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Using the UCC21520EVM-286, UCC20520EVM-286 and UCC21521CEVM-286

User's Guide

Literature Number: SLUUBG8AJune 2016–Revised November 2016

2 SLUUBG8A–June 2016–Revised November 2016Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated


User's GuideSLUUBG8A–June 2016–Revised November 2016

Using the UCC21520EVM-286, UCC20520EVM-286 andUCC21521CEVM-286

1 IntroductionUCC2x52xEVM-286 evaluation modules are designed for evaluation of TI's 5.7-kVRMS isolated dual-channel gate driver family with 4-A source and 6-A sink peak current for driving Si MOSFETs, IGBTs andWBG devices, i.e. SiC and GaN transistors. And this user guide covers UCC21520EVM-286,UCC20520EVM-286 and UCC21521CEVM-286, which are used for evaluation of UCC21520DW,UCC20520DW and UCC21521CDW respectively. To evaluate other Iso-Drivers in the UCC2x52x family, itis recommended to read the datasheet thoroughly before switching the part in the EVMs covered by thisuser guide. In this user guide, UCC21520EVM-286 evaluation module is used primarily for illustration, andkey differences will be highlighted for UCC20520EVM-286 and UCC21521CEVM-286.

Developed for high voltage applications where isolation and reliability is required, the UCC2x52x deliversreinforced isolation of 5.7 kVRMS and a surge immunity tested up to 12.8 kV along with a common modetransient immunity (CMTI) greater than 100 V/ns. It has the industry’s fastest propagation delay of 19 nsand the tightest channel-to-channel delay matching of less than 5 ns which enables high-switchingfrequency, high-power density and efficiency.

The flexible, universal capability of the UCC2x52x with up to 18-V VCCI and 25-V VDDA/VDDB allows thedevice to be used as a low-side, high-side, high-side/low-side or half-bridge driver with dual PWM input orsingle PWM input. With its integrated components, advanced protection features (UVLO, deadtime andenable/disable) and optimized switching performances, the UCC2x52x enables designers to build smaller,more robust designs for enterprise, telecom, automotive and industrial applications allowing for faster timeto market.

2 DescriptionThe UCC2x52x evaluation board has three independent screw terminal blocks for VCCI, VDDA andVDDB. 3-position headers with jumpers for all the key input signals, such as PWM INPUTs (INA, INB orPWM), deadtime (DT) programming and enable/disable function (EN/DIS), allow designers to easilyevaluate different protection function. And a variety of testing points support most of the key featureprobing of the UCC2x52x. Moreover, the PCB layout is not only optimized with minimized loop area ineach gate driver loop and power supply loop with bypassing capacitors, but also support high voltage testbetween primary side and secondary side with 120-mil PCB board cutout. Importantly, the creepagedistance between two output channels are maximized with bootstrap diode in footprint of TO252-2(DPAK),which facilitates high-voltage, half-bridge testing for a wide variety of power converter topologies. Fordetail device information, please refer to UCC21520DW, UCC20520DW and UCC21521CDW datasheetand TI's Isolated gate driver solutions.

2.1 Features• Evaluation module for UCC21520DW, UCC20520DW and UCC21521CDW in wide body SOIC-16

(DW) package• 3-V to 18-V VCCI power supply range, and up to 25-V VDDA/VDDB power supply range• 4-A and 6-A source/sink current capability• 5.7-kVRMS Isolation for 1 minute per UL 1577• TTL/CMOS compatible inputs• On-board trimmer potentiometer for dead-time programming• 3-position header with for INA, INB, DT and enable/disable

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLUUBG8A

http://www.ti.com/lit/pdf/SLUSCJ9

http://www.ti.com/lit/pdf/SLUSCN0

http://www.ti.com/lit/pdf/SLUSCO3

http://www.ti.com/lsds/ti/isolation/isolated-gate-driver-overview.page

www.ti.com Description

3SLUUBG8A–June 2016–Revised November 2016Submit Documentation Feedback



• PCB layout optimized for power supply bypassing cap, gate driver loop• PCB board cutout facilitates high voltage isolation test between primary side and secondary side• Maximized creepage distance between two output channels• Support half-bridge test with MOSFETs, IGBTs and SiC MOSFETs with connection to external power

stage• Testing points allows probing all the key pins of the UCC21520DW, UCC20520DW, UCC21521CDW

and other wide-board ISO driver family parts.

