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The top documents of shou-yi-chang

Nanomechanical analyses of porous SiO2 low-dielectric-constant films for evaluation of interconnect structure reliability
Nanomechanical analyses of porous SiO2 low-dielectric-constant films for evaluation of interconnect structure reliability
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Nanomechanical response and creep behavior of electroless deposited copper films under nanoindentation test
Nanomechanical response and creep behavior of electroless deposited copper films under nanoindentation test
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Preparation and mechanical properties of aluminum-doped zinc oxide transparent conducting films
Preparation and mechanical properties of aluminum-doped zinc oxide transparent conducting films
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Mechanical properties, deformation behaviors and interface adhesion of (AlCrTaTiZr)Nx multi-component coatings
Mechanical properties, deformation behaviors and interface adhesion of (AlCrTaTiZr)Nx multi-component coatings
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Properties and thermal stability of porous organic low-dielectric-constant materials
Properties and thermal stability of porous organic low-dielectric-constant materials
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Mechanical property analyses of porous low-dielectric-constant films for stability evaluation of multilevel-interconnect structures
Mechanical property analyses of porous low-dielectric-constant films for stability evaluation of multilevel-interconnect structures
217 views
Analyses of interface adhesion between porous SiOCH low-k film and SiCN layers by nanoindentation and nanoscratch tests
Analyses of interface adhesion between porous SiOCH low-k film and SiCN layers by nanoindentation and nanoscratch tests
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High thermal stability of AlCrTaTiZr nitride film as diffusion barrier for copper metallization
High thermal stability of AlCrTaTiZr nitride film as diffusion barrier for copper metallization
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Microstructures and mechanical properties of multi-component (AlCrTaTiZr)NxCy nanocomposite coatings
Microstructures and mechanical properties of multi-component (AlCrTaTiZr)NxCy nanocomposite coatings
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Processing copper and silver matrix composites by electroless plating and hot pressing
Processing copper and silver matrix composites by electroless plating and hot pressing
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Processing stainless steel fibre reinforced NiAl matrix composites by reactive hot pressing
Processing stainless steel fibre reinforced NiAl matrix composites by reactive hot pressing
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(AlCrTaTiZr)N/(AlCrTaTiZr)N0.7 bilayer structure of high resistance to the interdiffusion of Cu and Si at 900 °C
(AlCrTaTiZr)N/(AlCrTaTiZr)N0.7 bilayer structure of high resistance to the interdiffusion of Cu and Si at 900 °C
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Low-temperature curing of aluminum-doped zinc oxide films assisted by ultraviolet exposure
Low-temperature curing of aluminum-doped zinc oxide films assisted by ultraviolet exposure
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