Universal Semiconductor Technology

WWW.SEMI-UST.COMServices provide by UST CO.,LTD

UST Co.,Ltd will put customer' need before us andpromise that all UST staffs will do their best for maximization of satisfaction

Head Office and R&D CenterTechno Park D-908, Yatap-Dong 151,Bundang-Gu, Seongnam-City,Gyeonggi-Do, KOREA (463760)

TEL : +82-31-604-1004FAX : +82-31-711-6344E-mail : admin@semi-ust.com

Clean Room & Facility150-1, Seongju-ri, Wongog-myeon,Anseong,Gyeonggi-do, KOREA (456-812)

E-mail : sales@semi-ust.com

Yatap Subway Station

Head Office and R&D CenterTechno Park D-908, Yatap-Dong 151, Bundang-Gu, Seongnam-City, Gyeonggi-Do, KOREA (463760)

Clean Room & Facility150-1, Seongju-ri, Wongog-myeon, Anseong,Gyeonggi-do, KOREA (456-812)

CEOCEO

AccountingTeam

Sales TeamSales Team

R&D Dept.R&D Dept.

TRACK Dept.TRACK Dept.

CMP Dept.CMP Dept.

Engineering Team

Engineering Team

EquipmentTool Dept.EquipmentTool Dept.

We’ve got your solution Semiconductor Equipment toolUST supplies FAB, SUB/FAB of semiconductor equipment and specialize refurbishment.

TEL MARK-7,8 and ACT-8,12 Modification, Up-grade and Overhaul System Configuration Free change, Modification and up-grade.Open Cassette Type to SMIF Type modification and Size conversion

6inch and 8inch Multi FlowCassette Unit and Robot modificationMapping Sensor Block modificationMain Robot Arm modificationCOAT Unit and Cup modificationDEV Unit and Cup modificationWDS/Plate modification

TEL MARK-II,V,VZ,7,8 & ACT-8,12 inch Conversion (2,4,5,6,8 inch)

TEL MARK-II,V,VZ,7,8 and ACT-8,12 의 2nd Source Parts and Unit Fast delivery and low-cost and same condition with OEM partsCassette stage assembly manufactureC/S Arm, Main Arm (Ceramic, Vacuum Arm, Aluminum and Anodizing Type) manufacturePlate (LHP, HHP, CPL, HCP, ADH, HEL and CP Power Supply) manufactureFan Filter Unit A,B Type (Include HEPA Filter)Oven Central Stack manufacture of TEL ACT 8,12

L/E Tank (45cc, 100cc, 150cc, 200cc, etc) manufactureTEL MARK and ACT SMIF Type Unit manufacture of same condition with OEMCOAT Nozzle Assembly (EBR, Back Side Rinse and Photo Resist Nozzle Tip) manufactureDEV Nozzle Assembly (H, SH, Spray and Stream type) manufacturePlasma to TFT LCD modification and upgrade for TEL Mark on Low Cost

2nd Source parts Unit of TEL Mark-II, V, Vz, 7,8 and ACT-8,12

Chemical Cabinet / Auto Chemical Supply System Overhaul and upgrade

CSS or Manual Supply or Both supply modificationBuffer Tank Auto Exchange Type System modificationSolvent/Develop/HMDS Chemical Supply System modification and productionResist Cabinet Photo Resist Auto-Exchange modification and productionAuto Drain Controller and Tray modification and production

TEL Clean Track Mark and ACT-8,12 Hot and Cooling Plate

Hot / Cooling Plate ProductionCPL, HCP, ADH, LHP, HHP Assembly ProductionHot Plate Modification (LHP ⇔ HHP, CPL ⇔ HCP)Thermo Controller ProductionSame condition with OEMThermo Controller and SMC 200mm / 300mm ‘s Circulator Repair

TEL/DNS/SEMES Spin Scrubber Refurbishment and Overhaul

6inch and 8inch Multi flowCassette Unit and Robot modificationMapping Sensor Block modificationConsumable Parts Support2nd Source Parts SupportController up-grad and changeLabor and Service Support

Stepper HP Laser 5711X Series Repair

MODEL MACHINEG Line I Line

5517A NSR-G6 , G7 , G8 NSR-I6 , I7 , I8 5517B NSR-I9 , I10 , I11 5517C NSR-I12, NSR-I14

REFERENCEFREQUENCY BEAM DIAMETER POLARIZATION INDICATORS SHUTTER

5517A 1.5 MHz to 2.0 MHz 6mm f1 Horiz f2 Vert LASER ON READY

Open,Reduced, Closed

5517B 1.9 MHz to 2.4 MHz 6mm f1 Horiz f2 Vert

+15V POWER ON -15VPOWER ON LASER ON READ

Y

Open, Reduced,

Closed

5517C 2.4 MHz to 3.0 MHz

6mm(std) 3mm(5517C-003) 9mm(5517C-009)

f1 Horiz f2 Vert+15V POWER ON -15V

POWER ON LASER ON READY

Open, Reduced,

Closed

5517D 3.4 MHz to 4.0 MHz 6mm f1 Horiz f2 Vert

+15V POWER ON -15V POWER ON LASER ON READ

Y

Open, Reduced,

Closed f1 is the lower frequency, and f2 is the higher frequency. The Agilent 5517A is the basic head.

The HP Laser’s Model with Machine

The HP Laser 5517x Specification

Stepper LSA (Laser Step Alignment) / LIA Repair

LSA(LIA) Model Out Put Polarization Mode Wavelength

LSA(5mW) ≥ 5mW 500:01:00 TEM00 632.8nm

LIA(10mW) (Option) ≥ 10mW 500:01:00 TEM00 632.8nm

LAS (5mW)

LIA (10mW)Repair

LSA and LIA Specification

EPO2226/EPO2228Trouble Shooting and Labor serviceFree conversion between 6inch and 8inchI-Head repair and change2nd Source Parts support-Rotary Joint production and modification-I-Head production and modification-Consumable Parts support

EBARA EPO2226,2228 modification, up-grade and Overhaul

Single/Double-Layer PCBMulti-Layer PCB (4Layer ~ 26Layer)P.C.B Art WorkMetal / Flexible PCBMicom Firmware DevelopWire DesignBuild up etc.

P.C.B (Printed Circuit Board) Art-work and Assembly Support

OEM / ODM R&D Service

We are provide the special and improved semiconductor machine which has applied creative controller and developed by ourselves

Development process chartDevelopment Planning and Review - Item Concept arrangement - technology deployment for Item and Review - Making a Development PlanProduct Design - Product Features- 3D Rendering or Make a Design Mock-up and AssemblyThe design and mold development- Product Features- Make a each Standard Plane for Mechanism,

Electronic and Circuit- 3D modeling design and 2D drawing - Mold supplier selection and order - Parts assembly, test and review- Written specifications of Product and Parts

Product Design and Development Support

OEM / ODM R&D Service

Wafer Pre-Aligner- Wafer Size (2inch ~ 18inch)- Notch, Flat Wafer, Ring Type, Thin Wafer (50um)- Si, Glass, Film, Sapphire - Compact Size- Fast Alignment (< 3.5sec)- High Performance Accuracy and Repeatability- Easy to use and Install- Ethernet , RS-232 Communication- Auto Detect function of Notch and Flat Type - Si, Glass, Sapphire Type Simultaneous use - Wafer Edge Crack and Broken Detect - 2inch ~ 12inch Simultaneous use (CCD Stage Moving Type)- Poor Coating and Cracked wafer support alignment - Crack Point's degree and quantity information output function (max. 500ea)- Covered Tape at Notch point by Laminator support alignment - Wafer Serial Number Reading, Detect by OCR and output information

Wafer Pre-AlignerNormal Type Wafer Pre Aligner Feature

Edge Crack Detect

Compact Embedded System

Wafer Vision Function by CCD- Compact Embedded System (Window XP OS)

Auto Track Spinner System2~4inch, 6~8inch, 12inchInch Multi Flow ProcessCompact and Small Size Sapphire, Glass, SiPSS, MEMS, Bumping processProgrammable EBR, Back Rinse Bar Code System (Optional) and USB connection

Auto Track Spinner SystemGeneral Specification 1) Main frame with system controllera) System Controller

- User Friendly Software Based on PC Windows XP- User Interface : 15” LCD Touch Screen

b) Program Recipes- Recipe Editing / Storage: Process, Flow, Dummy Dispense and Recipe can be made and modified by Operation Panel

- Flow Recipe: Almost Operation of Machine can done by Recipe on Touch Panel

- Recipe Capacity: Unit Recipe : 50 sets each of 20 step

c) Throughput: > 60 wafers, depend upon process2) System lay-outa) 2~4inch Main Body Size : 1,700(W) X 1,400(D) X 1,600(H)b) 12inch Main Body Size : 2,100(W) X 2,000(D) X 2,100(H)

NEW Miracle 4-Spin Auto Track Spinner SystemGeneral Specification 1) 2COAT 2DEV SYSTEM2) High Throughput3) More Compact Size 4) 2~4inch Main Body Size :1370 x 1340 x 1580

NEW Miracle 4-Spin Auto Track Spinner System

BLDC (BRUSHLESS DC) MOTOR FAN FILTER UNIT

BLDC MOTOR1.Excellent Speed, Toque and Safety2. Compact and High Powerful Speed3. energy-saving4. High Strength and Long life Gear Head5. Low noise6. High Effectiveness7. Strong against Particle induction by FAN

Analog Control AC MOTOR FAN FILTER UNIT

New Digital Type BLDC FFU

- Support Chemical Filter- Installed ULPA Filter- Various Size and Option- Provide the Aging Test Data- Quickly Response- Remove the Particle induction by BL Motor

Application Machine- Track System. Etcher, Spotter, EEPM, Etc

Test Room for FFU (Fan Filter Unit)

DIGITAL CONTROLLER1.RS- 485 Communication2. Remote Controller3. Wide and Fan Speed Range (0~100 Step)4. Monitoring Lamp

Manual Spinner Coater / Develop / StripperThe machine has designed and manufactured a compact and easy-to –use spin coater.The process recipe can saved 20ea and provide the simple GUI

Application- University, R&D center and etc. Chip processing, PR Coating / Developing / StrippingWafer- FPD / GaAs / GaNi / OLEDSpecification- Substrate Manual Loading, up to 12inch- Operation : Manual operation switch (Tachometer, Timer), Micom or PLC