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    Tyndall National Institute

    Tyndall Central Fabrication

    Facility (CFF)

    IRDG March 2013

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    Tyndall Central Fabrication Facility Flexible collaboration with industry

    SensL APDs RADFETs Sicel/GAESi Xenics Silicon photodiode arrays for earth observation QinetiQ/DERA IR Bolometers


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    Silicon MOS Fabrication MEMS Fabrication Compound Semiconductor

    Fabrication Training Facility E-Beam Lithography CFF Centre is made up of a team of

    management, engineering and technical professionals

    Tyndall operates a Quality Management System that is ISO9001 accredited

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    Full CMOS/SOI process capability

    PiN Diode, RADFET and APD processes

    Research on Ultimate silicon devices

    Facility used in a mix and match mode with the E-beam facility to produce devices in nm range (30-50nm)

    Mixed technology processes

    Device Prototyping and Process Development for commercial customers

    Small-volume production for commercial customers

    MOS Fabrication Cleanroom

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    MEMS Fabrication

    Role within Tyndall is to support the design & fabrication of MST/MEM/MOEM devices and components

    Fabrication of structures using silicon, glasses and polymers

    Two way wafer exchange between the silicon facility and MEMS

    MEMS activity is located in the new fabrication cleanroom in a shared facility with III-V

    Full equipment suite with wet and dry etch double sided alignment and wafer bonding

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    Full process capability for compound semiconductor devices III-V (GaAs, AlGaAs, InP etc) GaN

    Optoelectronics Light-Emitting Diodes, RCLEDs Laser Diodes, VCSELs

    Sub-Millimeter Wave Technology Schottky Diodes MMICs Membrane Structures

    Nanotechnology Fabrication of structures for

    electrical characterization of nano-devices

    Compound Semiconductor Fabrication

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    Training Fabrication

    Fully equipped training fabrication facility

    Setup for compound semiconductor fabrication

    Will be used for training courses and introduction to processing

    Students can then graduate to full facility usage

    Full capability as a research laboratory

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    Capability/Concept rather than a separate space

    Allow for the introduction of new materials and process concepts in a controlled environment

    Significant amount of new equipment purchased under the PRTLI5 programme (3.8M) (Project:Tyffani)

    Fits with the work in the Advanced Materials group, Nanotechnology and the Photonics Devices groups

    Some equipment installed all ordered or identified

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    JEOL JBX 6000FS Resolution down to 20nm Min Spot-Size 5nm

    ZEP520A positive resist Min feature size 20nm for

    100nm layer Min feature size 150nm for

    650nm layer

    150mm wafer capability Mix-and-Match process

    capability with the other labs

    E-Beam Lithography

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    Other Laboratories Within Tyndall

    Ferroelectric/Ferromagnetic growth facility (Atomic Vapour Deposition)

    EMAF Microscopy Laboratory High resolution SEM Dual Beam FIB TEM

    Electronic test facilities Photonics and electronics packaging capabilities Mechanical workshop Nanotechnology Characterization laboratories

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    SensL was a spin-out from Tyndall in 2004 An APD process which had been the subject of several

    PhD projects was licensed by Tyndall to SensL To become a fully commercial process significant

    development had to be carried out Tyndall fabrication staff operated in a close

    collaboration with SensL process engineers to develop a process capable of supporting multiple commercial products

    From 2004 to 2010 all SensL development and production silicon was fabricated at Tyndall

    In 2010 the process was successfully transferred to a commercial foundry

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    SensL Technology

    SensL are active in the following application areas Medical imaging Homeland security Analytical Instruments

    SensL products include Silicon Photomultipliers

    A direct replacement for Linear Photomultiplier Tubes

    Photon Counting Systems High performance photon counting


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    Low Light Devices - SensL

    Post-graduate research project Spin-out Company

    Technology license Process transfer for high volume

    production Time scale

    Sensl founded 2004 Technology transferred 2010

    Project team Silcion process engineers Two engineers from Sensl

    Costs Two cost models

    One for production wafers One for development wafers

    IP Original process licensed to SensL All developments paid for and owned

    by SensL

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    Medical devices based on RADFETs

