BondMasterBondMaster HSC Rework System

R1346A

BondMaster Manual1. Unpacking the BandMaster2. Installation

3. Universal Paging Bonding Fixture4. Aligning the Pager5. Bonding Process6. BandMaster Technology7. BandMaster Technology and Fixturing8. BandMaster Fixturing and Specification

Manufactured exclusively for @ MOTOROLACAIIREII~

48 Coral Way, MM105.2Key Largo, FL 33037, USA

For service questions call:Automation Production EquipmentPhone: 305-451-4722Fax: 305-451-3374

-- ---- --- - - -- - --

Page 2 HSC Rework SystemR1346A BondMaster

Unpacking the BandMaster

The HSC 9000 BondMaster has beensecurely packaged in a robust customdesigned container with inserts sepa-rating and protecting each component.

On the outside of the container will beregistered the Model Number of theBandMaster and the Voltage. If youhave ordered an accessory such as aMicroscope or X-Y Table, this will alsobe registered. Follow these simplesteps to guide you through unpackingyour BondMaster safely:

1. Unseal the container, ensuring thatthe arrows on the side of the casepoint upwards.

2. Remove this manual and literaturefor reference.

BondingTape andDispenser

Fixturing& Pins

em ~~:: : mC I

'.:.:.:.: .;.;.:.:.:.......

.::=::?...: :.:..: ~.:.:..: :::)!

Component Parts

For more information contactMotorolas America s Parts Division at:

Phone:Fax:

1-800-543-91911-847-538-8079

BandMaster Basic System

3. Remove top insert containing:a) Halogen Lightb) ESD safe Bonding Tape and

Dispenserc) Manufacturing Test Sheet

4. Remove bottom insert containing:a) BondMasterb) Support Base Block (Gold)c) Foot switchd) Power cord

Optional:· MasterLens· Universal Pager Fixture Kit includes:

· Universal Bonding Fixture (Black)· 1 pk set location Pins (Gold)· 1 pk set location Pins (Silver)· 1 pk set Memo support pins (Black)· Intermediate Spacer Fixture (Gold)

Manufactured for Motorola by:

CA.RE.~

HSC Rework SystemR1J46A BondMaster

Page 3

Installing the BondMaster

1. Check that the work bench is sturdyand level.2. Ensure that a power supply is avail-able (11OVACor 220VAC),andthatthe main power is off.3. Connect the Foot Pedal and ACpower cord to rear of the machine andconnect the power cord to the ACsupply.4. Connect the halogen light andoptional MasterLens to the socketsprovided.5. Check that the Foot Pedal/Continuous switch is in Foot Pedalmode.6. Ensure that the Heating Element isin place within the Bond Head, theelement is designed to carry thethermal load of the Bond Head andmust be inserted to avoid failure ordegradation.7. Turn ON the main supply.8. Turn ON the BondMaster main sup-ply switch, the digital controller willconduct a Self Test and then displaythe ambient temperature of the BondHead in RED and the Set Point bondtemperature in GREEN.9. Place the Foot Pedal/Continuousswitch to the Continuous mode to testthe Bond Head heating element andnote the ambient temperature in thered display begin to ramp.Continue until the display reads 250°F121°C, then switch back to Foot Ped~1mode. .10. Press the Foot Pedal momentarilythen release to test that the tempera-ture cycle starts by noting when theambient temperature begins to ramp.

PID ControllerThree thermaVtemperature profileshave been pre-loaded and are ready

For more information contactMotorola's America's Parts Division at:

Phone: 1-800-543-9191Fax: 1-847-538-8079

Important: Do not switch off the BandMasteruntil the display registers under 110°F (43°C)

as this will rapidly degrade heater life.

Controller

to go for Bravo and other pagers, withan additional profile allocated for futureproducts. Do not change any fieldwithin the controller until you arefamiliar with it's operation.11. Pressing the "INDEX" key on thecontroller once will display the BondTime as "t1", the pager bond time 1:45minutes has been factory set as adefault and is recommended for mostapplications, however it may bechanged by using the "UP" and"DOWN" arrows, press "ENTER" tosave a new time.12. Press "INDEX" again to step to theBond Profile "Prof", the default profileis #1, and may be changed from 1 thru4 using the same procedure as chang-ing time but we recommend thatProfile #1 is used.13. Press "INDEX" again to display theBond TemperatureISPI which can bechanged as above, the prefix in ISPIindicates the profile number, werecommend you use the factory settemperature.14. Press "INDEX" to exit.

