Smart packaging for medicine

adherence:

Use, technological building blocks and applications

Corné Rentrop

© Holst Centre

Smart packaging:

• Connected world

• Customer engagement

• Security

Smart Packaging

© Holst Centre

Connected packaging …..

MLA DELIVERS WEATHER BASED RECIPES

… for customer adherence (?)

© Holst Centre

The internet of everything

http://www.siggyvolgt.nl/2013/11/vergeet-internet-of-things-het-wordt.html

Example: Smart Blister

Smart packaging for medicine adherence

Corné Rentrop

© Holst Centre

• Features

� Simple

� All electronics in footprint blister

� Printed resistance ladder

� Monitor when en what pill is pushed through

� NFC communication

Smart Medical Blisters

© Holst Centre

Non-Compliant patient, (red bar “forgotten” black arrow “double doses” red dots “out of the time window”). Glucose value too high when pill is not taken on time.

Therapy Compliance

© Holst Centre

E-communicative packaging for pharma

Smart blisters Support

centre

Patient

Medical devices

RFID/NFC

GSM/GPRS wireless network

GSM/GPRS wireless network

DataGator

• Smart pill blister addresses key health issue: medication non-compliance / non-adherence

• Developed jointly with DSM/TCG

© Holst Centre

Challenges of smart blister

Features:• Assembled • “3D”-system• High cost• Added to existing package,

not compatible with R2R

The Holst approach

e.g. StoraEnso Pharma DDSi

Holst Centre System in Foil

Near Future:• Fully integrated • 2D-System in Foil• Low cost, mass fabrication• Roll to Roll compatible

Smart Label: Environmental monitoring

Other Examples ….

Corné Rentrop

© Holst Centre

• Smart tag

• Humidity sensor

• Temperature sensor

• NFC

Smart label:

• Temperature, humidity sensor

• Data storage

• NFC enabled

Smart label: Integration on paper

© Holst Centre

Use cases:

• Report Max./Min. temperature and humidity during transport

• Actual temperature and humidity

• App assisted

© Holst Centre

Smart packaging

Smart label:

• Foil integration

• Temperature and ammonia sensor

• Ultrathin chip

© Holst Centre

• Envelope

• Track and trace

• Antenna 300m

• Chip

• Password control

• Web-acces

Printed registered mail

• 300 m communication

• Password control

• Web-access

• Embossed switches

Smart Packaging: Track and trace envelope

© Holst Centre

• Envelope

• Track and trace

• Antenna 300m

• Chip

• Password control

• Web-acces

Electronic lay-out

• Screen printing

• Roll-to-roll (up to 20m/min.)

• Flash sintered

• Component integration

Smart Packaging: Track and trace envelope

© Holst Centre

Smart envelope – track and trace

Electronic layout

Antenna performance

Wireless communication

Web access and security

Envelope Design

© Holst Centre

.. or can even be shaped into 2.5D objects… or that can be shaped into a 3D surface

© Holst Centre

… or PCB’s that are stretchable… or stretchable

© Holst Centre

Smart shelve:

Pressure sensors in series

Storage management

Wireless communicating

Internet of things

Smart packaging

How to create smart packaging?

Corné Rentrop

Smart Label: Environmental monitoring

© Holst Centre

Components

© Holst Centre

Multi disciplinary approach

Substrate

Printing/ inks

SensorsPlacing components

Electronics/logic

Graphical industry

© Holst Centre

Screen printing: resolution

•routinely print 30 µm line and spacing (60 µm pitch)

•(first steps towards 20 µm line and spacing)

© Holst Centre

Inkjet printing

• 15 µm line / spacing achievable

© Holst Centre

• Printed Thermistor

• Printed H2S sensor

• Printed humidity sensor

Interdigitated finger structure monitors:

• Temperature

• Humidity

• Gasses (H2S)

Sensing platform: interdigitated fingers

© Holst Centre

• Chip pad

• Antenna

• Switch

• Sensor

Printing of electrical components:

• Switch

• Antenna

• Chip pad

Sensing platform: Switches

© Holst Centre

• Smart tag

• Humidity sensor

• Temperature sensor

• NFC

Paper sensor tag:

• Chip (NFC)

• Antenna

• Sensor platform

Electronic components: Pick and place

© Holst Centre

Summary Components

© Holst Centre

- Component integration - Antenna - Chip - NFC- Sensor

- Applications: - Smart packaging - Wearables - Human machine interfaces

- Printed sensors- ECG, EMG, EEG .. - Temperature - Gas (H2S) - Humidity

Final remarks