    Sicels OneDose system: dosimeter patch with RAD1 and the reader

    Sicels DVS: implantable capsule and paddle reader

    INVORAD catheter array

    OneDose Product DVS Product Catheter Development

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    Radiation Detection

    In the mid-1980s Tyndall (then NMRC) entered an agreement with ESA (ESTEC) to be come the Microelectronics Technology Support Laboratory (MTSL)

    As part of that agreement, a simple radiation detector was developed for in-craft housekeeping

    This detector monitored the amount of radiation being detected by on-board electronics

    The device is very simple MOS device with special processing to make it radiation soft

    Continued development of this device brought the sensitivity and range into an area suitable for medical applications

    Tyndall has also provided RADFETs for personnel monitors in high radiation environments

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    Tyndall RADFETs

    Tyndall entered an agreement with a US company called Sicel, in 2004, to supply RADFETs for radiation detection in cancer radiotherapy

    Sicel have 2 products, both FDA approved OneDose - an external single use

    detector DVS an implanted (in the body)

    device that remains active over an entire course of radiotherapy. The device reports the dose from a single irradiation and holds the information on accumulated dose.

    Tyndall has the fabrication capacity to meet all future needs

    ESAPMOS4 quadruple chip (1mm x 1mm)

    RAD1 RADFET chip (0.5mm x 0.5mm)

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    Fabrication of Linear Diode Arrays for Xenics

    Xenics Infrared Solutions is involved in a space programme for satellite imaging

    Their role is to provide a system that will consist of 4 linear sensor arrays of 512 pixels on 25um pitch and pixel height

    Each of the 4 sensors will respond to a different wavelength range Visible (VIS) Near IR (NIR) Shortwave IR1 (SWIR1) Shortwave IR2 (SWIR2)

    Xenics are fabricating the SWIR detectors in their proprietary InGaAs process

    Tyndall fabricated the VIS and NIR sensors in Silicon

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    Device LayoutOptical Response single diode

    Optical Response 5 adjacent diodes

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    Project History

    The project history is interesting Tyndall was approached by Xenics and bid for the project in

    2008 The bid was unsuccessful and awarded to a commercial foundry In May of 2010 Xenics came back and asked to discuss simply

    processing silicon arrays on a batch basis It turned that after 2 years of development the project still had

    not got working silicon Tyndall was audited by the Prime Contractor, TNO, on

    27/05/2010 Purchase Order 10/06/2010 Silicon deliveries completed 13/09/2010 One delivery of silicon (3 wafers of each) for each of the

    wavelengths VIS/NIR met all of Xenics silicon requirements for the project

    This included a mask change at Xenics request after the first delivery of silicon

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    Process Development - Xenics

    Contract research Process development

    Product delivery Time scales

    15 weeks initial discussions to final delivery

    Team Tyndall silicon fabrication Micro/Nano research engineer Xenics process engineer

    Costs Circa 25,000

    IP Process IP remains with Tyndall Device design IP with Xenics

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    Microneedle Technology

    Microneedles first developed under an EU Framework 5 project

    Applications such as painless injections and endoporation for cancer treatment

    Has since found applications in the area of vaccination, emission sources

    Working with other university departments and a number of commercial organisations on further development and commercialization

    These devices have been used in two large projects with Industry in the last 2 years

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    Industry Engineers in Fabrication

    Researchers in residence at Tyndall well documented Also have fabrication engineers in residence This facilitated the conversion of a

    research/development process to a full production process with all of the documentation and characterization that goes with that

    Means that Tyndall not only can offer up through the 9 levels of TRL (mainly level 7) but also up to level level 9 of MRL

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    Tyndall has a range of flexible fabrication facilities to meet a wide cross-section of needs

    There are a number of collaborative models that are used for interaction with industry These