Manufactured for Motorola by:

CA.RE.p..t~

Page 4 HSC Rework SystemR1346A BondMaster

Universal Pager Bonding Fixture Kit

The Basic BondMaster system doesnot include the optional UniversalPager Fixture Kit.The BondMaster willaccommodate all Motorola pager fix-tures, or the user may decide to fabri-cate a special assembly. The optionaltwo piece Universal Pager Fixture Kitis supplied banded and assembled forBravotype pagers (the band must beremoved before use). The Base Block(gold) supplied with the BondMastersupports the kit, which includes anIntermediate Spacer (gold) and the topUniversal Pager Fixture (black), orien-tated for Bravo pagers. Also includedare two sets of location pins, silver andgold, which are color coded for usewith differentpager types. The MemoSupport Pins are black.

For more information contactMotorolas America s Parts Division at:

Phone: 1-800-543-9191Fax: 1-847-538-8079

Universal Pager Fixture Kit

Kit I :~ ~; I[

l-U--:~dd BIOOkT--J) supplied with BandMaster \..,

L_h U i !Location

PinsMemo

Support Pin

SilverBlack

With the BondMaster facing the user,note the Assembly Dock location holeson the left of the base plate, these willlocate with the roll pins on the bottomof the gold Base Block.The UniversalPager Fixture Kit will retain the pagerand display assembly once theHSC/LCD has been aligned using thecorrect location pins and the anti-staticthermal bonding insulating tape sup-plied. See next page. Once the pagerand display are securely taped, theBase Block can be moved to the

Bonding Docklocation under theBonding Head. Note:the IntermediateSpacer is not required when usingMotorolastandard tooling.

Manufactured for Motorola by:

CA.RE.~

AssemblyDock

, 0 0 >00

Bonding Dock

HSC Rework SystemR1346A BondMaster

Align-ing the Pager

The following steps prepare for thebonding process, using the UniversalPager Bonding Fixture:

Mount the Universal Paging Fixtureand Base Block at the Assembly Docklocation (see previous page).

Select the correct Bonding Anvil forthe pager.The fixture is supplied with"Anvil A" in position for Bravo pagers.When it is necessary to select "AnvilB" the fixture should be rotated 180degrees on the Intermediate Spacerand the correct holes aligned to theIntermediate Spacer pins by theLocation Arrows marked on the fixture.If the wrong pins are selected thenthe display will not register to theBonding Head when in the BondingDock location.

For more information contactMotorola's America's Parts Division at:

Phone: 1-800-543-9191Fax: 1-847-538-8079

Page 5

"Anvil A" Common BravoTypes

"Anvil A"

o@ oUniversalBonding

PagerFixture

oA1 0 0 0 0CB CB

00

oA1

o A2 OA2o.. 0Mounting'HolesFor"AnvilB"o.. 0MountinglHolesFor"AnvilA"00

o

o ~ 0. "Anvil B" diE

"Anvil B" For Renegade,Freespirit and Encore

The above illustration shows the positions of theTooling Pins and which Anvil to use with which pagertype.

The silver tooling pins are used forBravo and the gold pins are for BravoExpress pager types. Locate the pagerin the fixture using the appropriatepins, see illustration at left.

Lay the LCD on a clean flat surfacewith the side to be bonded to the con-nector facing down. The top surface,which will contact the Bonding Head,is facing up. Dispense and cut a 3 inchpiece of Bonding Tape and lay thetape over the HSC material end,ensure there is sufficient tape to cap-ture the pager and that there are nowrinkles before pealing the assemblyfrom the surface. Carefully align thetaped HSC traces of the LCD to thefinger contacts of the pager supportedin the fixture. Press and secure, thenadd an additional layer of tape.

