tsc (5425) roadshow - taiwan semiconductor · 2017 total semiconductor market discrete...

TSC (5425) Roadshow

2018 Rev1.0 Aug.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP

Company Key Information Update


TSC PRODUCTS OVERVIEW

PRODUCT FAMILY ACTIVE PNS AECQ PNS AECQ/ACTIVE PNS

TVS 2145 2145 100%

Power Zener 339 339 100%

Schottky 975 656 67%

Bridge 418 220 53%

Standard 252 177 70%

ESD capability rectifier 4 4 100%

FRD 158 99 63%

HER 286 237 83%

Superfast 353 307 87%

Ultrafast 90 84 93%

TOTAL 5020 4268 85%

FOOTPRINT OF MANUFACTURING SITES

TIANJIN, CHINA / FRONTEND (3“/4“ WAFER) LI-JE, TW / FRONTEND (4” WAFER; 6” IS ON THE WAY)

Technology : GPP, Photoglass, SIPOS passivation Technology : GPP, Photoglass, SIPOS/Si3N4 passivation, Planar (Under development, Q1E/FY19)

Capacity : 150,000pcs wafers/month (Q3-FY18) Capacity : 80,000pcs wafers/month (Q3-FY18)

Yangxin, China / Backend (Assembly) I-lan, Taiwan / Backend (Assembly)

SMD/Bridge/Power Pack/Axial SMD/Power Pack/ PDFN (MOSFET)

Capacity : • SMD : 350,000,000 pcs /month • Bridge : 80,000,000 pcs /month • Axial : 240,000,000 pcs /month • Power Pack : 20,000,000 pcs / month

Capacity : • SMD : 20,000,000 pcs /month • Power Pack : 5,000,000 pcs / month

STANDARD SMD PROCESS VS MATRIX LINE

BEFORE (STANDARD SMD) NOW (MATRIX SMD)

GLOBAL TOP 100 AUTOMOTIVE TIER 1 PROGRAM

Infotainment

Safety system

Body control

Chassis system

Engine Transmission

GLOBAL TOP 100 AUTOMOTIVE TIER 1 PROGRAM

Navigation

Audio

Air Bag

TPMS

ADAS

Lighting

Air-CON

ABS

IVI Transmission

Window lift Body control

Mirror

Chassis control

EPAS

OBD

AEC

Fuel Injection

Ignition

ECU

Air supply

SALES TREND & PROFITABILITY ($MNTD)

Revenue ($MNTD) Gross Profit & Margin ($MNTD)

Operation Profit & Margin ($MNTD) Net Profit & Margin ($MNTD)

7,640 7,745 8,702 8,994

0

2,000

4,000

6,000

8,000

10,000

FY2014 FY2015 FY2016 FY2017

2,453 2,679

3,157 3,310

32% 35%

36% 37%

20%

25%

30%

35%

40%

45%

50%

0

1,000

2,000

3,000

4,000

FY2014 FY2015 FY2016 FY2017

1,304 1,449 1,506

1,618

17% 19% 17% 18%

0%

10%

20%

30%

40%

0

1,000

2,000

FY2014 FY2015 FY2016 FY2017

916 1,131 1,119

1,261

12% 15% 13% 14%

0%

10%

20%

30%

40%

0

1,000

2,000

FY2014 FY2015 FY2016 FY2017

EPS ($NTD) & DIVIDEND PAYOUT

1.61

2.51

3.31 3.34

3.77

1.20

2.00

2.50 2.50

3.00

74.5%

79.7%

75.5% 74.9%

79.6%

71.0%

72.0%

73.0%

74.0%

75.0%

76.0%

77.0%

78.0%

79.0%

80.0%

81.0%

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

FY2013 FY2014 FY2015 FY2016 FY2017

EPS Dividend Dividend Payout Ratio

The RISE of Intelligent & Alternative Energy Vehicle


SHIPPMENT TRENDS IN AUTOMOTIVE MARKET

GLOBAL AUTOMOTIVE MAKRET SCALE

GLOBLA AUTOMOTIVE MAJOR MAKERS

75,000

80,000

85,000

90,000

95,000

100,000

105,000

FY1

3

FY1

4

FY1

5

FY1

6

FY1

7

FY1

8(f

) 0

500

1,000

1,500

2,000

2,500

FY1

3

FY1

4

FY1

5

FY1

6

FY1

7

FY1

8(f

)