2.2 I/O Description

Table 1. Jumpers Setting

PINS DESCRIPTIONJ1–1 VCCI positive inputJ1–2 VCCI negative inputJ2–1 VDDA negative inputJ2–2 Driver A outputJ2–3 VDDA positive inputJ3–1 VDDB negative inputJ3–2 Driver B outputJ3–3 VDDB positive input

J-INA-1 Primary groundJ-INA-2 INA/PWM signal inputJ-INA-3 Primary VCCJ-INB-1 Primary groundJ-INB-2 INB signal inputJ-INB-3 Primary VCC

J-DIS-1 or J-DIS/EN-1 Primary VCCJ-DIS-2 or J-DIS/EN-2 Enable/Disable signal inputJ-DIS-3 or J-DIS/EN-3 Primary ground

J-DT-1 Primary VCCJ-DT-2 Deadtime programming pinJ-DT-3 Connects to trimmer potentiometer

2.3 Jumpers (Shunt) Setting

Table 2. Jumpers Setting

JACK Jumper Setting Options FACTORY SETTING

J-INAOption A: Jumper not installed, INA/PWM signal provided by external signal and this

pin is default low if left openOption AOption B: Jumper on J-INA-2 and J-INA-1 set INA low

Option C: Jumper on J-INA-2 and J-INA-3 set INA high

J-INB

Option A: Jumper not installed, INB signal provided by external signal and this pin isdefault low if left open Option A for

UCC21520EVM-286 andUCC21521CEM-286;

Option D forUCC20520EVM-286

Option B: Jumper on J-INB-2 and J-INB-1 set INB lowOption C: Jumper on J-INB-2 and J-INB-3 set INB highOption D: Header J-INB is not installed, and no connection on the device under test

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Description www.ti.com




Table 2. Jumpers Setting (continued)JACK Jumper Setting Options FACTORY SETTING

J-DIS or J-DIS/EN

Option A: Jumper not installed, the devices under test are enabled when left open onenable/disable pin

Option C forUCC21520EVM-286 and

UCC20520CEM-286;Option B for

UCC21521EVM-286

Option B: Jumper on J-DIS-2 and J-DIS-1 or J-DIS/EN-2 and J-DIS/EN-1Option C: Jumper on J-DIS-2 and J-DIS-3 or J-DIS/EN-2 and J-DIS/EN-3

J-DT

Option A: Jumper not installed, interlock with 8-ns dead time

Option BOption B:

Jumper on J-DT-2 and J-DT-1 allows driver output overlap or driver outputfollows PWM input for UCC21520EVM and UCC21521CEVM. Thedeadtime will be around 0ns in this option for UCC20520EVM

Option C:Jumper on J-DT-2 and J-DT-3 set the deadtime by DT (in ns) = RDT (in kΩ)× 10. For better noise immunity and deadtime matching, it is recommendedto parallel a 2.2nF or above bypassing capacitor from DT pin to GND.

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www.ti.com Electrical Specifications




3 Electrical Specifications

Table 3. UCC2x52xEVM-286 Electrical Specifications

DESCRIPTION MIN TYP MAX UNITVCCI Primary-side power supply 3 18 V

VDDA, VDDB

Driver output power supply for UCC21520EVM-286 andUCC20520EVM-286 9.2 25 V

Driver output power supply for UCC21521CEM-286 14.7 25 VFS Switching frequency 0 5 MHzTJ Operating junction temperature range –40 125 °C

4 Test SummaryIn the section, UCC21520EVM-286 is primary used for illustration. Different Jumper settings, PWM signalinput options and voltage source settings can be found in Section 2 and Section 3

4.1 DefinitionsThis procedure details how to configure the UCC2x52x evaluation board. Within this test procedure thefollowing naming conventions are followed. Refer to the UCC21520EVM-286 Schematic, Figure 7, fordetails.

VXX: External voltage supply name.