Manufactured for Motorola by:

CA.RE.It~.~

Pager Group ColorBravo C SilverBravo Classic C SilverBravo Numeric C SilverBravo Alpha C SilverLifestyle (New) C SilverBravoExpress A GoldBravoUltra Exp A GoldLifestyle B SilverLifestyle+ B SilverBravoEncore D GoldPro Encore D GoldFree Spirit E SilverRenegade E SilverMemoExpress A Gold

Page 6 HSC Rework SystemR1346A BondMaster

Bonding Process

The objective of the tape preparationand alignment procedure ISnot only tosecure the aligned assembly, but toalso prevent tne Bonding Head stick-ing to the flexible circuit curing thebond process and to insulate the cir-cuit from the Bond Head. It also allowsfor a linear distribution of pressurethroughout the flexible circuit as theconductive epoxy reaches reflowand changes shape to conform to theBond Head.

Once aligned and secured, move theentire Universal Pager Fixture Kit, withthe installed assembly, to the BondingDock under the Bonding Head. Securethe roll pins in the location holes.

The Pager is now ready for the bond-ing process.

The BondMaster is supplied with cor-rect pressure tension adjustment foranosotropic and planer paQers.Thecorrect procedure for alignmg and

PagerLocated

in. ~Fixtureo

@o

For more information contactMotorola s America s Parts Division at:

Phone:Fax:

1-800-543-91911-847-538-8079

Bond Head

Head

,)

\

Bond Blade,/-.-...

HSC tFixture

adjusting pressure for Memo Express(monosotropic) is supplied with the fix-ture. Slowl¥ move the Bonding Leverdown until It contacts the anti-statictape and locks into position.

Depress the foot pedal to activate thetemperature cycle. The Set Point(green display) will convert to thedigital timer and count down from thepreset time to zero.

When the Timer reaches zero, disen-gage the foot pedal and immediatelyrelease the lever and allow the pagerand display to cool before removing.

Carefully peel the anti-static bondingtape from the HSC connector andpager assembly.

Caution - Hot Jradiating surface.DO NOT touch -~~BondHead. ~

Manufactured for Motorola by:

CA.RE.~

HSC Rework SystemR1346A BondMaster

Page 7

8~ndMaster Technology

There are two types of flexible cablethat will be found connected to pagerLCD assemblies.The technologiesvary but both require a similarpreparation.

Mylar technology is recognized by thepresence of solder.

The HSC (Heat Sealed Connector) areflexible circuits which haveconductive traces filled with conductiveepoxy.The technology was developedto provide a quick and effectiveprocess for connecting a LCD (LiquidCrystal Display) to printed circuitboards.

There are three variants of thistechnology, which offer differentelectricaf, mechanical and perfor-mance characteristics.

Monosotropic - Is used for Fine Pitchprojects of O.22mmand above.Thematerials contain gold and nickelparticles offering very low electricalresistance. Its typical yellow appear-ance derives from the titanium dioxideused in the thermoset adhesivecoating process.

BEFORE

~ ~ ~f ~,Tpager Insulator Conductive

AFTER Fingers Epoxy

Conductive PagerEpoxy Fingers InsulatorBond

CLEANING

Anosotropic - A low cost materialyielding reliable bond connections,filled with gold plated nickel particlesand found on most pagers, replacingPlanar in many instances.The materialcan also be used in Fine Pitch applica-tions of O.29mmand above.Indications are Green/White andBlack/White markings.

For more information contactMotorola's America's Parts Division at:

Phone: 1-800-543-9191Fax: 1-847-538-8079

Note "Pressure Calibration" on page 9.

Manufactured for Motorola by:

CA.REII~"I'II:fA

Pager Group Color Turns Pressure Temp. TimeBravo C Silver 10 75 PSI 302°F 1:45Bravo Classic C Silver 10 75 PSI 302°F 1:45Bravo Numeric C Silver 10 75 PSI 302°F 1:45Bravo Alpha C Silver 10 75 PSI 302°F 1:45Lifestyle (New) C Silver 10 75 PSI 302°F 1:45Bravo Express A Gold 10 75 PSI 302°F 1:45Bravo Ultra Exp A Gold' 10 75 PSI 302°F 1:45Lifestyle B Silver 10 75 PSI 302°F 1:45Lifestyle + B Silver 10 75 PSI 302°F 1:45Bravo Encore D Gold 10 75 PSI 302°F 1:45Pro Encore D Gold 10 75 PSI 302°F 1:45Free Spirit E Silver 10 75 PSI 302°F 1:45Renegade E Silver 10 75 PSI 302°F 1:45Memo Express A Gold 11 83 PSI 330°F 1:45

