to the filler body to form a planar transition between the filler body and the paint coat.

TREATING METAL SURFACES U.S. Patent 6,020,029. Feb. 1, 2000 D. Ferrier and F. Durso, assignors to MacDermid Inc., Waterbury, Conn

A process for adhering a poly- meric resin to a metal surface comprising contacting with an ad- hes ion promot ion composi t ion comprising: an oxidizer; an acid; a corrosion inhibitor; optionally, a source of halide ions; optionally, a water-soluble polymer; and there- after contacting with an alkaline solution; and thereafter adhering a polymeric resin to the metal surface.

C O A T I N 6 A L U M I N U M ALLOY SUBSTRATES U.S. Patent 6,020,030. Feb. 1, 2000 J.D. Guthrie and A.M. Dennis, assignors to Aluminum Company of America, Pittsburgh, Pa.

A process for pretreating an alu- minum alloy sheet having a sur- face portion in order to improve adhesion of a polymer coating comprising in a first container, pre t reat ing an a luminum alloy sheet having a surface portion comprising a luminum oxide or a luminum hydroxide with a solu- tion consisting essentially of wa- ter, an organophosphorus com- pound, and metal ions, thereby forming a layer comprising a re- action product of the compound and the oxide or hydroxide, and contaminating the solution with a luminum ions; t ransferr ing at least a portion of the solution to a second container containing a cat- ion exchange resin comprising a polymer functionalized with sul- fonate groups and therein adsorb- ing a luminum ions onto the resin, thereby producing a treated solu- tion containing the compound and having a reduced concentration of a luminum ions; and returning the

treated solution to the first con- tainer.

chain extended with a primary amine.

CATIlOOlC ELECTROCOAT U.S. Patent 6,020,069. Feb. 1, 2000 J.A. Antonelli and C. Scopazzi, assignors to E.I. du Pont de Nemours and Co:, Wilmington, Del.

A cathodic electrocoating compo- sition containing an epoxy resin

PLATING PROCESS U.S. Patent 6,020,266. Feb. 1, 2000 M. Hussein et al., assignors to Intel Corp., Santa Clara, Calif.

A single-step electroplating pro- cess for interconnect via fill and metal line patterning.

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