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Ubiquitous Displays and Sensors Activating Surfaces with Flexible Electronics
Dean Baker, Director FlexEnable
APAC Innovation Summit 2016, Hong Kong
APAC Innovation Summit 2016
Activating surfaces with flexible displays and sensors
25 November 2016 | 2
Consumer electronics Automotive
Healthcare NDT
Flexible Plastic Displays
Flexible Plastic Sensors
Banking and PoS
Wearables Digital Signage
Border control
APAC Innovation Summit 2016
Partnering to bring OTFT Technology to displays and sensors
25 November 2016 | 3
FlexEnable OTFT platform
Display Makers Product Companies
Production
APAC Innovation Summit 2016
OTFT Array Build Manufacturing at Low Process Temperatures
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Simple manufacturing processes that are compatible with plastics
• Choice of low cost plastic substrates (TAC / PET / PC) • Low Array Build Total Pitch Distortion (TPD)
• High performance material handling
OTFT Array Build Process Temperatures
Array Build Manufacturing Temperature Cycle
LTPS Array Build > 350 oC
IGZO Array Build > 150 oC
OTFT Array Build < 100 oC
APAC Innovation Summit 2016
Option to retro-fit existing a-Si lines with OTFT Array Build
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Industrial Material Supply Chain
Proven Industrial Processes
Favourable Process Flow
Unique Displays & Sensors
APAC Innovation Summit 2016
Breakthrough Organic LCD on low cost plastic substrates
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• OTFT process compatibility with existing LCD manufacturing • Ultra-thin, light, robust and conformable plastic OLCD displays • Easily formed around bend radius down to 35mm • 130 micron thin glass-free stack • Easily cut into non-square & irregular shapes
Conforming an OLCD to a curved surface In partnership with
APAC Innovation Summit 2016
Example: Conformable OLCD with curved backlight
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Example backlight uniformity
LED edge input
100mm from LEDs
88% Uniformity
Small drop-off (10%) in brightness seen with decreasing radius of curvature.
APAC Innovation Summit 2016 25 November 2016 | 10
Plastic OLCD can achieve same performance as colour a-Si LCD displays
Current Organic Semiconductors 3X a:Si Ongoing Rapid Performance Development
APAC Innovation Summit 2016
Organic Semiconductor Mobility Performance Progression
10
1
0.1
0.01
2011 2012 2013 2014 2015 2016 ….. 2020
EPD Focus
Carr
ier M
obili
ty c
m2/
Vs
Diverse Applications
In Production Next Generations
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a:Si TFT Mobility
APAC Innovation Summit 2016
OTFT: Extremely low leakage currents
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• Enable lower display refresh rates = power saving for static images • Higher signal-to-noise ratio = lower X-ray dose for X-Ray Sensor
APAC Innovation Summit 2016
Currently Polymer OSC materials provide best results manufacturing – but both materials types are developing
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Small molecule semiconductors
• High mobility 1-10 cm2/Vs
• Polycrystalline microstructure – Main issue: uniformity
S
SCnH2n+1H2n+1Cn
Cn- BTBT
SiR3
SiR3 R=iPr
TIPS-pentacene
S S
C16H33 C16H33
n
N SN
S S
C16H33 C16H33
N
N SN
n
N
NS
S
O
O
R
R
Ar
Conjugated polymers
• Near-amorphous microstructure: Good large area uniformity and excellent mechanical properties
• Until recently, performance and stability lower (Mobility 1-5 cm2/Vs)
APAC Innovation Summit 2016
Low Cost Direct Solution Coating used for Plastic OLCD
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Colour Photoresists
Photo Alignment Layers
Polymer Pixel Dielectric
Polymer Gate Dielectric
Polymer Semiconductor
Polymer Planarization
Polymer Hard Coating
Direct Solution Coating
TAC – Cellulose Triacetate
TAC – Cellulose Triacetate
Section of Plastic OTFT LCD Cell (FFS Mode)
Replacing expensive PI and PECVD SiOx & SiNx with low cost direct solution coating
APAC Innovation Summit 2016
Plastic OTFT for Image and X-Ray Sensors
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Organic Photo Diode (OPD) Deposition [Partner]
OTFT Array Fabrication [FlexEnable]
Image Sensor [Partner]
X-Ray Detector [Partner]
Scintillator Layer
OPD
OTFT Array
APAC Innovation Summit 2016 25 November 2016 | 18
FlexEnable & ISORG: Thin Plastic High Security Biometrics
Imaging Fingerprint Barcode Reading Vein recognition
• Large area Fingerprint and Vein Sensor on plastic • Biometric sensing wrapped surfaces
• Cost effective manufacturing of large area sensors
Demonstrated with FlexEnable/ISORG technology
OPD stack
Plastic substrate
OTFT stack ~300um
APAC Innovation Summit 2016
Advantages of FlexEnable / ISORG optical FP and vein sensor
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• High sensitivity than capacitive fingerprint sensors • Large area = better reliability / quicker detection • The image can be taken in one shot as the sensor
can be conformed to the finger
• No additional glass optics required • Multi-spectral imaging = less susceptibility to
contaminants, improper contact or bright ambient lights Parameter Array specifications
Sensor size 3” x 3.2” (FAP 60)
Resolution 500 dpi
Resolution 1536 x 1600
Pixel pitch 50.8µmx50.8µm
APAC Innovation Summit 2016 25 November 2016 | 22
Flexible X Ray Sensors
• Shatterproof, with near zero incremental thickness and weight
• Enables X-ray systems to go anywhere – to RTA’s1, around pipework, mobile systems
• Conformable around the body – improves accuracy and patient comfort
Industry Applications
1: Road Traffic Accidents