V(TPxx): Voltage at test point TPxx. For example, V(TP12) means the voltage at TP12.

V(Jxx): Voltage at jack terminal Jxx.

Jxx(yy): Terminal or pin yy of jack xx.

DMM: Digital multi-meters.

UUT: Unit under test

EVM: Evaluation module assembly, in this case the UUT assembly drawings have location for jumpers,test points and individual components.

4.2 Equipment

4.2.1 Power SuppliesThree DC power supply with voltage/current above 25 V/1 A, for example: Agilent E3634A;

4.2.2 Function GeneratorsOne two-channel function generator over 20 MHz, for example, Tektronics AFG3252

4.3 Equipment Setup

4.3.1 DC Power Supply Settings• DC power supply #1

– Voltage setting: 5 V– Current limit: 0.05 A

• DC power supply #2– Voltage setting: 12 V for UCC21520EVM and UCC20520EVM– Voltage setting: 15 V for UCC21521CEVM– Current limit: 0.1 A

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Test Summary www.ti.com




• DC power supply #3– Voltage setting: 12 V for UCC21520EVM and UCC20520EVM– Voltage setting: 15 V for UCC21521CEVM– Current limit: 0.1 A

4.3.2 Digital Multi-Meter Settings• Digital multi-meter #1

– DC current measurement, auto-range.• Digital multi-meter #2

– DC current measurement, auto-range.

4.3.3 Two-Channel Function Generator Settings

Table 4. Two-Channel Function Generator Settings

MODE FREQUENCY DUTY DELAY HIGH LOW OUTPUTIMPEDANCE

Channel APulse DC ~ 5 MHz 50%

0 ns3.3 V 0 V High Z

Channel B 100 ns

4.3.4 Oscilloscope Setting

Table 5. Oscilloscope Settings

BANDWIDTH COUPLING TERMINATION SCALE SETTINGS INVERTINGChannel A

500 MHz or above DC 1 MΩ or automatic 10× or automatic OFFChannel B

4.3.5 Jumper (Shunt) SettingsThere are two jumpers (shunts) need to be installed before test:1. Install shunt #1 for header J-DIS on pin 2-3 for UCC21520EVM, show in picture below in Figure 1. For

UCC20520EVM and UCC21521CEVM, please refer to Table 1 and UCC20520EVM is disable high onDIS pin while UCC21521CEM is enable high on EN pin.

2. Install shunt #2 on header J-DT on pin 1-2, show in picture below in Figure 1.

Figure 1. Jumpers Installation Position

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+

s

Power Supply #1 (5V/0.05A)

+

s


+s

DMM #2DC Current

+s

DMM #1DC Current

+

s


CH1 CH2

EVM

Function Generator

Oscilloscope

www.ti.com Test Summary




4.3.6 Bench Setup DiagramThe current bench setup diagram includes the function generator and oscilloscope connections.

Please follow the connection procedure below, and Figure 2 can be used as a reference.• Make sure all the output of the function generator, voltage source are disabled before connection;• Function generator channel-A channel applied on JINA ←→ TP14, see in Figure 2;• Function generator channel-B channel applied on JINB ←→ TP15, see in Figure 2. For

UCC20520EVM, JINB, J-INB and TP15 are not installed due to UCC20520 is a single PWM input dualchannel output Iso-Driver;

• Power supply #1: positive node applied on J1 pin-1 (or TP0), and negative node applied on J1 pin-2(or TP13);

• Power supply #2: positive node connected to input of DMM #1 and DMM #1 output connected to J2pin-3 (or TP10), negative node connected directly to J2 pin-1 (or TP17);

• Power supply #3: positive node connected to input of DMM #2 and DMM #2 output connected to J3pin-3 (or TP 11), negative node connected directly to J3 pin-1 (or TP19);

• Oscilloscope channel-A probes TP9 ←→ TP17, smaller measurement loop is preferred;• Oscilloscope channel-B probes TP12 ←→ TP19, smaller measurement loop is preferred;

Figure 2. Bench Setup Diagram and Configuration

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Power Up and Power Down Procedure www.ti.com




