status of ixys products products rohs compliance …...catalogue 04/05) latest date of conversion to...

1Efficiency Through Technology

STATUS RoHS – lead-free

Status of IXYS Status of IXYS Status of IXYS ProductsProductsProducts RoHSRoHSRoHS ComplianceComplianceCompliance

IXYS/Q Jan. ‘06



BackgroundEC Commission prepares an Integrated Product Policy (IPP) since 1997

2000/53/EC on

end-of life vehicles

IPPIntegrated Product Policy

”Green Book”

WEEEWaste Electrical and Electronic Equipment implement

WEEE & RoHS

in Germany

REACH

Registration Evaluation

Authorisation of

Chemical substances

EUPFramework for the Setting of Eco-Design

Requirements for Energy

Using Products

2000 2001 2002 2003 2004 2005

Draft status

Decision !

RoHS2002/95/EC

Restriction of Hazardous Substances



2002/95/EC Restriction of the use of certain Hazardous Substances in electrical and electronic equipment

under Article 4 „Prevention“ Clause 1

Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain

lead, mercury, cadmium, hexavalent chromium, polybrominated

biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).



However, there are exemptions listed in the Annex of RoHS :

Among others:

lead in high temperature melting type solders (like tin-lead solderalloys containing more than 85 % lead)

This means that

high lead die attach soft solders are not affected at all !!

like PbSn2Ag2,5 etc.


Definition Green Package (common use in the industry)

“The substances listed below are not intentionally added, but might be present as an impurity with an upper limit according to the listed values. The limits refer to the individual material (such as mold compound, solder, plating, leadframe, substrate...) “

Definition substance upper limit (weight) material e.g.

Lead-free Pb < 1000 ppm = 0,1%

Lead finish Solder balls

Cadmium Cd < 100 ppm = 0,01%

Mold compoundsLaminates

Solder resist

All others Hg, Cr6+, PBB, PBDE

< 1000 ppm = 0,1%

Mold compoundsLaminates coatings




Discrete bipolar & Schottky – products 1

*) no Ni underplate

Outline Type Label Identifier Latest Date of Conversion to Pb-Free Terminals

Pb-Free Date Codes

(yyww or yww)

Terminal finish *)

(JESD97)

TO-220, TO-247, TO-3P

suffix “SN” after/below part

type Feb. 1st, 2004

higher than 0404 or 402 respectively

TO-262AB — Jan. 1st, 2004 higher than 0401

DS(A)1, IXBOD 1-06…10 — May 21, 2004 higher than

421

pure tin (e3)

metal can DS2, TO-3, … — n. a. all Ni

higher than 0414

SnAgCu (e1)

Thro

ugh

Hol

e Te

chno

logy

(TH

T)

ISOPLUSTM I4-PAC, 220, 247

suffix “SN” after/below part

type Apr. 1st, 2004

higher than 414 pure tin (e3)



„SN“ means Pb-free terminals and RoHS compliance



Discrete bipolar & Schottky products - 2

Outline Type Label Identifier

Latest Date of Conversion to

Pb-Free Terminals

Pb-Free Date Codes

(yyww or yww)

Terminal finish *)

(JESD97)

TO-263 (D2-Pak) suffix “SN” after/below part type Feb. 1st, 2004 higher than

0404

SMT

SMT TO-252, (D Pak) — Jan. 1st, 2004 higher than

0401

pure tin (e3)

SOT-227B (miniBLOC) — n. a. all Ni

Scr

ew

Mou

nt

metal can, stud base DO-4/ DO-5/ TO-48/ TO-64/5 — n. a. All*) pure tin

‘) DO-5 shims (supplied as accessory) will be RoHS compliant by March 31, 2006 (Cr6+ replaced by Cr3+)

cont

*) no Ni underplate

DDDD2D2D2



Module Products 1

Outline Types (examples)

Outline Drawings #(IXYS short form catalogue 04/05)


Pb-Free Terminals

Pb-Free Date Codes

(yyww or yww)

Terminal finish

(JESD97)

Pin array (V1-Pack) VUO 52, VUB 72, VW2x …io1 47 Aug. 31, 2005 higher than 542 SnAg3Cu0.5*

Pin array (V2-Pack), VVZB120…io1; VUO/VUB,

VWO…NO1/2 48, 74 n. a. all Au with Ni

underplate (e4)

MMO, MLO…io1 60, 61 n. a. all Ag, no underplate (e4)

CBI 1 MWI, MUBW…A/E6K 49a n. a. all pure tin**)

CBI 2 & 3 MUBW, MWI …A/E7; …A/E8,

…E9 81, 77, 95 March 31, 2006 higher than 612 pure tin with

Ni underplatesold

erab

le p

in a

rray

s

ECO-PAC1/2 VII,VMO…P1, VUE…NO7 24, 25, 78 n. a. all Au with Ni

underplate (e4) * = Ag undercoat

** = no Ni undercoat



Module Products 2




Pb-Free Terminals

Pb-Free Date Codes

(yyww or yww)