Page 8 HSC ReworkSystemR1J46A BondMaster

BondAfaster Technology and Fixturing

Planar - The original pager material,limited to O.3mmor above pitch and ismore costly than the new technolo-gies. No metal particles are includedand it is more often being replaced byAnosotropic materials.

Bonding all three of these materialsrequires temperature, pressure andtime. The illustration at left shows thecharacteristics of each material. Notethe operating envelope for each type.

PAGER PREPARATION

MylarTechnology

Mylar solderedflexiblecircuits areremovedusing a soldering iron, reflow-ing each connectionas the circuit isgently peeled awayfrom the board.

To prepare the new LCD circuit, simplyapply a bead of no-clean solder pastereference 6680333E72 across the newconnector pads, then reflow the pastewith a temperature controlled solderingiron R1343A.

After reflow (tinning), add a bead ofno-clean flux reference 6680333E71across the pads. All necessary toolsare found in the SMT Tool Kit refer-ence 0180303E45.

HSCTechnology

Remove the HSC circuit by graspingthe LCD and gently peeling the flexiblecircuit from the pager board. A closeinspection of the finger contacts on theboard will reveal the residue of the oldbondedepoxy,seeillustrationonpage7.

For more information contactMotorola's America's Parts Division at:

Phone:Fax:

1-800-543-91911-847-538-8079

Precise and Repeatable Bondingof HSCand MylarSolder Materials

120110

100 ~ MaxImum BoncIngTempendin 18O"C I90

IIonolOtroplc 16O"C80JI Anisotropic 150°CI! 70

i :I Planar 140°-150"C1L

HSC Rework SystemR1346A BondMaster.

Page 9

B~ndAfaster Fixturing and Specification

Memo Express LCDPositioningupgrade package includes:- Linearx-v MicrometerBearingTable- Microscopewith mountinghardware- Universal Pager Bonding FixturePortable Radio Products Fixture forthe following:Radio Products Pager Products

Hot Bar.Advisor.Scriptor.Advisor Gold.Advisor Plus.Tango

.MTX 838

.MTX 8000

.MTX 9000

.HT 1000

.HT 2000

.MTS 2000

Technical SpecificationElectrical: 110V/220V 50/60HzCurrent: 5 Amps continuousPower: 200 Watts continuousMechanical Rugged Anodized

Aluminum PlateDimensions: 15 in. x 12 in. x 12 in.

(381 x 305 x 305mm)14 Ibs (6.36 Kg)Weight:

TemperatureEnvelope:PressureEnvelope:

Ambient to 550°F (288°C)

0-100 Ibs (45.45 Kg)

Time: Programmable1 sec-3 minutes

Reflow Profiles220200180

~ 160

~ 140! 120~loo~ 80

604020

ISeI,~ ."",, ,- Point1/ ,/ ../183°C Eutectic /

/2 / Temperature/. I I IJi 13 /

/1I ,/

.-; 4..():.~~:>.. 1-4DFFColon

60 120Seconds

180 240

For more information contactMotorola's America's Parts Division at:

Phone: 1-800-543-9191Fax: 1-847-538-8079

Memo Express Package

Pressure Calibration Pr~cedure:Each BondMaster is calibrated beforeleaving the factory and the PressureWheel is set in place by a "PressureSet Pin." .

If.it is necessary to calibrate thesystem, simply reset the location asfollows:

Raise Pressure Wheel and Bond Headby turning wheel in direction of arrowin Figure A.

Pressure Wheel

FigureA

Once the wheel is topped out, rotatewheel in reverse direction ten (10) fullturns, as Figure B.

Figure 8

This will apply 75 Ibs. (7.5 Ibs perrotation).End of procedure.

Manufactured for Motorola by: