slimm nano marketing pres

7/28/2019 Slimm Nano Marketing Pres

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SLLIMM-nano

Small low-loss intelligent molded modules


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Topics

Introduction to SLLIMM-nano

Features and protection

Package technology

Performance


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Module versus discrete approach

Short timeto market

Reduced design time andefforts (i.e. easier layout)

Not need for optimizingphase for power stage

Lower manufacturing cost

Single component instead ofseveral

Embedded protection

Space saving

Lower assembly cost

Higher yield

Easier management

Use of external analogcomponents can cause

time delay and noise

IGBTs/diodes HVICs Passivecomponents

High qualityand

reliability

Fewer components andsolder joints

Improved efficiency

Reduced EMI and noise


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Compact and reliable IPM for low-powermotor drives

The SLLIMM-nano is an intelligent power module and includes: three half-bridge HVICs for gate driving

six IGBTs six fast and ultra-soft recovery diodes for freewheeling

It is housed in a very compact and thermally efficient NDIP-26L package

The design of the embedded IGBTs and freewheeling diodes is tailored to offer the besttrade-off between switching and conduction losses for low-power BLDC motorapplications, resulting in high efficiency and low EMI


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Applications

Power range up to 100 W (free air)

9 Fans 9 Pumps 9 Compressors


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Main features and benefits

Features Benefits

Optimized driving characteristics Saved effort and design time

Low electromagnetic interference Reduced EMI and noise

VCE(sat) negative temperature coefficient Improved static performance with increasing temperature

3.3 V, 5 V, 15 V CMOS/TTL input comparators withhysteresis and pull-down/pull-up resistors

Easy and flexible driving

Undervoltage lockout Malfunctioning and fault prevention

Internal bootstrap diode Reduced bill of material and easier layout

Interlocking function Cross conduction prevention

Smart shutdown function Increased safety

Comparator for fault protection against over-temperatureand overcurrent

Effective failure protection

Uncommitted op-amp (for advanced current sensing) Flexible amplifying configurationsOptimized pinout Compact and simplified layout

Open emitter configuration Low-cost and flexible current sensing

1.57 mm creepage between high- and low-voltage pins Improved system safety


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SLLIMM-nano nomenclature

Technology information:H = Tailored for MC

Switch type:G = IGBT

Max VCE rating (x10)

Package type:N = NDIP (nano)

IC rating

Intelligentpower

GIPN3H60A

IC features:9 A = Basic version9 blank = Full version

(SD, comparator, op-amp)


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Part number STGIPN3H60A STGIPN3H60

Pin count 26 26

Package size (mm) 29.5 x 12.5 x 3.1 29.5 x 12.5 x 3.1

Voltage (V) 600 600

Current @ Tc = 25 C (A) 3 3

RTH(J-A) (C/W) 50 50

Integrated bootstrap diode

Smart shutdown funct ion

SD function

Op-amps for advanced current sensing

Comparator for fault protection

3.3/5 V input interface compatibil ity

Interlocking funct ion

Undervoltage lock out (on both VCC and VBOOT)

Product overview


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DIP molded package

Copper frame

RoHS and UL compatible

Small form factor

Package: full molded module

DiodeIGBTIC

Epoxymoldingcompound

CuframeCuframe


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Signal side is lowvoltage only

Leads optimized to preventpin short circuit during

soldering process

Package outline


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Further information

Please visitwww.st.com/modules

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