5 Power Up and Power Down Procedure

5.1 Power Up1. Before preceding the power up test procedure, please make sure that Section 4.3.6 is implemented for

setting up all the equipment. Figure 3 could be used as reference;2. Enable supply #1;3. Enable supply #2 and #3, the quiescent current on DMM1 and DMM2 ranges in 1 mA ~ 3 mA if

everything is set correctly;4. Enable function generator two channel output channel-A and channel-B;5. There will be:

(a) Stable pulse output on the channel-A and channel-B in the oscilloscope, refer to Figure 3;(b) Scope frequency measurement is same with function generator output;(c) DMM #1 and #2 should be read measurement results around 10 mA, ±2 mA under no load

conditions. For more information about operating current, please refer to UCC21520 Datasheet.

Figure 3. Example Input and Output Waveforms (Ch3&4 are PWM Inputs, Ch1&2 are outputs)

5.2 Power Down1. Disable function generator;2. Disable power supply #2 and #3;3. Disable power supply #1;4. Disconnect cables and probes;

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www.ti.com Test Waveforms (CL=0pF) with Different DT Configurations




6 Test Waveforms (CL=0pF) with Different DT Configurations

6.1 DT connected to VCCI(J-DT Option B in Table 2)The deadtime (DT) between two channels’ output is decided by inputs, see Figure 4. Overlap between twooutput channels is allowed. Figure 4 shows a waveform with overlapped operations.

Figure 4. Overlap is Allowed when DT Connected to VCCI(Channel 3 and 4 are PWM Inputs, Channel 1 and 2 are Driver Outputs)

6.2 DT Pin Floating or Left Open (J-DT Option A in Table 2)The deadtime (DT) between two channels’ output is around 8 ns, which is preset for interlock protections,see Figure 5.

Figure 5. Test Waveforms if DT is Left Open(Channel 3 and 4 are PWM Inputs, and channel 1 and 2 are Driver Outputs)

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Test Waveforms (CL=0pF) with Different DT Configurations www.ti.com




6.3 DT Pin Connected to RDT (J-DT Option C in Table 2)The deadtime (DT) between two channels’ output is set according to: DT (in ns) = 10 × RDT (in kΩ).

The steady state voltage at DT pin is around 0.8V, and the DT pin current will be less than 10uA whenRDT=100kΩ. Therefore, It is recommended to parallel a ceramic bypass capacitor, 2.2nF or above, withRDT to achieve better noise immunity and better deadtime matching between two channels, especiallywhen the dead time is larger than 300ns. The major consideration is that the current through the RDT isused to set the dead time, and this current decreases as RDT increases. This bypass capacitor is notinstalled in the EVM and the user can easily install it on the bottom layer where RDT locates.

Figure 6. Test Waveforms if DT Connected to RDT(Channel 3 and 4 is PWM Inputs, and Channel 1 and 2 is Driver Outputs)

7 SchematicFigure 7 shows only the schematic diagram for UCC21520EVM. The schematic diagrams forUCC20520EVM and UCC21521CEVM are very similar to Figure 7 except for the device under test, U1 inFigure 7 .