BEV PHEV

Renault-Nissan-

Mistubishi 10%

BYD 9%

BAIC 9%

Geely 8%

Tesla 8%

BMW 8%

VW 6%

SAIC 5%

GM 5%

Toyota 4%

Others 28%

VW 11%

Toyota 11%

Renault-Nissan

10% Hyundai-

Kia 8%

GM 7%

Ford 6%

Honda 6%

FCA 5%

PSA 4%

Suzuki 3%

Others 29%

WW Car Shipment 96,800K pcs

FY17

WW EV Shipment 1,850K pcs

FY17

China 62%

USA 21% NOR

6%

JPN 6%

GER 5%

WW EV Shipment TOP 5 Regions

FY17

GLOBAL GREEN CAR GROWTH TREND BY POWER TYPE

0

5

10

15

20

2015 2016 2017 2018 2019 2020

48V Mild hybrid FHEV PHEV EV

Unit : M units

100% EV HEV

Motor

Inverter

Battery

Motor

Inverter

Battery

Engine

Gener-ator

FHEV : 42.4% 48V : 34.4%

CAR MAKERS’ AMBITION IN EV

TOP TRENDS IN AUTOMOTIVE MARKET

New FINDINGS in the market

• Total Car Q’ty in China area est. to increase 50% • In FY2030, “33%” driving mileage comes from “sharing” • In FY2030, “40%” driving mileage comes from “Self-driving” • In FY2030, “55%” new cars will be EV (Electrical vehicle)

Top 5 TRENDS in the market

• Electrified …. More ECUs, new add+ EV charging systems • Autonomous …. New add+ ECUs for ADAS • Shared …. Service on demand • Connected …. New add+ communication NODES • Yearly updated …. In past, ave 5-8 yrs, with 1-4, frequency ↑

Top 3 TRENDS in the tier 1 and component market

• Shared platform, and keep implement new technology (More M&A) • Software development capability becomes more and more important • China tier 1 and component providers drive M&A activity bcz of local huge market

TOP KEY DRIVERS IN ELECTRICAL VEHICLE MARKET

STOP SELLING ANY FUEL CARS

FUNDAMENTAL INFRASTRUCTURE BATTERY TECHNOLOGY

TECHNOLOGY DRIVERS

Diesel Car

Rental Car w/ Diesel Engine

SUV w/Diesel Engine

China Outdoor EV Charging Station Qty

TESLA Shanghai Site Taiwan ARTC Platform Japan 7 alliance EU BMW

EU BenZ

CHINA DOMINATES ALL CHARGING OUTLET TYPES

Automotive Business Development

2018 Rev1.0 07.25.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP

2017 TOTAL SEMICONDUCTOR MARKET

DISCRETE SEMICONDUCTOR MARKET BY PRODUCT FAMILY (Discrete $21.5B)

SEMICONDUCTOR MARKET BY FAMILY

DISCRETE SEMICON. MARKET BY FAMILY

PRODUCT CATEGORY 2016 WW 2017 WW GROWTH

Rectifier+Diode (W/o Small Signal Diode) 4,657 5,481 17.7% IGBT 3,421 4,024 17.6% Thyristor 650 706 8.6%

Small Signal 2,494 2,677 7.3% Power MOSFET 6,309 6,691 6.1%

Power Transistor 1,773 1,792 1.1% Other discrete 114 128 12.3%

Unit : M USD

IC 83%

Opto 9%

Discrete 5%

Sensors 3% MOSFET

31%

Rectifier 26%

IGBT 19% Diode

13%

Pwr Transistor

8%

Thyristor 3%

AUTOMOTIVE ELECTRONICS COST STRUCTURE IN A CAR

AVERAGE SEMI COST IN A CAR

AVERAGE COST IN A E-CAR

Power 42%

MCUs 23%

Others 22%

Sensors 13%

Power 76%

Others 16%

MCUs 4%

Sensors 4%

Power 55% Others

27%

MCUs 11%

Sensors 7%

Engine Car ~$USD 320

Hybrid Car ~$USD 690

E-Car ~$USD 700

Battery 48%

Driving System

20%

Body and

Chassie 16%

Ass. 13%

Others 3%

50% from IGBT

600-1200V for Car

Ave. $300 per HEV/PHEV

Ave. $540 per BEV

Ave. $1000 per E-BUS

• EV needs 100~140pcs IGBTs • HST needs 50-80pcs IGBTs per Carriage • Ex. Tesla Model X : 132 IGBTs (Front : 36/Back : 96)

Continuous Innovation in Wafer & Package to Support Automotive Trends

2018 Rev1.0 07.25.2018 Prepared by Auto SBU Presented by Stanley Lin, AVP

CONTINUOUS INNOVATION IN WAFER & PACKAGE

Miniaturization Electrification

Efficiency Transient Capability

PACKAGE TRENDS

SOD-123HE 3.70 x 1.80 x 0.80mm

MicroSMA 2.50 x 1.30 x 0.65mm

• 48% in space

• 80% in height • 100% of the current rating

SMA 4.33x2.56x2.30mm

SOD-123W 3.70 x 1.80 x 0.96mm

• 45% in space


SOD-123HE 3.70 x 1.80 x 0.80mm

• 45% in space


SMB 4.33x3.63x2.30mm

ThinSMA 4.25 x 2.60 x 0.95mm

SOD-128 3.80 x 2.50 x 1.00mm

• 69% in space


SMC 6.55x5.90x2.30mm

ThinSMA 4.25 x 2.60 x 0.95mm

SOD-128 3.80 x 2.50 x 1.00mm

• 29% in space


TO-277A(SMPC) 6.50 x 4.60 x 1.10mm

• 64% in space


D-PAK 9.90x 6.57x2.29mm

TO-277A(SMPC) 6.50 x 4.60 x 1.10mm

• 45% in space


ELECTRIFICATION OF A CAR

Increased Elec. function

ADAS (Vision & Safety)

Replacement of Relays

Electrification of powertrain


Increased Electrical function

ADAS Replacement

of Relays Electrification of

powertrain

• ECU ++ • ABS, Power steering,

Fuel injection, Automatic transmission

• ECU ++ • Vision & Safety

• Replace conventional electrical or mechanical relays

• Hybrid • 48V • BMS

• STD rectifier up to 1000V • Avalanche ruggedness (BYG, Avalanche Rectifier) • High current density package (SOD-128, SMPC) • ESD protection (ESD rectifier) • Load Dump Protection (Load Dump TVS) • PwrMOS with low RDS(ON) and high ID (*)

• PwrMOS (*) • Space saving • Efficient • Low Noise

• SKY up to 150V Trench SKY (*)

• FRD up to 200V • PwrMOS 40/80/100V

(*)

Remarks : (*) under development

ELECTRIFICATION OF A CAR

Increased Elec. function

ADAS (Vision & Safety)

FY2010 FY2020 FY2030

Level 2 Level 3 Level 4

ACC

LKA LDW

EPS

Radar Lidar

Min ECU+ 2

Hi-res Maps

Hi-res Radar Lidar

GPU

V2X

AISL C&D uC

DSRC

3/4G

Max ECU+ 10

• Adaptive Cruise Control (ACC) • Automatic Emergency Braking (AEB) • Lane Departure Warning (LDW) • Lane Keep Assist (LKA)

AVERAGE ECUs PER CAR

0

20

40

60

80

100

120

140

160

FY2016 FY2017 FY2018 FY2019 FY2020

Small Medium Large Executive Luxury Special

ON/OFF BOARD CHARGING

On Board Charger AC Charging

DC(Fast) Charging

AC

DC

DC

AC Motor HSG ISG

AC Charging • 7.2KW (32A, 1-phase) • 22KW (3-phases) • Charging time, 7.2KW, 3-4hrs

DC Charging • >50KW @ >100A • 80%, 30-60mins

HV BATTERY PACK

Fast Charging Module

PCU

Inverter

Inverter (Motor)

Boost Converter

DC-DC Converter

Inverter (HSG)

TOPOLOGIES FOR EV OBC (On Board Charger)

AC/DC + PFC (Interleaved PFC) DC-DC (LLC Full Bridge)

Singe phase + Full Bridge LLC

(OBC)

(1) Bridge

• Higher efficiency concern may choose “Bridgeless” topology, but higher cost • Design concern : Lower VF (To reduce conduction loss), 600/1200V • Package concern : Common package is TS6P Bridge rectifier x 1, TO-247 x 2. Later, SMD will be preferred PKG • TSC Solution : TS15P-50P series, and new PLDS3060H-80H (D2PAK-D, under development stage)

(2) TVS • 400W SMA Bi-directional TVS & 600W SMB Bi-directional TVS • TSC Solution : SMAJ & SMBJ series (Package Trend : SMB to SOD-128; SMA to SOD-123W/HE)

(3) PFC MOSFET • Super junction MOS ( Infenion/Toshiba/STM are major suppliers) • 650V/41mohm & 65mohm • TSC Solution : TSM60NB041PW (No AECQ yet)

(4) PFC Diode • Ultrafast, 30A/600-1200V/DO-247, fast trr + Soft recovery (Switch loss & Noise), Lower VF (Conduction loss) • SiC SBD, 10A/650V/TO-220, also Zero switch loss (Cree, Infenion) • TSC Solution : SMAJ & SMBJ series (Package Trend : SMB to SOD-128; SMA to SOD-123W/HE)

(5) LLC MOSFET • Super junction MOS ( Infenion/Toshiba/STM are major suppliers) • 650V/41mohm & 65mohm + Built-in FRD (trr ~ 200ns) • TSC Solution : Under development stage

(6) Output Diode • Ultrafast, 20-30A/600-1200V/DO-247, fast trr + Soft recovery (Switch loss & Noise), Lower VF (Conduction loss) • SMD will be preferred package (Suitable for SMT process) • TSC Solution : UG20J/UG30J (D2PAK-D, under development stage)

(1)

(2) (2)

(2) (2)

(2) (2)

(3) (3)

(4)

(4)

(4)

(5) (5)

(5) (5)

(6) (6)

(6) (6)

CHINA OFF BOARD CHARGING DESIGN SPEC

0

100

200

300

400

500

600

700

800

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

670V

BYD E5

490V

Danza

BYD E6

300V

Kandi K17A

350V

Unstable Area 250V

110V

INPUT FROM MKT FOR FUTURE POWER SEMICON.

Power Device Semiconductor Key characteristic

VBR (V) IModule (A) Fswitch(KHz) Die size(mm2)

Inverter 650 900

1200 200…800 10 100…300

HV DC-DC

650 900

1200 85…500 50…300 100…300

Charging 650 900

1200 15…50

10…100 100…300

20…100

12V/48V DC-DC

650 900

1200 5…20 100…500 10…50

Component Current SPEC Next SPEC

OBCM

SiC SBD 600V 15/30A 35ns 30ns

IGBT 600V 40/60A 650V/60A

SJMOS 650V, 40A, 41mohm < 40mohm

DC-DC SiC SBD 600V 10A 35ns 30ns

SJMOS 650V, 48mohm < 40mohm

Inverter IGBT Module 660A 950A

MVMOS -16A, -60V, 65mohm < 40mohm

SiC FOR XEV APPLICATIONS

ROADMAP

300 Amp SiC More Capable than 600 Amp Si IGBTs!

SYSTEM COST REDUCTION OF 20% USING 1200V SiC

• Increased frequency reduces size and weight of magnetics • Lower losses reduce system cooling requirements • Amperage rating for SiC less than half required for Si IGBTs

