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TECHNICS TECHNOLOGIES EDUCATION MANAGEMENT-TTEM, 2012; 7 (2): 914
Thermoelastic stress analysis based on infrared thermography
Damnjanovic, Z; Mancic, D; Dasic, P; Lazarevic, D; Pantovic, R
Damnjanovic, Z (reprint author), Univ Belgrade, Tech Fac Bor, Belgrade 11001, Serbia.
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关键词: computer digital image TSA Software Thermoelastic stress analysis Measurement Infrared
thermography Structural health monitoring Thermoelasticity
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Abstract
A new concept of visual and virtual instrumentation based on infrared analysis of thermoelastic stress is
presented in this paper. The parts of the construction where the highest tension occur are determined by the
thermal analysis. It is predicted by installing devices for measure the level of strain suffered by excavator
construction. Combining thermal imaging techniques with measurements using a measuring tape tension, the
great benefit in maintaining these structures can be achieved. Thermal imaging analysis gives a general picture
of the distribution of tension. Examined the structure on which the measuring tape to measure the intensity and
possible direction of tension action. The TSA also helps to make a numerical analysis faster and in a
predictable manner, without need for extensive iterative investigations, what reduces both time and costs. In this
paper are shown results of thermal analysis wheel excavator construction.
TECHNICS TECHNOLOGIES EDUCATION MANAGEMENT-TTEM 影响因子:0.414 (投稿经验 | MedSci指数 | 杂志信息
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