vertical dip pretreatment and electrodeposition system
TRANSCRIPT
VERTICAL DIP PRETREATMENT ANDELECTRODEPOSITION SYSTEMU.S. Patent 5,989,401. Nov. 23, 1999T.R. Breneiser et ai., assignors toChrysler Corp., Auburn Hills, Mich.
In a vertical dip pretreatment andelectrodeposition system having aplurality of spray stations and aplurality of dip stations a methodof expanding the system to increase the volume throughput.
SELECTIVE nCHING OFNICKEL-IRON ALLOWSU.S. Patent 5,989,443. Nov. 23, 1999K.L. Covert et al., assignors toInternational Business MachinesCorp., Armonk, N. Y.
A method for producing a coppernickel-iron alloy printed circuitboard structure comprising providing a printed circuit boardstructure having a copper layer
and a nickel-iron alloy layer disposed on the copper layer; selectively etching the nickel-iron alloyby contacting with an aqueousetchant comprising an effectiveamount of etch nickel-iron alloybut not copper, of ferric ammonium sulfate; and 0.1 to 10 molarsulfuric acid or phosphoric acid.
STRIPPING TIN AND TIN-LEADFROM COPPERU.S. Patent 5,989,449. Nov. 23, 1999S. Campbell, assignor to MortonInternational Inc., Chicago
A composition for stripping tin ortin-lead alloys and any underlying copper-tin intermetallic froma copper surface, the compositioncomprising an aqueous solution ofnitric acid in a range of 5 to 60%by weight; ferric nitrate in a
range of 0.5 to 30%; and a nitricacid stabilizer.
APPARATUS FOR REDUCING AIRENTRAPMENT IN SPRAYAPPLICATIONU.S. Patent 5,989,638. Nov. 23, 1999K.A. Nielsen et al., assignor to UnionCarbide Chemicals & PlasticsTechnology Corp., Danbury, Conn.
A method for liquid spray application of coatings onto a substrate,which minimizes entrapped nonsoluble gaseous bubbles, comprising spraying without a viscosity-reducing diluent undersuper-critical conditions into anenvironment of non-soluble gasor gases.
COLOR-CLEAR COMPOSITECOATINGU.S. Patent 5,989,642. Nov. 23, 1999
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