Data from Cree

0

50

100

150

200

250

300

350

SiC MOSFET 300 Amp,

10 kHz

Si IGBT 600 Amp,

3 kHz

Loss

es (W

atts

)

Diode

Switching

Conduction

PROTECTION SOLUTIONS FOR AUTOMOTIVE

MCU/MPU

CO

MM

CAN

LIN

I/O

Data Port

Lighting Body & Chassis Window fit Electronics

LCD LED

I/O Port

RF

3G Module Wifi Bluetooth GPS Audio

Power V Boost V Buck V Digital

Vbat

TVS Protection ISO7637-2 / ISO16750-2

ESD Protection IEC61000-4-2/ ISO10605

Display

TVS/ESD Protection ISO7637-2 / ISO16750-2/ IEC61000-4-2/ ISO10605

ESD Protection IEC61000-4-2/ ISO10605

ESD Protection

IEC61000-4-2 ISO10605

USB

2.0

H

DM

I SI

M

SD

Dig

i I/O

O

N/O

FF

Key

pad

G

PIO

TVS/ESD Protection ISO7637-2/ ISO16750-2 IEC61000-4-2/ ISO10605

Output Driver

Threats Of Automotive Electronics –ESD(Transient wave)

Vehicle test - Internal points

Vehicle test - external points

Electrostatic Discharge Path - Inside Electrostatic Discharge Path - Outside

THREATS OF AUTO. ELECTRONICS –ESD

ESD Standard

Vehicle test ISO 10605 vs. IEC 61000-4-2

Object Standard Evaluation Cause Automotive Customer

Electronic equipment

IEC 61000-4-2 Malfunction Human body VW(TL82466)

Vehicle Components

ISO 10605 Malfunction

Break Human body

GM(GVM3097), VW(TL82466), Ford(ES-XW7T), Citoren(B21-7110), BMW(GS95002)

Vehicle Components

SAE J1113-13 Malfunction

Break Human body

Standard Module Test Sensitivity Level

Test

ISO 10605

• 150pF/330Ω • 330pF/330Ω • 150pF/2000Ω • 330pF/2000Ω

• 150pF/330Ω • 330pF/330Ω • 150pF/2000Ω • 330pF/2000

IEC 61000-4-2 • 150pF/330Ω • 150pF/330Ω

THREATS OF AUTO. ELECTRONICS : TRANSIENT PULSE

Vehicle test - Electrical disturbance by conduction and coupling ( Standard ISO 7637/ISO 16750)

Pulse Description

1 Connected directly to an inductive load in parallel

2a

Transient interruption of a device connected in parallel, due to hardness inductance

2b Transients from DC motor acting as a generator when ignition is switched off

3a/3b Switching transients due to distributed inductance and capacitance of hardness

4 Voltage dip due to starter-Motor current during cranking (Excluding spikes)

5 Load Dump

Wiper

Airbag

ABS

EEC

Motor

ESP

Alternator

Conventional

Central Load Dump

ISG (BSG/IMG)

SUMMARY

TSC is MOVING forward to AUTOMOTIVE

Penetrating into Automotive since FY2002 85% rectifier products is Automotive grade, TVS (Protection) is 100% Engaged with 1st tier WW Automotive OEM manufacturing companies Complete product portfolio to fulfill Automotive application (ECU,

Powertrain, On/Off board charging, Protection solution) DO-218 Load Dump TVS is a START products to help TSC penetrate into

EU/US/JPN/CN 1st tier automotive ECU makers Technology migration – GPP to Planar

THANK YOU

Taiwan Semiconductor Co., Ltd. Headquarters Address: 11F. No. 25 Sec. 3, Beishin Rd, Shindian District, New Taipei City, Taiwan R.O.C. Telephone: +886-2-8913-1588 E-mail: [email protected] Website: www.taiwansemi.com

mailto:[email protected]

http://www.taiwansemi.com/

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