Terminal finish

(JESD97)

flexi

ble

flat l

eads

VUM24/33, VUC25/36, VVZ/ VVY…io1, VBE20…NO1 45, 46 n. a. all Ag, no

underplate (e4)



Module Products 3




Pb-Free Terminals

Pb-Free Date Codes

(yyww or yww)

Terminal finish

(JESD97)

VBO…O2; VUO…NO3; VHF…io5; 40, 43, 44 n. a. all Ni

Plu

g Ty

pe

(fast

on)

VBO/VUO…NO8; VBO, VHF, VHO, VKO, VTO, VYK,

VTOF, VVZF…io7 41, 42, 57, 62 n. a. all Au with Ni

underplate (e4)



Schedule for the elimination of Cr6+ on washers and screws for modules

Part Types Fig. No.* Screw Type

Delivery as

Alternative Coating Material

Date of Conversion

TO-240 style, MII75…300

26, 27, 28, 33, 34 M5x10 option

ZY253 week 17 ‘05

MCC/MDD/MCD310/250/220 35, 36 M8x16 standard week 26 ‘05 MCC/MDD/MCD200/162/132 FRED modules, VMM650/1500,MII/MID/MDI400

29…32 80 M6x16 standard week 29 ‘05

MCC/MDC/MCD/MDD312/255, MDO/MCO450/500/600, HVL900

37…39, 69 M8x20 standard

Zn with Cr III finish

week 18 ‘05

*= see IXYS short form catalogue



Module Products 4

Outline Types (examples) Outline Drawings #

(IXYS short form catalogue 04/05)


Pb-Free Terminals

Pb-Free Date Codes

(yyww or yww)

Terminal finish

(JESD97)

MCC/MCD/MDD 26, 162, 310, 500…io1/NO1/N1 26 … 39, 80, 103 n. a. all

Scr

ew M

ount

VBO, VUO, VWO…NO7/io7 49 … 54, 63 n. a. all

Sn or Ni on tabs and

auxiliary pins



Package Type Conversion

date Lead Free later than Date Code

Terminal finish (JESD97)

Label Identifier

TO-251 I-Pak TO-262 I2-Pak

TO-220 TO-220 FP

Jan 1, 2004 0401 Pure Tin (e3)

TO-268 leaded Jul 1, 2004 04027 Sn/Ag/Cu solder dip (e1)

TO-3P TO-247 K Jan 1, 2004 0401 Pure Tin (e3)

TO-247 P Jul 1, 2004 04027 Sn/Ag/Cu solder dip (e1)

TO-264 S Jan 1, 2004 0401 Pure Tin (e3) TO-264 P

TO-220 ISOPLUS/PLUS

TO-247 ISOPLUS/PLUS

TO-264 ISOPLUS/PLUS

I4-PAK

04027

Thro

ugh

Hol

e Te

chno

logy

(TH

T)

TO-3 METAL CAN

Jul 1, 2004

0427

Sn/Ag/Cu solder dip (e1) su

ffix

"SN

" afte

r/bel

ow p

art t

ype

IXYS MOS & IGBT products



IXYS MOS & IGBT products

Package Type Conversion

date Lead Free later than Date Code

Terminal finish (JESD97)

Label Identifier

TO-252 D-PAK

TO-263 D2-PAK

Jan 1, 2004 0401

SMT

TO-268 Jul 1, 2004 0427

Pure Tin (e3) suffix "SN" after/below part type

Screw mount SOT-227 n.a. all Ni —

D2D2D2

DDD


STATUS RoHS - ICs

Package Type Conversion date

Lead Free later than Date Code

Terminal finish (JESD97) Label Identifier

8-pin DIP Pure Tin (e3) suffix "SN" after/below part type

18-pin DIP

5 pin TO-263

5-pin TO-220

8-pin SOP

16-pin SOP

Jul 1, 2004 0427

IXYS PWM controllers and MOSFET/IGBT Drivers


STATUS RoHS – lead-free labels - Discretes

How to discern easier between leaded and lead-free on IXYS products ?

For discrete components IXYS will apply this marking on the card boxes and containers (according to JESD97)


STATUS RoHS – lead-free labels – Module Products 1, 2, 3, 4

For modules with various kinds of connectors *) (like screws, fast-on, solderable pins etc.)

IXYS will apply this marking on the card boxes

*) These are modules that have lead-free external electrical connectors, but with internal high-lead solders as exempted by the RoHS


STATUS RoHS – lead-free labels – Module Products 1, 2, 4

For modules that are totally lead-free *) IXYS will apply this marking on the card boxes

*) according to the definition given under 3.5 of JESD97

status of ixys products products rohs compliance …...catalogue 04/05) latest date of conversion to...

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