library building blocks proven in silicon
TLP measurements for ESD structures supporting I/O development for >8kV
Strong engineering support for custom I/O development
• EMC robust design environments
• ESD Checker tool
ECC = Error Correction and Detection Single bit error correction and dual bit error detection
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ESD solutions and ESD support
ESD Webinars
ASIC Design
ESD Design Checker (XESDC)
Special ESD Protection
Structures
Consultations and ESD Design
Reviews Circuit Under Pad
IO / HV library documentation
HBM (CDM) ESD Test Reports of ESD
Test Vehicles
TLP I-V Characteristics of Primitive Devices and
ESD Protection Structures
ESD Design Guidelines
Standard Digital I/O Libraries
Special I/O Libraries
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Fab / Operations
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Extensive (cpk monitored) inline parameter control
Advanced inline SPC use of extended WECO rules
Use of customer yield information / ppm data, needed to trigger closed loop continuous improvement activities
Limited agreed rework
Automotive Processing Capabilities
ADVANCED PROCESSING
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Automotive Processing Capabilities
ADVANCED INLINE SCREENEING
Cpk monitored parameter testing (Cpk ≥ 1.67)
Additional inline inspections:
- Enhanced event control
- Yield-matched, tightened reject criteria
- Higher sensitivity levels at inspections
Advanced outgoing product inspection
- 100% automated visual inspection (AVI) with electronic wafer maps
- Outlier screening
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Quality Systems
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Quality Methods
Test data feedback (PCM and
customers)
Inspection concept
Wafer level reliability
Safe launch Fast and secure
ramp up
Problem solving
competence 8d & 5why
6 S Program
Automotive Quality System - Zero Defect Mindset
6 SIGMA approach for measurement, analysis,
improvement and control
Zero defect mindset requires close alignment between Manufacturing, Design Support, Process Technology and Quality Systems This is ensured by strictly following and applying the implemented quality methods:
Design
Quality
Fab
Process / Technology
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Summary
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Quality Assurance Methods @ X-FAB
Area Method X-FAB’s contributions to support the method
Design Design for Robustness Six-Sigma Process Spec, Monte-Carlo Simulation, Lot-Specific SPICE Models, Corner Models; Process Reliability Spec, SOA Check, DRC, Reliability Design Rules, Reliability Calculator
Design for Test BIST for IP blocks, NVM IP Test Spec
FMEA/FMEDA Design FMEA, Process Reliability Spec, FIT Data
Qualification Robustness Validation AEC-Q100/JEDEC Process Qual., Reliability Models, Reliability Margin Analysis, Reliability Monitoring
KB Qualification Level 1 Reliability Tests, Reliability Failure Matrix
Manufacturability Study Statistical Process Qualification Methods, Cp/Cpk Study, Process Boundary Study, Corner Lot Evaluation
Manufacturing Process Control Inline Control, PCM Test, AVI, WLR/fWLR, SPC
Screening NVM IP Test Spec, Screening Guidelines
Failure Analysis Construction Analysis, Failure Case Studies; 8D Procedure, FA Support, IP Design for Analysis
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Thank You! Alexander Muffler Field Application Engineering Manager EMEA E-Mail: alexander.muffler[at]xfab.com
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Abbreviations
Foundry Solutions for Autonomous Driving 28
ADAS … Advanced driver assistance systems
APQP … Advanced product quality planning
AVI … Automated visual inspection
ASIL … Automotive Safety Integrity Level
BLDC … Brushless DC electric motor,
BIST … Built-In Self-Test
CAN … Controller area network
DFM … Design for manufacturability
DRC … Design rule check
EEPROM … Electrically Erasable Programmable Read-Only Memory
EMC … Electromagnetic compatibility
ESD … Electrostatic discharge
ECC … Error correcting code
FIT … Failure in time
FMEDA … Failure Modes, Effects and Diagnostics Analysis
HV … High Voltage
IP … Intellectual Property
IP … Intellectual property
IATF … International Automotive Task Force
ISO TS … International Organization for Standardization Technical Sspecification
Tj … junction temperature
LIDAR … Light detection and ranging
LED … Light-emitting diode
LIN … Local Interconnect Network
MOS … Metal Oxide Semiconductor
MEMS … Micromechanical sensor
NVM … Non Volatile Memory
OTP … One Time Programmable (Memory)
OCAP … Out of control action plan
Cpk … Process capability index
PCM … Process control monitor
PPAP … Production Part Approval Process
RGB … red green blue
SiC … Silicon Carbide
SONOS … Silicon Oxide Nitride Oxide Silicon
SPC … Statistical process control
SILC … Stress Induced Leakage Current
TLP … Transmission-line pulse
WLR … Wafer level reliability