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0.2

2µ

FC

11

0.2

2µ

FC

12

0.2

2µ

FC

13

1µ

FC

14

1µ

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15

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GN

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GN

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GN

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J1

17

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J-I

NA

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J-I

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J-D

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J-D

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GN

D

GN

DG

ND

VC

CIN

VC

C

VC

C

VC

C

GN

D

GN

D

DT

VC

C

VC

C

GN

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INA

INB

1.0

0

R1

1

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DA

GN

DB

GN

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GN

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TA

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TB

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VD

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IN

V_

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IN

DIS

AB

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C

VD

DA

VD

DB

123

J2

17

27

023

123

J3

17

27

023

TP

1T

P2

TP

3

TP

4

TP

5

TP

6

TP

7

TP

8

TP

10

TP

11

TP

13

TP

14

TP

15

TP

16

TP

20

TP

0

0R_

LA

10

00

pF

CL

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10

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CL

_B

GN

DG

ND

GN

DG

ND

GN

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TP

19

10

pF

C1

10

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C2

2.2

R1

2

2.2

R1

3

10

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CIN

10

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C1

6

10

0k

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JIN

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JIN

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TP

9

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Cla

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INA

1

INB

2

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CI

3

GN

D4

DIS

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5

DT

6

NC

7

VC

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8V

SS

B9

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10

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12

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15

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51

R5

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3

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C3

D0

20

60E

www.ti.com Schematic




Figure 7. UCC21520EVM-286 Schematic

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Layout Diagrams www.ti.com




8 Layout DiagramsThe PCB layout information for UCC21520EVM is shown in Figure 8, Figure 9, Figure 10 and Figure 11,and they are the same for UCC20520EVM and UCC21521CEVM except for the labels which designatesthe EVM part number with the device under test.

Figure 8. Top Overlay

Figure 9. Top Layer

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www.ti.com Layout Diagrams




Figure 10. Bottom Layer

Figure 11. Bottom Overlay

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List of Materials www.ti.com



Revision History

9 List of Materials

Table 6. UCC2x52xEVM-286 List of Materials

QTY DES DESCRIPTION MANUFACTURE PART NUMBER2 C1, C2 Capacitor, ceramic, 10 pF, 50 V, ±5%, C0G/NP0, 0603. C2 is

not populated in UCC20520EVM.Std Std

3 C11, C12,C13

Capacitor, ceramic, 0.22 μF, 50 V, ±10%, X7R, 0603 Std Std

2 C14, C15 Capacitor, ceramic, 1 μF, 50 V, ±10%, X5R, 0603 Std Std2 C16, CIN Capacitor, ceramic, 10 μF, 50 V, ±10%, X5R, 1206_190 Std Std0 CL_A, CL_B Capacitor, ceramic, 1000 pF, 50 V, ±5%, C0G/NP0, 0805 Not Populated Not Populated0 DB Diode, Schottky, 600 V, 8 A, DPAK Not Populated Not Populated4 H1, H2, H3,

H4Machine screw, round, #4-40 x 1/4, nylon, philips panhead Std Std

4 H5, H6, H7,H8

Standoff, hex, 0.5"L #4-40 nylon Std Std

4 J-DIS, J-DT,J-INA, J-INB

Header, 100 mil, 3 × 1, gold, TH. J-INB is not installed inUCC20520EVM.

Std Std

1 J1 Connection terminal block, 2 position, 3.81 mm, TH Std Std2 J2, J3 Terminal block receptacle, 3 × 1, 3.81 mm, R/A, TH Std Std15 JINA, JINB,

TP0, TP1,TP2, TP3,TP4, TP5,TP6, TP7,TP8, TP9,TP10, TP11,TP12

Test point, miniature, red, TH. JINB and TP4 are not installedin UCC20520EVM.

Std Std

0 R4, R5 Resistor, 51 Ω, 5%, 0.1 W, 0603 Not Populated Not Populated1 R11 Resistor, 1.00 Ω, 1%, 0.125 W, 0805 Std Std2 R12, R13 Resistor, 2.2 Ω, 5%, 0.1 W, 0603 Std Std1 RB Resistor, 2.2 Ω, 5%, 0.125 W, 0805 Std Std2 R_LA, R_LB Resistor, 0 Ω, 5%, 0.125 W, 0805 Std Std1 RDT Trimmer, 100 kΩ, 0.25 W, TH Std Std2 SH1, SH2 Shunt, 100 mil, flash gold, black Std Std6 TP13, TP14,

TP15, TP16,TP19, TP20

Test point, miniature, black, TH. TP15 is not installed inUCC20520EVM.

Std Std

1 TP17 Test point, miniature, SMT Std Std1 U1 UCC21520DW, UCC20520DW or UCC21521CDW, 4-A and

6-A, 5-KVRMS Dual Isolated-channel Universal Gate Driver,DW0016A

Texas Instruments UCC21520DW,UCC20520DW, orUCC21521CDW

Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (June 2016) to A Revision ......................................................................................................... Page

• Added device type to include the UCC20520EVM-286 and UCC21521CEVM-286 Evalustion Modules. .................... 2

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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation

which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the termsand conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

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http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

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